CN111101104A - Method for metalizing surface of insulating material - Google Patents
Method for metalizing surface of insulating material Download PDFInfo
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- CN111101104A CN111101104A CN202010027108.5A CN202010027108A CN111101104A CN 111101104 A CN111101104 A CN 111101104A CN 202010027108 A CN202010027108 A CN 202010027108A CN 111101104 A CN111101104 A CN 111101104A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a method for metalizing the surface of an insulating material, which comprises the steps of firstly carrying out ion beam cleaning treatment on the surface of a substrate material by adopting an ion beam cleaning process after the substrate material is vacuumized in a vacuum container, and then carrying out pure ion vacuum coating treatment on the surface after the ion beam cleaning treatment by adopting a pure ion vacuum coating process. According to the technical scheme provided by the invention, before pure ion vacuum coating, the surface of the substrate material is cleaned by adopting an ion beam cleaning process, so that gas molecules adsorbed on the surface of the substrate material are completely removed, and the bonding strength of the film material is obviously improved. Meanwhile, the requirement on the coating temperature of the pure ion vacuum coating is low, and the requirement on the temperature resistance of the insulating material is met.
Description
Technical Field
The invention relates to the field of material surface treatment, in particular to a method for metalizing the surface of an insulating material.
Background
In the fields of military aerospace and civil use, the surfaces of a plurality of insulating products need to have electric conduction capability, namely, the surfaces of insulating materials need to be subjected to electric conduction and metallization. The existing methods for metalizing the surface of the insulating material comprise chemical plating, vacuum evaporation coating and vacuum magnetron sputtering coating. Chemical plating is a relatively traditional surface treatment method, which is a method for reducing metal ions in plating solution into metal by using a strong reducing agent under the condition of no external current and depositing the metal ions on the surfaces of various materials to form a plating layer; the method has the advantages of environmental pollution, poor binding force, loose film layer and non-compact plating layer. Vacuum evaporation coating refers to that a vacuum pumping system pumps a vacuum container to a specified vacuum condition; heating the solid film material to a proper temperature by a heating source to vaporize the surface; the gasified atoms on the surface of the film raw material are incident on the surface of the film coating product to form a film layer; the film obtained by the method has poor and uneven binding force, and is loose and not compact. The vacuum magnetron sputtering coating is characterized in that a vacuum pumping system pumps a vacuum container to a specified vacuum condition, argon is filled in a vacuum environment, electrons collide with argon atoms in the motion process under the action of an electric field to ionize argon ions and electrons, the argon ions bombard a cathode target under the action of the electric field to sputter target atoms and ions, the ionization efficiency of the argon is improved by utilizing a magnetic field, the deposition rate of a film layer is improved, and the target atoms and the ions are deposited on the surface of a coated product to form the film layer. The vacuum magnetron sputtering coating film also has the defects of weak film bonding force and untight film layer.
In order to solve the problem of binding force in the existing vacuum coating, a heating method is generally adopted: the temperature of vacuum coating is increased to more than 400 ℃, the thermal movement capability of molecules is increased, and the binding force is improved. However, most insulating materials, especially plastics, are resistant to temperatures below 200 ℃ and cannot bear the high temperature of vacuum coating, so that the existing vacuum coating technology cannot effectively improve the bonding force of the film on the insulating materials, especially on the plastics.
Disclosure of Invention
The invention aims to provide a method for metalizing the surface of an insulating material, which can improve the bonding force between a film layer and the insulating material.
The technical scheme adopted by the invention is as follows:
a method for metalizing the surface of an insulating material is characterized by comprising the following steps: after the substrate material is vacuumized in a vacuum container, the surface of the substrate material is firstly cleaned by ion beams by an ion beam cleaning process, and then the surface cleaned by the ion beams is subjected to pure ion vacuum coating by a pure ion vacuum coating process.
The specific scheme is as follows: the substrate material is biased during the pure ion vacuum coating process.
The voltage of the ion beam cleaning treatment is 300V-5000V, and the Ar ion energy is as follows: 200eV to 5000 eV.
The bias voltage applied to the substrate material when the substrate material is subjected to pure ion vacuum coating treatment is-10000V-0V.
The temperature in the vacuum container is 0-150 ℃ when the substrate material is subjected to pure ion vacuum coating treatment.
The substrate material is an insulating material, and the film plated on the substrate material comprises conductive materials such as metal, alloy and metal compound.
The pressure after vacuum-pumping in the vacuum container is 10-1Pa magnitude of 10-5Of the order of Pa.
The insulating material comprises inorganic glass, resin, organic glass, plastics (such as polytetrafluoroethylene, PE, PP, PVC, PET, acrylic plate, etc.), bakelite and ceramics, and the film layers plated on the substrate material comprise a metal film layer, an alloy film layer and a metal compound film layer.
The thickness of the coating layer on the substrate material is 0-50 microns.
The film layer plated on the substrate material is of a layered structure, and the material compositions of all layers are the same or different.
The current parameter of pure ions in the pure ion vacuum coating is 20A-300A; diameter range of the pure ion electromagnetic filtering elbow pipe: 0.1m to 0.8 m; the length range of the pure ion electromagnetic filtering bent pipe is as follows: 0.2m to 1.5 m; the material requirement of the pure ion electromagnetic filtering bent pipe is as follows: stainless steel, pure copper, copper alloys, aluminum alloys, and the like; magnetic field range of pure ion electromagnetic filtration system: 30Gs to 3000 Gs; range of pure ion electromagnetic scanning magnetic field: 10Gs to 3000 Gs; the driving mechanism of the plasma trigger mechanism is driven by compressed gas or a motor.
Compared with the prior art, the technical scheme provided by the invention has the advantages that before pure ion vacuum coating, the surface of the substrate material is cleaned by adopting an ion beam cleaning process, so that gas molecules adsorbed on the surface of the substrate material are completely removed, and the bonding strength of the film layer is obviously improved. Meanwhile, the requirement on the coating temperature of the pure ion vacuum coating is low, and the requirement on the temperature resistance of the insulating material is met.
Drawings
Fig. 1 is a schematic structural diagram of a pure ion vacuum coating system.
100-vacuum container, 200-substrate material, 300-ion beam cleaning equipment, 410-pure ion coating equipment, 411-plasma trigger device, 412-cathode, 413-anode, 420-electromagnetic filter device, 430-electromagnetic scanning device and 500-vacuum pumping device.
Detailed Description
In order that the objects and advantages of the invention will be more clearly understood, the following description is given in conjunction with the accompanying examples. It is to be understood that the following text is merely illustrative of one or more specific embodiments of the invention and does not strictly limit the scope of the invention as specifically claimed.
As used herein, the terms "parallel," "perpendicular," and the like are not limited to their strict geometric definition, but include tolerances for machining or human error, reasonable and inconsistent.
The structure is shown in fig. 1, which is a vacuum coating system for coating according to the present invention, and the vacuum coating system includes a vacuum container 100, the vacuum container 100 is connected to a vacuum pumping device 500, an assembling device for assembling a substrate material 200 to be coated is disposed in the vacuum container 100, and an ion beam cleaning device 300 and a pure ion coating device 410 are further disposed on the vacuum container 100. The specific ion beam cleaning apparatus 300 and the pure ion plating apparatus 410 are disposed correspondingly on the side wall of the vacuum vessel 100. The assembling device is connected with the adjusting device, and the adjusting device adjusts the substrate material 100 to rotate, so that the surface to be processed of the substrate material 100 can be arranged corresponding to the ion beam cleaning equipment 300 and the pure ion plating equipment 410. The mounting device is connected to a bias power supply.
In detail, the pure ion plating apparatus 410 includes a cathode 412, an anode 413, and a plasma trigger 411, wherein the plasma trigger 411 is connected to the vacuum vessel 100 through an electromagnetic filter 420. The outlet end of the electromagnetic filtering device 420 is provided with an electromagnetic scanning device 430. The electromagnetic filtering device 420 comprises a filtering pipe with the radian of 30-180 degrees, a magnetic field filtering device is arranged on the filtering pipe, the length of the filtering pipe is 0.2-1.5 m, and the diameter of the filtering pipe is 0.1-0.8 m. The electromagnetic scanning device 430 includes a straight tube with a filtering tube outlet end arranged along the length direction, the diameter of the straight tube is consistent with that of the filtering tube, and a scanning magnetic field device is arranged on the straight tube. The base material is mounted in the vacuum container in a pedestal supporting or hanging manner. The bias power supply is a negative voltage power supply of-10000V-0V. The material of the filter pipe can be stainless steel, pure copper, copper alloy and aluminum alloy.
The example of using the vacuum coating system to realize the material surface metallization is as follows:
example 1 (Metal film)
The substrate material is inorganic glass, the substrate material is clamped in a vacuum container through an assembling device, and the vacuum container is vacuumized by starting a vacuumizing device, so that the pressure in the vacuum container is 10-5Pa magnitude, adjusting the rotation of the rotating structure to enable the surface to be processed of the substrate material to be arranged corresponding to the ion beam cleaning device, and performing ion beam cleaning treatment on the surface of the substrate material by adopting an ion beam cleaning process, wherein the voltage of the ion beam cleaning treatment is 5000V, and the energy of Ar ions is as follows: 5000 eV. After the ion beam cleaning is finished, the substrate material is rotated to enable the surface after the cleaning treatment to be arranged corresponding to the pure ion vacuum coating equipment, the substrate material is connected with a negative pressure power supply of-10000V, and the temperature in the vacuum container is controlled to be 150 ℃. Titanium is used as a coating target material of a cathode, a plasma trigger device is driven by compressed gas, and the parameter of pure ion current is 100A; adjusting the filtering magnetic field device to make the magnetic field in the filtering pipe: 300 Gs; adjusting the scanning magnetic field device to make the scanning magnetic field: 3000 Gs; so that the thickness of the plated film on the base material was 10 μm.
Example 2 (Metal film)
Clamping the base material in a vacuum container by an assembling device, starting a vacuumizing device, and vacuumizing the vacuum container to ensure that the pressure in the vacuum container is 10-4Pa magnitude, adjusting the rotation of the rotating structure to enable the surface to be processed of the substrate material to be arranged corresponding to the ion beam cleaning device, and performing ion beam cleaning treatment on the surface of the substrate material by adopting an ion beam cleaning process, wherein the voltage of the ion beam cleaning treatment is 800V, and the energy of Ar ions is as follows: 800 eV. After the ion beam cleaning is finished, the substrate material is rotated to enable the surface after the cleaning treatment to be arranged corresponding to the pure ion vacuum coating equipment, the substrate material is connected with a negative pressure power supply of-1000V, and the temperature in the vacuum container is controlled to be 100 ℃. Chromium is used as a coating target material of a cathode, a plasma trigger device is driven by a motor, and the parameter of pure ion current is 50A; adjusting the filtering magnetic field device to make the magnetic field in the filtering pipe: 3000 Gs; the scanning magnetic field device is adjusted to ensure that the magnetic field in the straight pipe is as follows: 2000 Gs; so that the thickness of the coating layer on the base material is 30 μm.
Example 3 (Metal film)
The base material is plastic, the base material is clamped in a vacuum container through an assembling device, a vacuumizing device is started, the vacuum container is vacuumized, and the pressure in the vacuum container is 10-4Pa magnitude, adjusting the rotation of the rotating structure to enable the surface to be processed of the substrate material to be arranged corresponding to the ion beam cleaning device, and performing ion beam cleaning treatment on the surface of the substrate material by adopting an ion beam cleaning process, wherein the voltage of the ion beam cleaning treatment is 500V, and the energy of Ar ions is as follows: 300 eV. After the ion beam cleaning is finished, the substrate material is rotated to enable the surface after the cleaning treatment to be arranged corresponding to the pure ion vacuum coating equipment, the substrate material is connected with a negative pressure power supply of-50V, and the temperature in the vacuum container is controlled to be 75 ℃. Pure gold is adopted as a coating target material of a cathode, a plasma trigger device is driven by compressed gas or a motor, and the pure ion current parameter is 30A; adjusting the filtering magnetic field device to make the magnetic field in the filtering pipe: 2500 Gs; adjusting the scanning magnetic field device so that the magnetic field in the straight tube is: 1000 Gs; so that the thickness of the film coated layer on the base material is 0.1 micron.
Example 4 (Metal film)
The substrate material is a composite circuit board, the substrate material is clamped in a vacuum container through an assembling device, a vacuumizing device is started, the vacuum container is vacuumized, and the pressure in the vacuum container is 10-3Pa magnitude, adjusting the surface to be processed of the substrate material to be arranged corresponding to the ion beam cleaning device, and performing ion beam cleaning treatment on the surface of the substrate material by adopting an ion beam cleaning process, wherein the voltage of the ion beam cleaning treatment is 1000V, and the energy of Ar ions is as follows: 900 eV. After the ion beam cleaning is finished, the substrate material is rotated to enable the surface after the cleaning treatment to be arranged corresponding to the pure ion vacuum coating equipment, the substrate material is connected with a negative pressure power supply of-800V, and the temperature in the vacuum container is controlled to be 120 ℃. Pure copper is adopted as a coating target material of a cathode, a plasma trigger device is driven by compressed gas, and the pure ion current parameter is 80A; adjusting the filtering magnetic field device to make the magnetic field in the filtering pipe: 2500 Gs; the scanning magnetic field device is adjusted to ensure that the magnetic field in the straight pipe is as follows: 1500 Gs; so that the thickness of the plated film on the base material was 50 μm.
Example 5 (alloy film)
The substrate material is ceramic, the substrate material is clamped in a vacuum container through an assembling device, a vacuumizing device is started, the vacuum container is vacuumized, and the pressure in the vacuum container is 10-4Pa magnitude, adjusting the rotation of the rotating structure to enable the surface to be processed of the substrate material to be arranged corresponding to the ion beam cleaning device, and performing ion beam cleaning treatment on the surface of the substrate material by adopting an ion beam cleaning process, wherein the voltage of the ion beam cleaning treatment is 5000V, and the energy of Ar ions is as follows: 2500 eV. After the ion beam cleaning is finished, the substrate material is rotated to enable the surface after the cleaning treatment to be arranged corresponding to the pure ion vacuum coating equipment, the substrate material is connected with a negative pressure power supply of-2000V, and the temperature in the vacuum container is controlled to be 150 ℃. The method comprises the following steps of (1) adopting nickel-chromium alloy as a cathode coating target material, driving a plasma trigger device by adopting compressed gas, wherein the pure ion current parameter is 300A; adjusting the magnetic field filtering device to make the filter tube inThe magnetic field of (A) is: 1500 Gs; the scanning magnetic field device is adjusted to ensure that the magnetic field in the straight pipe is as follows: 2000 Gs; so that the thickness of the plated layer on the base material was 25 μm.
Example 6 (Metal Compound film layer)
The substrate material is organic glass, the substrate material is clamped in a vacuum container through an assembling device, a vacuumizing device is started, the vacuum container is vacuumized, and the pressure in the vacuum container is 10-4Pa magnitude, adjusting the rotation of the rotating mechanism to enable the surface to be treated of the substrate material to be arranged corresponding to the ion beam cleaning device, and performing ion beam cleaning treatment on the surface of the substrate material by adopting an ion beam cleaning process, wherein the voltage of the ion beam cleaning treatment is 600V, and the energy of Ar ions is as follows: 500 eV. After the ion beam cleaning is finished, the substrate material is rotated to enable the surface after the cleaning treatment to be arranged corresponding to the pure ion vacuum coating equipment, the substrate material is connected with a negative pressure power supply of-1000V, and the temperature in the vacuum container is controlled to be 100 ℃. Chromium is used as a coating target material of a cathode, a plasma trigger device is driven by a motor, and the parameter of pure ion current is 150A; adjusting the filtering magnetic field device to make the magnetic field in the filtering pipe: 1000 Gs; the scanning magnetic field device is adjusted to ensure that the magnetic field in the straight pipe is as follows: 2000 Gs; when the film deposition process is carried out, N2 is filled as process gas to generate a chromium nitride film, so that the thickness of a film coating layer on the substrate material is 2 microns.
Example 7 (multilayer film)
The substrate material is organic glass, the substrate material is clamped in a vacuum container through an assembling device, a vacuumizing device is started, the vacuum container is vacuumized, and the pressure in the vacuum container is 10-4And Pa magnitude, adjusting the rotation of the rotating mechanism to enable the surface to be treated of the substrate material to be arranged corresponding to the ion beam cleaning device, and performing ion beam cleaning treatment on the surface of the substrate material by adopting an ion beam cleaning process, wherein the voltage of the ion beam cleaning treatment is 800V, and the energy of Ar ions is as follows: 600 eV. After the ion beam cleaning is finished, the substrate material is rotated to ensure that the surface after the cleaning treatment is arranged corresponding to the pure ion vacuum coating equipment, the substrate material is connected with a negative pressure power supply of-600V, and the temperature in the vacuum container is controlled to be120 ℃ is adopted. The equipment is provided with 2 sets of pure ion coating devices, and chromium and gold are respectively adopted as coating targets of the cathode. The plasma trigger device is driven by a motor, and the pure ion current parameter is 150A; adjusting the filtering magnetic field device to make the magnetic field in the filtering pipe: 1000 Gs; the scanning magnetic field device is adjusted to ensure that the magnetic field in the straight pipe is as follows: 2000 Gs. Firstly, depositing a chromium film with the thickness of 1 micron; and then gold film deposition is carried out, the thickness is 0.5 micron, and the total thickness of the film coating layer on the substrate material is 1.5 micron.
The coating films on the substrate materials in examples 1-6 were tested according to the terms 2.4 and 2.8 in the test method for electrodeposition and chemical deposition adhesion strength of the covering layer on the GB/T5270-2005 metal substrate.
The method for testing the binding force of the plating layer comprises the following steps: the cross-cut method plus the tape method.
And scribing a plurality of rows of 1mm multiplied by 1mm small squares on the surface of the plating layer by using a scalpel, scratching the small squares into the basal layer, observing whether a metal layer peels off or peels off, then adhering a 2-3.5N/cm transparent adhesive tape to a grid scribing area, completely adhering the small squares without air bubbles, standing for 10 seconds, applying a force vertical to the surface of the plating layer, quickly pulling down the adhesive tape, and visually inspecting whether the metal layer peels off or peels off by using a 3-time linear magnifier.
Coating layers in examples 1 to 6: the 3M adhesive tape paper is torn 20 times, and the film layer is not peeled off and peeled.
Coating layers prepared by three embodiments in the background art: all appear to peel off, desquamate phenomenon to different extent.
Before pure ion vacuum coating, the invention adopts an ion beam cleaning process to clean the surface of the substrate material, so that gas molecules adsorbed on the surface of the substrate material are completely removed, thereby obviously improving the bonding strength of the film material. Meanwhile, the requirement on the coating temperature of the pure ion vacuum coating is low, and the requirement on the temperature resistance of the insulating material is met.
The vacuum container is pumped to a specified vacuum condition through a vacuum pumping device, the cathode coating target material is excited to generate plasma by a plasma trigger device, the plasma is filtered and purified when passing through an electromagnetic filtering device, coating particles are removed, and only positive ions and electrons can pass through the electromagnetic filtering device; when the plasma reaches the tail end of the electromagnetic filtering device, the plasma is changed into a pure charged ion beam; the pure charged ion beam current is controlled by the electromagnetic scanning system, the flying direction is changed, the substrate material is connected with the negative-pressure power supply, an electric field is formed, the pure charged ions are accelerated by the electric field in the flying process and are deposited on the surface of a plated product with large energy, and therefore a compact and uniform coating layer with high bonding strength is formed on the surface of the substrate material.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention. Structures, devices, and methods of operation not specifically described or illustrated herein are generally practiced in the art without specific recitation or limitation.
Claims (10)
1. A method for metalizing the surface of an insulating material is characterized by comprising the following steps: after the substrate material is vacuumized in a vacuum container, the surface of the substrate material is firstly cleaned by ion beams by an ion beam cleaning process, and then the surface cleaned by the ion beams is subjected to pure ion vacuum coating by a pure ion vacuum coating process.
2. The method of surface metallization of an insulating material according to claim 1, characterized in that: the substrate material is biased during the pure ion vacuum coating process.
3. The method of surface metallization of an insulating material according to claim 1, characterized in that: the voltage of the ion beam cleaning treatment is 300V-5000V, and the Ar ion energy is as follows: 200eV to 5000 eV.
4. The method of surface metallization of an insulating material according to claim 2, characterized in that: the bias voltage applied to the substrate material when the substrate material is subjected to pure ion vacuum coating treatment is-10000V-0V.
5. The method of surface metallization of an insulating material according to claim 1, characterized in that: the temperature in the vacuum container is 0-150 ℃ when the substrate material is subjected to pure ion vacuum coating treatment.
6. The method of surface metallization of an insulating material according to claim 1, characterized in that: the substrate material is an insulating material, and the film layer plated on the substrate material comprises metal, alloy and metal compound.
7. The method of surface metallization of an insulating material according to claim 1, characterized in that: the pressure after vacuum-pumping in the vacuum container is 10-1Pa magnitude of 10-5Of the order of Pa.
8. The method of surface metallization of an insulating material according to claim 6, characterized in that: the insulating material comprises inorganic glass, organic glass, resin, plastic, bakelite and ceramic, and the film layer plated on the substrate material comprises a metal film layer and an alloy film layer.
9. The method of surface metallization of an insulating material according to claim 1, characterized in that: the thickness of the coating layer on the substrate material is 0-50 microns.
10. The method of insulating material surface metallization according to claim 9, characterized in that: the film layer plated on the substrate material is of a layered structure, and the material compositions of all layers are the same or different.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113278929A (en) * | 2021-05-28 | 2021-08-20 | 安徽纯源镀膜科技有限公司 | Multilayer conductive nano coating and production process thereof |
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