CN111194151A - Modular towards IMA platform's high integration frame - Google Patents
Modular towards IMA platform's high integration frame Download PDFInfo
- Publication number
- CN111194151A CN111194151A CN201911262753.9A CN201911262753A CN111194151A CN 111194151 A CN111194151 A CN 111194151A CN 201911262753 A CN201911262753 A CN 201911262753A CN 111194151 A CN111194151 A CN 111194151A
- Authority
- CN
- China
- Prior art keywords
- rack
- mechanical
- frame
- liquid cooling
- electrical signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a combined IMA platform-oriented high-integration rack, which comprises: the frame foundation component part and the frame combination function module part; wherein, the frame basis component part includes: the device comprises a frame mechanical structural part, an electrical signal motherboard and a power supply circuit; the rack combination function module includes: a detachable electronic functional module and a detachable mechanical structural component; the rack combination functional module is mounted on the rack mechanical structural component or the electrical signal motherboard in a mechanical mode or an electrical interconnection mode. The integrated rack of the IMA platform is formed by combining changeable platform support functions, and the requirements of the IMA platform on high integration degree and diversification of the rack after a plurality of brand new technologies are used are met.
Description
Technical Field
The invention belongs to the field of high-integration rack design, and relates to a combined IMA platform-oriented high-integration rack.
Background
With the further improvement of the comprehensive degree of an airborne avionics system and the development of the avionics task integration, a plurality of task systems are required to be integrated more deeply, so that the performance of hardware functional modules of the integrated processing platform is improved, the number of the hardware functional modules is increased, and with the enhancement of the requirement of the processing capacity of airborne tasks, the IMA platform puts forward new requirements on heat dissipation, debugging and interface interconnection.
Disclosure of Invention
The technical problem solved by the invention is as follows: the invention forms a specific IMA platform integrated frame meeting the user through the combination of the selectable functional components, namely, a high-integration frame meeting the user requirement is quickly formed through the combination of the electronic functional module with the support function and the mechanical structural component, thereby greatly shortening the design and implementation period of the integrated frame, improving the reusability of the design, reducing the design cost, reducing the production cost and the process cost through the application of mature technology, and solving the requirement of the IMA platform on high integration and diversification of the frame after using a plurality of brand new technologies.
The technical scheme of the invention is as follows:
the invention provides a combined IMA platform-oriented high-integration rack, which comprises: the frame foundation component part and the frame combination function module part; wherein the content of the first and second substances,
the frame foundation component includes: the device comprises a frame mechanical structural part, an electrical signal motherboard and a power supply circuit;
the rack combination function module includes: a detachable electronic functional module and a detachable mechanical structural component; the rack combination functional module is mounted on the rack mechanical structural component or the electrical signal motherboard in a mechanical mode or an electrical interconnection mode.
Optionally, the electronic function module includes: the system comprises an optical fiber signal interconnection motherboard, an Ethernet switching module and a serial port switching module; wherein the content of the first and second substances,
the optical fiber signal interconnection motherboard is mechanically installed on a mechanical structural part of the rack and is used for providing optical fiber signal interconnection for all the functional modules installed on the rack;
the Ethernet exchange module is arranged on the electrical signal motherboard in an electrical signal interconnection and mechanical mode and is used for providing exchanged external Ethernet interface signals for all modules with Ethernet interface functions arranged on the rack;
and the serial port exchange module is arranged on the electrical signal motherboard in an electrical signal interconnection and mechanical mode and is used for providing exchanged external Ethernet interface signals for all modules with serial port functions arranged on the rack.
Optionally, the mechanical structure assembly is mechanically mounted on the mechanical structure member of the frame; the mechanical structure assembly comprises a fan assembly, a side wall liquid cooling passage mechanical assembly, a through type liquid cooling passage mechanical assembly and a shock absorber structure assembly; wherein the content of the first and second substances,
the fan subassembly includes: the air duct passage structure consists of a fan component and an air duct passage structure; the fan assembly is arranged right above the rack; the air duct passage structural member is matched with the fan assembly for use and is arranged right below the rack, and when the fan assembly works, heat inside the rack is dissipated from top to bottom;
the sidewall liquid cooling passage mechanical assembly comprises an external liquid cooling inlet, an external liquid cooling outlet and a liquid cooling circulation loop; the side wall liquid cooling passage mechanical assembly is arranged above the rack or on the left side wall and the right side wall;
the through type liquid cooling passage mechanical assembly comprises an external liquid cooling interface, an external liquid cooling outlet, internal liquid cooling interfaces of all modules in the rack and a liquid cooling circulation trunk line; the through type liquid cooling passage mechanical assembly is arranged right behind the rack and is positioned between the rack mechanical structural part and the electrical signal motherboard;
and the shock absorber structural component is arranged at the lowest part of the rack and is used for providing a shock absorption function for the rack.
Optionally, the frame mechanical structure provides an installation space for all the functional modules of the IMA platform, and all the functional modules of the IMA platform are mechanically installed on the frame mechanical structure.
Optionally, the electrical signal motherboard is mechanically mounted on a mechanical structural member of the rack, and provides electrical signal interconnection for all the functional modules mounted on the rack.
Optionally, the power supply circuit is mechanically mounted on a mechanical structural member of the rack, and is configured to safely supply power to all functional components on the rack.
The invention has the beneficial effects that:
the invention forms a specific IMA platform integrated frame meeting the user through the combination of the selectable functional components, namely, a high-integration frame meeting the user requirement is quickly formed through the combination of the electronic functional module with the support function and the mechanical structural component, thereby greatly shortening the design and implementation period of the integrated frame, improving the reusability of the design, reducing the design cost, reducing the production cost and the process cost through the application of mature technology, and solving the requirement of the IMA platform on high integration and diversification of the frame after using a plurality of brand new technologies.
Detailed Description
The technical solution is further described in detail below.
The invention provides a combined IMA platform-oriented high-integration rack, which consists of two parts, namely a rack foundation component and a combinable item, and specifically comprises the following steps:
a) the frame foundation component part: is an integral component of the integrated frame and is a necessary option of the integrated frame. It provides the most basic mechanical components, electrical signal interconnections and power supply circuitry for the rack.
1) Mechanical structural parts of the frame: is a necessary functional component of the integrated frame and is the most basic composition content of the integrated frame. The mechanical structural part of the rack provides reliable installation space for all the functional modules which can be used by the IMA platform, all the functional modules which can be used by the IMA platform are installed on the mechanical structural part of the rack in a mechanical mode, and all the functional modules can be interconnected to exchange data;
2) an electrical signal motherboard: is a necessary functional component of an integrated frame and is arranged on a mechanical structural member of the frame in a mechanical mode. Providing electrical signal interconnections for all functional modules that may ultimately be mounted to an integrated chassis;
3) a power supply circuit: is a necessary functional component of an integrated frame and is arranged on a mechanical structural member of the frame in a mechanical mode. And all functional components on the integrated rack are safely powered.
b) The rack combination function module: the integrated rack is an optional functional component of the integrated rack and is arranged on a mechanical structural component of the rack or an electrical signal motherboard in a mechanical mode or an electrical interconnection mode. The method comprises a frame mechanical structural part combination item and an electronic functional module combination item. The method comprises the following specific steps:
1) an electronic function module: the functional module is an optional functional component of an integrated rack, belongs to a class of airborne electronic modules, realizes specific functions by each functional module, and is mechanically installed on a mechanical structural part of the rack or an electrical signal motherboard. The method specifically comprises the following steps:
i. optical fiber signal interconnection motherboard: the integrated machine frame is an optional functional component of the integrated machine frame and is mechanically installed on a mechanical structural component of the machine frame. Providing fiber optic signal interconnections for all functional modules that may ultimately be mounted to an integrated chassis;
an ethernet switching module: the integrated chassis is an optional functional component of the integrated chassis and is mounted on an electrical signal motherboard in an electrical signal interconnection and mechanical mode. Providing exchanged external Ethernet interface signals for all modules with Ethernet interface functions which can be finally installed on the integrated rack;
a serial port exchange module: the integrated chassis is an optional functional component of the integrated chassis and is mounted on an electrical signal motherboard in an electrical signal interconnection and mechanical mode. Providing exchanged external Ethernet interface signals for all modules with serial port functions which can be finally installed on the integrated rack;
2) mechanical structure component: the mechanical structure component is an optional functional component of an integrated rack and belongs to the class of mechanical structure components, each type of mechanical structure component realizes a specific environment adaptation function, and the mechanical structure components are mechanically installed on a mechanical structural member of the rack. The method specifically comprises the following steps:
i. a fan assembly: the air duct consists of a fan component and an air duct passage structural component. The fan component is an integrated mechanical structure component which is provided with a plurality of industrial fans, and the fan component is arranged right above the rack component; the air duct passage structural member is matched with the fan assembly for use and is arranged right below the rack assembly, and heat inside the rack is dissipated from top to bottom through the fan;
a sidewall liquid cooling passage mechanical assembly; the assembly is suitable for heat dissipation in a side wall liquid cooling mode and comprises an external liquid cooling inlet, an external liquid cooling outlet and a liquid cooling circulation loop. The assembly may be mounted above the frame or on the left and right side walls.
A through liquid cooling passage mechanical assembly: the assembly is suitable for radiating in a through type liquid cooling mode and comprises an external liquid cooling interface, an external liquid cooling outlet, internal liquid cooling interfaces of all modules in the integrated rack and a liquid cooling circulation trunk line. The assembly is arranged right behind the frame and between the frame structural member and the motherboard;
a shock absorber structural assembly: the assembly provides a damping function for the integrated frame, so that the integrated frame can meet the severe installation environment. The assembly is mounted lowermost in the frame.
Claims (9)
1. A modular IMA platform-oriented high-integration gantry, comprising: the frame foundation component part and the frame combination function module part; wherein the content of the first and second substances,
the frame foundation component includes: the device comprises a frame mechanical structural part, an electrical signal motherboard and a power supply circuit;
the rack combination function module includes: a detachable electronic functional module and a detachable mechanical structural component; the rack combination functional module is mounted on the rack mechanical structural component or the electrical signal motherboard in a mechanical mode or an electrical interconnection mode.
2. The rack of claim 1, wherein the electronic functional module comprises: the system comprises an optical fiber signal interconnection motherboard, an Ethernet switching module and a serial port switching module; wherein the content of the first and second substances,
the optical fiber signal interconnection motherboard is mechanically installed on a mechanical structural part of the rack and is used for providing optical fiber signal interconnection for all the functional modules installed on the rack;
the Ethernet exchange module is arranged on the electrical signal motherboard in an electrical signal interconnection and mechanical mode and is used for providing exchanged external Ethernet interface signals for all modules with Ethernet interface functions arranged on the rack;
and the serial port exchange module is arranged on the electrical signal motherboard in an electrical signal interconnection and mechanical mode and is used for providing exchanged external Ethernet interface signals for all modules with serial port functions arranged on the rack.
3. The frame according to claim 1, wherein the mechanical structure component is mechanically mounted to the frame mechanical structure; the mechanical structure assembly comprises a fan assembly;
the fan subassembly includes: the air duct passage structure consists of a fan component and an air duct passage structure; the fan assembly is arranged right above the rack; the air duct passage structural member is matched with the fan assembly for use and is arranged right below the rack, and when the fan assembly works, heat inside the rack is dissipated from top to bottom.
4. The frame of claim 3, wherein the mechanical structure assembly further comprises a sidewall liquid cooled channel mechanical assembly;
the sidewall liquid cooling passage mechanical assembly comprises an external liquid cooling inlet, an external liquid cooling outlet and a liquid cooling circulation loop; and the side wall liquid cooling passage mechanical assembly is arranged above the rack or on the left side wall and the right side wall.
5. The frame of claim 4, wherein the mechanical structure assembly further comprises a through liquid cooling path mechanical assembly;
the through type liquid cooling passage mechanical assembly comprises an external liquid cooling interface, an external liquid cooling outlet, internal liquid cooling interfaces of all modules in the rack and a liquid cooling circulation trunk line; the through type liquid cooling passage mechanical assembly is arranged right behind the rack and is positioned between the rack mechanical structural part and the electrical signal motherboard.
6. The frame according to claim 5, wherein the mechanical structure assembly further comprises: a shock absorber structural component;
and the shock absorber structural component is arranged at the lowest part of the rack and is used for providing a shock absorption function for the rack.
7. A frame as claimed in claim 1, wherein a frame machine structure provides mounting space for all the functional modules of the IMA platform, which are mechanically mounted on the frame machine structure.
8. The rack of claim 1, wherein the electrical signal motherboard is mechanically mounted to a mechanical structural component of the rack to provide electrical signal interconnection for all functional modules mounted to the rack.
9. The rack of claim 1, wherein the power supply circuit is mechanically mounted on a mechanical structure of the rack for safely supplying power to all functional components on the rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911262753.9A CN111194151A (en) | 2019-12-10 | 2019-12-10 | Modular towards IMA platform's high integration frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911262753.9A CN111194151A (en) | 2019-12-10 | 2019-12-10 | Modular towards IMA platform's high integration frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111194151A true CN111194151A (en) | 2020-05-22 |
Family
ID=70709237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911262753.9A Pending CN111194151A (en) | 2019-12-10 | 2019-12-10 | Modular towards IMA platform's high integration frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111194151A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140175030A1 (en) * | 2012-12-20 | 2014-06-26 | Giga-Byte Technology Co., Ltd. | Server rack |
| CN105658030A (en) * | 2016-01-11 | 2016-06-08 | 中国电子科技集团公司第十研究所 | Corrosion-resistant modular integrated frame |
| CN105992476A (en) * | 2016-07-13 | 2016-10-05 | 西安电子工程研究所 | Sealed cabinet with independent cooling air duct for each module |
| CN110337209A (en) * | 2019-07-16 | 2019-10-15 | 中国电子科技集团公司第二十九研究所 | A kind of electronic cabinet and its assemble method of structure-function integration |
-
2019
- 2019-12-10 CN CN201911262753.9A patent/CN111194151A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140175030A1 (en) * | 2012-12-20 | 2014-06-26 | Giga-Byte Technology Co., Ltd. | Server rack |
| CN105658030A (en) * | 2016-01-11 | 2016-06-08 | 中国电子科技集团公司第十研究所 | Corrosion-resistant modular integrated frame |
| CN105992476A (en) * | 2016-07-13 | 2016-10-05 | 西安电子工程研究所 | Sealed cabinet with independent cooling air duct for each module |
| CN110337209A (en) * | 2019-07-16 | 2019-10-15 | 中国电子科技集团公司第二十九研究所 | A kind of electronic cabinet and its assemble method of structure-function integration |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2007047386A3 (en) | Method for electronics equipment cooling having improved emi control and reduced weight | |
| US8144458B2 (en) | Component layout in an enclosure | |
| US20130077223A1 (en) | Server | |
| JP2007504569A (en) | Computer rack with power distribution system | |
| CN104597973B (en) | Cloud server system | |
| CN112414207A (en) | Portable general parallel test equipment | |
| CN108337844B (en) | Modularized high-speed VPX bus multi-blade server case | |
| CN203786606U (en) | Cabinet type server device | |
| CN111194151A (en) | Modular towards IMA platform's high integration frame | |
| WO2022126937A1 (en) | Drawer-type high-density fpga cloud platform case | |
| CN205210788U (en) | Place electronic component's installation frame | |
| CN211745074U (en) | Server cabinet and heat exchange equipment cabinet for server | |
| CN109936597A (en) | A kind of multi-module cluster formula server application device | |
| CN216145187U (en) | Server capable of achieving efficient heat dissipation | |
| CN210297698U (en) | Digital relay station device and case | |
| CN203840329U (en) | Drawer-type power source device used for 2U transceiver | |
| CN210671122U (en) | Liquid cooling transceiver that many platforms were fit for dress | |
| CN111177921A (en) | Design method and system for airborne platform integrated general processing system | |
| CN220986438U (en) | Integrated fan heat dissipation device | |
| CN212256226U (en) | Modularized big data scientific research platform | |
| WO2017193721A1 (en) | Modular router | |
| CN109739314A (en) | A kind of computer hardware case that controlling is strong | |
| CN220292448U (en) | Communication data wireless acquisition terminal with high safety | |
| CN117202607A (en) | Heat dissipation design method for rack-mounted multi-GPU server structure | |
| CN215341070U (en) | Server machine case convenient to connect and server thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200522 |
|
| RJ01 | Rejection of invention patent application after publication |