CN111128760A - 一种基于扇出型封装工艺的芯片封装方法及芯片封装结构 - Google Patents
一种基于扇出型封装工艺的芯片封装方法及芯片封装结构 Download PDFInfo
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- CN111128760A CN111128760A CN201911379301.9A CN201911379301A CN111128760A CN 111128760 A CN111128760 A CN 111128760A CN 201911379301 A CN201911379301 A CN 201911379301A CN 111128760 A CN111128760 A CN 111128760A
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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Abstract
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CN201911379301.9A CN111128760B (zh) | 2019-12-27 | 2019-12-27 | 一种基于扇出型封装工艺的芯片封装方法及芯片封装结构 |
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CN112831140A (zh) * | 2021-01-29 | 2021-05-25 | 福建省民爆化工股份有限公司 | 一体化注塑材料制备及其使用方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105140211A (zh) * | 2015-07-14 | 2015-12-09 | 华进半导体封装先导技术研发中心有限公司 | 一种fan-out的封装结构及其封装方法 |
CN105161465A (zh) * | 2015-08-10 | 2015-12-16 | 中芯长电半导体(江阴)有限公司 | 晶圆级芯片封装方法 |
CN105225965A (zh) * | 2015-11-03 | 2016-01-06 | 中芯长电半导体(江阴)有限公司 | 一种扇出型封装结构及其制作方法 |
CN105304605A (zh) * | 2015-11-20 | 2016-02-03 | 江阴长电先进封装有限公司 | 一种芯片嵌入式封装结构及其封装方法 |
CN107195607A (zh) * | 2017-07-03 | 2017-09-22 | 京东方科技集团股份有限公司 | 一种芯片封装方法及芯片封装结构 |
CN109003907A (zh) * | 2018-08-06 | 2018-12-14 | 中芯集成电路(宁波)有限公司 | 封装方法 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105140211A (zh) * | 2015-07-14 | 2015-12-09 | 华进半导体封装先导技术研发中心有限公司 | 一种fan-out的封装结构及其封装方法 |
CN105161465A (zh) * | 2015-08-10 | 2015-12-16 | 中芯长电半导体(江阴)有限公司 | 晶圆级芯片封装方法 |
CN105225965A (zh) * | 2015-11-03 | 2016-01-06 | 中芯长电半导体(江阴)有限公司 | 一种扇出型封装结构及其制作方法 |
CN105304605A (zh) * | 2015-11-20 | 2016-02-03 | 江阴长电先进封装有限公司 | 一种芯片嵌入式封装结构及其封装方法 |
CN107195607A (zh) * | 2017-07-03 | 2017-09-22 | 京东方科技集团股份有限公司 | 一种芯片封装方法及芯片封装结构 |
CN109003907A (zh) * | 2018-08-06 | 2018-12-14 | 中芯集成电路(宁波)有限公司 | 封装方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112831140A (zh) * | 2021-01-29 | 2021-05-25 | 福建省民爆化工股份有限公司 | 一体化注塑材料制备及其使用方法 |
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