CN111148378B - Manufacturing method of local thick copper plate - Google Patents
Manufacturing method of local thick copper plate Download PDFInfo
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- CN111148378B CN111148378B CN202010021108.4A CN202010021108A CN111148378B CN 111148378 B CN111148378 B CN 111148378B CN 202010021108 A CN202010021108 A CN 202010021108A CN 111148378 B CN111148378 B CN 111148378B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
Abstract
The invention is suitable for the technical field of circuit boards, and provides a manufacturing method of a local thick copper plate, which comprises the following steps: providing at least one substrate, wherein each substrate comprises an insulating base layer and a copper layer arranged on at least one side of the insulating base layer; copper reduction treatment: carrying out copper reduction treatment on one part of the copper layer and forming a thin copper area, wherein the other part of the copper layer forms a thick copper area, and the thickness of the copper layer of the thick copper area is larger than that of the copper layer of the thin copper area; and manufacturing a circuit: forming a circuit pattern on the thin copper area and/or the thick copper area to obtain at least one core board; the method does not need electroplating treatment, can avoid the problem of uneven thickness of the copper layer in the thick copper area compared with the existing electroplating thickening mode, further can ensure the uniformity of the subsequent circuit pattern manufacture and the precision of the line width, and ensures the functions of the core plate.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a manufacturing method of a local thick copper plate.
Background
The local thick copper refers to the design that a common thin copper area and a common thick copper area exist in the same circuit board at the same time, and the common thick copper plate is designed to be only one copper thickness in the same layer of circuit. The existence of two copper thicknesses causes a certain height difference on the surface of the circuit board, has certain difficulty in copper surface manufacturing, circuit manufacturing, pressing manufacturing and the like, and easily causes the problems of glue shortage, poor etching uniformity, unavailable line width precision and the like.
At present, the local thick copper is usually realized by an electroplating thickening method. When the thickness value of copper is large, especially when the thickness of copper in the thick copper area is greater than or equal to 140 micrometers, and the height difference between the thick copper area and the thin copper area is greater than or equal to 105 micrometers, the problem of poor uniformity of copper plating and the like may occur in the thickening process due to the large height difference, and the problem that the dry film at the edge cannot be compressed in the pressing process may also occur.
Disclosure of Invention
The embodiment of the invention aims to provide a method for manufacturing a local thick copper plate, and aims to solve the technical problem of poor uniformity of copper plating in the existing local thick copper manufacturing process.
The embodiment of the invention is realized in such a way that the manufacturing method of the local thick copper plate comprises the following steps:
providing at least one substrate, wherein each substrate comprises an insulating base layer and a copper layer arranged on at least one side of the insulating base layer;
copper reduction treatment: carrying out copper reduction treatment on one part of the copper layer and forming a thin copper area, wherein the other part of the copper layer forms a thick copper area, and the thickness of the copper layer of the thick copper area is larger than that of the copper layer of the thin copper area; and
manufacturing a circuit: and forming a circuit pattern on the thin copper area and/or the thick copper area to obtain at least one core board.
In one embodiment, the step of copper reduction treatment comprises at least one controlled deep etching treatment and at least one copper reduction liquid treatment: and carrying out at least one time of controlled-depth etching treatment on a part of the copper layer, and then immersing the copper layer into a copper reducing liquid until the tolerance of the thickness of the copper layer of the thin copper area meets the requirement.
In one embodiment, in the controlled deep etching treatment, at least one controlled deep etching treatment is carried out on a part of the copper layer until the tolerance of the thickness of the copper layer of the thin copper area is +15 microns; and immersing the copper layer into a copper reduction liquid until the tolerance of the thickness of the copper layer of the thin copper area is +/-2.5 microns.
In one embodiment, in the step of forming the circuit, a resist layer is printed on the copper layer in a region corresponding to the circuit pattern, a photosensitive film and a negative film are sequentially formed on the resist layer and the copper layer, the photosensitive film is exposed and developed, and the exposed portion of the copper layer is etched to form the circuit pattern.
In one embodiment, the anti-corrosion layer is made of solder resist ink in a silk-screen printing manner.
In one embodiment, the circuit pattern is formed on the thin copper region and the thick copper region; and at least one through hole is arranged on the bottom sheet corresponding to the area where the thin copper area and the thick copper area are connected, and in the step of manufacturing the circuit, etching of the exposed part of the copper layer is carried out in a vacuum environment.
In one embodiment, the diameter of the through hole is 0.5 mm to 1.0 mm.
In one embodiment, the method for manufacturing the local thick copper plate further includes:
hot pressing: and sequentially laminating the core plates, respectively arranging copper foils on the two outermost sides of the core plates, arranging semi-cured layers between every two adjacent core plates and between the core plates and the copper foils, and performing hot-press bonding to obtain the multilayer local thick copper plate.
In one embodiment, the prepreg layer includes at least one first prepreg and at least one second prepreg, wherein the first prepreg is provided with a slot corresponding to the thick copper portion of the circuit pattern, and the second prepreg is provided on a side of the first prepreg away from the thick copper portion.
In one embodiment, the distance between the edge of the slot and the edge of the thick copper portion is greater than 0.1 mm; the semi-cured layer includes a plurality of first semi-cured sheets and at least one second semi-cured sheet, and an absolute value of a difference between a sum of heights of the plurality of first semi-cured sheets and a difference between thicknesses of copper layers of the thick copper portion and the thin copper portion is less than or equal to one-half of a thickness of the first semi-cured sheet.
The manufacturing method of the local thick copper plate provided by the embodiment of the invention has the beneficial effects that:
the thin copper area and the thick copper area are obtained by carrying out copper reduction treatment on partial areas of the copper layer, electroplating treatment is not needed, the problem that the thickness of the copper layer in the thick copper area is not uniform can be avoided compared with the existing electroplating thickening mode, the uniformity of the subsequent circuit pattern manufacture and the line width precision can be further guaranteed, and the core board function is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flow chart illustrating steps of a method for manufacturing a local thick copper plate according to an embodiment of the present invention;
FIG. 2 is a schematic view of a substrate;
FIG. 3 is a schematic diagram of step S2;
fig. 4 is a schematic structural view of the substrate before etching in step S3;
FIG. 5 is a schematic diagram showing the correspondence between the through holes and the copper layers on the base sheet;
FIG. 6 is a schematic structural view of a core plate;
FIG. 7 is a schematic view of a laminated structure of a multilayer partially thick copper plate;
FIG. 8 is a schematic view showing a press-fit state of four layers of local thick copper plates;
fig. 9 is a schematic view showing a press-fit state of six layers of local thick copper plates.
The designations in the figures mean:
1-substrate, 11-insulating base layer, 12-copper layer, 121-thick copper region, 122-thin copper region;
2-core board, 20-circuit pattern, 21-thick copper part, 22-thin copper part;
3-a resist layer; 4-negative plate, 40-through hole;
5-copper foil; 6. 6' -semi-cured layer, 61-first semi-cured sheet, 610-grooved, 62-second semi-cured sheet;
7. 7' -multilayer, locally thick copper plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
In order to explain the technical solution of the present invention, the following detailed description is made with reference to the specific drawings and examples.
Referring to fig. 1, an embodiment of the invention provides a method for manufacturing a local thick copper plate, including:
step S1, providing the substrate 1: dividing the motherboard into a plurality of substrates 1, each substrate 1 comprising an insulating base layer 11 and a copper layer 12 disposed on at least one side of the insulating base layer 11, as shown in fig. 2; here, the thickness of the copper layer 12 on the substrate 1 is selected according to the maximum thickness of the copper layer on the core board 2 to be obtained later;
step S2, copper reduction: performing copper reduction treatment on a part of the copper layer 12 to form a thin copper region 122, wherein the part of the copper layer 12 which is not subjected to the copper reduction treatment is used as a thick copper region 121, and the copper layer thickness of the thick copper region 121 is greater than that of the thin copper region 122; and
step S3, creating the circuit pattern 20: the wiring pattern 20 is formed on the thin copper region 122 and/or the thick copper region 121, thereby obtaining at least one core 2, as shown in fig. 6.
According to the method for manufacturing the local thick copper plate provided by the embodiment of the invention, the thin copper region 122 is obtained by performing the copper reduction treatment on the partial region of the copper layer 12, the thick copper region 121 is formed on the part of the copper layer 12 which is not subjected to the copper reduction treatment, the electroplating treatment is not needed, and compared with the existing electroplating thickening mode, the problem of uneven thickness of the copper layer of the thick copper region 121 can be avoided, the uniformity of the subsequent circuit pattern 20 and the precision of the line width can be further ensured, and the function of the core plate 2 can be ensured.
According to an embodiment of the present invention, step S2 includes at least one controlled etching process for performing a first process on the copper layer 12 to rapidly reduce the thickness of the copper layer 12 and at least one copper reducing process for performing a second process on the copper layer 12 to more precisely control the thickness of the copper layer 12 within a desired thickness range.
Optionally, step S2 includes multiple deep etching processes. By adjusting the process parameters of the controlled-depth etching, the speed of the controlled-depth etching can be controlled so as to control the thickness of the copper layer 12 removed in the controlled-depth etching.
Specifically, the first controlled deep etching step comprises: a photosensitive film layer is formed on the copper layer 12 in the area corresponding to the thin copper region 122, an exposure negative film is disposed on the photosensitive film layer, the area corresponding to the thin copper region 122 is exposed after exposing and developing the photosensitive film layer, and then the exposed portion is etched to remove a portion of the thickness.
In a particular application, the controlled depth etch may be a vacuum etch. And, in the vacuum etching equipment, the pressure of the nozzle can be adjusted to 1.0 kg/square centimeter at maximum, and the maximum speed of the controlled-depth etching is not more than 7.2 microns/minute, so that the speed and the depth of the etching can be controlled.
In a specific application, the copper reduction rate can be controlled by selecting a suitable copper reduction solution, for example, in an alternative embodiment, the copper reduction solution treatment rate is at most 5 μm/min, so as to control the thickness of the thin copper region 122 more precisely.
According to an embodiment of the present invention, in the copper reduction process, a portion of the copper layer 12 is subjected to a controlled deep etching process until the copper layer thickness of the thin copper region 122 is within +20mm of the target thickness, i.e., the tolerance of the copper layer thickness of the thin copper region 122 is +20 microns, and optionally, until the copper layer thickness of the thin copper region 122 is within +15 microns of the target thickness, i.e., the tolerance of the copper layer thickness of the thin copper region 122 is +15 microns. And then, the copper layer 12 after the multiple deep etching control treatment is immersed in the copper reducing liquid until the thickness of the copper layer of the thin copper region 122 is within +/-2.5 microns of the target thickness, namely the tolerance of the thickness of the copper layer 12 of the thin copper region 122 is +/-2.5 microns.
According to an embodiment of the present invention, the substrate 1 provided in step S1 is a double-layer substrate, in which the copper layers 12 are disposed on both sides of the insulation base layer 11. In step S2, copper reduction is performed on the two copper layers 12 of each substrate 1, and a thick copper region 121 and a thin copper region 122 are formed on each copper layer 12.
Optionally, in step S2, when the two copper layers 12 of each substrate 1 are subjected to the controlled-depth etching process, the copper layers 12 on both sides are subjected to multiple controlled-depth etching processes, and the copper layers 12 on both sides are alternately subjected to controlled-depth etching until the tolerance of the copper layer thickness of the thin copper regions 122 on the copper layers 12 on both sides is +15 μm.
Thus, thick copper regions 121 and thin copper regions 122 of desired thickness are obtained, as shown in fig. 3.
According to an embodiment of the present invention, step S3 specifically includes:
step S31, forming a photosensitive film (not shown) on each copper layer 12, disposing a negative film 4 on the photosensitive film, and exposing the photosensitive film by uv irradiation above the negative film 4 as shown in fig. 4; taking the negative photosensitive film as an example, the portion of the photosensitive film corresponding to the circuit pattern 20 is exposed and polymerized, and the portion of the photosensitive film other than the portion corresponding to the circuit pattern 20 is not exposed and polymerized;
step S32, developing, using the developing solution to develop and remove the part of the photosensitive film that has not undergone polymerization reaction, and exposing the area of the copper layer 12 outside the corresponding circuit pattern 20;
in step S33, the exposed portion of the copper layer 12 is etched by the etching solution, and the portion covered and protected by the photosensitive film is remained, thereby forming the circuit pattern 20.
In step S33, the exposed portion of the copper layer 12 removed by etching may be located in the thin copper region 122, the thick copper region 121, or both the thin copper region 122 and the thick copper region 121. The wiring pattern 20 is formed on both the thin copper region 122 and the thick copper region 121.
As shown in fig. 6, the wiring pattern 20 includes a thick copper portion 21 and a thin copper portion 22, wherein the thick copper portion 21 is a part of the thick copper region 121 (referred to in the length and width directions, not the height direction), the thin copper portion 22 is a part of the thin copper region 122 (referred to in the length and width directions, not the height direction), and the core 2 includes the insulating base layer 11, and the wiring patterns 20 disposed on both sides of the insulating base layer 11.
Due to the height difference between the thin copper region 122 and the thick copper region 121, when the photosensitive film is formed in step S31, the surface bonding force between the photosensitive film and the copper layer 12 may be poor, which may result in an abnormal quality of the circuit pattern 20 due to the corrosion of the intersection region of the thin copper region 122 and the thick copper region 121 during etching. Therefore, according to an embodiment of the present invention, in step S31, before forming the photosensitive film, printing a resist layer 3 on the copper layer 12 in a region corresponding to the circuit pattern 20, where the resist layer 3 is attached to the surface of the copper layer 12, and the resist layer 3 and the copper layer 12 can have a good bonding force therebetween, and the photosensitive film is formed on the resist layer 3, so that the photosensitive film and the resist layer 3 can have a good bonding force therebetween, thereby ensuring that the photosensitive film and the copper layer 12 can have a good bonding force therebetween and preventing etching liquid from seeping into the copper layer; moreover, the etching-resistant layer 3 can further protect the non-etching region on the copper layer 12, prevent the corrosion and ensure the quality of the circuit pattern 20.
Specifically, the material of the anti-corrosion layer 3 may be solder resist ink, and the anti-corrosion layer 3 may be manufactured in a screen printing manner.
According to one embodiment of the present invention, the bottom sheet 4 is provided with at least one through hole 40 at the area corresponding to the intersection of the thin copper region 122 and the thick copper region 121, as shown in FIG. 5. Further, in step S31, a vacuum exposure machine is provided, and the substrate 1 provided with the negative plate 4 is placed in a vacuum chamber of the vacuum exposure machine. This has the advantage that, when in the vacuum chamber, due to the arrangement of the through holes 40, any position on the negative plate 4, especially the area corresponding to the junction of the thin copper area 122 and the thick copper area 121, can be well attached to the copper layer 12, thereby ensuring the accuracy of the exposed area, the line width of the circuit pattern 20, and the function of the circuit pattern 20.
Optionally, the diameter of the through hole 40 is 0.5 mm to 1.0 mm. Of course, the size of the through-hole 40 may have other values in alternative embodiments, depending on the actual operational requirements.
According to an embodiment of the present invention, referring to fig. 1, the method for manufacturing the local thick copper plate further includes:
step S4, thermocompression bonding: sequentially laminating a plurality of core boards 2 with a semi-cured layer 6 provided between every two adjacent core boards 2, copper foils 5 provided on the outermost sides of the plurality of core boards 2, respectively, and the semi-cured layer 6 provided between the copper foils 5 and the core boards 2, as shown in fig. 7, and then thermally compressing the laminated structure; under high temperature and high pressure, the semi-cured layer 6 is melted and flowed to fill between the copper layer 12 of one core board 2 and the copper layer 12 of the other core board 2, and between the copper layer 12 of one core board 2 and the copper foil 5 on the outer side, resulting in multilayer local thick copper plates 7 and 7', as shown in fig. 8 and 9.
According to an embodiment of the present invention, referring to fig. 7, the prepreg 6 includes at least one first prepreg 61 and at least one second prepreg 62, wherein the first prepreg 61 has a slot 610 corresponding to the thick copper portion 21 of the circuit pattern 20, and when the prepreg 6 is stacked with the core 2, the slot 610 is disposed toward the circuit pattern 20 of the core 2, so that the thick copper portion 21 is at least partially received in the slot 610 in height. Thus, the problem that the semi-solidified layer 6 cannot be completely filled after being melted due to the difference in height between the thick copper portion 21 and the thin copper portion 22 can be reduced, and the stitching void can be reduced.
Wherein, the distance between the edge of the slot 610 and the edge of the thick copper part 21 is more than 0.1mm, so that the thick copper part 21 can smoothly and completely enter the slot 610 in the length and width directions. Optionally, the distance between the edge of the slot 610 and the edge of the thick copper part 21 is further less than 0.3 mm, so that the slot 610 on the first semi-cured sheet 61 is not too large to affect the filling thereof.
Fig. 8 shows a multilayer partially thick copper plate 7, which is four layers, comprising a core 2 and two copper foils 5, wherein a semi-cured layer 6 is provided between one side of the core 2 and one copper foil 5, and a semi-cured layer 6 is also provided between the other side of the core 2 and the other copper foil 5.
In fig. 8, since both of the semi-cured layers 6 are oriented with one side thereof facing the wiring pattern 20 and the other side thereof facing the copper foil 5, both of the semi-cured layers 6 may include at least one first semi-cured sheet 61 (only one is shown in fig. 8) and a second semi-cured sheet 62, the second semi-cured sheet 62 being disposed closer to the copper foil 5 than the first semi-cured sheet 61.
Wherein, optionally, the semi-curing layer 6 comprises a plurality of first semi-curing sheets 61. The number of the first semi-cured sheets 61 is determined by the difference in height between the thick copper part 21 and the thin copper part 22, and the plurality of first semi-cured sheets 61 may be set so as to accommodate the thick copper part 21 in the height direction as much as possible. The slot 610 is in the form of a through hole that extends through both surfaces of the first prepreg sheet 61.
Specifically, assuming that the difference between the heights of the thick copper portion 21 and the thin copper portion 22 is H and the thickness of one first semi-cured sheet 61 is L, the number of the first semi-cured sheets 61 corresponding to the image wiring 20 on one side of one core board 2 is taken as an integer part N of H/L or as an integer part N +1 of H/L, so that the difference between the sum of the heights of the first semi-cured sheets 61 corresponding to one wiring pattern 20 and the difference between the heights of the thick copper portion 21 and the thin copper portion 22 is controlled to be within ± L/2 μm.
For example, the height difference H is 200 micrometers, L is 70 micrometers, H/L is 2.85, and the integer part N is 2. When the number of the first semi-cured sheets 61 is 2, if the difference between the sum of the heights of the first semi-cured sheets 61 corresponding to one wiring pattern 20 and the difference between the heights of the thick copper part 21 and the thin copper part 22 cannot be made within ± 35 micrometers, the number of the first semi-cured sheets 61 is adjusted to N +1, that is, the number of the first semi-cured sheets 61 is 3, and in this case, the difference between the sum of the heights of the first semi-cured sheets 61 corresponding to one wiring pattern 20 and the difference between the heights of the thick copper part 21 and the thin copper part 22 can be made within ± 35 micrometers. Of course, this is merely an example, and in other alternative embodiments, the number of the first semi-solidified sheets 61 corresponding to each line pattern 20 may be other values according to the difference in the thickness L of the first semi-solidified sheets 61 and the difference in height H between the thick copper portions 21 and the thin copper portions 22.
Fig. 9 shows a multilayer partially thick copper plate 7' which is six-layered and comprises two core plates 2 and two copper foils 5. A semi-cured layer 6 ' is disposed between the two core plates 2, because both sides of the semi-cured layer 6 ' need to accommodate the thick copper portion 21, the semi-cured layer 6 ' includes at least one second semi-cured sheet 62 and a plurality of first semi-cured sheets 61 (only one shown in fig. 9) disposed on each side of the second semi-cured sheet 62, the number of the plurality of first semi-cured sheets 61 on each side is selected according to the difference in thickness L of the first semi-cured sheets 61 and the height difference H between the thick copper portion 21 and the thin copper portion 22, for example, there may be 3 semi-cured sheets on each side, which is not described again. Moreover, a semi-cured layer 6 is also disposed between each core 2 and the copper foil 5, and since only one side of the semi-cured layer 6 needs to accommodate the thick copper portion 21, the plurality of first semi-cured sheets 61 may be disposed only on one side of the second semi-cured sheet 62, and at this time, the number of the plurality of first semi-cured sheets 61 is selected according to the difference of the thickness L of the first semi-cured sheets 61 and the height difference H between the thick copper portion 21 and the thin copper portion 22, and is not repeated if 3.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A method for manufacturing a local thick copper plate is characterized by comprising the following steps:
providing at least one substrate, wherein each substrate comprises an insulating base layer and a copper layer arranged on at least one side of the insulating base layer;
copper reduction treatment: carrying out copper reduction treatment on one part of the copper layer and forming a thin copper area, wherein the other part of the copper layer forms a thick copper area, and the thickness of the copper layer of the thick copper area is larger than that of the copper layer of the thin copper area; and
manufacturing a circuit: forming a circuit pattern on the thin copper area and/or the thick copper area to obtain at least one core board;
in the step of manufacturing the circuit, printing a corrosion-resistant layer on the copper layer in a region corresponding to the circuit pattern, sequentially forming a photosensitive film and a negative film on the corrosion-resistant layer and the copper layer, exposing and developing the photosensitive film, and etching the exposed part of the copper layer to form the circuit pattern;
at least one through hole is formed in the region, corresponding to the joint of the thin copper region and the thick copper region, on the bottom sheet, and in the step of manufacturing the circuit, etching of the exposed part of the copper layer is carried out in a vacuum environment;
in the step of manufacturing the circuit, the method further comprises a vacuum exposure machine, and the substrate provided with the negative film is placed in a vacuum cavity of the vacuum exposure machine.
2. The method for manufacturing a local thick copper plate as claimed in claim 1, wherein said step of copper reduction treatment comprises at least one controlled etch back treatment and at least one copper reduction solution treatment: and carrying out at least one time of controlled-depth etching treatment on a part of the copper layer, and then immersing the copper layer into a copper reducing liquid until the tolerance of the thickness of the copper layer of the thin copper area meets the requirement.
3. The method for manufacturing a locally thick copper plate according to claim 2, characterized in that in the controlled-depth etching process, at least one controlled-depth etching process is performed on a portion of the copper layer until the tolerance of the copper layer thickness of the thin copper region is +15 μm; and immersing the copper layer into a copper reduction liquid until the tolerance of the thickness of the copper layer of the thin copper area is +/-2.5 microns.
4. The method for manufacturing a local thick copper plate as claimed in claim 1, wherein said resist layer is made of solder resist ink by screen printing.
5. The method for manufacturing a local thick copper plate as claimed in claim 1, wherein the diameter of said through-hole is 0.5 mm to 1.0 mm.
6. The method for manufacturing a local thick copper plate as claimed in any one of claims 1 to 5, further comprising:
hot pressing: and sequentially laminating the core plates, respectively arranging copper foils on the two outermost sides of the core plates, arranging semi-cured layers between every two adjacent core plates and between the core plates and the copper foils, and performing hot-press bonding to obtain the multilayer local thick copper plate.
7. The method for manufacturing a local thick copper plate according to claim 6, wherein the semi-cured layer comprises at least one first semi-cured sheet and at least one second semi-cured sheet, wherein the first semi-cured sheet is provided with a slot corresponding to the thick copper portion of the circuit pattern, and the second semi-cured sheet is provided on the side of the first semi-cured sheet away from the thick copper portion.
8. The method for manufacturing a local thick copper plate as claimed in claim 7, wherein the distance between the edge of said slot and the edge of said thick copper portion is greater than 0.1 mm; the semi-cured layer includes a plurality of first semi-cured sheets and at least one second semi-cured sheet, and an absolute value of a difference between a sum of heights of the plurality of first semi-cured sheets and a difference between thicknesses of copper layers of the thick copper portion and the thin copper portion is less than or equal to one-half of a thickness of the first semi-cured sheet.
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| CN112165783A (en) * | 2020-09-23 | 2021-01-01 | 黄石星河电路有限公司 | Process for manufacturing single-surface local convex copper by copper reduction mode |
| CN112654169A (en) * | 2020-11-09 | 2021-04-13 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with bending requirement |
| CN112822856A (en) * | 2020-12-30 | 2021-05-18 | 厦门柔性电子研究院有限公司 | Manufacturing method of thin double-sided flexible circuit board capable of improving wrinkles |
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