CN117202607A - Heat dissipation design method for rack-mounted multi-GPU server structure - Google Patents
Heat dissipation design method for rack-mounted multi-GPU server structure Download PDFInfo
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- CN117202607A CN117202607A CN202311062112.5A CN202311062112A CN117202607A CN 117202607 A CN117202607 A CN 117202607A CN 202311062112 A CN202311062112 A CN 202311062112A CN 117202607 A CN117202607 A CN 117202607A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 238000012423 maintenance Methods 0.000 claims abstract description 10
- 239000007921 spray Substances 0.000 claims abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The invention belongs to the field of servers, in particular to a method for designing the structural heat dissipation of a rack-mounted multi-GPU server, which aims at solving the problems of maintainability and expandability in the existing liquid cooling heat dissipation and is not beneficial to the commercial popularization of the liquid cooling heat dissipation technology, and the scheme is provided, which comprises a spray-type liquid cooling heat dissipation design and a structural modularized design and is characterized in that the structural modularized design comprises a calculation subsystem, a GPU subsystem, a storage subsystem, a network subsystem and a power subsystem; the spray type liquid cooling heat dissipation design specifically comprises: the invention solves the difficult problem of heat dissipation caused by heating of the GPU core, effectively reduces noise and vibration, reduces PUE to save energy consumption, effectively solves the problems of easy volatilization of liquid, low space utilization rate, difficult maintenance and the like, solves the difficult problem of heat dissipation of multiple GPU servers, and simultaneously meets the requirements of expandability and maintainability of the system.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a heat dissipation design method for a rack-mounted multi-GPU server structure.
Background
With the continuous increase of the power consumption of the CPU and the GPU of the server, the adoption of an air cooling technology for cooling the system cannot be realized for some high-power consumption CPU and multi-GPU server systems.
The liquid cooling technology provides a new solution for the heat dissipation of the server by virtue of the advantages of high heat dissipation efficiency, noise reduction, energy conservation and the like. However, compared with air cooling heat dissipation, the liquid cooling heat dissipation has the design problems of maintainability and expandability, and is not beneficial to the commercial popularization of the liquid cooling heat dissipation technology.
Disclosure of Invention
The invention aims to solve the problems of maintainability and expandability in liquid cooling heat dissipation in the prior art and is unfavorable for the commercialized popularization of a liquid cooling heat dissipation technology, and provides a frame type multi-GPU server structure heat dissipation design method.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the design method comprises a spray type liquid cooling heat dissipation design and a structure modularization design, wherein the structure modularization design comprises a computing subsystem, a GPU subsystem, a storage subsystem, a network subsystem and a power subsystem;
the spray type liquid cooling heat dissipation design specifically comprises: and (3) liquid is sprayed in the top layer of the server, liquid is recovered in the bottom layer of the server, and heat is exchanged through an external CDU and then returned for circulating heat dissipation.
Preferably, each module of the structural modular design supports front-to-back plug maintenance.
Preferably, the server volatile liquid is isolated inside the cabinet by the closed cabinet design and does not volatilize into the machine room.
Preferably, the structural modularized design comprises a computing subsystem, a GPU subsystem, a storage subsystem, a network subsystem and a power subsystem, and is connected with each other through PCIE back boards in a modularized design mode.
In the invention, the frame type multi-GPU server structure heat dissipation design method has the beneficial effects that:
1. compared with the air-cooled heat dissipation server technology, the heat dissipation problem that the heat of the GPU core is not generated is solved, noise and vibration are effectively reduced, and the PUE is reduced so as to save energy consumption.
2. Compared with the Tank immersed liquid cooling server technology, the invention effectively solves the problems of easy volatilization of liquid, low space utilization rate, difficult maintenance and the like.
3. By adopting the design method, the heat dissipation problem of the multiple GPU servers is solved, and the requirements of expandability and maintainability of the system are met.
Drawings
Fig. 1 is a design diagram of a 16GPU server architecture of a method for designing a heat dissipation of a rack-mounted multi-GPU server architecture according to the present invention;
fig. 2 is a heat dissipation design diagram of a 16GPU server according to the heat dissipation design method of a rack-mounted multi-GPU server structure provided by the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-2, a method for designing heat dissipation of a rack-mounted multi-GPU server structure is provided.
Example 1
A rack-mounted multi-GPU server structure heat dissipation design method comprises a spray-type liquid cooling heat dissipation design and a structure modularization design, wherein the structure modularization design comprises a computing subsystem, a GPU subsystem, a storage subsystem, a network subsystem and a power subsystem;
the spray type liquid cooling heat dissipation design specifically comprises: and (3) liquid is sprayed in the top layer of the server, liquid is recovered in the bottom layer of the server, and heat is exchanged through an external CDU and then returned for circulating heat dissipation.
In this embodiment, each module of the structural modular design supports front-to-back plug maintenance.
In this embodiment, the server volatile liquid is isolated inside the cabinet by the closed cabinet design and does not volatilize into the machine room.
In this embodiment, the structural modularized design includes a computing subsystem, a GPU subsystem, a storage subsystem, a network subsystem, and a power subsystem, and is connected to each other through PCIE backplanes in a modularized design manner.
Example two
The invention will be described in further detail with reference to a 16GPU server design:
system architecture aspects (see fig. 1):
1) The system takes a PCIE switching backboard as a core, adopts 4 PLX switching chips, and supports PCIE 5.0 standard data switching.
2) The GPU module supports 2 HGX H100/H800/A100/A800 GPU modules or 2 PCIE mode 8GPU modules, and supports plug maintenance.
3) And the computing module supports various platform mainboard specifications (Intel, AMD, feiteng, sea light and the like), and the module supports plug-in maintenance.
4) The hard disk module supports 24 SSD hard disks, and the hard disks support single hot plug maintenance.
5) The network module supports 8 100G/200G/400G optical modules IB network cards, and each network card can independently support plug maintenance.
6) The power supply module supports 8 CRPS power supplies with 550W-3000W unequal specifications, and the power supply supports single hot plug maintenance.
System heat dissipation aspect (see fig. 2):
1) And (5) liquid inlet and outlet design. The liquid inlet is positioned at the top of the rear end and communicated with the top spray plate; the liquid outlet is positioned at the bottom of the rear end and communicated with the bottom bus plate.
And (5) designing a flow channel. The GPU module dissipates heat, sprays and guides the flow, and the bottom is converged; the CPU module dissipates heat, the top spraying plate is provided with holes, sprays to the CPU, the memory and the like, and is converged at the bottom; PLX chip, network card, hard disk, power supply heat dissipation, top-down sprays, bottom converges.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (4)
1. The method for designing the structural heat dissipation of the rack-mounted multi-GPU server comprises a spray-type liquid cooling heat dissipation design and a structural modularized design, and is characterized in that the structural modularized design comprises a computing subsystem, a GPU subsystem, a storage subsystem, a network subsystem and a power subsystem;
the spray type liquid cooling heat dissipation design specifically comprises: and (3) liquid is sprayed in the top layer of the server, liquid is recovered in the bottom layer of the server, and heat is exchanged through an external CDU and then returned for circulating heat dissipation.
2. The method for designing a rack-mounted multiple GPU server architecture heat dissipation according to claim 1, wherein each module of the architecture modular design supports front-to-back plug maintenance.
3. The method for designing a rack-mounted multiple GPU server architecture for heat dissipation according to claim 2, wherein the server volatile liquid is isolated from the interior of the cabinet by a closed cabinet design and does not volatilize into the machine room.
4. The method for designing heat dissipation of a rack-mounted multi-GPU server structure according to claim 3, wherein the modular design of the structure comprises a computing subsystem, a GPU subsystem, a storage subsystem, a network subsystem and a power subsystem, and the modular design is adopted, and the modular design is connected with each other through PCIE back boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311062112.5A CN117202607A (en) | 2023-08-23 | 2023-08-23 | Heat dissipation design method for rack-mounted multi-GPU server structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311062112.5A CN117202607A (en) | 2023-08-23 | 2023-08-23 | Heat dissipation design method for rack-mounted multi-GPU server structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117202607A true CN117202607A (en) | 2023-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311062112.5A Pending CN117202607A (en) | 2023-08-23 | 2023-08-23 | Heat dissipation design method for rack-mounted multi-GPU server structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN117202607A (en) |
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2023
- 2023-08-23 CN CN202311062112.5A patent/CN117202607A/en active Pending
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