CN111159970B - Multi-physical-field analysis method and device for flexible interconnection reliability - Google Patents
Multi-physical-field analysis method and device for flexible interconnection reliability Download PDFInfo
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- CN111159970B CN111159970B CN201911248429.1A CN201911248429A CN111159970B CN 111159970 B CN111159970 B CN 111159970B CN 201911248429 A CN201911248429 A CN 201911248429A CN 111159970 B CN111159970 B CN 111159970B
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Abstract
The invention provides a multi-physical field analysis method and device aiming at flexible interconnection reliability. The method comprises the following steps: importing the flexible interconnection circuit design file into electromagnetic simulation software; based on the flexible interconnection circuit design file, establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in electromagnetic simulation software; extracting interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model; calculating a first error rate of the flexible interconnection circuit board according to the interconnection transmission parameters; at a first error rate of 10 or less ‑12 When the flexible interconnection circuit board is in the process of structural simulation, calculating to obtain the maximum deformation which can be born by the flexible interconnection circuit board; determining a maximum deformation model of the flexible circuit board based on the maximum deformation; calculating a second error rate of the flexible interconnection circuit board according to the maximum deformation model; and analyzing the signal transmission quality of the flexible interconnection circuit board based on the second error rate. The invention can realize the full evaluation of the reliability of the flexible circuit.
Description
Technical Field
The invention relates to the technical field of circuit design, in particular to a multi-physical field analysis method and device aiming at flexible interconnection reliability.
Background
The flexible electronic overcomes the defect of brittleness and hardness of the traditional inorganic electronic product, and greatly expands the application range of the microelectronic device with excellent extensibility on the basis of maintaining excellent electrical properties. Flexible interconnects are a critical scientific issue in flexible electronics research. The flexible interconnect is not only the primary load bearing object for the deformation of the flexible circuit, but the deformed interconnect has a significant impact on the signal integrity of the electronic system. Therefore, it is important to deeply analyze the electrical properties and deformation rules of the flexible interconnect and establish a reliability analysis suitable for an electronic system, which is also a necessary premise for performance simulation and optimization of interconnect layout and wiring of the flexible electronic system.
The flexible circuit board takes a combination of a conductor and a heat-resistant polymer film as a basic structure, and the flexible circuit board with the conductor arranged on only one side of the heat-resistant polymer film is called a single-side flexible circuit board; a flexible circuit board in which conductors are provided on both sides of a heat-resistant polymer film is called a double-sided flexible circuit board. In a method for producing a single-sided flexible circuit board, a copper foil laminate, that is, a copper foil laminate laminated on a heat-resistant polymer film with an adhesive, is generally used, and a wiring pattern can be formed by applying a metal surface etching method to the copper foil laminate, whereby a single-sided flexible circuit board is produced. The multilayer flexible circuit board is a circuit board obtained by coating a film and an insulating resin on a single-sided flexible circuit board or a double-sided flexible circuit board, and is formed by forming a via conductor by providing a metal on the inner wall of a via hole by a plating method, and connecting wiring patterns of the layers of the multilayer flexible circuit board.
With the rapid increase of signal transmission frequency, the signal quality borne by the flexible interconnection is of great importance, but the analysis of the reliability of the flexible interconnection still has the following problems:
firstly, the analysis of the electrical performance of the flexible interconnection is mainly based on testing, and the main parameters of the testing are the transmission impedance, the insertion loss and the return loss parameters of the interconnection line. Most of analysis objects are concentrated at a packaging level, analysis frequency bands are concentrated at a direct current or low frequency stage, and few modeling and analysis methods of flexible interconnection for high frequency stage and long-distance transmission are studied;
secondly, the flexible circuit board has the advantages of small volume, thin thickness, light weight, large flexibility, simple and flexible structure and the like, and is used for occasions of dynamic bending, curling and folding. However, the flexible interconnection faces large-amplitude bending, the flexible board has low local rigidity, high vibration frequency, poor compression resistance and bending resistance, the problems of strong nonlinearity and high coupling exist, the deformation under the stress condition has the characteristic of nonlinearity, and the difficulty is how to simulate the structural characteristics after the nonlinear deformation.
Third, influence of deformation on electrical characteristics: and analyzing the influence of different deformations on the signal transmission quality of the flexible interconnection. Because the flexible board structure can not resist external pressure and has small bending rigidity, the flexible board often generates bending after being subjected to the action of external pressure or bending torsion, and internal electric signal transmission distortion is possibly caused after bending.
Disclosure of Invention
The invention solves the technical problems that: the defects of the prior art are overcome, and a multi-physical field analysis method and device aiming at flexible interconnection reliability are provided.
In order to solve the above technical problems, an embodiment of the present invention provides a multi-physical field analysis method for reliability of flexible interconnection, including:
importing the flexible interconnection circuit design file into electromagnetic simulation software;
based on the flexible interconnection circuit design file, establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software;
extracting interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model;
calculating a first error rate of the flexible interconnection circuit board under the actual working frequency according to the interconnection transmission parameters;
at the first error rate of 10 or less -12 When the flexible interconnection circuit board is in the process of structural simulation, calculating to obtain the maximum deformation which can be born by the flexible interconnection circuit board;
determining a maximum deformation model of the flexible circuit board based on the maximum deformation;
calculating a second error rate of the flexible interconnection circuit board under the actual working frequency according to the maximum deformation model;
and analyzing the signal transmission quality of the flexible interconnection circuit board based on the second error rate.
Preferably, the step of establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file includes:
setting material parameters and lamination parameters of the flexible interconnection circuit board according to the flexible interconnection circuit design file, wherein the material parameters comprise transmission wire material parameters and medium parameters;
calculating the skin depth of the flexible interconnection circuit board under high frequency;
calculating and setting the maximum length of the grid when dividing the electromagnetic field finite element grid;
calculating and extracting electromagnetic scattering parameters of the flexible interconnection circuit board;
determining whether the flexible interconnection circuit board has deformation and distortion states;
when the flexible interconnection circuit board is in a deformation and torsion state, the three-dimensional electromagnetic model is built according to the transmission wire material parameters, the medium parameters, the lamination parameters, the skin depth, the maximum length and the electromagnetic scattering parameters.
Preferably, the step of calculating the first error rate of the flexible interconnection circuit board at the actual operating frequency according to the interconnection transmission parameters includes:
calculating a transmission eye pattern, a jitter parameter and a bathtub curve of a high-speed signal under the actual working frequency according to the three-dimensional electromagnetic model and the interconnection transmission parameter;
and calculating the first error rate according to the transmission eye diagram, the jitter parameter and the bathtub curve.
Preferably, after the step of calculating the first error rate of the flexible interconnect circuit board at the actual operating frequency according to the interconnect transmission parameter, the method further includes:
at the first error rate greater than 10 -12 When the flexible interconnect is redesignedAnd the flexible interconnection circuit design file corresponding to the connection circuit board.
Preferably, the step of performing structural simulation on the flexible interconnection circuit board to calculate the maximum deformation that the flexible interconnection circuit board can bear includes:
setting material properties of the flexible interconnection circuit board;
dividing a finite element grid;
applying boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
and calculating the maximum deformation according to the material property, the finite element mesh, the boundary condition and the load.
Preferably, the step of analyzing the signal transmission quality of the flexible interconnection circuit board based on the second error rate includes:
at the second error rate of 10 or less -12 When the flexible interconnection circuit board is in the maximum deformation condition, determining that the signal transmission is error-free;
at the second error rate is greater than 10 -12 And determining that the quality of the transmitted electric signal cannot be ensured under the state of maximum deformation of the flexible interconnection circuit board.
In order to solve the above technical problems, an embodiment of the present invention provides a multi-physical field analysis device for flexible interconnection reliability, including:
the circuit design file importing module is used for importing the flexible interconnection circuit design file into electromagnetic simulation software;
the three-dimensional electromagnetic model building module is used for building a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file;
the interconnection transmission parameter extraction module is used for extracting interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model;
the first error rate calculation module is used for calculating a first error rate of the flexible interconnection circuit board under the actual working frequency according to the interconnection transmission parameters;
a maximum deformation calculation module configured to, when the first error rate is less than or equal to 10 -12 When the flexible interconnection circuit board is in the process of structural simulation, calculating to obtain the maximum deformation which can be born by the flexible interconnection circuit board;
the maximum deformation model determining module is used for determining a maximum deformation model of the flexible circuit board based on the maximum deformation;
the second error rate calculation module is used for calculating a second error rate of the flexible interconnection circuit board under the actual working frequency according to the maximum deformation model;
and the signal transmission quality analysis module is used for analyzing the signal transmission quality of the flexible interconnection circuit board based on the second error rate.
Preferably, the three-dimensional electromagnetic model building module includes:
a material lamination parameter setting sub-module, configured to set material parameters and lamination parameters of the flexible interconnection circuit board according to the flexible interconnection circuit design file, where the material parameters include transmission wire material parameters and medium parameters;
the skin depth calculation sub-module is used for calculating the skin depth of the flexible interconnection circuit board under high frequency;
the maximum length calculation sub-module is used for calculating and setting the maximum length of the grid when the electromagnetic field finite element grid is divided;
the electromagnetic scattering parameter calculation sub-module is used for calculating and extracting electromagnetic scattering parameters of the flexible interconnection circuit board;
the deformation and distortion state determining submodule is used for determining whether the flexible interconnection circuit board has deformation and distortion states or not;
and the three-dimensional electromagnetic model building sub-module is used for building the three-dimensional electromagnetic model according to the transmission wire material parameters, the medium parameters, the lamination parameters, the skin depth, the maximum length and the electromagnetic scattering parameters when the flexible interconnection circuit board is in a deformation and torsion state.
Preferably, the first bit error rate calculation module includes:
the eye pattern jitter bathtub calculation submodule is used for calculating a transmission eye pattern, jitter parameters and bathtub curves of the high-speed signal under the actual working frequency according to the three-dimensional electromagnetic model and the interconnection transmission parameters;
and the first error rate calculation submodule is used for calculating the first error rate according to the transmission eye pattern, the jitter parameter and the bathtub curve.
Preferably, the method further comprises:
a circuit design file redesign module for, at the first bit error rate greater than 10 -12 And when the flexible interconnection circuit board is in a flexible interconnection circuit design file, the flexible interconnection circuit design file corresponding to the flexible interconnection circuit board is redesigned.
Preferably, the maximum deformation calculation module includes:
a material property setting sub-module for setting material properties of the flexible interconnection circuit board;
the finite element grid dividing sub-module is used for dividing the finite element grid;
the boundary condition load applying sub-module is used for applying boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
and the maximum deformation calculation submodule is used for calculating the maximum deformation according to the material attribute, the finite element grid, the boundary condition and the load.
Preferably, the signal transmission quality analysis module includes:
a transmission error-free determination submodule for determining that the second error rate is less than or equal to 10 -12 When the flexible interconnection circuit board is in the maximum deformation condition, determining that the signal transmission is error-free;
an electrical signal quality determination sub-module for determining a quality of the electrical signal at the second bit error rate greater than 10 -12 And determining that the quality of the transmitted electric signal cannot be ensured under the state of maximum deformation of the flexible interconnection circuit board.
Compared with the prior art, the invention has the advantages that:
(1) The invention adopts a method for dividing the surface grid of the ultrathin circuit board based on skin effect in the electrical performance analysis method of the flexible interconnection circuit board, and fully considers the skin effect brought by high-speed transmission;
(2) The method comprises the steps of calculating the maximum deformation of the flexible interconnection circuit board through structural simulation analysis, and extracting a maximum deformation model;
(3) The reliability of the flexible circuit is fully evaluated by combining structural analysis and electromagnetic field analysis by adopting a multi-physical field analysis method.
Drawings
FIG. 1 is a flow chart of steps of a multi-physical field analysis method for flexible interconnect reliability according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a multi-physical field analysis device for reliability of flexible interconnection according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the present invention. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the invention, are within the scope of the embodiments of the invention.
Example 1
Referring to fig. 1, a step flow chart of a multi-physical field analysis method for reliability of flexible interconnection provided by an embodiment of the present invention is shown, and as shown in fig. 1, the multi-physical field analysis method for reliability of flexible interconnection may specifically include the following steps:
step 101: and importing the flexible interconnection circuit design file into electromagnetic simulation software.
In the embodiment of the present invention, the format of the flexible interconnect circuit design file may be a brd format or an ANF format.
First, a flexible interconnect circuit design file may be imported into electromagnetic simulation software, and step 102 is performed.
Step 102: and establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file.
Step 103: and extracting interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model.
Step 104: and calculating a first error rate of the flexible interconnection circuit board under the actual working frequency according to the interconnection transmission parameters.
Three-dimensional electromagnetic modeling is carried out under the state that the flexible circuit board is free from deformation and distortion, transmission parameters are extracted, analysis of a frequency domain and a time domain is carried out, and transmission eye diagrams and jitter parameters of high-speed signals are analyzed, wherein the method comprises the following specific steps:
a) Setting material parameters and lamination parameters of the flexible PCB (Printed Circuit Board ), wherein the material parameters comprise transmission wire material parameters and medium parameters;
b) Calculating the skin depth of the flexible circuit under high frequency, and calculating and setting the maximum length of the grid when dividing the finite element grid;
the skin depth delta is calculated as follows:
in the above formula (1), δ is the metal skin depth, f is the transmission frequency, u is the metal permeability, and σ is the metal conductivity.
After the skin depth of the metal is obtained, finite element grid setting based on the skin depth is further carried out on the surface of a transmission line in the flexible circuit board, and in order to accurately calculate electromagnetic parameters of a high-speed ultrathin conductor, grid division of the surface of the conductor needs to be fine enough, and the grid length is not more than the skin depth.
c) Frequency domain simulation: calculating and extracting electromagnetic scattering parameters (simulation frequency range is direct current to cut-off frequency) of the flexible interconnection;
the calculation formula of the cutoff frequency is:
F＝0.35/TR (2)
in the above formula (2), F is a cut-off frequency, and TR is a rise time of an actual operation signal.
d) Time domain simulation: an analysis circuit model is built, an excitation source is a square wave signal, the frequency of the excitation source is the frequency of an actual working signal, an eye pattern, jitter and bathtub curves of a high-speed signal at the frequency are calculated, and the error rate at the frequency is calculated.
Step 105: at the first error rate of 10 or less -12 And during the process, carrying out structural simulation on the flexible interconnection circuit board, and calculating to obtain the maximum deformation which can be born by the flexible interconnection circuit board.
Judging the error rate calculated, if it is less than or equal to 10 -12 Then the next analysis is performed if it is greater than 10 -12 The interconnect line is proved to be unable to guarantee the quality of the transmitted electrical signal in the non-deformed state, and the design is modified back to the first step.
Structural simulation (simulation software is ANSYS Mechanical or PATAN) is carried out on a flexible circuit board design file (brd), and the maximum deformation which the flexible circuit board can bear is calculated by the following steps:
a) Setting material properties, and introducing interconnection line characteristic parameters for the flexible printed circuit board structure;
b) Dividing a finite element grid;
c) Refining finite element grids;
d) Applying boundary conditions and loads;
e) Analysis and calculation, and post-processing of results: outputting modes, stress and deformation;
f) And outputting the model file.
At a first error rate of 10 or less -12 And when the flexible interconnection circuit board is subjected to structural simulation, the maximum deformation which can be born by the flexible interconnection circuit board is calculated, and then the step 106 is executed.
Step 106: determining a maximum deformation model of the flexible circuit board based on the maximum deformation;
step 107: and calculating a second error rate of the flexible interconnection circuit board under the actual working frequency according to the maximum deformation model.
And obtaining a maximum deformation model of the flexible interconnection, namely a worst working condition model according to the result of the structural analysis, carrying out another electrical analysis on the model, extracting transmission parameters of the interconnection line in the deformation state in the analysis step as step 104, carrying out analysis of a frequency domain and a time domain, calculating an eye pattern, jitter and bathtub curve of a high-speed signal under the actual working frequency, and calculating the bit error rate under the frequency, namely a second bit error rate.
Step 108: and analyzing the signal transmission quality of the flexible interconnection circuit board based on the second error rate.
Judging the second error rate if less than or equal to 10 -12 The flexible PCB is proved to have no error code in signal transmission under the condition of maximum deformation, and the design is completed; if it is greater than 10 -12 The interconnect line is proved to be unable to guarantee the quality of the transmitted electrical signal in the state of maximum deformation, and the design is modified in a first step.
The multi-physical field analysis method for the reliability of the flexible interconnection, provided by the embodiment of the invention, has the following beneficial effects:
(1) The invention adopts a method for dividing the surface grid of the ultrathin circuit board based on skin effect in the electrical performance analysis method of the flexible interconnection circuit board, and fully considers the skin effect brought by high-speed transmission;
(2) The method comprises the steps of calculating the maximum deformation of the flexible circuit board through structural simulation analysis, and extracting a maximum deformation model;
(3) The reliability of the flexible circuit is fully evaluated by combining structural analysis and electromagnetic field analysis by adopting a multi-physical field analysis method.
Example two
Referring to fig. 2, a schematic structural diagram of a multi-physical field analysis device for reliability of flexible interconnection provided by an embodiment of the present invention is shown, and as shown in fig. 2, the multi-physical field analysis device for reliability of flexible interconnection may specifically include the following modules:
a circuit design file importing module 201, configured to import a flexible interconnect circuit design file into electromagnetic simulation software;
the three-dimensional electromagnetic model building module 202 is configured to build a three-dimensional electromagnetic model corresponding to the flexible interconnect circuit board in the electromagnetic simulation software based on the flexible interconnect circuit design file;
the interconnection transmission parameter extraction module 203 is configured to extract interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model;
a first bit error rate calculation module 204, configured to calculate a first bit error rate of the flexible interconnect circuit board at an actual operating frequency according to the interconnect transmission parameter;
a maximum deformation calculation module 205, configured to, when the first error rate is less than or equal to 10 -12 When the flexible interconnection circuit board is in the process of structural simulation, calculating to obtain the maximum deformation which can be born by the flexible interconnection circuit board;
a maximum deformation model determining module 206, configured to determine a maximum deformation model of the flexible interconnection circuit board based on the maximum deformation;
a second error rate calculation module 207, configured to calculate a second error rate of the flexible interconnection circuit board at an actual working frequency according to the maximum deformation model;
and a signal transmission quality analysis module 208, configured to analyze signal transmission quality of the flexible interconnection circuit board based on the second error rate.
Preferably, the three-dimensional electromagnetic model building module 202 includes:
a material lamination parameter setting sub-module, configured to set material parameters and lamination parameters of the flexible interconnection circuit board according to the flexible interconnection circuit design file, where the material parameters include transmission wire material parameters and medium parameters;
the skin depth calculation sub-module is used for calculating the skin depth of the flexible interconnection circuit board under high frequency;
the maximum length calculation sub-module is used for calculating and setting the maximum length of the grid when the electromagnetic field finite element grid is divided;
the electromagnetic scattering parameter calculation sub-module is used for calculating and extracting electromagnetic scattering parameters of the flexible interconnection circuit board;
the deformation and distortion state determining submodule is used for determining whether the flexible interconnection circuit board has deformation and distortion states or not;
and the three-dimensional electromagnetic model building sub-module is used for building the three-dimensional electromagnetic model according to the transmission wire material parameters, the medium parameters, the lamination parameters, the skin depth, the maximum length and the electromagnetic scattering parameters when the flexible interconnection circuit board is in a deformation and torsion state.
Preferably, the first bit error rate calculation module 204 includes:
the eye pattern jitter bathtub calculation submodule is used for calculating a transmission eye pattern, jitter parameters and bathtub curves of the high-speed signal under the actual working frequency according to the three-dimensional electromagnetic model and the interconnection transmission parameters;
and the first error rate calculation submodule is used for calculating the first error rate according to the transmission eye pattern, the jitter parameter and the bathtub curve.
Preferably, the method further comprises:
a circuit design file redesign module for, at the first bit error rate greater than 10 -12 And when the flexible interconnection circuit board is in a flexible interconnection circuit design file, the flexible interconnection circuit design file corresponding to the flexible interconnection circuit board is redesigned.
Preferably, the maximum deformation calculation module 205 includes:
a material property setting sub-module for setting material properties of the flexible interconnection circuit board;
the finite element grid dividing sub-module is used for dividing the finite element grid;
the boundary condition load applying sub-module is used for applying boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
and the maximum deformation calculation submodule is used for calculating the maximum deformation according to the material attribute, the finite element grid, the boundary condition and the load.
Preferably, the signal transmission quality analysis module 208 includes:
a transmission error-free determination submodule for determining that the second error rate is less than or equal to 10 -12 When the flexible interconnection circuit board is in the maximum deformation condition, determining that the signal transmission is error-free;
an electrical signal quality determination sub-module for determining a quality of the electrical signal at the second bit error rate greater than 10 -12 And determining that the quality of the transmitted electric signal cannot be ensured under the state of maximum deformation of the flexible interconnection circuit board.
The foregoing description is of the preferred embodiment of the invention and is not intended to limit the embodiment of the invention, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A multi-physical field analysis method for flexible interconnect reliability, comprising:
importing the flexible interconnection circuit design file into electromagnetic simulation software;
based on the flexible interconnection circuit design file, establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software;
extracting interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model;
calculating a first error rate of the flexible interconnection circuit board under the actual working frequency according to the interconnection transmission parameters;
at the first error rate of 10 or less -12 When the flexible interconnection circuit board is in the process of structural simulation, calculating to obtain the maximum deformation which can be born by the flexible interconnection circuit board;
determining a maximum deformation model of the flexible interconnection circuit board based on the maximum deformation;
carrying out another electrical analysis on the maximum deformation model, extracting transmission parameters of the interconnection line under the deformation state, carrying out analysis on a frequency domain and a time domain, calculating eye patterns, jitter and bathtub curves of high-speed signals under the actual working frequency, and calculating the bit error rate under the frequency, namely a second bit error rate;
analyzing the signal transmission quality of the flexible interconnection circuit board based on the second error rate;
the step of establishing a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file comprises the following steps:
setting material parameters and lamination parameters of the flexible interconnection circuit board according to the flexible interconnection circuit design file, wherein the material parameters comprise transmission wire material parameters and medium parameters;
calculating the skin depth of the flexible interconnection circuit board under high frequency;
calculating and setting the maximum length of the grid when dividing the electromagnetic field finite element grid;
calculating and extracting electromagnetic scattering parameters of the flexible interconnection circuit board;
determining whether the flexible interconnection circuit board has deformation and distortion states;
when the flexible interconnection circuit board is in a deformation and torsion state, the three-dimensional electromagnetic model is built according to the transmission wire material parameters, the medium parameters, the lamination parameters, the skin depth, the maximum length and the electromagnetic scattering parameters.
2. The method of claim 1, wherein the step of calculating a first bit error rate of the flexible interconnect circuit board at an actual operating frequency based on the interconnect transmission parameters comprises:
calculating a transmission eye pattern, a jitter parameter and a bathtub curve of a high-speed signal under the actual working frequency according to the three-dimensional electromagnetic model and the interconnection transmission parameter;
and calculating the first error rate according to the transmission eye diagram, the jitter parameter and the bathtub curve.
3. The method of claim 1, wherein, after said step of calculating a first bit error rate of said flexible interconnect circuit board at an actual operating frequency based on said interconnect transmission parameters,
further comprises:
at the first error rate greater than 10 -12 And when the flexible interconnection circuit board is in a flexible interconnection circuit design file, the flexible interconnection circuit design file corresponding to the flexible interconnection circuit board is redesigned.
4. The method of claim 1, wherein said step of performing structural simulation on said flexible interconnect circuit board calculates a maximum deformation that said flexible interconnect circuit board can withstand,
comprising the following steps:
setting material properties of the flexible interconnection circuit board;
dividing a finite element grid;
applying boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
and calculating the maximum deformation according to the material property, the finite element mesh, the boundary condition and the load.
5. The method of claim 1, wherein said determining is based on said second bit error rate,
a step of analyzing signal transmission quality of the flexible interconnect circuit board, comprising:
at the second error rate of 10 or less -12 When the flexible interconnection circuit board is in the maximum deformation condition, determining that the signal transmission is error-free;
at the second error rate is greater than 10 -12 And determining that the quality of the transmitted electric signal cannot be ensured under the state of maximum deformation of the flexible interconnection circuit board.
6. A multi-physical field analysis device for flexible interconnect reliability, comprising:
the circuit design file importing module is used for importing the flexible interconnection circuit design file into electromagnetic simulation software;
the three-dimensional electromagnetic model building module is used for building a three-dimensional electromagnetic model corresponding to the flexible interconnection circuit board in the electromagnetic simulation software based on the flexible interconnection circuit design file;
the interconnection transmission parameter extraction module is used for extracting interconnection transmission parameters corresponding to the flexible interconnection circuit board based on the three-dimensional electromagnetic model;
the first error rate calculation module is used for calculating a first error rate of the flexible interconnection circuit board under the actual working frequency according to the interconnection transmission parameters;
a maximum deformation calculation module configured to, when the first error rate is less than or equal to 10 -12 When the flexible interconnection circuit board is in the process of structural simulation, calculating to obtain the maximum deformation which can be born by the flexible interconnection circuit board;
the maximum deformation model determining module is used for determining a maximum deformation model of the flexible interconnection circuit board based on the maximum deformation;
the second error rate calculation module is used for carrying out another electrical analysis on the maximum deformation model, extracting transmission parameters of the interconnection line under the deformation state, carrying out analysis on a frequency domain and a time domain, calculating an eye pattern, jitter and bathtub curve of a high-speed signal under the actual working frequency, and calculating the error rate under the frequency, namely the second error rate;
the signal transmission quality analysis module is used for analyzing the signal transmission quality of the flexible interconnection circuit board based on the second error rate;
the three-dimensional electromagnetic model building module comprises:
a material lamination parameter setting sub-module, configured to set material parameters and lamination parameters of the flexible interconnection circuit board according to the flexible interconnection circuit design file, where the material parameters include transmission wire material parameters and medium parameters;
the skin depth calculation sub-module is used for calculating the skin depth of the flexible interconnection circuit board under high frequency;
the maximum length calculation sub-module is used for calculating and setting the maximum length of the grid when the electromagnetic field finite element grid is divided;
the electromagnetic scattering parameter calculation sub-module is used for calculating and extracting electromagnetic scattering parameters of the flexible interconnection circuit board;
the deformation and distortion state determining submodule is used for determining whether the flexible interconnection circuit board has deformation and distortion states or not;
and the three-dimensional electromagnetic model building sub-module is used for building the three-dimensional electromagnetic model according to the transmission wire material parameters, the medium parameters, the lamination parameters, the skin depth, the maximum length and the electromagnetic scattering parameters when the flexible interconnection circuit board is in a deformation and torsion state.
7. The apparatus of claim 6, wherein the first bit error rate calculation module
Comprising the following steps:
the eye pattern jitter bathtub calculation submodule is used for calculating a transmission eye pattern, jitter parameters and bathtub curves of the high-speed signal under the actual working frequency according to the three-dimensional electromagnetic model and the interconnection transmission parameters;
and the first error rate calculation submodule is used for calculating the first error rate according to the transmission eye pattern, the jitter parameter and the bathtub curve.
8. The apparatus as recited in claim 6, further comprising:
and the circuit design file redesign module is used for redesigning the flexible interconnection circuit design file corresponding to the flexible interconnection circuit board when the first error rate is greater than 10 < -12 >.
9. The apparatus of claim 6, wherein the maximum deformation calculation module comprises:
a material property setting sub-module for setting material properties of the flexible interconnection circuit board;
the finite element grid dividing sub-module is used for dividing the finite element grid;
the boundary condition load applying sub-module is used for applying boundary conditions and loads according to the actual working conditions of the flexible interconnection circuit board;
and the maximum deformation calculation submodule is used for calculating the maximum deformation according to the material attribute, the finite element grid, the boundary condition and the load.
10. The apparatus of claim 6, wherein the signal transmission quality analysis module comprises:
a transmission error-free determining sub-module, configured to determine that signal transmission is error-free under a condition of maximum deformation of the flexible interconnection circuit board when the second error rate is less than or equal to 10-12;
and the electric signal quality determining submodule is used for determining that the quality of the transmitted electric signal cannot be ensured under the state of maximum deformation of the flexible interconnection circuit board when the second error rate is larger than 10 < -12 >.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911248429.1A CN111159970B (en) | 2019-12-09 | 2019-12-09 | Multi-physical-field analysis method and device for flexible interconnection reliability |
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| CN106999060A (en) * | 2014-08-11 | 2017-08-01 | 伊利诺伊大学评议会 | For analysis temperature characteristic and the epidermis device of hot transmission characteristic |
| CN110516357A (en) * | 2019-08-27 | 2019-11-29 | 西安电子科技大学 | Gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method |
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| JP2008293066A (en) * | 2007-05-22 | 2008-12-04 | Panasonic Corp | Library for electronic circuit simulation, library generating system, recording medium storing them, and method for manufacturing electronic apparatus using them |
| US10441185B2 (en) * | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
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| CN106999060A (en) * | 2014-08-11 | 2017-08-01 | 伊利诺伊大学评议会 | For analysis temperature characteristic and the epidermis device of hot transmission characteristic |
| CN110516357A (en) * | 2019-08-27 | 2019-11-29 | 西安电子科技大学 | Gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method |
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