CN110989101A - Optical waveguide device - Google Patents
Optical waveguide device Download PDFInfo
- Publication number
- CN110989101A CN110989101A CN201911261028.XA CN201911261028A CN110989101A CN 110989101 A CN110989101 A CN 110989101A CN 201911261028 A CN201911261028 A CN 201911261028A CN 110989101 A CN110989101 A CN 110989101A
- Authority
- CN
- China
- Prior art keywords
- optical waveguide
- housing
- waveguide device
- receiving element
- coupling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides an optical waveguide device, which comprises a first optical waveguide chip, a light receiving element, an adhesive layer and a protective part, wherein one end of the first optical waveguide chip is fixedly connected with one end of the light receiving element through the adhesive layer; the shielding part comprises a shell and a light shielding layer arranged on the surface of the shell, and the shell is wrapped on the peripheral side of the coupling structure to seal the coupling structure. The protective part of the optical waveguide device can keep the long-term reliability of the bonding layer, ensure that the coupling structure does not have a displacement phenomenon, and improve the stability of key indexes such as insertion loss, polarization-related loss and the like of the optical waveguide device.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an optical waveguide device.
Background
In an optical communication system, a first optical waveguide chip is usually coupled with other chips or optical fibers to realize signal transmission and processing functions, and then packaged in a suitable form to be made into a module product which is easy to access and use. When the conventional first optical waveguide chip is coupled with other chips or optical fibers, the two coupling end faces are usually fixed by using an adhesive, such as epoxy resin, silica gel, acrylate, etc., and the curing manner of the adhesive is thermal curing, ultraviolet light irradiation curing, moisture curing, anaerobic curing, etc. After curing, these adhesives form a solid state at the coupling end face for supporting the coupling structure of the two end faces.
At present, the coupling structure is generally directly arranged in a packaging box after an adhesive is cured, and an optical device is isolated from the external severe environment. However, since the adhesive is sensitive to moisture and light, the package box cannot prevent the adhesive from being affected by the external environment, and aging and deterioration of the adhesive may be caused during long-term use, so that the adhesive performance thereof is deteriorated, the coupling structure is deformed and distorted, and is out of the normal alignment position, thereby deteriorating the optical performance of the coupling structure. For example, after the coupled optical device is subjected to a reliability test of the Telcordia series (typical conditions are high temperature and high humidity, temperature 85 degrees, humidity 85% RH, and test time 2000 hours), the optical device may suffer deterioration of key indexes such as insertion loss and polarization-dependent loss. For this case, a threshold is allowed in the industry, and usually the insertion loss cannot vary by more than 0.5 dB. However, the limitation of the coupling process conditions and the aging and deterioration of the adhesive at present cause that the coupling optical device can not meet the industrial requirements.
Disclosure of Invention
The invention aims to provide an optical waveguide device to solve the technical problem that a coupling optical waveguide device in the prior art is poor in long-term stability.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the invention provides an optical waveguide device, which comprises a first optical waveguide chip, a light receiving element, an adhesive layer and a protective part, wherein one end of the first optical waveguide chip is fixedly connected with one end of the light receiving element through the adhesive layer; the shielding part comprises a shell and a light shielding layer arranged on the surface of the shell, and the shell covers the peripheral side of the coupling structure to seal the coupling structure.
Further, the housing encloses a cavity, and the coupling structure is located in the cavity.
Further, the housing has a first opening, and the housing is hermetically connected to the first optical waveguide chip and/or the light receiving element at the first opening.
Further, the shell is provided with a second opening and a third opening, the shell is connected with the first optical waveguide chip in a sealing mode at the second opening, and is connected with the light receiving element in a sealing mode at the third opening.
Further, the protection piece further comprises a waterproof layer arranged on the surface of the shading layer.
Further, the thickness of the light shielding layer is 1-100 μm; and/or the thickness of the waterproof layer is 0.1 mm-10 mm.
Further, the housing and the first optical waveguide chip or the light receiving element are hermetically connected by laser welding.
Further, the laser welding has a pulse width of less than or equal to 400fs and a pulse energy of less than or equal to 10 muj.
Further, the shell and the first optical waveguide chip or the light receiving element are connected in a sealing mode through sealing glue.
Further, the material of the shell is selected from one of metal, glass and polymer material.
According to the optical waveguide device, the coupling structure is coated and sealed by the shell, so that the bonding layer of the coupling structure can be effectively isolated from external factors, and the bonding layer cannot be adversely affected; the sealing structure prevents moisture from invading the coupling structure, thereby avoiding deterioration of the bonding layer; the light shading layer arranged on the surface of the shell can resist the irradiation of a light source and avoid the aging of the bonding layer caused by light irradiation. The protective part of the optical waveguide device can keep the long-term reliability of the bonding layer, ensure that the coupling structure does not have a displacement phenomenon, and improve the stability of key indexes such as insertion loss, polarization-related loss and the like of the optical waveguide device.
Drawings
Fig. 1 is a schematic structural diagram of an optical waveguide device according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another optical waveguide device according to an embodiment of the present invention;
FIG. 3 is a graph of the effect of moisture on the transmittance of an adhesive layer;
fig. 4 is a graph comparing the change of the insertion loss with time of the optical waveguide device provided by the embodiment of the present invention and the conventional optical waveguide device.
Description of reference numerals:
1. a first optical waveguide chip; 2. a light receiving element; 3. a second optical waveguide chip; 4. an adhesive layer; 5. a guard; 51. a housing; 52. a light-shielding layer; 53. and a waterproof layer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The descriptions of "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number or order of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Referring to fig. 1 and 2, an embodiment of the present application provides an optical waveguide device, including a first optical waveguide chip 1, a light receiving element 2, an adhesive layer 4, and a protection member 5, where one end of the first optical waveguide chip 1 and one end of the light receiving element 2 are fixedly connected by the adhesive layer 4, and the adhesive layer 4, an end face of the first optical waveguide chip 1 connected to the adhesive layer 4, and an end face of the light receiving element 2 connected to the adhesive layer 4 form a coupling structure; the shield 5 includes a housing 51 and a light shielding layer 52 provided on a surface of the housing 51, and the housing 51 covers a peripheral side of the coupling structure to seal the coupling structure. The light receiving element 2 may be an optical fiber or another chip such as a photoelectric chip.
In the coupling process of the optical waveguide chip, the most used method is the adhesive fixing method, which can be effectively applied to the connection of different materials, including different types of materials such as metal, silicon, quartz, polymer, and the like, and the adhesive can be uniformly distributed on the connection surface, and the damage phenomena such as corrosion, stress deformation and the like caused by other connection methods such as welding, mechanical connection and the like can not occur. However, the use of the adhesive also has some limitations, for example, the adhesive is sensitive to the influence of external factors such as light, heat, moisture, etc., and especially, when the adhesive is exposed to a high-temperature and high-humidity environment for a long time, hydrolysis of the adhesive layer may be caused, so that the adhesive deteriorates, the adhesive strength is reduced, the coupling structure is displaced, the transmission direction of the optical signal is shifted, the key indexes such as insertion loss are deteriorated, and the service life of the optical waveguide device is influenced. In addition, the coupled optical waveguide device is generally directly placed in a packaging box, and the packaging box cannot resist the influence of moisture, light source irradiation and the like on the adhesive.
The embodiment of the application provides the optical waveguide device, which aims at the problem that the adhesive is easy to age and deteriorate, and the coupling structure is coated and sealed by the shell 51, so that the adhesive layer 4 of the coupling structure can be effectively isolated from external factors, and the adhesive layer 4 cannot be adversely affected; the sealing structure prevents moisture from invading the coupling structure, thereby avoiding deterioration of the bonding layer 4; the light-shielding layer 52 provided on the surface of the case 51 can resist the irradiation of the light source, and prevent the adhesive layer 4 from being deteriorated due to the light irradiation. The protective part 5 of the optical waveguide device can maintain the long-term reliability of the adhesive layer 4, ensure that the coupling structure does not have a displacement phenomenon, and improve the stability of key indexes of the optical waveguide device, such as insertion loss, polarization-related loss and the like.
It is understood that the light shielding layer 52 disposed on the surface of the housing 51 may be disposed on the outer surface or the inner surface of the housing 51, and can shield light, so that the adhesive layer 4 can prevent light sources such as ultraviolet light, visible light, infrared light, and the like from being irradiated, thereby effectively preventing the adhesive from being aged due to light irradiation. The light-shielding layer 52 may be a light-shielding material coated on the surface of the housing 51, or may be a light-shielding film attached to the surface of the housing 51, and may be selected according to process requirements. The housing 51 wraps the coupling structure and seals the coupling structure inside the housing 51, so that the coupling structure, especially the adhesive layer 4, can be effectively isolated from the external environment, the adhesive layer 4 is protected, and the invasion of moisture is avoided. The material of the housing 51 is selected from one of metal, glass, and polymer. The shape of the housing 51 may be selected according to the requirements of the final product, and may be spherical, hemispherical, cubic, etc.
In some embodiments, the housing 51 encloses a cavity in which the coupling structure is located. It is understood that the first optical waveguide chip 1 and the light receiving element 2 may be respectively accommodated in the cavity, or may have a portion located outside the cavity, but the coupling structure is located in the cavity to seal the coupling structure for protection. In addition, the selection is carried out according to the actual situation. Further, the housing 51 has a first opening where the housing 51 is in sealing connection with the first optical waveguide chip 1 and/or the light receiving element 2. At this time, the coupling structure is located in a closed cavity enclosed by the housing 51, so that the influence of the external environment on the adhesive layer 4 can be avoided. The sealing position may be located at other parts of the first optical waveguide chip 1 and the light receiving element 2 outside the coupling structure, i.e. the sealing position cannot be located at the fixed end of the first optical waveguide chip and the adhesive layer 4.
It will be understood that the first optical waveguide chip 1 and the light receiving element 2 each have a connection end, i.e., a fixed end to the adhesive layer 4, and a non-connection end, i.e., an end away from the adhesive layer 4. In one case, the non-connection end of at least one of the first optical waveguide chip 1 and the light receiving element 2 is located outside the housing 51, the non-connection end of at least one is located inside the housing 51, at least one of the first optical waveguide chip 1 and the light receiving element 2 extends into a cavity enclosed by the housing 51 through a first opening, and at least one of the first optical waveguide chip 1 and the light receiving element 2 is hermetically connected with the housing 51 at the first opening.
Alternatively, referring to fig. 2, the first optical waveguide chip 1 and the light receiving element 2 are both part of the second optical waveguide chip 3. The second optical waveguide chip 3 is provided with a groove, in order to match with the optical path, the groove is filled with an adhesive to form an adhesive layer 4, the adhesive layer is sensitive to light, moisture and heat, and aging and denaturation are easy to occur under a high-temperature and high-humidity environment, so that the light transmittance is low, and the optical index is influenced. Referring to fig. 3, after the cured adhesive on the second optical waveguide chip 3 is exposed to humidity of 80% RH for 2000 hours, the transmittance of the cured adhesive in the range of 400nm to 1560nm will be reduced from 95% to about 80% in the initial state, which will significantly reduce the transmission efficiency of the optical signal, and deteriorate the insertion loss of the second optical waveguide chip 3. In the embodiment of the present application, the housing 51 covers the periphery of the coupling structure and has a first opening, the coupling structure is located in the cavity surrounded by the housing 51, and the housing 51 and the second optical waveguide chip 3 are hermetically connected at the first opening. The housing 51 can effectively isolate the adhesive layer 4 on the second optical waveguide chip 3 from the external environment, so as to prevent the adhesive layer 4 from being affected by the external environment.
In other embodiments, the housing 51 has a second opening and a third opening, and the housing 51 is hermetically connected to the first optical waveguide chip 1 at the second opening and to the light receiving element 2 at the third opening. Referring to fig. 1, the non-connection end of the first optical waveguide chip 1 and the non-connection end of the light receiving element 2 are both located outside a cavity enclosed by the housing 51, and the coupling structure is located in the cavity. The sealing connection position of the second opening and the first optical waveguide chip 1 may be at another position on the first optical waveguide chip 1 except for the connection end surface thereof, which is a fixed end of the first optical waveguide chip 1 and the adhesive layer 4. Similarly, the sealed connection position of the third opening to the light receiving element 2 may be at a position other than the connection end surface of the light receiving element 2, which is the fixed end of the light receiving element 2 and the adhesive layer 4. The housing 51 seals the coupling structure in its cavity and prevents the adhesive layer 4 from coming into contact with moisture.
In some embodiments, the shielding member 5 further includes a waterproof layer 53 disposed on the surface of the light shielding layer 52. That is, whether the light shielding layer 52 is located on the outer surface or the inner surface of the housing 51, a waterproof layer 53 may be further provided on the surface of the light shielding layer 52, for example, waterproof grease may be applied to form the waterproof layer 53 for preventing moisture from entering into the coupling structure, and the adhesive may not be deteriorated. Further, the light-shielding layer 52 has a thickness of 1 μm to 100 μm. The thickness of the waterproof layer 53 is 0.1mm to 10 mm. The minimum thickness of the light shielding layer 52 is required to cover the surface of the housing 51 to prevent the light source from irradiating into the interior of the housing 51. The minimum thickness of the waterproof layer 53 is required to be sufficient to prevent moisture from entering the housing 51. The maximum thickness of the light shielding layer 52 and the waterproof layer 53 is not too large to cause cost waste on the basis of satisfying the achievement of the respective functions.
In some embodiments, the housing 51 and the first optical waveguide chip 1 or the light receiving element 2 are hermetically connected by laser welding. The sealing connection method by laser welding is easy and convenient to operate, and does not affect the structures and functions of the housing 51, the first optical waveguide chip 1, and the light receiving element 2. Specifically, the pulse width of the laser welding is less than or equal to 400fs, and the pulse energy is less than or equal to 10 μ J. The embodiment of the application adopts the ultrashort pulse laser for welding, for example, the ultraviolet femtosecond pulse laser can realize cold processing, effectively avoids splashing and deformation generated during hot melting, can realize the effect of closed blocking, and can reduce the damage to the minimum.
In other embodiments, the housing 51 and the first optical waveguide chip 1 or the light receiving element 2 are hermetically connected by using a sealant. The sealant can seal the housing 51 and the first optical waveguide chip 1, and the housing 51 and the light receiving element 2. The sealant has simple sealing operation and low cost, and can not damage and influence other components of the optical waveguide device.
The optical waveguide device of the embodiment of the application adopts the protection part 5 to protect the coupling structure, and mainly solves the problem that the optical waveguide device is poor in long-term stability due to the fact that adhesives used by the optical waveguide chip and the optical fiber or other chips such as the photoelectric chip in the coupling, cutting and other technological processes are easily aged and deteriorated by the influence of the external environment. The protection part 5 of the optical waveguide device in the embodiment of the application can keep the long-term reliability of the bonding layer 4, ensure that the coupling structure does not have a displacement phenomenon, and improve the stability of key indexes such as insertion loss, polarization-related loss and the like of the optical waveguide device. Referring to fig. 4, in the optical waveguide device according to the embodiment of the present invention, compared to the optical waveguide device commonly used in the prior art, after a time of 2000 hours in a high temperature and high humidity environment (e.g., 85 ℃ c, 85% RH), the insertion loss variation (Δ IL) of the latter is degraded by 0.5dB, while the former is degraded by only 0.2dB, and in a longer time range, the difference is more significant, and a nonlinear effect is exhibited.
The specific steps of protecting the coupling structure in the optical waveguide device according to the embodiment of the present application are described below by taking the coupling between the optical waveguide chip and the optical fiber array as an example:
firstly, aligning an optical waveguide chip and an optical fiber array through a high-precision fine adjustment system, and monitoring optical power by adopting monitoring equipment; when the optical power reaches the appropriate range, the alignment is considered to be satisfactory.
Then, coating adhesives on the coupling end faces of the optical waveguide chip and the optical fiber array respectively, curing the adhesives after the adhesives completely cover the two end faces and are uniformly distributed, wherein the curing can be performed by adopting an ultraviolet lamp irradiation or heat radiation mode, and is specifically determined by the type of the adhesives until the adhesives are completely cured.
Finally, the coupled coupling structure of the optical waveguide chip and the optical fiber array is placed in the housing 51 of the protection part 5, so that the housing 51 completely wraps the coupling structure, and the ultrashort pulse laser is adopted to weld the connection parts of the housing 51, the optical waveguide chip and the optical fiber array respectively, so that the coupling structure is sealed in the housing 51, and the protection of the coupling structure in the optical waveguide device is completed.
In the optical waveguide device according to the embodiment of the present application, the protection member 5 can effectively protect the coupling structure, reduce cracking of the coupling structure caused by environmental factors, and improve long-term reliability of the optical waveguide device.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention, and all such changes or substitutions are included in the scope of the present invention. Moreover, the technical solutions in the embodiments of the present invention may be combined with each other, but it is necessary to be able to be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. An optical waveguide device, characterized by: the optical waveguide module comprises a first optical waveguide chip, a light receiving element, an adhesive layer and a protection piece, wherein one end of the first optical waveguide chip is fixedly connected with one end of the light receiving element through the adhesive layer, and the adhesive layer, the end face of the first optical waveguide chip connected with the adhesive layer and the end face of the light receiving element connected with the adhesive layer form a coupling structure;
the shielding part comprises a shell and a light shielding layer arranged on the surface of the shell, and the shell covers the peripheral side of the coupling structure to seal the coupling structure.
2. The optical waveguide device of claim 1 wherein the housing encloses a cavity, the coupling structure being located in the cavity.
3. The optical waveguide device according to claim 2, wherein the housing has a first opening, and the housing is hermetically connected to the first optical waveguide chip and/or to the light receiving element at the first opening.
4. The optical waveguide device according to claim 2, wherein the housing has a second opening and a third opening, the housing being hermetically connected to the first optical waveguide chip at the second opening and to the light receiving element at the third opening.
5. The optical waveguide device according to any one of claims 1 to 4, wherein the shielding member further comprises a water-repellent layer provided on a surface of the light-shielding layer.
6. The optical waveguide device according to claim 5, wherein the light shielding layer has a thickness of 1 μm to 100 μm; and/or
The thickness of the waterproof layer is 0.1 mm-10 mm.
7. The optical waveguide device according to any one of claims 1 to 4, wherein the housing is hermetically connected to the first optical waveguide chip or the light receiving element by laser welding.
8. The optical waveguide device of claim 7 wherein said laser weld has a pulse width of less than or equal to 400fs and a pulse energy of less than or equal to 10 μ J.
9. The optical waveguide device according to any one of claims 1 to 4, wherein the housing is hermetically connected to the first optical waveguide chip or the light receiving element by using a sealant.
10. The optical waveguide device according to any one of claims 1 to 4, wherein the material of the housing is selected from one of metal, glass, and polymer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911261028.XA CN110989101A (en) | 2019-12-10 | 2019-12-10 | Optical waveguide device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911261028.XA CN110989101A (en) | 2019-12-10 | 2019-12-10 | Optical waveguide device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110989101A true CN110989101A (en) | 2020-04-10 |
Family
ID=70091939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911261028.XA Pending CN110989101A (en) | 2019-12-10 | 2019-12-10 | Optical waveguide device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110989101A (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1178584A (en) * | 1996-01-26 | 1998-04-08 | 住友电气工业株式会社 | Light waveguide module |
| CN1287700A (en) * | 1998-08-05 | 2001-03-14 | 精工爱普生株式会社 | Optical module and method of manufacture thereof |
| CN1477414A (en) * | 2002-06-27 | 2004-02-25 | 雅马哈株式会社 | Optical fibre connector enhanced part and optical fibre connector |
| CN2664028Y (en) * | 2003-09-15 | 2004-12-15 | 彩虹彩色显像管总厂 | Shading device of working plate in exposure procedure |
| CN101601176A (en) * | 2006-12-05 | 2009-12-09 | 韩国电子通信研究院 | Planar lightwave circuit (PLC) device, the Wave division multiplexing passive optical network (WDM-PON) that comprises the Wavelength tunable light source of this device and adopt this light source |
| CN201611394U (en) * | 2010-03-05 | 2010-10-20 | 武汉光迅科技股份有限公司 | Packing structure of passive guided-wave optical device |
| CN102770791A (en) * | 2010-02-10 | 2012-11-07 | 奥兰若技术有限公司 | Reduced length optoelectronic devices |
| CN102884015A (en) * | 2010-07-28 | 2013-01-16 | 欧司朗股份有限公司 | Optoelectronic semiconductor element and associated method of production by direct welding of glass housing components by means of ultrashort pulsed laser without glass solder |
| TWM445340U (en) * | 2012-08-03 | 2013-01-21 | Tot Biotechnology Co Ltd | Fungus cultivation box |
| CN103885122A (en) * | 2012-12-21 | 2014-06-25 | 微机电科技香港有限公司 | MEMS array electric variable optical attenuator and manufacturing method thereof |
| CN203930115U (en) * | 2014-07-02 | 2014-11-05 | 国家电网公司 | A kind of wavelength division multiplexer |
| CN106449439A (en) * | 2016-09-27 | 2017-02-22 | 华中科技大学 | Glass chip packaging method |
| CN206469121U (en) * | 2016-12-12 | 2017-09-05 | 浙江海吉船用电器有限公司 | Naval light |
| JP6488539B2 (en) * | 2013-11-27 | 2019-03-27 | 住友大阪セメント株式会社 | Optical element module |
| JP2019053313A (en) * | 2018-11-07 | 2019-04-04 | 住友大阪セメント株式会社 | Optical element module |
-
2019
- 2019-12-10 CN CN201911261028.XA patent/CN110989101A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1178584A (en) * | 1996-01-26 | 1998-04-08 | 住友电气工业株式会社 | Light waveguide module |
| CN1287700A (en) * | 1998-08-05 | 2001-03-14 | 精工爱普生株式会社 | Optical module and method of manufacture thereof |
| CN1477414A (en) * | 2002-06-27 | 2004-02-25 | 雅马哈株式会社 | Optical fibre connector enhanced part and optical fibre connector |
| CN2664028Y (en) * | 2003-09-15 | 2004-12-15 | 彩虹彩色显像管总厂 | Shading device of working plate in exposure procedure |
| CN101601176A (en) * | 2006-12-05 | 2009-12-09 | 韩国电子通信研究院 | Planar lightwave circuit (PLC) device, the Wave division multiplexing passive optical network (WDM-PON) that comprises the Wavelength tunable light source of this device and adopt this light source |
| CN102770791A (en) * | 2010-02-10 | 2012-11-07 | 奥兰若技术有限公司 | Reduced length optoelectronic devices |
| CN201611394U (en) * | 2010-03-05 | 2010-10-20 | 武汉光迅科技股份有限公司 | Packing structure of passive guided-wave optical device |
| CN102884015A (en) * | 2010-07-28 | 2013-01-16 | 欧司朗股份有限公司 | Optoelectronic semiconductor element and associated method of production by direct welding of glass housing components by means of ultrashort pulsed laser without glass solder |
| TWM445340U (en) * | 2012-08-03 | 2013-01-21 | Tot Biotechnology Co Ltd | Fungus cultivation box |
| CN103885122A (en) * | 2012-12-21 | 2014-06-25 | 微机电科技香港有限公司 | MEMS array electric variable optical attenuator and manufacturing method thereof |
| JP6488539B2 (en) * | 2013-11-27 | 2019-03-27 | 住友大阪セメント株式会社 | Optical element module |
| CN203930115U (en) * | 2014-07-02 | 2014-11-05 | 国家电网公司 | A kind of wavelength division multiplexer |
| CN106449439A (en) * | 2016-09-27 | 2017-02-22 | 华中科技大学 | Glass chip packaging method |
| CN206469121U (en) * | 2016-12-12 | 2017-09-05 | 浙江海吉船用电器有限公司 | Naval light |
| JP2019053313A (en) * | 2018-11-07 | 2019-04-04 | 住友大阪セメント株式会社 | Optical element module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1977274B1 (en) | Optical fiber component package for high power dissipation | |
| US6850674B2 (en) | Optical device | |
| JP2798955B2 (en) | Method and apparatus for hermetically conducting an optical waveguide | |
| CN102893211B (en) | The manufacture method of liquid crystal cell and liquid crystal cell | |
| KR100294041B1 (en) | Optical part packaging method and collimatior assembly mounting method | |
| EP3444647A1 (en) | Optical fiber protection structure and method for producing optical element | |
| JP2007206364A (en) | Liquid crystal display element | |
| EP0608895B1 (en) | Airtight seal structure of low melting point glass to be used in optical fiber guiding portion of optical device and method of airtight seal using low melting point glass | |
| KR100373481B1 (en) | Package structure of solid state imaging device | |
| CN110989101A (en) | Optical waveguide device | |
| US7309175B1 (en) | Reducing heating from non-coupled light in power transmitting optical fibers | |
| JP3199181B2 (en) | Optical waveguide circuit module | |
| US5497268A (en) | Hermetically sealed polished optical surface | |
| EP3760982B1 (en) | Water meter comprising a transducer enclosure with variable moisture proofing | |
| US6613980B1 (en) | Environmental protection for an optical assembly and method therefor | |
| US20030190135A1 (en) | Hermetic waveguide seals and method of making them | |
| JP3085344B2 (en) | Optical module | |
| JPH08110436A (en) | Optical transmission module | |
| CN210222297U (en) | Reflector packaging structure | |
| JP3210367B2 (en) | Optical waveguide circuit module | |
| US20100239209A1 (en) | Method and system for packaging a high power fiber-optic coupler | |
| CN103777285B (en) | A kind of optic fibre end packaging mechanism | |
| CN103777298B (en) | A kind of airtight packaging method for optical fiber | |
| JP2000111748A (en) | Optical device having optical fiber diffraction grating | |
| CN214409409U (en) | Melting point protection device of double-clad optical fiber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200410 |