CN111916374B - Chip array huge transfer device - Google Patents
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- CN111916374B CN111916374B CN202010779969.9A CN202010779969A CN111916374B CN 111916374 B CN111916374 B CN 111916374B CN 202010779969 A CN202010779969 A CN 202010779969A CN 111916374 B CN111916374 B CN 111916374B
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- 238000012546 transfer Methods 0.000 title claims abstract description 61
- 230000007246 mechanism Effects 0.000 claims abstract description 240
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- 238000003491 array Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 285
- 238000003825 pressing Methods 0.000 description 48
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- 238000001514 detection method Methods 0.000 description 25
- 235000012431 wafers Nutrition 0.000 description 16
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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Abstract
The application discloses a chip array huge transfer device, which comprises a film stretching alignment mechanism, wherein the film stretching alignment mechanism comprises a film stretching mechanism and a comb tooth mechanism, the comb tooth mechanism comprises a driving assembly, a conveying assembly and an alignment die, the conveying assembly comprises at least two conveying units, each conveying unit comprises a synchronous belt, each synchronous belt is wound on at least two synchronous wheels, the alignment die is detachably arranged on the inner surface of the synchronous belt, the driving assembly is used for driving the synchronous wheels at one end of the conveying unit to rotate, and the synchronous wheels at the other end of the conveying unit are respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism. The synchronous belts of the two conveying units move under the drive of the driving assembly, so that the alignment die on the synchronous belts is driven to move towards the length direction of the synchronous belts, and therefore alignment of one row of chips can be realized, batch transfer of chip arrays can be realized, the transfer yield is ensured, and the efficiency of mass transfer is improved.
Description
Technical Field
The invention belongs to the technical field of chip manufacturing, and particularly relates to a chip array huge transfer device.
Background
With the gradual development of LED pixelation, the difficulty is upgraded, and a plurality of difficulties such as chips, packaging, driving ICs and the like are faced. The mass transfer is another difficulty brought by pixelation, and it takes much time to transfer the LED chips to the circuit substrate in batch, and the transfer yield is not easy to control, i.e. the efficiency and success rate of the mass transfer determine whether the commercialization is successful or not. The difficulty of the mass transfer technology is how to improve the transfer yield, and the transfer accuracy of each chip is controlled within plus or minus 0.5 micron, and meanwhile, the production efficiency is required to be improved. At present, most of the mass transfer technology is single chip transfer, and although the yield is high, the efficiency is low, and the technology does not accord with the high-speed development of the current electronic technology industry, so that the efficiency of the mass transfer is required to be improved while the transfer yield is ensured.
Disclosure of Invention
In view of the foregoing drawbacks or shortcomings of the prior art, it is desirable to provide a chip array macro transfer device.
In order to overcome the defects in the prior art, the technical scheme provided by the invention is as follows:
The invention provides a chip array huge transfer device, which comprises a frame, a bonding pad lifting alignment mechanism, a film stretching alignment mechanism and an unlocking operation assembly, wherein the bonding pad lifting alignment mechanism is used for adjusting the position of a bonding pad by horizontal and vertical movement; the film stretching alignment mechanism is used for clamping and stretching the film, and adjusting the position of the film in the horizontal direction so as to align with the bonding pad; the de-bonding operation assembly is used for stripping the chip;
The film stretching alignment mechanism comprises a film stretching mechanism and a comb tooth mechanism, the film stretching mechanism comprises a film stretching mechanism fixed end and a film stretching mechanism movable end, the film stretching mechanism fixed end and the film stretching mechanism movable end are respectively used for clamping two ends of the film, and the film stretching mechanism movable end is close to or far away from the film stretching mechanism fixed end to stretch the film;
The comb tooth mechanism comprises a driving assembly, a conveying assembly and an alignment die, the conveying assembly comprises at least two conveying units, each conveying unit comprises a synchronous belt, each synchronous belt is wound on at least two synchronous wheels, the alignment die is detachably arranged on the inner surface of the synchronous belt, the driving assembly is used for driving one end of each conveying unit to rotate, and the synchronous wheels at the other end of each conveying unit are respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism.
In one embodiment, the driving assembly comprises a spline shaft, a coupler and a driving motor, one end of the spline shaft is connected with the driving motor through the coupler, and the other end of the spline shaft is connected with the center of the corresponding synchronous wheel of each conveying unit in a key manner.
In one embodiment, the other end of the spline shaft is respectively connected with the centers of the synchronous wheels of the two groups of conveying components in a key way, and two ends of the comb-tooth type plate-shaped structure are respectively and detachably connected with the inner surfaces of the synchronous belts of the two groups of conveying components.
In one embodiment, the alignment die comprises a comb plate-shaped structure, comb slots are formed between two adjacent comb teeth, the forming positions of the comb slots correspond to the setting positions of the chips, and the root width of the comb slots is matched with the size and the number of the chips to be placed.
In one embodiment, the formation position of the comb slot corresponds to a set position of the chip on the substrate pad, and the width of the root of the comb slot is equal to the width of one chip and/or the sum of the widths of a plurality of chips and the distances between the plurality of chips.
In one embodiment, the frame comprises a frame base, a frame strut, a frame cross member, and a frame rail, the frame strut being secured to the frame base and supporting the frame cross member and the frame rail; the bonding pad lifting alignment mechanism is arranged on the frame base, the film stretching alignment mechanism is arranged at the bottoms of the two frame cross beams, and the de-bonding control assembly is arranged on the frame cross beams.
In one embodiment, the unlocking operation assembly comprises a transverse moving assembly and an unlocking operation mechanism, wherein the unlocking operation mechanism comprises a laser and a camera, the camera is connected with the output end of the laser, and the camera is used for projecting a laser beam emitted by the laser onto a wafer; the transverse moving assembly is fixed on the frame beam and can move on the frame beam, and comprises a transverse moving right angle block, wherein the laser is mounted on the transverse moving right angle block.
In one embodiment, the unlocking operation assembly comprises a transverse movement assembly and an unlocking operation mechanism, and the unlocking operation mechanism comprises a thimble mechanism vertical movement assembly, a thimble mechanism and a precision camera device; the horizontal moving assembly is fixed on the frame cross beam and can move on the frame cross beam, the thimble mechanism vertical moving assembly is fixed on the horizontal moving assembly and can move up and down, and the thimble mechanism is arranged on the thimble mechanism vertical moving assembly; the precise camera device is used for detecting whether the distance between the chip on the film stretching mechanism and the corresponding position of the bonding pad chip on the substrate in the stretching direction is deviated or not.
In one embodiment, the pad lifting alignment mechanism comprises a bevel block assembly, a substrate assembly and a pad; the substrate assembly is mounted on the bevel block assembly, and the bonding pads are placed on a substrate of the substrate assembly; the oblique block assembly can bear the substrate assembly to horizontally and transversely move along the length direction of the frame, and the substrate assembly can bear the bonding pad to vertically move up and down.
In one embodiment, the film stretching and aligning mechanism further comprises a film stretching transverse aligning component and a film stretching longitudinal aligning component; the film stretching transverse alignment assembly is fixed at the bottom of the frame beam; the film stretching longitudinal alignment assembly is fixed on the film stretching transverse alignment assembly and can horizontally move along the length direction of the frame cross beam on the film stretching transverse alignment assembly; the film stretching mechanism is fixed on the film stretching longitudinal alignment assembly and can horizontally move along the length direction of the frame longitudinal beam on the film stretching longitudinal alignment assembly; the fixed end of the film stretching mechanism is fixed on the film stretching longitudinal alignment assembly, and the movable end of the film stretching mechanism can horizontally move along the length direction of the frame cross beam on the film stretching longitudinal alignment assembly.
Compared with the prior art, the invention has the beneficial effects that:
The invention provides a chip array huge amount transfer device which comprises a film stretching and aligning mechanism, wherein the film stretching and aligning mechanism comprises a film stretching mechanism and a comb tooth mechanism, the comb tooth mechanism comprises a driving assembly, a conveying assembly and an aligning die, the conveying assembly comprises at least two conveying units, each conveying unit comprises a synchronous belt, each synchronous belt is wound on at least two synchronous wheels, the aligning die is detachably arranged on the inner surface of the synchronous belt, the driving assembly is used for driving the synchronous wheels at one end of the conveying unit to rotate, and the synchronous wheels at the other end of the conveying unit are respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism. The synchronous belts of the two conveying units move under the drive of the driving assembly, so that the alignment die on the synchronous belts is driven to move towards the length direction of the synchronous belts, and therefore alignment of one row of chips can be realized, batch transfer of chip arrays can be realized, the transfer yield is ensured, and the efficiency of mass transfer is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. It is evident that the drawings in the following description are only examples, from which other drawings can be obtained by a person skilled in the art without the inventive effort. In the drawings:
FIG. 1 is a schematic diagram of a chip array macro transfer apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a frame according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a pad lifting alignment mechanism according to an embodiment of the present invention;
FIG. 4 is a schematic view of a swash block assembly according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a swash block driving assembly according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a substrate assembly according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a film stretching and aligning mechanism according to an embodiment of the present invention;
FIG. 8 is a schematic view of a film stretching and transverse alignment assembly according to an embodiment of the present invention;
FIG. 9 is a schematic view of a film stretching machine direction alignment assembly according to an embodiment of the present invention;
FIG. 10 is a schematic view of a film stretching mechanism according to an embodiment of the present invention;
FIG. 11 is a schematic view of a fixed end of a film stretching mechanism according to an embodiment of the present invention;
FIG. 12 is a schematic view of the movable end of a film stretching mechanism according to an embodiment of the present invention;
FIG. 13 is another schematic view of the movable end of the film stretching mechanism according to an embodiment of the present invention;
FIG. 14 is a schematic view of a comb mechanism according to an embodiment of the present invention;
FIG. 15 is another schematic view of a comb mechanism according to an embodiment of the present invention;
FIG. 16 is an enlarged view of a portion of the portion A of FIG. 15;
FIG. 17 is a schematic diagram of a structure of a positioning mold before positioning according to an embodiment of the present invention;
FIG. 18 is a schematic diagram of a structure of a contraposition mold according to an embodiment of the present invention;
FIG. 19 is a schematic view of another structure of the alignment die before alignment according to the embodiment of the invention;
FIG. 20 is a schematic view of another structure of the alignment mold according to the embodiment of the present invention after alignment;
FIG. 21 is a schematic view of another structure of a contraposition mold according to an embodiment of the present invention after contraposition;
FIG. 22 is a schematic view of a spike de-keying manipulation assembly according to an embodiment of the present invention;
FIG. 23 is another schematic view of an ejector pin debonding manipulation assembly according to an embodiment of the present invention;
FIG. 24 is a schematic view of a spike de-keying manipulation assembly according to an embodiment of the present invention;
FIG. 25 is a further schematic view of a spike de-keying manipulation assembly according to an embodiment of the present invention;
FIG. 26 is an enlarged partial view of the portion B of FIG. 25
FIG. 27 is a schematic view of a thimble mechanism according to an embodiment of the present invention;
FIG. 28 is a schematic view of a laser debonding manipulation mechanism according to an embodiment of the present invention;
FIGS. 29-32 are schematic diagrams illustrating operation of a chip array macro-transfer apparatus according to embodiments of the present invention.
It should be noted that these drawings and the written description are not intended to limit the scope of the inventive concept in any way, but to illustrate the inventive concept to those skilled in the art by referring to the specific embodiments.
Detailed Description
The application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be noted that, for convenience of description, only the portions related to the application are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
As mentioned in the background art, the present mass transfer technology is mostly single chip transfer, but the yield is high, but the efficiency is low, which does not accord with the high-speed development of the present electronic technology industry, so the improvement of the mass transfer efficiency while ensuring the transfer yield becomes the improvement direction of the present application.
Referring to fig. 1 to 32, fig. 1 to 32 show the specific structure and operation principle of the chip array mass transfer device of the present embodiment.
The overall view of the device is shown in fig. 1. The embodiment is a chip array huge transfer device, which mainly comprises a frame 1, a bonding pad lifting alignment mechanism 2, a film stretching alignment mechanism 3 and a de-bonding operation assembly 4. The bonding pad lifting alignment mechanism 2 is used for adjusting the position of the bonding pad in a horizontal and vertical movement manner; the film stretching alignment mechanism 3 is used for clamping and stretching a film, and adjusting the position of the film in the horizontal direction so as to align with a bonding pad; the de-bonding manipulation assembly 4 is used for peeling off the chip.
As shown in fig. 2, the frame 1 mainly includes: frame base 101, frame post 102, frame cross member 103, and frame stringer 104. The bonding pad lifting alignment mechanism 2 is arranged on the frame base 101; the film stretching and aligning mechanism 3 is arranged at the bottoms of the two frame beams 103; the de-keying steering assembly 4 is mounted on a frame rail 103.
As shown in fig. 3, the pad lifting and aligning mechanism 2 includes: the bevel block assembly 201, the substrate assembly 202, the bonding pad 203 are shown in fig. 4. The oblique block assembly 201 is fixed on the frame base 101, the substrate assembly 202 is stacked on the oblique block assembly 201, the bonding pad 203 is placed on the substrate assembly 202, the oblique block assembly 201 can bear the substrate assembly 202 to horizontally and transversely move along the length direction of the frame 1, and the substrate assembly 202 can bear the bonding pad to vertically move up and down.
As shown in fig. 4, the bevel block assembly 201 of the pad lifting alignment mechanism 2 includes: the bottom linear guide module 201A, the diagonal block 201B, the diagonal block linear guide module 201C, and the diagonal block drive module 201D are shown in fig. 5. The inclined block 201B is connected to the frame base 101 through the bottom linear guide rail module 201A, wherein the bottom of the inclined block 201B is connected with the slide block of the bottom linear guide rail module 201A, and the guide rail of the bottom linear guide rail module 201A is fixed with the frame base 101; the inclined block driving module 201D is assembled on two opposite inner sides of the two inclined blocks 201B; the guide rail of the inclined block linear guide rail module 201C is fixed on two inclined surfaces of the inclined block 201B, and comprises six groups, and three groups of the two inclined blocks 201B are respectively installed.
As shown in fig. 5, the swash block driving module 201D of the swash block assembly 201 mainly includes a fixed block 201D1, a nut 201D2, a forward and reverse screw 201D3, a coupling 201D4, a motor 201D5, a motor supporting block 201D6, and the like. Wherein the fixed block 201D1 is arranged on the frame base 101 and comprises three blocks; the number of the nuts 201D2 is two, and the nuts are respectively arranged on the inclined blocks 201B at the two sides; the forward and reverse lead screw 201D3 is connected with the fixed block 201D1 and the nut 201D2, and extends out of the fixed block 201D1 near one end of the motor 201D5 for a certain distance, and the forward and reverse lead screw 201D3 and the motor 201D5 are connected together through the coupler 201D 4; therefore, the motor 201D5 can drive the forward and reverse screw 201D3 and the nut 201D2, and then drive the two inclined blocks 201B fixed with the two nuts 201D2, and since the screw used is the forward and reverse screw, the two inclined blocks 201B can move in opposite directions under the driving of the motor 201D5 during operation, so as to adjust the lifting of the component mounted on the inclined surface thereof.
As shown in fig. 6, the substrate assembly 202 of the pad lifting/lowering alignment mechanism 2 includes: bevel stage 202A, substrate drive module 202B, substrate 202C, substrate linear guide module 202D, substrate displacement detection device 202E, and substrate displacement detection device connection block 202F. Wherein the inclined plane platform 202A is connected with the slide block of the inclined block linear guide rail module 201C, so that the substrate assembly 202 is connected with the inclined block assembly 201; the substrate 202C is connected with a slide block of the substrate linear guide rail module 202D, a linear guide rail of the substrate linear guide rail module 202D is fixed on the inclined plane platform 202A, and the bonding pad 203 is placed on the substrate 202C; the stator of the substrate driving module 202B is fixed on the inclined plane platform 202A, and the rotor of the stator is fixed with the bottom of the substrate 202C, i.e. the substrate driving module 202B drives the substrate 202C to move in the length direction of the guide rail of the substrate linear guide rail module 202D, so that the bonding pad 203 on the substrate driving module 202B moves; the substrate displacement detecting device 202E includes a detecting head and a scale element, the detecting head is fixed to the substrate displacement detecting device connecting block 202F, the substrate displacement detecting device connecting block 202F is mounted at the bottom of the substrate 202C, and the scale element of the substrate displacement detecting device 202E is attached to the inclined plane platform 202A, so that the displacement and the speed of the substrate 202C during movement can be detected.
As shown in fig. 7, the film stretching and aligning mechanism 3 includes the film stretching and aligning mechanism, and further includes a film stretching and transverse aligning component 301 and a film stretching and longitudinal aligning component 302; the film stretching transverse alignment assembly is fixed at the bottom of the frame beam 103; the film stretching longitudinal alignment assembly 302 is fixed on the film stretching transverse alignment assembly 301, the fixed end of the film stretching mechanism 303 is fixed on the film stretching longitudinal alignment assembly 302, and the movable end of the film stretching mechanism can horizontally move on the film stretching longitudinal alignment assembly along the length direction of the frame beam.
A film stretching transverse alignment assembly 301, a film stretching longitudinal alignment assembly 302, a film stretching mechanism 303, a film 304, a wafer 305 and a comb mechanism 306. Wherein the film stretching transverse alignment assembly 301 is fixed with the frame beam 103; the film stretching transverse alignment assembly 301 is fixed at the bottom of the frame beam 103, and the film stretching longitudinal alignment assembly 302 is mounted on the film stretching transverse alignment assembly 301 and can horizontally move along the length direction of the frame beam 103 on the film stretching transverse alignment assembly; the film stretching mechanism 303 is used for pressing the film 304 placed on the film stretching mechanism 303, and stretching the film 304 transversely outwards, and the film stretching mechanism 303 is fixed on the film stretching longitudinal alignment assembly and can horizontally move along the length direction of the frame longitudinal beam on the film stretching longitudinal alignment assembly; the wafer 305 is placed on the membrane 304; the comb mechanism 306 is mounted on the film stretching mechanism 303 for changing the distance between the chips on the wafer 305.
As shown in fig. 8, the film stretching and transverse alignment assembly 301 of the film stretching and alignment mechanism 3 includes a transverse linear guide rail module 301A, a film stretching and transverse alignment frame 301B, a film stretching and transverse alignment frame driving module 301C, a film stretching and transverse alignment frame displacement detection device 301D, and a film stretching and transverse alignment frame displacement detection device connection block 301E. Wherein, the film stretching transverse alignment frame 301B is connected with the slide block of the transverse linear guide rail module 301A, and the linear guide rail in the transverse linear guide rail module 301A is fixed at the bottom of the frame beam 103 in the frame 1; the stator of the film stretching transverse alignment frame driving module 301C is mounted at the bottom of the frame beam 103 in the frame 1, the rotor of the stator is fixed with the connecting block 301E of the film stretching transverse alignment frame displacement detecting device, and the connecting block 301E of the film stretching transverse alignment frame displacement detecting device is connected with the film stretching transverse alignment frame 301B, so that the film stretching transverse alignment frame 301B can move in the length direction of the guide rail of the transverse linear guide rail module 301A under the driving of the film stretching transverse alignment frame driving module 301C; the film stretching transverse alignment frame displacement detection device 301D comprises a detection head and a scale element, wherein the detection head is fixed on a connecting block 301E of the film stretching transverse alignment frame displacement detection device, the scale element is attached to the bottom of a frame beam 103 in the frame 1, and then the displacement and the speed of the film stretching transverse alignment frame 301B are detected by the film stretching transverse alignment frame displacement detection device 301D. The film stretching and lateral alignment assembly 301 is used for lateral alignment of the chip after stretching the film 304.
As shown in fig. 9, the film stretching and longitudinal alignment assembly 302 of the film stretching and alignment mechanism 3 includes: the film stretching longitudinal alignment frame comprises a longitudinal linear guide rail module 302A, a film stretching longitudinal alignment frame 302B, a film stretching longitudinal alignment frame driving module 302C, a film stretching longitudinal alignment frame displacement detection device 302D and a film stretching longitudinal alignment frame displacement detection device connecting block 302E. Wherein the film stretching longitudinal alignment frame 302B is fixed with the linear guide rail of the longitudinal linear guide rail module 302A, and the sliding block in the longitudinal linear guide rail module 302A is fixed on the film stretching transverse alignment frame 301B; the stator of the film stretching longitudinal alignment frame driving module 302C is mounted on the film stretching transverse alignment frame 301B, and the mover is connected to the film stretching longitudinal alignment frame 302B through the film stretching longitudinal alignment frame displacement detecting device connecting block 302E, so that the film stretching longitudinal alignment frame 302B can move along the length direction of the guide rail of the longitudinal linear guide rail module 302A under the driving of the film stretching longitudinal alignment frame driving module 302C; the film stretching longitudinal alignment frame displacement detection device 302D includes a detection head and a scale element, wherein the detection head is fixed on the connection block 302E of the film stretching longitudinal alignment frame displacement detection device, and the scale element is attached to the film stretching transverse alignment frame 301B, so that the displacement and the speed of the film stretching longitudinal alignment frame 302B can be detected. The film stretching machine direction alignment assembly 302 is used for machine direction alignment of the die after stretching of the film 304.
As shown in fig. 10, the film stretching mechanism 303 of the film stretching and aligning mechanism 3 includes: a film stretching mechanism fixed end 303A and a film stretching mechanism movable end 303B, wherein the film stretching mechanism movable end 303A can horizontally move along the length direction of the frame beam 103 on the film stretching longitudinal alignment assembly 302.
As shown in fig. 11 and 12, the film stretching mechanism fixed end 303A in the film stretching mechanism 303 includes: film stretching mechanism fixed end film pressing fixed block 303A1, film stretching mechanism fixed end film pressing movable block 303A2, film stretching mechanism fixed end film pressing movable block linear guide rail module 303A3, film stretching mechanism fixed end film pressing movable block driving device 303A4, film stretching mechanism fixed end film pressing fixed block fixed bearing boss 303A5. Wherein the film stretching mechanism fixing end film pressing fixing block 303A1 is fixed on the film stretching longitudinal alignment frame 302B in the film stretching longitudinal alignment assembly 302; the guide rail of the film stretching mechanism fixed end film pressing moving block linear guide rail module 303A3 is fixed on the film stretching mechanism fixed end film pressing fixed block 303A1, and the slide block of the guide rail is fixed with the film stretching mechanism fixed end film pressing moving block 303A 2; the film stretching mechanism fixed end film pressing moving block driving device 303A4 can drive the film stretching mechanism fixed end film pressing moving block 303A2 to move along the length direction of the guide rail in the linear guide rail module 303A 3; the film stretching mechanism fixed end film pressing moving block 303A2 is matched with the film stretching mechanism fixed end film pressing fixed block 303A1 to compress and loosen the film 304; the film stretching mechanism fixed end film pressing fixed block fixed bearing boss 303A5 and the film stretching mechanism fixed end film pressing fixed block 303A1 are integrally processed and are positioned on the outer side of the L-shaped fixed end film pressing fixed block.
As shown in fig. 12 and 13, the film stretching mechanism movable end 303B of the film stretching mechanism 303 includes: film stretching mechanism movable end linear guide rail module 303B1, film stretching mechanism movable end film pressing fixed block 303B2, film stretching mechanism movable end film pressing movable block 303B3, film stretching mechanism movable end film pressing movable block linear guide rail module 303B4, film stretching mechanism movable end film pressing movable block driving device 303B5, film stretching mechanism movable end displacement detection device connecting block 303B6, film stretching mechanism movable end driving module 303B7, film stretching mechanism movable end film pressing fixed block fixed bearing boss 303B8 and film stretching mechanism movable end displacement detection device 303B9. The film stretching mechanism movable end film pressing fixed block 303B2 is connected with a sliding block in the film stretching mechanism movable end linear guide rail module 303B1, and a linear guide rail in the film stretching mechanism movable end linear guide rail module 303B1 is fixed on a film stretching longitudinal alignment frame 302B in the film stretching longitudinal alignment assembly 302; the stator of the movable end driving module 303B7 of the film stretching mechanism is fixed on the film stretching longitudinal alignment frame 302B of the film stretching longitudinal alignment assembly 302, and the rotor of the stator is connected with the film pressing fixed block 303B2 of the movable end of the film stretching mechanism through the connecting block 303B6 of the movable end displacement detecting device of the film stretching mechanism, so that the movable end 303B of the whole film stretching mechanism can be driven to move along the length direction of the guide rail of the linear guide rail module 303B1 of the movable end of the film stretching mechanism; the movable end displacement detection device 303B9 of the film stretching mechanism comprises a detection head and a scale element, wherein the detection head is arranged on a connecting block 303B6 of the movable end displacement detection device of the film stretching mechanism, and the scale element is attached to a film stretching longitudinal alignment frame 302B of the film stretching longitudinal alignment assembly 302, so that the detection head can be used for detecting the displacement and the speed of the movable end film pressing fixed block 303B2 of the film stretching mechanism along the length direction of a guide rail of the movable end linear guide rail module 303B1 of the film stretching mechanism; the film stretching mechanism movable end film pressing movable block 303B3 is arranged on a sliding block of the film stretching mechanism movable end film pressing movable block linear guide rail module 303B4, and a guide rail of the film stretching mechanism movable end film pressing movable block linear guide rail module 303B4 is fixed on the film stretching mechanism movable end film pressing fixed block 303B 2; the film stretching mechanism movable end film pressing moving block driving device 303B5 can drive the film stretching mechanism movable end film pressing moving block 303B3 to move along the length direction of the guide rail of the film stretching mechanism movable end film pressing moving block linear guide rail module 303B 4; the film stretching mechanism movable end film pressing moving block 303B3 is matched with the film stretching mechanism movable end film pressing fixed block 303B2 to compress and loosen the film 304; the film stretching mechanism movable end film pressing fixed block fixing bearing boss 303B8 and the film stretching mechanism movable end film pressing fixed block 303B2 are integrally processed and are positioned on the outer side of the L-shaped movable end film pressing fixed block. Therefore, the film stretching mechanism 303 can compress the film 304 through the fixed end 303A and the movable end 303B of the film stretching mechanism, and after the two ends of the film 304 are compressed, the movable end 303B of the film stretching mechanism moves along the length direction of the guide rail in the linear guide rail module 303B1 of the movable end of the film stretching mechanism under the driving of the driving module 303B7 of the movable end of the film stretching mechanism, so as to transversely stretch the film 304.
The film stretching mechanism 303 is mainly used for fixing and stretching the film 304 attached with the wafer 305, so that the chips are transversely arranged in an array, and the inter-chip particle distance of the chips is in a multiple relationship with the corresponding positions of the chips of the bonding pads 203 on the substrate 202C, so that mass transfer can be conveniently realized, and the efficiency is improved.
Referring to fig. 14 to 16, the comb mechanism 306 in the film stretching mechanism 303 includes a driving assembly 306D, a conveying assembly and an alignment mold 306E, the conveying assembly includes two conveying units, each conveying unit includes a synchronous belt, each synchronous belt is wound on at least two synchronous wheels 306B, the alignment mold 306E is detachably mounted on an inner surface of the synchronous belt 306A, the driving assembly 306D is used for driving the synchronous wheels 306B at one end of the conveying unit to rotate, and the synchronous wheels 306B at the other end of the conveying unit are respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism. The synchronous belt 306B of the two conveying units moves under the drive of the driving assembly 306D, so that the alignment die 306E on the synchronous belt is driven to move towards the length direction of the synchronous belt 306A, alignment of one row of chips can be realized, batch transfer of chip arrays can be realized, the transfer yield is ensured, and the efficiency of mass transfer is improved.
Specifically, the transfer unit includes a timing belt 306A, a timing wheel 306B, and a bearing 306C. The comb mechanism driving assembly 306D includes a spline shaft 306D1, a coupling 306D2, and a comb mechanism driving motor 306D3, as shown in fig. 14. The synchronizing wheel 306B includes four spline shafts 306D1 connected to the comb mechanism driving assembly 306D, and two other spline shafts connected to the film stretching mechanism fixed end film pressing fixed block fixing bearing boss 303A5 and the film stretching mechanism movable end film pressing fixed block fixing bearing boss 303B8 through bearings 306C, respectively; the alignment die 306E is arranged on the inner surfaces of the two synchronous belts 306A, and is detachable and provided with a sparse ruler and a dense ruler; the synchronous belt 306A comprises two synchronous belts, one of the synchronous belts is close to the comb mechanism driving motor 306D3, the two synchronous belts 306A are arranged on four synchronous wheels 306B, and one synchronous belt 306A is matched with two synchronous wheels 306B; the two synchronizing wheels 306B connected with the spline shaft 306D1 are respectively connected with the film stretching mechanism fixed end film pressing fixed block 303A1 and the film stretching mechanism movable end film pressing fixed block 303B2 through bearings 306C, so that the distance between the two synchronizing wheels 306B connected with the spline shaft 306D1 can be adjusted along with the movement of the film stretching mechanism movable end 303B; after the distance is adjusted, assembling the alignment mold 306E; the spline shaft 306D1 is connected with the comb mechanism driving motor 306D3 through the coupling 306D2, so that the two synchronous belt structures move under the driving of the motor, and the alignment mold 306E thereon is driven to move in the length direction of the synchronous belt 306A, so that a row of chips on the wafer 305 are aligned.
In particular, the alignment mold 306E includes a comb-shaped plate-like structure 306E1, and a comb slot 306E12 is formed between two adjacent comb teeth 306E11, where the position of the comb slot 306E12 corresponds to the set position of the chip 306E2, and the root width of the comb slot 306E12 matches the size and the number of the chips 306E2 to be placed. The formation position of the comb slot 306E12 corresponds to the set position of the chip 306E2 on the substrate pad, and the width of the root of the comb slot 306E12 is equal to the sum of the width of one chip 306E2 and/or the width of a plurality of chips and the distance between a plurality of chips. Specifically, the tooth profile of the alignment die 306E can be designed as follows.
1) Dense teeth, as shown in fig. 17 and 18: that is, each die 306E2 occupies one comb tooth position, so that a one-time alignment of a whole row of die 306E2 can be realized, and then selective die-punching is performed, wherein the pitch of the dense teeth is matched with the pitch of the dies on the wafer 305.
2) Sparse teeth, as shown in fig. 19 and 20: the chip 306E2 sandwiched between the two comb teeth 306E12 is fixed, the chip sandwiched by the comb teeth 306E11 is the transferred chip, and the comb teeth slits 306E12 of the sparse teeth are matched with the chip position pitch on the bonding pad 203 on the substrate. The sparse teeth design reduces the alignment difficulty of the comb teeth and reduces the manufacturing difficulty of the comb teeth, but has the defects that alignment is needed for transferring one row of chips for several times, and huge transfer efficiency is lower than that of dense teeth.
In particular, the alignment mold 306E may be manufactured by etching, or may be a comb structure as shown in fig. 21, which has a relatively large size, or may be manufactured by machining, which is convenient.
In particular, the film stretching mechanism 303 may operate in two ways:
1) Film stretching scheme: the stretching film 304 is stretched to a chip pitch that is a multiple of the corresponding pitch of the chip locations of the pads 203 on the substrate 202C in the stretching direction. However, the thin film is unevenly deformed during stretching, and batch alignment cannot be ensured, so that the sparse teeth are used for fixing the chips to be transferred.
2) Film non-stretching protocol: the wafer 305 on the film 304 is directly fixed on the film stretching mechanism 303 after dicing, and is not stretched by the stretching mechanism or is only stretched appropriately to increase the distance between chips, so that the wafer is applicable to multi-size wafer transfer without stretching, and the dense teeth can be used for fixing the chips so as to facilitate the spike 402-1D3 spike.
In particular, the alignment mold 306E is detachable on the timing belt 306A. When the distance between the fixed end 303A of the film stretching mechanism and the movable end of the film stretching mechanism is fixed, an alignment mold 306E is installed to adapt to wafers with different sizes.
The unlocking operation assembly 4 comprises a transverse moving assembly and an unlocking operation mechanism 402, the transverse moving assembly is fixed on the frame beam 103 and can move on the frame beam 103, and the transverse moving assembly comprises a transverse moving right angle block 401, the unlocking operation mechanism 402, a transverse moving right angle block driving module 403, a transverse moving linear guide rail module 404, a transverse moving right angle block displacement detection device 405 and a transverse moving right angle block driving module connecting block 406.
Referring to fig. 22, the transverse moving right angle block driving module 403 and the transverse moving linear guide module 404 are installed at one side of the frame beam 103, wherein the two modules of the transverse moving linear guide module 404 are respectively fixed at the upper part and the inner side surface of one side of the frame beam 103 to form a right angle. The transverse movement right angle block 401 is mounted on the transverse movement linear guide rail module 404 and is connected with the rotor of the transverse movement right angle block driving module 403 through the transverse movement right angle block driving module connecting block 406, so that the transverse movement right angle block 401 can move along the length direction of the linear guide rail module under the driving of the driving module, namely, the transverse movement on the frame beam 103 is realized. The unlocking operation mechanism 402 is arranged on the transverse movement right-angle block 401; the lateral movement rectangular block displacement detecting device 405 is used for detecting the displacement and the speed of the lateral movement rectangular block 401, i.e. the upper part thereof.
The unlocking operation mechanism 402 may have two forms, namely a thimble unlocking operation mechanism 402-1 and a laser unlocking operation mechanism 402-2. It should be noted that the device shown in fig. 1 is generally shown in the form of a thimble-unlocking operation mechanism.
The structure and operation of the two debonding mechanisms are described below.
22-27, The form of the ejector pin de-keying manipulation mechanism 402-1 is first described. The ejector pin unlocking manipulating mechanism 402-1 includes: rigid-flexible coupled motion stage mechanism 402-1A, ejector pin de-keying vertical movement drive assembly 402-1B, ejector pin mechanism 402-1C and precision imaging apparatus 402-1D. The vertical moving assembly 402-1B of the thimble mechanism is fixed on the horizontal moving assembly and can move up and down, the thimble mechanism is mounted on the vertical moving assembly of the thimble mechanism, and the precision camera device is used for detecting whether the distance between the chip on the film stretching mechanism 303 and the corresponding position of the bonding pad chip on the substrate in the stretching direction is deviated or not.
The rigid-flexible coupled motion stage mechanism 402-1A includes: rigid-flexible coupled motion stage rigid frame 402-1A1, rigid-flexible coupled motion stage core motion platform 402-1A2, and rigid-flexible coupled motion stage flexible hinge 402-1A3; the rigid-flexible coupling motion platform core motion platform 402-1A2 further comprises a rigid-flexible coupling motion platform core motion platform driving device 402-1A21, a rigid-flexible coupling motion platform core motion platform driving device connecting block 402-1A22, a rigid-flexible coupling motion platform core motion platform displacement detection device 402-1A23 and a rigid-flexible coupling motion platform core motion platform displacement detection device fixing block 402-1A24; the ejector pin de-bonding vertical movement driving assembly 402-1B comprises an ejector pin Jie Jian, an ejector pin de-bonding vertical movement driving assembly connecting block 402-1B1 and an ejector pin de-bonding vertical movement linear guide rail module 402-1B2; the thimble mechanism 402-1C includes a thimble mounting block 402-1D1, a thimble mounting block pushing device 402-1D2, and a thimble 402-1D3.
Wherein, the ejector pin unlocking operation mechanism 402-1 is connected to the transverse movement right angle block 401 through the ejector pin unlocking vertical movement driving component connecting block 402-1B 1; in addition, the sliding block of the thimble-unlocking vertical moving linear guide rail module 402-1B2 is fixed on the side surface of the transverse moving right angle block 401, and the linear guide rail is fixed on the rigid-flexible coupling motion platform mechanism 402-1A and is driven by the thimble-unlocking vertical moving driving component 402-1B; the stator of the ejector pin unlocking vertical movement driving assembly 402-1B is fixed on the rigid-flexible coupling movement table mechanism 402-1A, the mover is connected with the ejector pin unlocking vertical movement driving assembly connecting block 402-1B1, and under the driving of the vertical movement driving assembly, the rigid-flexible coupling movement table mechanism 402-1A can move along the length direction of the ejector pin unlocking vertical movement linear guide rail module 402-1B2 linear guide rail, namely, vertical movement in the Z direction is realized.
The rigid-flexible coupling motion platform core motion platform 402-1A2 of the rigid-flexible coupling motion platform mechanism 402-1A is driven by the rigid-flexible coupling motion platform core motion platform driving device 402-1A21, the rigid-flexible coupling motion platform flexible hinge 402-1A3 is driven to elastically deform under the action of driving force, and micro displacement is generated by the elastic deformation of the rigid-flexible coupling motion platform flexible hinge 402-1A3, so that precise micro motion in the vertical direction is realized. This allows the device to be used in sub-micron and even nano-scale macro-transfer technologies such as Mini/Micro LEDs.
The thimble mechanism 402-1C of the de-bonding operation assembly 4 is arranged at the lower end of the rigid-flexible coupling motion platform core motion platform 402-1A2 through a thimble installation block pushing device 402-1D2 and is not contacted with the rigid frame 402-1A1 of the rigid-flexible coupling motion platform; the thimble installation block 402-1D1 is fixed at the tail end of the thimble installation block pushing device 402-1D2, and the thimble 402-1D3 is arranged at the bottom of the thimble installation block 402-1D 1. Then for the displacement of ejector pin 402-1D 3: the thimble Jie Jian is combined with the vertical movement driving component 402-1B to drive the 402-1A rigid-flexible coupling motion platform mechanism to realize a large stroke, so that the thimble 402-1D3 initially reaches a preset position, and the rigid-flexible coupling motion platform core motion platform driving device 402-1A21 is used for driving the rigid-flexible coupling motion platform core motion platform 402-1A2, so that the thimble 402-1D3 realizes precise micro-displacement under the pushing of the thimble installation block pushing device 402-1D2, and the precise positioning in the vertical direction is completed.
The precision camera device 402-1D is arranged outside the rigid-flexible coupling motion platform rigid frame 402-1A1 of the rigid-flexible coupling motion platform mechanism 402-1A and is used for observing the motion positioning of the whole de-bonding operation assembly 4.
Preferably, the rigid-flexible coupling motion platform flexible hinges 402-1A3 between the rigid-flexible coupling motion platform core motion platform 402-1A2 and the rigid-flexible coupling motion platform rigid frame 402-1A1 are symmetrically arranged and manufactured in an integral manner.
In particular, besides the crystal-piercing device in the form of a mechanical thimble, the crystal-piercing device can also be in the form of a laser-stripped chip, so that the crystal-piercing device is not in contact with and is transferred. With reference to fig. 28, a laser debonding manipulation mechanism 402-2 is described next.
The laser debonding manipulation mechanism 402-2 includes a laser 402-2A and a camera 402-2B. Wherein the laser 402-2A is mounted on the lateral movement right angle block 401, and the camera 402-2B is connected with the output end of the laser 402-2A. Laser is emitted by the laser 402-2A, and laser beams are projected onto the wafer by the camera 402-2B to realize chip stripping.
In addition, the laser is focused by a special optical system to form a very small light spot, so that the laser has high energy density and is non-contact in operation, so that a laser de-bonding mode is adopted to realize no mechanical punching force on a workpiece, the workpiece is not easy to deform, and the laser has the advantages of extremely small thermal influence, high precision and the like.
The working process of the chip array huge transfer device comprises the following steps:
1) Stretching a film: as shown in fig. 29, a wafer 305 attached to a film 304 is diced and then fixed on the film stretching mechanism 303, and a film stretching mechanism fixed end film pressing block driving device 303A4 and a film stretching mechanism movable end film pressing block driving device 303B5 are started to enable the two film pressing block film stretching mechanism fixed end film pressing blocks 303A2 and the film stretching mechanism movable end film pressing block 303B3 of the film stretching mechanism 303 to be matched with the film stretching mechanism fixed end film pressing block 303A1 and the film stretching mechanism movable end film pressing block 303B2 corresponding to the wafer to press the film 304; the film stretching mechanism movable end driving module 303B7 continuously applies force to stretch and deform the film 304, and the precise camera device 402-1D is used for detecting the spacing of the chips of the wafer 305 until the spacing of the chips is stretched to the relationship of the corresponding spacing of the chips of the bonding pads 203 on the substrate 202C in the stretching direction. However, the thin film is unevenly deformed during stretching, and batch alignment cannot be ensured, so that the sparse teeth are used for fixing the chips to be transferred.
2) Film non-stretching protocol: the wafer 305 on the film 304 is fixed on the film stretching mechanism 303 after dicing treatment, the distance between chips is increased without stretching by the stretching mechanism, and the dense teeth are directly used for fixing the chips to be transferred, so that the ejector pins 402-1D3 are punched.
Chip alignment: detecting the position of the chip after the film 304 is stretched by using a precision camera device 402-1D, and transversely moving the film stretching transverse alignment assembly 301 of the film stretching alignment mechanism 3 to integrally move along the length direction of the transverse linear guide rail module 301A arranged at the bottom of the frame beam 103 in the frame 1, namely, the transverse alignment process of the chip, as shown in FIG. 30; then, the film stretching and longitudinal alignment assembly 302 of the film stretching and alignment mechanism 3 is longitudinally moved, so that the film stretching and longitudinal alignment assembly 302 and the film stretching mechanism 303 move along the length direction of the longitudinal linear guide rail module 302A mounted on the film stretching and transverse alignment frame 301B, namely, the longitudinal alignment process of the chip is shown in fig. 31; the bonding pad 203 on the substrate 202C may be driven by the bevel block driving module 201D in the bevel block assembly 201 to change along with the change of the height of the bevel platform 202A; in addition, the bonding pad 203 on the substrate 202C may move along the length direction of the substrate linear guide module 202D along with the substrate driving module 202B driving the substrate 202C, which is a longitudinal feeding process of the bonding pad 203, as shown in fig. 32.
The comb teeth fix the chip. After the alignment process, the alignment die 306E of the comb mechanism 306 is used to fix the transferred chip, so as to avoid further deformation of the film during the needling of the ejector pins 402-1D3, and the deformation of the film is redistributed after the partial chip transfer, so that the chip dislocation is increased, and the chip transfer yield is affected.
And detecting again, ensuring accurate alignment and transferring huge amounts. The precision imaging device 402-1D again detects whether the chip position after alignment deviates from the chip corresponding position of the bonding pad 203 on the substrate 202C, and if so, the mass transfer is performed after the alignment is adjusted to the correct position. And manufacturing a display panel, and transferring the red, green and blue chips in batches.
Referring to fig. 6, fig. 6 shows an alignment mechanism for mass transfer of chip arrays according to the present embodiment.
The alignment mechanism comprises a driving assembly, a conveying assembly and the alignment die, wherein the conveying assembly comprises a synchronous belt and at least two synchronous wheels, the synchronous belt is wound on the at least two synchronous wheels, the comb-tooth type plate-shaped structure is detachably arranged on the inner surface of the synchronous belt, and the driving assembly is used for driving the synchronous wheels to rotate.
The structure of the transmission assembly includes, but is not limited to, the above manner, and other structures capable of converting rotational motion into translational motion may be adopted, such as a gear and a rack meshed with each other, and further such as a worm wheel and a worm screw matched with each other.
The driving assembly comprises a driving motor, a coupler and a spline shaft, one end of the spline shaft is connected with the driving motor through the coupler, and the other end of the spline shaft is connected with the center of one of the synchronous wheels in a key manner. The driving motor drives the spline shaft to rotate through the coupler, and the spline shaft drives the synchronous wheel to rotate.
Preferably, the conveying assembly comprises two groups of conveying assemblies, the other ends of the spline shafts are respectively connected with the centers of the synchronous wheels of the two groups of conveying assemblies in a key way, and two ends of the comb-tooth-shaped plate-shaped structure are respectively and detachably connected with the inner surfaces of the synchronous belts of the two groups of conveying assemblies.
According to the embodiment of the application, the batch transfer mode of the existing chip array is improved, the driving assembly drives the synchronous wheel to rotate, the synchronous wheel rotates to drive the synchronous belt to move, the comb tooth-shaped plate-shaped structure arranged on the inner surface of the synchronous belt moves forwards, the comb tooth tops of the comb tooth-shaped plate-shaped structure are inserted into gaps between two adjacent chips, and the movement is continued until the chips are completely clamped into the comb tooth gaps, so that the chips are fixed, one row of chip alignment is completed, the batch transfer of the chip array can be realized, the transfer yield is ensured, and the efficiency of mass transfer is improved.
It should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The foregoing description is only illustrative of the preferred embodiment of the present invention, and is not to be construed as limiting the invention, but is to be construed as limiting the invention to any and all simple modifications, equivalent variations and adaptations of the embodiments described above, which are within the scope of the invention, may be made by those skilled in the art without departing from the scope of the invention.
Claims (9)
1. The chip array huge transfer device is characterized by comprising a frame, a bonding pad lifting alignment mechanism, a film stretching alignment mechanism and an unlocking operation assembly, wherein the bonding pad lifting alignment mechanism is used for adjusting the position of a bonding pad in a horizontal and vertical movement manner; the film stretching alignment mechanism is used for clamping and stretching the film, and adjusting the position of the film in the horizontal direction so as to align with the bonding pad; the de-bonding operation assembly is used for stripping the chip;
The film stretching alignment mechanism comprises a film stretching mechanism and a comb tooth mechanism, the film stretching mechanism comprises a film stretching mechanism fixed end and a film stretching mechanism movable end, the film stretching mechanism fixed end and the film stretching mechanism movable end are respectively used for clamping two ends of the film, and the film stretching mechanism movable end stretches the film by approaching to or separating from the film stretching mechanism fixed end;
the comb tooth mechanism comprises a driving assembly, a conveying assembly and an alignment die, wherein the conveying assembly comprises at least two conveying units, each conveying unit comprises a synchronous belt, each synchronous belt is wound on at least two synchronous wheels, the alignment die is detachably arranged on the inner surface of each synchronous belt, the driving assembly is used for driving one synchronous wheel at one end of each conveying unit to rotate, and the synchronous wheel at the other end of each conveying unit is respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism;
The alignment die comprises a comb-tooth-shaped plate structure, comb-tooth slits are formed between two adjacent comb teeth, the forming positions of the comb-tooth slits correspond to the setting positions of the chips, and the root width of the comb-tooth slits is matched with the size and the number of the chips to be placed.
2. The chip array macro transfer apparatus according to claim 1, wherein the driving assembly comprises a spline shaft, a coupling and a driving motor, one end of the spline shaft is connected with the driving motor through the coupling, and the other end of the spline shaft is connected with the center of the corresponding synchronizing wheel of each of the transfer units in a key manner.
3. The chip array macro-transfer apparatus of claim 2, wherein the transfer assembly comprises two sets of transfer assemblies; the other end of the spline shaft is respectively connected with the centers of the synchronous wheels of the two groups of conveying components in a key way, and two ends of the comb-tooth type plate-shaped structure are respectively and detachably connected with the inner surfaces of the synchronous belts of the two groups of conveying components.
4. The chip array mass transfer device according to claim 1, wherein the formation position of the comb-teeth slit corresponds to a set position of the chip on the substrate pad, and the root width of the comb-teeth slit is equal to the sum of the width of one chip and/or the width of a plurality of chips and the distance between the plurality of chips.
5. The chip array macro-transfer device of claim 1, wherein the frame comprises a frame base, a frame post, a frame cross member, and a frame rail, the frame post being secured to the frame base and supporting the frame cross member and the frame rail; the bonding pad lifting alignment mechanism is arranged on the frame base, the film stretching alignment mechanism is arranged at the bottoms of the two frame cross beams, and the de-bonding control assembly is arranged on the frame cross beams.
6. The chip array macro transfer apparatus according to claim 5, wherein the de-bonding operation assembly comprises a lateral movement assembly and a de-bonding operation mechanism, the de-bonding operation mechanism comprises a laser and a camera, the camera is connected with an output end of the laser, and the camera is used for projecting a laser beam emitted by the laser onto a wafer; the transverse moving assembly is fixed on the frame beam and can move on the frame beam, and comprises a transverse moving right angle block, wherein the laser is mounted on the transverse moving right angle block.
7. The chip array macro transfer apparatus of claim 5, wherein the de-keying manipulation assembly comprises a lateral movement assembly and a de-keying manipulation mechanism, the de-keying manipulation mechanism comprising a thimble mechanism vertical movement assembly, a thimble mechanism and a precision camera device; the horizontal moving assembly is fixed on the frame cross beam and can move on the frame cross beam, the thimble mechanism vertical moving assembly is fixed on the horizontal moving assembly and can move up and down, and the thimble mechanism is arranged on the thimble mechanism vertical moving assembly; the precise camera device is used for detecting whether the distance between the chip on the film stretching mechanism and the corresponding position of the bonding pad chip on the substrate in the stretching direction is deviated or not.
8. The chip array macro transfer apparatus of claim 5, wherein the pad lift alignment mechanism comprises a bevel block assembly, a substrate assembly and a pad; the substrate assembly is mounted on the bevel block assembly, and the bonding pads are placed on a substrate of the substrate assembly; the oblique block assembly can bear the substrate assembly to horizontally and transversely move along the length direction of the frame, and the substrate assembly can bear the bonding pad to vertically move up and down.
9. The chip array macro transfer apparatus of claim 5, wherein the film stretching and aligning mechanism further comprises a film stretching and transverse aligning component and a film stretching and longitudinal aligning component; the film stretching transverse alignment assembly is fixed at the bottom of the frame beam; the film stretching longitudinal alignment assembly is fixed on the film stretching transverse alignment assembly and can horizontally move along the length direction of the frame cross beam on the film stretching transverse alignment assembly; the film stretching mechanism is fixed on the film stretching longitudinal alignment assembly and can horizontally move along the length direction of the frame longitudinal beam on the film stretching longitudinal alignment assembly; the fixed end of the film stretching mechanism is fixed on the film stretching longitudinal alignment assembly, and the movable end of the film stretching mechanism can horizontally move along the length direction of the frame cross beam on the film stretching longitudinal alignment assembly.
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| CN114512584B (en) | 2022-02-18 | 2022-08-16 | 广东工业大学 | Mini/micro chip fast transferring and packaging system |
| CN114512579B (en) * | 2022-02-18 | 2022-10-11 | 广东工业大学 | Mini/micro chip flexible flying crystal-pricking device |
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