CN101324933A - Synchronous and continuous making process of RFID label INLAY - Google Patents
Synchronous and continuous making process of RFID label INLAY Download PDFInfo
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- CN101324933A CN101324933A CNA2008100684443A CN200810068444A CN101324933A CN 101324933 A CN101324933 A CN 101324933A CN A2008100684443 A CNA2008100684443 A CN A2008100684443A CN 200810068444 A CN200810068444 A CN 200810068444A CN 101324933 A CN101324933 A CN 101324933A
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Abstract
The invention discloses a synchronous continuous manufacturing process of RFID tag INLAY, which comprises an antenna forming procedure and a reversed sealing procedure of chips. The manufacturing process is characterized in that the antenna forming procedure adopts the die cutting antenna forming process; the reversed sealing procedure of chips adopts the reversed sealing process of chips of the synchronous continuous method; and a continuous sealing process integrating the antenna with the chips is included. The synchronous continuous manufacturing process completes the procedures of antenna manufacture, the sealing of chips, the layer of compensation of bulge thickness of chips, and cutting and rewinding at one time, thereby improving the production efficiency, significantly reducing the manufacturing cost of INLAY, facilitating special additional processes of INLAY, such as extra thickness compensation layer, building-out capacitance, and improving the performance of INLAY.
Description
Technical field
The present invention relates to a kind of novel I NLAY manufacture technology (sheet material that INLAY:RFID chip and antenna combine or coiled material have function of reading, are used for manufacturing RFID label, drop, ticket card) that is used to manufacture RFID label, drop, ticket card.
Background technology
The making of INLAY comprises antenna molding procedure and chip two parts of falling the packaging process, and in the prior art, this two parts operation is finished on two machines respectively.
1, traditional antenna moulding process:
(1) characteristics of the etching method of forming:
Operation is many, the time is long, cost is high, not environmental protection, is unsuitable for producing in enormous quantities.
The investment door is low, is suitable for small serial production RFID label.
(2) vacuum aluminum-coated, the vacuum copper facing method of forming (vapour deposition method)
Solved the defective of etching method, but scale of investment is big, the equipment amortization height can't encapsulate online synchronous operation with chip, and the RFID label is manufactured the cost height.
2, traditional chip reverse packaging process:
Pulsation (asynchronous) reciprocating type package method
Mechanical arm drives vacuum cups, takes off chip from brilliant garden, coats conducting resinl (or be coated in antenna on conducting resinl), is bonded on the antenna then.The mobile of antenna is the stepping pulsating, and moving of chip also is the stepping pulsating, and the two is asynchronous.Vacuum cups moves back and forth, and has limited the speed that chip falls to encapsulate.Because it is high that the encapsulation aligning accuracy requires, it is high that asynchronous reciprocating type sealed in unit is manufactured cost, improved the cost of Chip Packaging.
Summary of the invention
The synchronously continuous manufacture technology that the purpose of this invention is to provide a kind of RFID label INLAY, it is manufactured antenna, Chip Packaging, chip projection thickness layer of compensation, cut that operation is online once finishes with rewinding etc., improve production efficiency, reduced the cost of manufacturing of INLAY significantly.
Technical scheme of the present invention is, the synchronously continuous manufacture technology of a kind of RFID label INLAY, comprise that antenna molding procedure and chip fall packaging process, it is characterized in that: the antenna molding procedure adopts cross cutting method antenna moulding process, chip falls packaging process and adopts the chip reverse packaging process of synchronous continuity method, has also comprised antenna and the whole continuous packaging technology that combines of chip.
The synchronously continuous manufacture technology of a kind of RFID label INLAY, wherein, described cross cutting method antenna moulding process, comprise the upper strata antenna substrate involved in capable shape cross cutting, stripping, seal insulation course, surperficial purification procedures and lower floor's antenna substrate involved in capable shape cross cutting, stripping, surperficial purification procedures after, with compound, the rolling contoured beam antenna operation of upper and lower layer antenna substrate volume.
The synchronously continuous manufacture technology of a kind of RFID label INLAY; wherein; described synchronous continuity method chip reverse packaging process comprises connecting the chip storehouse with chip feeder, contraposition, adjustment forme roller and print glue, stickup chip, topped protective seam on the position of antenna chip, compress, solidifying and setting, detection and mark, cut and the rewinding operation.
The synchronously continuous manufacture technology of a kind of RFID label INLAY, wherein, the whole continuous packaging technology that combines of described antenna and chip can adopt the synchronous packaging technology continuously of STRAP, also can directly adopt antenna is made and the synchronously continuous online technology of once finishing of Chip Packaging.
The synchronously continuous manufacture technology of a kind of RFID label INLAY; wherein; the packaging technology synchronously continuously of described STRAP, comprise connect the STRAP storehouse with STRAP feeder, contraposition, adjustment forme roller and on the position of antenna STRAP, print glue, paste STRAP, topped protective seam, punching press chip are protected the hole, compress, solidifying and setting, detection and mark, cut and the rewinding operation.
The synchronously continuous manufacture technology of a kind of RFID label INLAY, wherein, described direct employing is made antenna and the synchronously continuous online technology of once finishing of Chip Packaging, can adopt the synchronous continuity method INLAY manufacture craft of individual layer antenna or the synchronous continuity method INLAY manufacture craft of dual-layer atenna.
The synchronously continuous manufacture technology of a kind of RFID label INLAY, wherein, the synchronous continuity method INLAY manufacture craft of individual layer antenna, comprise and overlayer (PET film) is involved in the coating of capable UV glue and antenna substrate is involved in capable shape cross cutting, stripping, purifying seal glue, chip fall behind the packaging process, both are compound, and carry out sizing and solidifying, branch cutting process, rolling is finished.
The synchronously continuous manufacture technology of a kind of RFID label INLAY, wherein, the synchronous continuity method INLAY manufacture craft of dual-layer atenna, comprise that the upper strata antenna is carried out shape cross cutting, stripping, seal insulation course, UV glue painting process and lower floor's antenna to carry out shape cross cutting, stripping, purifying seal glue, chip and fall behind the packaging process, both are compound, and cut operation, rolling is finished.
The synchronously continuous manufacture technology of a kind of RFID label INLAY, wherein, described cross cutting method antenna moulding process, can also comprise the technology of the upper strata antenna being made bonding line, promptly after the cross cutting stripping, on the face of conductive layer, except the contact terminal at the two of " cross-line ", printing dielectric ink in the middle part of " bonding line " lumps together the conductive layer of upper strata antenna and lower floor's antenna.
The synchronously continuous manufacture technology of a kind of RFID label INLAY wherein, can also add the punching press pin hole and improve the bonding line conductive stability.
Beneficial effect of the present invention is as follows:
1, adopt cross cutting method antenna moulding process, the production efficiency height, cost is low, and is environment friendly and pollution-free.
2, the synchronous continuous motion of antenna and chip, chip is sticked on the antenna by the cycle type conveying roller, than the routine shuttle packaging technology method efficient height of pulsing, easier realization robotization.
3, antenna is manufactured with Chip Packaging (manufacturing INLAY) is online and is once finished, improve production efficiency, reduced the cost of manufacturing of INLAY significantly, and be convenient to the special additional process of INLAY, as additional thickness layer of compensation, building-out condenser etc., improve the performance of INLAY.
Description of drawings
Fig. 1 is a cross cutting method antenna moulding process process flow diagram of the present invention.
Fig. 2 is the present invention's " bonding line " antenna coil construction figure.
Fig. 3 is the chip reverse packaging process process flow diagram of the synchronous continuity method of the present invention.
Fig. 4 uses the synchronously continuous packaging technology process flow diagram of STRAP for the present invention.
Fig. 5 is the pinhole arrangement figure of STRAP of the present invention and antenna binding.
Fig. 6 is the synchronous continuity method INLAY manufacture technology process flow diagram of individual layer antenna of the present invention.
Fig. 7 is the synchronous continuity method INLAY manufacture technology process flow diagram of HF section dual-layer atenna of the present invention.
Embodiment
This is described in further details invention below in conjunction with drawings and Examples.
INLAY method for production in the conventional art, comprise antenna molding procedure and chip two parts of falling packaging process operation, this two steps operation is finished on two machines respectively, and such production process production efficiency is low, increase the cost of manufacturing of INLAY, limited the development in RFID market.The invention provides the synchronously continuous manufacture technology of a kind of RFID label INLAY, it comprises that antenna molding procedure and chip fall packaging process, antenna molding procedure of the present invention adopts cross cutting method antenna moulding process, chip falls packaging process and adopts the chip reverse packaging process of synchronous continuity method, simultaneously, the present invention is in the operation of combined antenna and chip, can adopt the synchronously continuous packaging technology of STRAP, also can directly adopt antenna is made and the synchronously continuous online technology of once finishing of Chip Packaging, antenna is manufactured with Chip Packaging (manufacturing INLAY) is online once finishes, improve production efficiency, reduced the cost of manufacturing of INLAY significantly.
Be cross cutting method antenna moulding process synoptic diagram of the present invention as accompanying drawing 1.Antenna substrate is made up of antenna counterdie, pressure sensitive adhesive, conductive layer (aluminium or copper pool).Shape according to antenna, the design die-cutting rule, as die cut label, cut out the profile of antenna at the antenna substrate patrix,, unnecessary useless conductive layer is got rid of through the stripping operation, through " surperficial purification process ", the dirt of conductive layer surface is removed, improve surface conduction efficient, become the antenna of RFID label.
Some baroque antennas can be composited by upper strata antenna 1 and lower floor's antenna 2, as the aerial coil of the RFID label of HF section " bonding line " are arranged, and make " bonding line " with " upper strata antenna ", as shown in Figure 2.The manufacture technology of upper strata antenna 1 (as the bonding line of HF section aerial coil) is: after the cross cutting stripping, on the face of conductive layer, except the contact terminal at the two of " bonding line ", printing dielectric ink in the middle part of " bonding line " prevents to electrically contact with lower floor antenna 2.Upper strata antenna 1 lumps together with the conductive layer of lower floor's antenna 2, promptly becomes HF section aerial coil.In order to improve conductive stability, can also add the punching press pin hole.The upper strata antenna can be one deck, also can be two-layer.
The advantage of the above-mentioned cross cutting method craftwork manufacture antenna that adopts is as follows:
1, the manufacture technology simple and fast is environment friendly and pollution-free;
2, antenna edge is neat;
3, can make up by stacked antenna;
4, it is low to manufacture cost;
5, with the online on-line synchronous utilization of chip (STRAP) encapsulation, manufacturing of INLAY onlinely once finished.
Chip of the present invention falls packaging process and adopts the chip reverse packaging process of synchronous continuity method, and its packaging technology as shown in Figure 3.The machine construction of this process using is:
(1) brilliant garden
(2) chip storehouse, chip is arranged above and below, and chip moves down smoothly, and count automatically in the chip storehouse, has the function from the motion tracking move left and right, guarantees continuously to supply with chip.
(3) chip feeder: move synchronous supply chip to conveying roller with antenna, and have storage function, when changing the chip storehouse, also can not influence the normal supply of chip.
(4) chip conveying roller: have the chip cutting on the conveying roller, suction nozzle is arranged in the cutting, in order to adsorb chip, the electrical contact of chip is outside.The motion of delivery wheel and antenna is synchronous with speed, and the height of chip conveying roller is fine-tuning, adjusts the pressure of chip to antenna, guarantees that chip and antenna are bonding reliably.The cutting of multiple row chip is arranged on the chip conveying roller simultaneously,, ten cover chip storehouses and ten cover chip feeders are just arranged, can manufacture ten row INLAY simultaneously as ten row.
(5) live roll below the bottom roller, antenna.
(6) rubber printing equipment: printing adhesion glue or conducting resinl on the position of chip on the antenna, in order to fixed chip.
(7) compound cap rock hyaline membrane (PET)
(8) UV printing equipment: stamp part (or all) UV compound adhesive in the inside of overcoat
(9) overcoat pinch roller: synchronous with the chip delivery wheel, adjustable in pressure provides chip suitable pressure, contacts with the antenna good electrical, can not damage chip by pressure again.
(10) contact roller: be carved with the location hole of chip on the contact roller, be synchronized with the movement with the chip delivery wheel, location hole provides protection for chip when implementing to compress, and can not damage chip by pressure, and antenna and overcoat closely force together.
(11) UV solidification equipment: the UV curing compound adhesive guarantees that antenna and overcoat have good combined strength bination.
The power of all moving components in this equipment is provided by propulsion system, and all moving components all are synchronized with the movement.Have manual adjustment and adjust alignment system automatically, can in time adjust the tension force of antenna coiled material, adjust the angle of chip conveying roller, the aligning accuracy of guaranteeing chip and antenna is within the permissible error scope.
Operation 1: chip is taken off from brilliant garden, be arranged in the chip storehouse, chip storehouse and chip feeder are linked together.
Operation 2: " contraposition ", the angle of adjustment chip conveying roller, the position of chip aligns on chip on the assurance conveying roller and the antenna.The position of chip aligns on location hole on the adjustment hold-down roller and the antenna.
Operation 3: adjust the forme roller of printing seats, on the position of antenna chip, print glue.
Operation 4: packaged chip: the chip on antenna chip position and the conveying roller aligns and coincides together accurately, and conveying roller pastes the chip shellfish and is imprinted on the antenna.Adjust the pressure of conveying roller, make the contact point of chip subdue 2-3 micron in antenna surface, (can not damage chip by pressure) obtains good electric binding.
Operation 5: topped protective seam (PET film): overcoat (film) is through the printing UV compound adhesive, and is topped on antenna by pressure roller 9, adjusts the pressure of topped roller, makes overcoat (film) and smooth the sticking together of antenna.
Operation 6: compress: hold-down roller 9 is with overcoat (film) and antenna forcing together tightly, and overcoat is pushed down chip tightly, and chip is positioned on the antenna, keeps stable electric contact, and the while protects chip not to be subjected to damage again.
Operation 7: solidifying and setting: through the antenna and the chip of overcompaction, after UV curing, the UV adhesive curing, antenna and overcoat (film) become one, and INLAY manufactures and finishes.
Operation 8: detect with mark: INLAY and pass through the RFID read/write head, detect read-write capability, if defective products, online ink jet numbering machine is spray printing unacceptable product sign on bad INLAY.
Operation 9: cut and rewinding: have the INLAY of thickness compensation layer, the rewinding diameter is more than 600 millimeters.
The present invention is in the operation of combined antenna and chip, can adopt the synchronously continuous packaging technology of STRAP, also can directly adopt antenna is made and the synchronously continuous online technology of once finishing of Chip Packaging, accompanying drawing 4 uses the synchronous packaging technology synoptic diagram continuously of STRAP for the present invention.This technology and chip synchronously continuously packaging technology are basic identical, and the difference of two technologies is: on the position corresponding with two conduction butterfly wings 5 of STRAP, increased punching needle on hold-down roller.When compressing antenna 3 and overcoat, on two conduction butterfly wings 5 of STRAP, stamp out several pin holes 6, make two conduction butterfly wings 5 of STRAP pass through pin hole " riveting " together with antenna, obtain more reliable electric contact.As the pinhole arrangement figure of accompanying drawing 5 for STRAP of the present invention and antenna binding.Adopt the synchronously continuous packaging technology of STRAP, can on the INLAY base material, punch out the thickness compensation hole, chip 4 is fallen in this hole, chip is protected, make the INLAY substrate surface smooth, attractive in appearance simultaneously.
The operation of combined antenna and chip, can also adopt antenna is made and the Chip Packaging online technology of once finishing continuously synchronously, this technology comprises two kinds of the synchronous continuity method INLAY manufacture crafts of the synchronous continuity method INLAY manufacture craft of individual layer antenna and HF section dual-layer atenna.Be respectively the synchronous continuity method INLAY manufacture technology process flow diagram of individual layer of the present invention, dual-layer atenna as accompanying drawing 6, Fig. 7.The synchronous continuity method INLAY manufacture craft of individual layer antenna, comprise overlayer (PET film) is involved in capable UV glue coating, simultaneously, antenna substrate is involved in capable shape cross cutting, stripping, purifying seal glue, chip to fall behind the packaging process, overlayer (PET film) volume is compound with the antenna substrate volume, and carry out sizing and solidifying, branch cutting process, rolling is finished; The synchronous continuity method INLAY manufacture craft of HF section dual-layer atenna, comprise the upper strata antenna is carried out shape cross cutting, stripping, seal insulation course, UV glue painting process, simultaneously, lower floor's antenna is carried out shape cross cutting, stripping, purifying seal glue, chip to fall behind the packaging process, upper strata antenna and lower floor's antenna is compound, and cut operation, rolling is finished.Employing is made antenna and the synchronously continuous online technology of once finishing of Chip Packaging; can on the INLAY base material, cover one deck thickness compensation layer, and on the thickness compensation layer die-cut chip hole, chip is fallen in this hole; chip is protected, makes the INLAY substrate surface smooth, attractive in appearance simultaneously.
Antenna of the present invention is manufactured with all moving components of Chip Packaging and is all adopted a power, has very easyly obtained the successional motion of synchronous same-speed.Wheel as routine changes the flexographic printing line, and small chip is regarded as a small label, is attached on the position of setting.Antenna is manufactured (cross cutting), seal glue, packaged chip (decals automatically), topped diaphragm (multiple film), punching press conduction pin hole (cross cutting) etc. whole operations are online and once finish, improved production efficiency, promoted the development in RFID market.
Claims (10)
1, the synchronously continuous manufacture technology of a kind of RFID label INLAY, comprise that antenna molding procedure and chip fall packaging process, it is characterized in that: the antenna molding procedure adopts cross cutting method antenna moulding process, chip falls packaging process and adopts the chip reverse packaging process of synchronous continuity method, has also comprised antenna and the whole continuous packaging technology that combines of chip.
2, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 1, it is characterized in that: cross cutting method antenna moulding process, comprise the upper strata antenna substrate involved in capable shape cross cutting, stripping, seal insulation course, surperficial purification procedures and lower floor's antenna substrate involved in capable shape cross cutting, stripping, surperficial purification procedures after, with compound, the rolling contoured beam antenna operation of upper and lower layer antenna substrate volume.
3, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 1; it is characterized in that: synchronous continuity method chip reverse packaging process comprises connecting the chip storehouse with chip feeder, contraposition, adjustment forme roller and print glue, stickup chip, topped protective seam on the position of antenna chip, compress, solidifying and setting, detection and mark, cut and the rewinding operation.
4, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 1, it is characterized in that: described antenna and the whole continuous packaging technology that combines of chip, can adopt the synchronously continuous packaging technology of STRAP, also can directly adopt antenna is made and the synchronous online technology of once finishing continuously of Chip Packaging.
5, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 4; it is characterized in that: the packaging technology synchronously continuously of described STRAP, comprise connect the STRAP storehouse with STRAP feeder, contraposition, adjustment forme roller and on the position of antenna STRAP, print glue, paste STRAP, topped protective seam, punching press chip are protected the hole, compress, solidifying and setting, detection and mark, cut and the rewinding operation.
6, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 4, it is characterized in that: described direct employing is made antenna and the synchronously continuous online technology of once finishing of Chip Packaging, can adopt the synchronous continuity method INLAY manufacture craft of individual layer antenna or the synchronous continuity method INLAY manufacture craft of dual-layer atenna.
7, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 6, it is characterized in that: the synchronous continuity method INLAY manufacture craft of individual layer antenna, comprise and overlayer (PET film) is involved in the coating of capable UV glue and antenna substrate is involved in capable shape cross cutting, stripping, purifying seal glue, chip fall behind the packaging process, both are compound, and carry out sizing and solidifying, branch cutting process, rolling is finished.
8, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 6, it is characterized in that: the synchronous continuity method INLAY manufacture craft of dual-layer atenna, comprise that the upper strata antenna is carried out shape cross cutting, stripping, seal insulation course, UV glue painting process and lower floor's antenna to carry out shape cross cutting, stripping, purifying seal glue, chip and fall behind the packaging process, both are compound, and cut operation, rolling is finished.
9, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 2, it is characterized in that: cross cutting method antenna moulding process, can also comprise the technology of the upper strata antenna being made bonding line, promptly after the cross cutting stripping, on the face of conductive layer, except the contact terminal at the two of " cross-line ", printing dielectric ink in the middle part of " bonding line " lumps together the conductive layer of upper strata antenna and lower floor's antenna.
10, the synchronously continuous manufacture technology of a kind of RFID label INLAY according to claim 2 is characterized in that: can also add the punching press pin hole and improve the bonding line conductive stability.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2008100684443A CN101324933A (en) | 2008-07-11 | 2008-07-11 | Synchronous and continuous making process of RFID label INLAY |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2008100684443A CN101324933A (en) | 2008-07-11 | 2008-07-11 | Synchronous and continuous making process of RFID label INLAY |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102034717A (en) * | 2010-09-21 | 2011-04-27 | 深圳市卡的智能科技有限公司 | Packaging method for radio frequency card |
| CN101551874B (en) * | 2009-04-22 | 2011-05-04 | 深圳市瑞虎自动化科技有限公司 | RFID electronic label compounding, molding, testing technology and equipment |
| CN102339411A (en) * | 2011-10-18 | 2012-02-01 | 无锡邦普氿顺微电子有限公司 | Method for manufacturing ultrahigh-frequency radio frequency identification (RFID) tag |
| CN102394358A (en) * | 2011-06-16 | 2012-03-28 | 焦林 | Manufacturing method of transfer type radio frequency identification read-write antenna |
| CN101714692B (en) * | 2009-11-23 | 2013-05-22 | 北京澳普林特精密电子有限公司 | Preparation method of copper foil antenna |
| CN103367896A (en) * | 2013-07-08 | 2013-10-23 | 温州格洛博电子有限公司 | Environmental-friendly radio frequency antenna die cutting processing technique |
| CN103367895A (en) * | 2013-07-08 | 2013-10-23 | 温州格洛博电子有限公司 | Radio frequency identification copper-plated antenna and preparation method thereof |
| CN103824109A (en) * | 2014-03-12 | 2014-05-28 | 厦门英诺尔信息科技有限公司 | Transfer-prevention and adhesive-residue-free electronic tag of RFID (radio frequency identification device) as well as preparation method of electronic tag |
| CN105680149A (en) * | 2016-01-15 | 2016-06-15 | 深圳市骄冠科技实业有限公司 | Antenna chip inlay and device and technology for manufacturing antenna chip inlay |
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| CN101714692B (en) * | 2009-11-23 | 2013-05-22 | 北京澳普林特精密电子有限公司 | Preparation method of copper foil antenna |
| CN102034717A (en) * | 2010-09-21 | 2011-04-27 | 深圳市卡的智能科技有限公司 | Packaging method for radio frequency card |
| CN102394358A (en) * | 2011-06-16 | 2012-03-28 | 焦林 | Manufacturing method of transfer type radio frequency identification read-write antenna |
| CN102339411A (en) * | 2011-10-18 | 2012-02-01 | 无锡邦普氿顺微电子有限公司 | Method for manufacturing ultrahigh-frequency radio frequency identification (RFID) tag |
| CN103367896A (en) * | 2013-07-08 | 2013-10-23 | 温州格洛博电子有限公司 | Environmental-friendly radio frequency antenna die cutting processing technique |
| CN103367895A (en) * | 2013-07-08 | 2013-10-23 | 温州格洛博电子有限公司 | Radio frequency identification copper-plated antenna and preparation method thereof |
| CN103367895B (en) * | 2013-07-08 | 2015-10-14 | 温州格洛博电子有限公司 | A kind of less radio-frequency copper facing antenna and preparation method thereof |
| CN103367896B (en) * | 2013-07-08 | 2016-05-04 | 温州格洛博电子有限公司 | A kind of radio-frequency antenna cross cutting processing technology of environmental protection |
| CN103824109A (en) * | 2014-03-12 | 2014-05-28 | 厦门英诺尔信息科技有限公司 | Transfer-prevention and adhesive-residue-free electronic tag of RFID (radio frequency identification device) as well as preparation method of electronic tag |
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| CN109801869A (en) * | 2019-01-18 | 2019-05-24 | 广州明森科技股份有限公司 | A kind of efficient radio frequency identification tag package Processes and apparatus |
| CN109801869B (en) * | 2019-01-18 | 2020-10-09 | 广州明森科技股份有限公司 | Efficient electronic tag packaging process and device |
| CN110350292A (en) * | 2019-06-24 | 2019-10-18 | 武汉中鼎智科物联网科技有限公司 | A kind of manufacturing method of environment-friendly type RFID label antenna |
| CN110399962A (en) * | 2019-07-24 | 2019-11-01 | 江阴市浩天绮科技有限公司 | The production technology of compound coding RFID label tag |
| CN110399963A (en) * | 2019-07-24 | 2019-11-01 | 江阴市浩天绮科技有限公司 | The compound coding production line of RFID label tag |
| CN110399962B (en) * | 2019-07-24 | 2023-03-10 | 江阴市浩天绮科技有限公司 | Production process of composite code-spraying RFID (radio frequency identification) label |
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| CN111275154A (en) * | 2020-01-17 | 2020-06-12 | 黄光伟 | Full-die-cutting ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof |
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Application publication date: 20081217 |