CN111223837A - 一种双界面智能卡模块及其制备方法 - Google Patents
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Abstract
本发明公开了一种双界面智能卡模块及其制备方法,包括抗电磁干扰智能卡载带和智能卡芯片;所述抗电磁干扰载带依次包括智能卡接触面焊盘层、抗电磁干扰基材层和智能卡焊接面焊盘层;所述抗电磁干扰基材层包括磁性材料和聚合物材料;所述智能卡芯片与智能卡焊接面焊盘层通过锡球焊接以实现抗电磁干扰智能卡载带和智能卡芯片的电连接。本发明采用将抗电磁干扰材料封装于双界面智能卡模块内部的方式对双界面智能卡的接触式功能与非接触式功能进行整合,将原本需要外加天线或外加铁氧体进行天线信号放大的工艺进行优化;用此方法制作的新型双界面智能卡模块,在不增加工序的情况下增强了产品性、节省了生产材料、降低了环境污染。
Description
技术领域
本发明涉及微电子半导体以及集成电路的封装技术,特别是涉及一种双界面智能卡模块。
背景技术
随着集成电路封装技术的不断进步,集成电路的集成度日益提高,功能也越来越丰富,而且对于产品应用领域的要求也越来越苛刻,这就要求集成电路封装企业能开发出新型的封装形式来配合新的需求。
例如在双界面智能卡封装领域,国内及国外市场对双界面智能卡的需求量都非常大,目前,双界面智能卡行业正朝着技术创新的路线发展,新技术不断涌现,新型制造技术也越来越多,许多老的制造技术也不断改进和加强,从而对智能卡的功能和性能的提升要求也不可避免。
传统的双界面智能卡的封装方法(即制作方法)是:首先,将芯片用引线键合的方式将芯片功能焊盘与载带功能焊盘电性连接,然后,采用注胶或者模塑封装的方式将芯片进行包封保护制作成双界面智能卡模块,最后,将双界面智能卡模块载带上的非接触式功能焊盘与卡基上的高频天线进行焊接。其中,使用此种传统封卡完成的智能卡,若不进行外接天线,完全无法使用智能卡中的非接触式功能。另外,目前较先进的改良型的双界面智能卡,采用小型天线对双界面智能卡模块进行封卡,后在卡基上额外贴附铁氧体或磁片进行抗电磁干扰和信号增强作用,但此方法工艺非常复杂、成本较为昂贵,且在产品最后使用时尺寸较厚、外观不够美观。
因此,提供一种可在模块形态下直接作为终端使用、功能集成度高、制作工艺简便、制作工序污染少的双界面智能卡,是所属技术领域亟需解决的技术难题。
发明内容
鉴于以上所述现有技术的缺点,本发明要解决的技术问题在于提供一种使用范围广泛、功能集成度高、制作工艺简便、制作工序污染少的双界面智能卡模块,以克服现有技术的上述缺陷。
为了解决上述技术问题,本发明提供一种双界面智能卡模块,包括抗电磁干扰智能卡载带和智能卡芯片;所述抗电磁干扰载带依次包括智能卡接触面焊盘层、抗电磁干扰基材层和智能卡焊接面焊盘层;所述抗电磁干扰基材层包括磁性材料和聚合物材料;所述智能卡芯片与智能卡焊接面焊盘层通过锡球焊接以实现抗电磁干扰智能卡载带和智能卡芯片的电连接。
根据本申请上述所述的技术方案,所述智能卡接触面焊盘层上形成有智能卡接触面金属图形。优选地,所述智能卡接触面焊盘层包括由ISO7816标准所规定的智能卡接触面金属图形。
根据本申请上述所述的技术方案,所述智能卡焊接面焊盘层包括若干个接触式功能焊盘、两个非接触式功能焊盘和电感耦合天线,其中两个所述非接触式功能焊盘分别与所述电感耦合天线的两端电连接。
根据本申请上述所述的技术方案,所述磁性材料选自铁铝合金磁粉,铁硅铝磁粉,坡莫合金磁粉,铁钴系合金磁粉,软磁铁氧体磁粉和铁基纳米晶软磁粉中的一种或多种。
根据本申请上述所述的技术方案,所述聚合物材料为环氧树脂、聚酰亚胺、聚芳酯和聚醚醚酮中的一种或多种。
根据本申请上述所述的技术方案,以抗电磁干扰基材层的总质量为基准计,所述磁性材料的含量至少为50wt%。优选地,所述磁性材料的含量为50wt%~90wt%。
根据本申请上述所述的技术方案,所述抗电磁干扰基材层的多个磁性粒子及聚合物材料磁导率为50H/m-200H/m,电阻率为108Ω-1012Ω。
根据本申请上述所述的技术方案,在智能卡芯片和抗电磁干扰智能卡载带之间采用填充胶填充并加固。
根据本申请上述所述的技术方案,所述智能卡芯片包括若干个芯片接触式功能焊盘和两个芯片非接触式功能焊盘;两个芯片非接触式功能焊盘与智能卡焊接面焊盘层中的非接触式功能焊盘焊接实现电连接;芯片接触式功能焊盘分别与智能卡焊接面焊盘层中的接触式功能焊盘对应电连接。
根据本申请上述所述的技术方案,所述智能卡接触面焊盘层上设有若干个接触式功能焊盘,所述智能卡接触面焊盘层中的接触式功能焊盘分别与所对应的智能卡焊接面焊盘层中的接触式功能焊盘通过贯穿所述抗电磁干扰基材层的导通孔进行电连接。
本申请另一方面还提供一种新型双界面智能卡模块制作方法,包括以下步骤:
a、采用压合的方式将金属层、抗电磁干扰基材层、金属层三层结构逐层叠加后、通过层压加工成双面线路板,抗电磁干扰基材层作为中间层将两层金属层隔开;
b、对层压完成的双面线路板进行导通孔制作;
c、对导通孔进行电镀,以在抗电磁干扰基材层中的导通孔的侧壁形成电连接层,并填充金属层中的导通孔形成接触式功能焊盘;
d、对双面线路板进行蚀刻线路制作,形成智能卡接触面焊盘层和智能卡焊接面焊盘层;
e、对智能卡芯片功能焊盘采用锡球进行植球;
f、采用倒装焊的方式将智能卡芯片的功能焊盘与智能卡焊接面焊盘电性结合;
g、涂胶进行封装保护。
如上所述,本发明的智能卡模块,具有以下有益效果:
本发明采用将抗电磁干扰材料设置于双界面智能卡模块内部的方式将双界面智能卡模块作为不需要外接大尺寸天线即能稳定工作的终端产品,本发明的双界面智能卡模块比传统工艺制作的双界面智能卡有更高的环保效果和更简便的工艺,使生产制作过程中产生较少的废料与污染,不但能够超越传统双界面智能卡的性能效果,而且还能够大大降低原料成本、生产成本以及保存成本,使营运成本低。
附图说明
图1显示为本发明的双界面智能卡模块的结构示意图。
图2显示为本发明的抗电磁干扰智能卡载带的智能卡接触面焊盘层示意图。
图3显示为本发明的抗电磁干扰智能卡载带的智能卡焊接面焊盘层示意图。
图4显示为本发明的芯片的焊接示意图。
图1~图4中的标号说明
1 抗电磁干扰智能卡载带
11 智能卡接触面焊盘层
111 智能卡接触面金属图形
12 抗电磁干扰基材层
13 智能卡焊接面焊盘层
131 金属线路焊盘
1311 智能卡焊接面焊盘层的接触式功能焊盘
1312 智能卡焊接面焊盘层的非接触式功能焊盘
132 天线
14 导通孔电镀介质
2 智能卡芯片
21 智能卡芯片的接触式功能焊盘
22 智能卡芯片的非接触式功能焊盘
23 锡球
24 填充胶
具体实施方式
以下由特定的具体实施例说明本发明的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本发明的其他优点及功效。
请参阅图1至图4。须知,本说明书所附图式所绘示的结构、比例、大小等,均仅用以配合说明书所揭示的内容,以供熟悉此技术的人士了解与阅读,并非用以限定本发明可实施的限定条件,故不具技术上的实质意义,任何结构的修饰、比例关系的改变或大小的调整,在不影响本发明所能产生的功效及所能达成的目的下,均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时,本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语,亦仅为便于叙述的明了,而非用以限定本发明可实施的范围,其相对关系的改变或调整,在无实质变更技术内容下,当亦视为本发明可实施的范畴。
如图1所示,本发明提供一种双界面智能卡模块,包括抗电磁干扰智能卡载带1和智能卡芯片2;为了使双界面智能卡模块本身能够实现接触式读卡功能与非接触式读卡功能,所以本抗电磁干扰载带1依次包括三层结构:智能卡接触面焊盘层11、抗电磁干扰基材层12、智能卡焊接面焊盘层13;所述抗电磁干扰基材层12包括磁性材料和聚合物材料;所述智能卡芯片2与智能卡焊接面焊接层通过锡球23焊接以实现抗电磁干扰智能卡载带1和智能卡芯片2的电连接。本申请中抗电磁干扰基材层12的材料设置是为了使电感耦合天线132在后续使用中不被智能卡接触面焊盘层11的金属部分对信号进行屏蔽,并且增加电感耦合天线132工作中的读取距离。
如图2所示,为使智能卡模块与市场上智能卡读卡器进行适用,本智能卡模块的接触面焊盘层11上设有智能卡接触面金属图形111,智能卡接触面金属图形111设计时完全符合国际智能卡标准ISO7816所规定的接触面金属图形,具体如图2所示。
根据本申请上述所述的技术方案,智能卡焊接面焊盘层13包括若干个接触式功能焊盘、两个非接触式功能焊盘和电感耦合天线,两个所述非接触式功能焊盘分别与所述电感耦合天线的两端电连接。如图3和图4所示,所述智能卡焊接面焊盘层13既设置有与智能卡芯片2的接触式功能焊盘21相电性连接的金属线路焊盘131;又设置有与芯片的非接触式功能焊盘22相电性连接的13.56MHz频率的电感耦合天线132。
在一个优选的实施例中,所述磁性材料选自铁铝合金磁粉,铁硅铝磁粉,坡莫合金磁粉,铁钴系合金磁粉,软磁铁氧体磁粉和铁基纳米晶软磁粉中的一种或多种。
在一个优选的实施例中,聚合物材料为环氧树脂、聚酰亚胺、聚芳酯和聚醚醚酮中的一种或多种。
在一个更优选的实施例中,以抗电磁干扰基材层的总质量为基准计,所述磁性材料的含量至少为50wt%。优选地,所述磁性材料的含量为50wt%~90wt%。
在双界面智能卡模块的使用时,读卡器天线与智能卡模块天线进行电感耦合,读写智能卡模块内的信息。传统智能卡模块中若植入天线,由读卡器读写时的电磁波完全被智能卡接触面层的大面积金属所吸收,造成屏蔽,从而无法与读卡器进行正常读写动作;本申请中加入磁性材料形成抗电磁干扰基材层后,其会将智能卡接触面层的大面积金属吸收电磁波的动作进行阻挡,而且增加天线通讯时的磁导率,使得电磁波能够正常地从智能卡模块天线进行收发,与读卡器进行通讯。
在一个更具体的实施例中,通过聚合物材料和掺杂的磁性材料使得最终制备获得的抗电磁干扰基材层的磁导率为50H/m~200H/m,电阻率为108Ω~1012Ω。具体地,可以采用20wt%的环氧树脂为聚合物材料和80wt%的铁硅铝磁粉作为磁性材料,共混后成型形成的抗电磁干扰基材层的磁导率为120H/m;采用90wt%的铁基纳米精软磁粉和10wt%的环氧树脂共混后形成抗电磁干扰基材层,其磁导率为200H/m;采用50wt%的铁基纳米精软磁粉和50wt%的环氧树脂共混后形成抗电磁干扰基材层,其磁导率为50H/m;采用70wt%的坡莫合金磁粉和30wt%的环氧树脂共混后形成抗电磁干扰基材层,其磁导率为100H/m。
本申请中的磁导率是将材料制成外径为10mm,内径为5mm的圆环,然后利用阻抗分析仪测试。本申请实施例测试时采用13.56MHz频率。
在选择抗电磁干扰基材层12的多个磁性粒子及聚合物材料时,根据电感耦合天线132靠近金属材料则易被屏蔽的特殊性,选择磁导率为50H/m~200H/m、电阻率为108Ω~1012Ω的材料进行抗电磁干扰基材层12制作,以抵抗电感耦合天线132在使用过程中靠近金属材料后被屏蔽的缺陷,并且选用以上磁导率、电阻率的材料亦能够有效地对电感耦合天线132在使用中的信号进行放大以增加读取距离。
如图3和图4所示,所述智能卡芯片2包括若干个芯片接触式功能焊盘21和两个芯片非接触式功能焊盘22;两个芯片非接触式功能焊盘22与智能卡焊接面焊盘层13中的非接触式功能焊盘焊接1312电连接;芯片接触式功能焊盘21分别与智能卡焊接面焊盘层13中的接触式功能焊盘1311对应电连接。具体地,所述芯片接触式功能焊盘为5个。智能卡焊接面焊盘层中的接触式功能焊盘为5个。
所述智能卡接触面焊盘层11上设有若干个接触式功能焊盘,所述智能卡接触面焊盘层中的接触式功能焊盘分别与所对应的智能卡焊接面焊盘层中的接触式功能焊盘1311通过贯穿所述抗电磁干扰基材层12的导通孔14上的镀层进行电连接。具体地,智能卡接触面焊盘层中的接触式功能焊盘为5个。
为了使智能卡接触面焊盘层11与智能卡焊接面焊盘层13所对应的功能焊盘本身进行电性导通,可采用导通孔14进行实现,以达到芯片的功能直接传输到智能卡接触面焊盘层11上。
如图1、图4所示,本发明还公开了双界面智能卡模块制作方法,包括以下步骤:
a、采用压合的方式将金属层、抗电磁干扰基材层12、金属层三层结构逐层叠加后、通过层压加工成双面线路板,抗电磁干扰基材层作为中间层将两层金属层隔开;
b、对层压完成的双面线路板进行导通孔14制作,作为后续智能卡接触面焊盘层11和智能卡焊接面焊盘层13所有功能焊盘分别进行电性导通作用;
c、对导通孔进行电镀,以在抗电磁干扰基材层12中的导通孔14的侧壁形成电连接层,并填充智能卡接触面焊盘层11和智能卡焊接面焊盘层13中的导通孔形成接触式功能焊盘形成导通孔电镀介质14;
d、对双面线路板进行蚀刻线路制作,形成智能卡接触面焊盘层11和智能卡焊接面焊盘层
13,在此处智能卡接触面焊盘层11上形成有ISO7816所规定的接触面金属图形111;在智能卡焊接面焊盘层13上形成有金属线路焊盘131和电感耦合天线132;
e、对智能卡芯片2功能焊盘采用圆片级封装的形式进行焊盘植球23,此处焊球23可采用电镀工艺将锡球设置于智能卡芯片2功能焊盘上;
f、采用倒装焊设备,用设备上的一号吸嘴将智能卡芯片2拾起后,再采用二号吸嘴拾取一号吸嘴上的芯片并将二号吸嘴移动至智能卡焊接面焊盘层13的对应焊盘位置后放置芯片,此时的芯片接触式功能焊盘21、非接触式功能焊盘22与智能卡焊接面焊盘层13的对应接触式功能焊盘1311、非接触式功能焊盘1312位置重合;再使用回流加热的温度梯度对焊球23进行熔化并与智能卡焊接面焊盘层13的对应接触式功能焊盘1311、非接触式功能焊盘1312相融合,最后采用冷却的方式将已熔化的焊球23进行固化;此时的芯片接触式功能焊盘21、非接触式功能焊盘22与智能卡焊接面焊盘层13的对应接触式功能焊盘1311、非接触式功能焊盘1312完全电性连接。
g、最后为了将智能卡芯片2和线路板进行封装保护,采用涂胶的方法将底部填充胶24注入智能卡芯片2和线路板中间间隙部分,并将间隙部分填满。这样既能将智能卡芯片2和线路板中间间隙部分进行支撑,又能保护芯片2在受到外力作用下不会失效。
具体地,步骤a)中的层压为加热加压。
综上所述,本发明的新型双界面智能卡模块比传统工艺制作的智能卡模块有更高的环保效果和更简便的工艺,使生产制作过程中产生较少的废料与污染,不但能够延续传统智能卡模块的性能效果,而且还能够大大降低原料成本、生产成本以及保存成本,使营运成本低。所以,本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。
Claims (10)
1.一种双界面智能卡模块,其特征在于,包括抗电磁干扰智能卡载带(1)和智能卡芯片(2);所述抗电磁干扰载带(1)依次包括智能卡接触面焊盘层(11)、抗电磁干扰基材层(12)和智能卡焊接面焊盘层(13);所述抗电磁干扰基材层(12)包括磁性材料和聚合物材料;所述智能卡芯片(2)与智能卡焊接面焊盘层(13)通过锡球(23)焊接以实现抗电磁干扰智能卡载带(1)和智能卡芯片(2)的电连接。
2.根据权利要求1所述的双界面智能卡模块,其特征在于,所述智能卡接触面焊盘层(11)上形成有智能卡接触面金属图形。
3.根据权利要求1所述的双界面智能卡模块,其特征在于,所述智能卡焊接面焊盘层(13)包括若干个接触式功能焊盘、两个非接触式功能焊盘和电感耦合天线,两个所述非接触式功能焊盘分别与所述电感耦合天线的两端电连接。
4.根据权利要求1所述的一种双界面智能卡模块,其特征在于,所述磁性材料选自铁铝合金磁粉,铁硅铝磁粉,坡莫合金磁粉,铁钴系合金磁粉,软磁铁氧体磁粉和铁基纳米晶软磁粉中的一种或多种。
5.根据权利要求1所述的一种双界面智能卡模块,其特征在于,聚合物材料为环氧树脂、聚酰亚胺、聚芳酯和聚醚醚酮中的一种或多种。
6.根据权利要求1所述的一种双界面智能卡模块,其特征在于,以抗电磁干扰基材层的总质量为基准计,所述磁性材料的含量至少为50wt%;和/或所述抗电磁干扰基材层的磁导率为50H/m~200H/m,电阻率为108Ω~1012Ω。
7.根据权利要求1所述的一种双界面智能卡模块,其特征在于,在智能卡芯片(2)和抗电磁干扰智能卡载带(1)之间采用填充胶填充并加固。
8.根据权利要求1所述的一种双界面智能卡模块,其特征在于:所述智能卡芯片(2)包括若干个芯片接触式功能焊盘(21)和两个芯片非接触式功能焊盘(22);两个芯片非接触式功能焊盘(22)与智能卡焊接面焊盘层(13)中的非接触式功能焊盘(1312)电连接;芯片接触式功能焊盘(21)分别与智能卡焊接面焊盘层(13)中的接触式功能焊盘(1311)对应电连接。
9.根据权利要求3所述的一种双界面智能卡模块,其特征在于:所述智能卡接触面焊盘层(11)上设有若干个接触式功能焊盘,所述智能卡接触面焊盘层(11)中的接触式功能焊盘分别与所对应的智能卡焊接面焊盘层中的接触式功能焊盘(1311)通过贯穿所述抗电磁干扰基材层(12)的导通孔(14)进行电连接。
10.根据权利要求1~9任一项所述的一种双界面智能卡模块的制作方法,其特征在于,包括以下步骤:
a、采用压合的方式将金属层、抗电磁干扰基材层、金属层三层结构逐层叠加后、通过层压加工成双面线路板,抗电磁干扰基材层作为中间层将两层金属层隔开;
b、对层压完成的双面线路板进行导通孔制作;
c、对导通孔进行电镀,以在抗电磁干扰基材层中的导通孔的侧壁形成电连接层,并填充金属层中的导通孔形成接触式功能焊盘;
d、对双面线路板进行蚀刻线路制作,形成智能卡接触面焊盘层和智能卡焊接面焊盘层;
e、对智能卡芯片功能焊盘采用锡球进行植球;
f、采用倒装焊的方式将智能卡芯片的功能焊盘与智能卡焊接面焊盘电性结合;
g、涂胶进行封装保护。
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