CN111128798B - Thin film stretching transverse alignment mechanism and alignment device using same - Google Patents
Thin film stretching transverse alignment mechanism and alignment device using same Download PDFInfo
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- CN111128798B CN111128798B CN201911124492.4A CN201911124492A CN111128798B CN 111128798 B CN111128798 B CN 111128798B CN 201911124492 A CN201911124492 A CN 201911124492A CN 111128798 B CN111128798 B CN 111128798B
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The invention relates to a film stretching transverse alignment mechanism and an alignment device for huge transfer of an equidistant chip array by using the same. The film stretching transverse alignment mechanism comprises: the middle connecting plate, the film pressing device and the film stretching driving assembly are arranged on the middle connecting plate; the film pressing device comprises: a movable end film pressing device and a fixed end film pressing device; the two film pressing devices have the same structure, and the film pressing devices comprise: film pressing fixed blocks, film pressing movable block power devices and film pressing movable block linear guide rail modules; the film pressing movable block linear guide rail module is fixed on the film pressing fixed block; the film pressing moving block power device drives the film pressing moving block to slide on the film pressing moving block linear guide rail module; the film pressing fixed block of the film pressing device at the fixed end is fixed on the middle connecting plate; the film pressing fixed block of the movable end film pressing device moves along the length direction of the movable end linear guide rail module of the film pressing device under the drive of the film stretching driving assembly.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a film stretching transverse alignment mechanism and an alignment device for mass transfer of an equidistant chip array by using the same.
Background
LEDs show significant advantages, e.g. Micro LEDs consume only 10% of the LCD, 50% of the OLED. In addition, compared with the OLED which belongs to the self-luminous display, the brightness is three times higher than that of the OLED screen under the same power, and the OLED has better material stability and no image residue and lower power consumption. Micro LEDs and Mini LEDs are the same and are based on tiny LED crystal particles as pixel luminous points, and the difference is that the Micro LEDs are 1-10 microns LED crystals, so that a display screen with 0.05 millimeter or smaller pixel particles is realized; the Mini LED is a display screen which adopts tens of micron-sized LED crystals to realize 0.5-1.2 mm pixel particles.
With the gradual development of LED pixelation, the difficulty is upgraded, and a plurality of difficulties such as chips, packaging, driving ICs and the like are faced. The mass transfer is another difficulty brought by pixelation, especially the Mini/Micro LED technology has extremely small chip size and huge number, and the batch transfer of the LED chips to a circuit substrate (TFT substrate or CMOS substrate) needs to take much time, the yield is not easy to control, and the LED chips become a commercial large blocking tiger. The difficulty of the current mass transfer technology is how to improve the transfer yield, and the transfer accuracy of each chip is controlled within plus or minus 0.5 micron, and meanwhile, the production efficiency is required to be improved.
Disclosure of Invention
The invention aims to overcome at least one defect in the prior art, and starts from improving the yield and efficiency of the mass transfer of the micro chip array, the invention provides a film stretching transverse alignment mechanism and an equidistant chip array mass transfer alignment device applying the film stretching transverse alignment mechanism, the chip mass transfer is realized, and the transfer yield is high. The invention adopts the following specific technical scheme.
In a first aspect, the present invention provides a film stretching lateral alignment mechanism, the film stretching lateral alignment mechanism (4) comprising: the device comprises an intermediate connecting plate (402), a film pressing device (404) and a film stretching driving assembly (405); the middle connecting plate (402) is provided with a linear guide rail module (404E) at the movable end of the film pressing device; the film pressing device (404) comprises: a movable end film pressing device and a fixed end film pressing device; the two film pressing devices have the same structure, and the film pressing device (404) comprises: a film pressing fixed block (404A), a film pressing movable block (404B), a film pressing movable block power device (404C) and a film pressing movable block linear guide rail module (404D); the film pressing moving block linear guide rail module (404D) is fixed on the film pressing fixed block (404A); the film pressing moving block power device (404C) drives the film pressing moving block (404B) to slide on the film pressing moving block linear guide rail module (404D); a film pressing fixed block (404A) of the fixed end film pressing device is fixed on the middle connecting plate (402); the film pressing fixed block (404A) of the movable end film pressing device moves along the length direction of the linear guide rail module (404E) of the movable end of the film pressing device under the driving of the film stretching driving component (405).
Further, the film stretching transverse alignment mechanism further comprises: a bottom linear guide rail module (401) and a transverse alignment driving assembly (403); the transverse alignment driving assembly (403) drives the middle connecting plate (402) to slide on the bottom linear guide rail module (401).
In a second aspect, the present invention provides an alignment device for macro-transferring of an equidistant chip array, the alignment device for macro-transferring of an equidistant chip array includes: the device comprises a base (1), a target substrate (2), a flexible gantry (3), the thin film stretching transverse alignment mechanism (4) and a bonding pad (5); the target substrate (2) is placed on the base (1), and the bonding pad (5) is placed on the target substrate (2); the flexible gantry (3) comprises: two parallel arranged linear modules (301) and a frame cross beam assembly (302); the linear modules (301) are fixed to the base (1) and are arranged on the upper side and the lower side in the planar direction of the target substrate (2), respectively; the linear module (301) comprises: a linear motor (301A), a small platform (301B) and a linear guide rail module (301D); the linear guide rail module (301D) is connected with the base (1), and the linear motor (301A) drives the small platform (301B) to move on the linear guide rail module (301D); the frame cross member assembly (302) includes: the film stretching transverse alignment mechanism comprises a rotary bearing (302C), two rotary platforms (302A) and two parallel beams (302B), wherein the two rotary platforms (302A) are respectively connected with a small platform (301B) through the rotary bearing (302C), one end of each beam (302B) is fixed on the rotary platform (302A) and the other end of each beam is installed on the other rotary platform (302A) through a linear guide rail sliding block, and the film stretching transverse alignment mechanism (4) is installed at the bottom of the parallel beams (302B) of the frame beam assembly (302) through a bottom linear guide rail module (401).
Further, the small platform (301B) comprises: a rigid frame (301B 1), a flexible hinge (301B 2), a core motion platform (301B 3); wherein the core motion platform (301B 3) is connected with the rigid frame (301B 1) through a flexible hinge (301B 2).
Further, flexible hinges (301B 2) between the core motion platform (301B 3) and the rigid frame (301B 1) of the small platform (301B) are symmetrically arranged, and the small platform (301B) is integrally manufactured.
Further, the linear module (301) further includes: module base (301C); the linear guide rail module (301D) is connected to the module base (301C), and the module base (301C) is connected with the base (1).
Compared with the prior art, the beneficial effects are that:
1. the vast transfer technology which is widely applied at present is mostly single chip transfer, and the transfer yield is high, but the efficiency is low, and the technology is not in line with the high-speed development of the current electronic technology industry. According to the invention, the chips are stretched into arrays, the array spacing corresponds to the chip position of the bonding pads (5) on the target substrate (2), and the batch transfer of the chip equidistant chip arrays can be realized by only accurately aligning the stretched film (406).
2. The existing mass transfer technologies such as electrostatic force, van der Waals force, magnetic force, selective release, self-assembly, transfer and the like have higher cost, and the invention realizes mass transfer based on the angle of mechanical structural design completely, thereby greatly reducing the manufacturing cost of the display panel.
3. The wafer (407) has an adjustable stretching pitch. Whether the distance between the chip on the film and the corresponding position of the chip of the bonding pad (5) on the target substrate (2) is deviated or not is detected by the precise camera device, and if the distance deviation exists, the distance between the chips can be adjusted by adjusting the movable end of the film stretching transverse alignment mechanism (4).
4. The stretching angle of the wafer (407) is adjustable. The wafer (407) on the film may deflect in the stretching direction after stretching, and the position of the chip can be detected by the precise camera after stretching, and if the wafer deflects, the wafer can be adjusted by the rotating platform (302A) of the frame beam assembly (302).
5. When the deflection angle of the chip is adjusted, the cross beam of the frame cross beam assembly can realize motion decoupling through one end provided with the linear guide rail sliding block, so that the change of the length of the cross beam caused by rotary motion is adapted.
6. If the small platform (301B) adopts the structural design of the rigid-flexible coupling platform, the flexible hinge can actively adapt to the friction force change of the guide rail kinematic pair by means of self elastic deformation, so that the influence of creeping caused by friction state switching of the kinematic pair on continuous displacement positioning is avoided, precise micro-feeding can be performed, and higher alignment precision is facilitated.
7. The alignment device for huge transfer of the equidistant chip array has wide application range, and can perform huge transfer alignment on chips (micron level, submicron level and even nanometer level) with small pitches, mini, micro LEDs and the like.
Drawings
FIG. 1 is a general diagram of an alignment apparatus for mass transfer of an equally spaced chip array according to the present invention;
FIG. 2 is a schematic view of a flexible gantry according to the present invention;
FIG. 3 is a schematic view of a parallel-arranged linear module according to the present invention;
FIG. 4 is a schematic view of a frame cross member assembly according to the present invention;
FIG. 5 is a schematic diagram of a rigid-flexible coupling platform according to the present invention;
FIG. 6 is a schematic view of a film stretching and transverse alignment mechanism according to the present invention;
FIG. 7 is a schematic diagram of an intermediate connection plate;
FIG. 8 is a schematic view of a parallel arrangement film pressing device according to the present invention;
fig. 9 is a schematic diagram of the operation of the transverse alignment mechanism for stretching a film according to the present invention.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the present patent; for the purpose of better illustrating the embodiments, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the actual product dimensions; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationship depicted in the drawings is for illustrative purposes only and is not to be construed as limiting the present patent.
As shown in FIG. 1, the alignment device for mass transfer of an equidistant chip array according to the present invention comprises: the device comprises a base (1), a target substrate (2), a flexible gantry (3), a film stretching transverse alignment mechanism (4) and a bonding pad (5). The target substrate (2) is placed on the stand (1), and the flexible gantry (3) is also arranged on the stand (1) and spans over the target substrate (2). The film stretching transverse alignment mechanism (4) is arranged on the flexible gantry (3) and is positioned below the flexible gantry (3). The pads (5) are placed on the target substrate (2).
As shown in fig. 2, the flexible gantry (3) comprises: two parallel arranged linear modules (301) and a frame cross member assembly (302). As shown in fig. 1, two linear modules (301) are fixed to the base (1) and are arranged on the upper side and the lower side in the planar direction of the target substrate (2), respectively. The frame beam assembly (302) spans over the two linear modules (301) and is located above the target substrate (2) in the vertical direction. As shown in fig. 3, each linear module (301) includes: the linear motor (301A), the small platform (301B), the module base (301C) and the linear guide rail module (301D). The small platform (301B) is connected to the module base (301C) through the linear guide rail module (301D), the module base (301C) is indirectly connected with the base (1) through bolts, and the linear motor (301A) drives the small platform (301B) to move on the linear guide rail module (301D).
The structure of the small platform (301B) can be determined according to the alignment precision requirement of the huge amount of transfer chips. If the precision is in the micron level, the small platform (301B) is a rigid platform; if the chip needing massive transfer is Mini/Micro LED and other chips with high precision requirements (submicron or even nanometer level), a rigid-flexible coupling platform is adopted.
As shown in fig. 4, the rigid-flexible coupling platform mainly includes: rigid frame (301B 1), flexible hinge (301B 2), core motion platform (301B 3). Wherein the core motion platform (301B 3) is connected with the rigid frame (301B 1) through a flexible hinge (301B 2).
If a rigid platform is adopted, the mover of the linear motor (301A) is directly connected with the rigid platform; if a rigid-flexible coupling platform is adopted, the core motion platform (301B 3) is connected with a rotor of a linear motor (301A), the rigid frame (301B 1) is connected with a linear guide rail sliding block through bolts, slides on a guide rail through the guide rail sliding block, and is indirectly connected with the base (1) through a module base (301C). The rigid-flexible coupling platform structure is adopted to enable the core motion platform (301B 3) to drive the flexible hinge (301B 2) to elastically deform under the driving action of the linear motor (301A), and micro displacement is generated through the elastic deformation of the flexible hinge (301B 2) so as to realize precise micro alignment. The small platform (301B) can move along the length direction of the linear guide rail and realize large-stroke linear motion, and displacement is measured by using a displacement sensor.
As shown in fig. 5, the frame beam assembly (302) includes: a rotary bearing (302C), two rotary platforms (302A), two parallel arranged cross beams (302B). Wherein, the two rotary platforms (302A) are respectively connected with the small platform (301B) through rotary bearings (302C); the uniform end of each beam (302B) is fixed on the rotating platform (302A) through bolts, and the other end of each beam is installed on the other rotating platform (302A) through a linear guide rail sliding block, so that the length change of the beams (302B) during rotating motion is compensated.
As shown in fig. 6, fig. 6 provides some adjustment of the direction of placement of the film stretching lateral alignment mechanism (4) for ease of illustration. When the transverse alignment mechanism (4) for stretching the film of fig. 6 is placed in the overall diagram of fig. 1, the mechanism is turned over, namely the bottom linear guide rail module (401) is at the topmost end, and the film (406) is at the bottommost end; in addition, the bottom linear guide module (401) in fig. 6 is oriented side-to-side, when placed in the general view of fig. 1, and is oriented back-and-forth, i.e., is oriented the same as the frame rail assembly (302).
The film stretching transverse alignment mechanism (4) comprises: the device comprises a bottom linear guide rail module (401), a middle connecting plate (402) (shown in fig. 7), a transverse alignment driving assembly (403), two film pressing devices (404) arranged in parallel and a film stretching driving assembly (405). The film (406) and the wafer (407) are clamped by two film pressing devices (404) arranged in parallel.
The film stretching transverse alignment mechanism (4) is arranged at the bottom of a parallel-arranged beam (302B) of the frame beam assembly (302) through a bottom linear guide rail module (401), wherein a linear guide rail in the bottom linear guide rail module (401) is fixed at the bottom of the parallel-arranged beam (302B) through a bolt, and a sliding block is fixed on the middle connecting plate (402); the transverse alignment driving assembly (403) of the film stretching transverse alignment mechanism (4) is also arranged on one side of the bottom of the parallel-arranged cross beam (302B), and the transverse alignment driving assembly (403) and the middle connecting plate (402) are connected through a connecting plate, so that the middle connecting plate (402) and the upper part of the middle connecting plate are driven to integrally move along the length direction of the bottom linear guide rail module (401); the film pressing device (404) of the film stretching transverse alignment mechanism (4) which is arranged in parallel is divided into a fixed end and a movable end (the structures of the two ends are the same), and mainly comprises a film pressing fixed block (404A), a film pressing movable block (404B), a film pressing movable block power device (404C), a film pressing movable block linear guide rail module (404D) and a film pressing device movable end linear guide rail module (404E), as shown in figure 8; the fixed end is directly fixed on a boss of the middle connecting plate (402) through a film pressing fixed block (404A) by bolts, the movable end of the fixed end is connected with the middle connecting plate (402) through a film pressing device movable end linear guide rail module (404E), namely, the linear guide rail of the film pressing device movable end linear guide rail module (404E) is fixed on the middle connecting plate (402), and the sliding block is fixed on the film pressing fixed block (404A) of the movable end of the film pressing device (404) which is arranged in parallel; the film pressing fixed block (404A) of the film pressing device (404) which is arranged in parallel is connected with the film pressing movable block (404B) through the film pressing movable block linear guide rail module (404D) and is driven by the film pressing movable block power device (404C), so that the film pressing movable block (404B) can move along the length direction of the film pressing movable block linear guide rail module (404D) to be matched with the film pressing fixed block (404A) so as to compress the film (406); after the film (406) is compressed, the movable end of the film pressing device (404) which is arranged in parallel can move along the length direction of the linear guide rail module (404E) at the movable end of the film pressing device under the drive of the film stretching driving assembly (405), so that the compressed film (406) is transversely stretched, the displacement of the film is detected by the displacement detection device, the deviation condition of the corresponding positions of the wafer (407) on the film (406) and the chip of the bonding pad (5) on the target substrate (2) is detected while stretching, and real-time adjustment is performed.
The film stretching transverse alignment mechanism (4) mainly works to uniformly stretch the film (406) attached with the wafer (407) so as to enable the chip array to be arranged, and the grain spacing of the chips is in a multiple relationship with the corresponding positions of the chips of the bonding pads (5) on the target substrate (2), so that mass transfer is realized, and the efficiency is improved.
The rotating bearing (302C) connects the small platform (301B) and the rotating platform (302A) to solve the problem of deflection angle generated in the stretching process of the film (406), that is, correct the deflection of the film (406) to make the chip maintain a straight line state along the stretching direction after stretching, which is important for the improvement of the transfer yield of mass transfer of the chip.
Preferably, if a rigid-flexible coupling platform is used for the small platform, flexible hinges between the core motion platform and the rigid frame are symmetrically arranged, and the rigid-flexible coupling platform is integrally manufactured.
As shown in fig. 9, the working principle of the equidistant chip array huge transfer alignment device of the invention is as follows:
1. as shown in fig. 9 (i), the wafer-attached film (406) is stretched, and the wafer (407) has been subjected to dicing processing to arrange the chip arrays.
2. As shown in fig. 9 (ii), if the die on the stretched film (406) is deflected by an angle, the die is adjusted by the rotating platform (302A) of the frame beam assembly (302) so that the stretched die is parallel to the row direction (lateral direction) of the bonding pads (5).
3. As shown in fig. 9 (iii), the thin film stretching and transverse alignment mechanism (4) is aligned to the corresponding position, and mass transfer can be performed.
The working process of the equidistant chip array huge transfer alignment device comprises the following steps:
1. stretching the film. After dicing, fixing a wafer (407) attached to a film (406) on the film pressing device (404) which is arranged in parallel, and starting a film pressing moving block power device (404C) to enable a film pressing moving block (404B) of the film pressing device (404) which is arranged in parallel to press the film (406); and starting the film stretching driving assembly (405) to transversely stretch and deform the film (406) so as to enable the chip array of the wafer (407) to be arranged, enabling the chip particle spacing to be in a multiple relation with the corresponding position of the chip of the bonding pad (5) on the target substrate (2), and detecting the spacing of the chip of the wafer (407) by using the precise camera shooting detection device until the chip spacing is stretched to be in a multiple relation with the corresponding spacing of the chip position of the target substrate (2).
2. And (5) deflection correction. Detecting whether deflection exists along the stretching direction after the film (406) is stretched, if so, controlling a rotating platform (302A) of a frame beam assembly (302) of the flexible gantry (3), and adjusting the rotating angle of the rotating platform (302A) so as to adjust the stretching deflection angle of the film, thereby realizing accurate alignment.
3. And detecting again, ensuring accurate alignment and transferring huge amounts. Detecting the position of a chip after stretching the film (406), and integrally and transversely moving the film stretching transverse alignment mechanism (4) and longitudinally moving the flexible gantry (3) to align the chip, wherein the transverse movement of the film stretching transverse alignment mechanism (4) is driven by a transverse alignment driving assembly (403); and detecting whether the chip deviates from the corresponding position of the bonding pad (5) chip on the target substrate (2) again, and performing mass transfer after accurate alignment. And manufacturing a display panel, and transferring the red, green and blue crystal grains in batches.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
It is to be understood that the above examples of the present invention are provided by way of illustration only and not by way of limitation of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (5)
1. A film stretching transverse alignment mechanism is characterized in that,
the film stretching transverse alignment mechanism (4) comprises: the device comprises an intermediate connecting plate (402), a film pressing device (404) and a film stretching driving assembly (405);
the middle connecting plate (402) is provided with a linear guide rail module (404E) at the movable end of the film pressing device;
the film pressing device (404) comprises: a movable end film pressing device and a fixed end film pressing device;
the two film pressing devices have the same structure, and the film pressing device (404) comprises: a film pressing fixed block (404A), a film pressing movable block (404B), a film pressing movable block power device (404C) and a film pressing movable block linear guide rail module (404D);
the film pressing moving block linear guide rail module (404D) is fixed on the film pressing fixed block (404A);
the film pressing moving block power device (404C) drives the film pressing moving block (404B) to slide on the film pressing moving block linear guide rail module (404D);
a film pressing fixed block (404A) of the fixed end film pressing device is fixed on the middle connecting plate (402);
the film pressing fixed block (404A) of the movable end film pressing device moves along the length direction of the linear guide rail module (404E) of the movable end of the film pressing device under the drive of the film stretching driving component (405);
the film stretching transverse alignment mechanism further comprises: a bottom linear guide rail module (401) and a transverse alignment driving assembly (403);
the transverse alignment driving assembly (403) drives the middle connecting plate (402) to slide on the bottom linear guide rail module (401).
2. The utility model provides a huge transfer's of equidistant chip array counterpoint device which characterized in that, equidistant chip array huge transfer's counterpoint device includes: a machine base (1), a target substrate (2), a flexible gantry (3), a thin film stretching transverse alignment mechanism (4) and a bonding pad (5) according to claim 1;
the target substrate (2) is placed on the base (1), and the bonding pad (5) is placed on the target substrate (2);
the flexible gantry (3) comprises: two parallel arranged linear modules (301) and a frame cross beam assembly (302);
the linear modules (301) are fixed to the base (1) and are arranged on the upper side and the lower side in the planar direction of the target substrate (2), respectively;
the linear module (301) comprises: a linear motor (301A), a small platform (301B) and a linear guide rail module (301D); the linear guide rail module (301D) is connected with the base (1), and the linear motor (301A) drives the small platform (301B) to move on the linear guide rail module (301D);
the frame cross member assembly (302) includes: a swivel bearing (302C), two swivel platforms (302A), two parallel arranged cross beams (302B); the two rotary platforms (302A) are respectively connected with the small platform (301B) through rotary bearings (302C), the uniform end of each cross beam (302B) is fixed on the rotary platform (302A), and the other end of each cross beam is arranged on the other rotary platform (302A) through a linear guide rail sliding block;
the film stretching transverse alignment mechanism (4) is arranged at the bottom of a parallel-arranged beam (302B) of the frame beam assembly (302) through a bottom linear guide rail module (401).
3. The equal-pitch chip array macro-transfer alignment device of claim 2, wherein the small platform (301B) comprises: a rigid frame (301B 1), a flexible hinge (301B 2), a core motion platform (301B 3);
wherein the core motion platform (301B 3) is connected with the rigid frame (301B 1) through a flexible hinge (301B 2).
4. The alignment device for mass transfer of equidistant chip array as set forth in claim 3, wherein flexible hinges (301B 2) between a core motion platform (301B 3) and a rigid frame (301B 1) of the small platform (301B) are symmetrically arranged, and the small platform (301B) is manufactured as one piece.
5. The equal-pitch chip array macro-transfer alignment device according to any of claims 2-4, wherein the linear module (301) further comprises: a module base (301C);
the linear guide rail module (301D) is connected to the module base (301C), and the module base (301C) is connected with the base (1).
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| CN201911124492.4A CN111128798B (en) | 2019-11-18 | 2019-11-18 | Thin film stretching transverse alignment mechanism and alignment device using same |
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| CN201911124492.4A CN111128798B (en) | 2019-11-18 | 2019-11-18 | Thin film stretching transverse alignment mechanism and alignment device using same |
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