JP3199181B2 - Optical waveguide circuit module - Google Patents
Optical waveguide circuit moduleInfo
- Publication number
- JP3199181B2 JP3199181B2 JP16722991A JP16722991A JP3199181B2 JP 3199181 B2 JP3199181 B2 JP 3199181B2 JP 16722991 A JP16722991 A JP 16722991A JP 16722991 A JP16722991 A JP 16722991A JP 3199181 B2 JP3199181 B2 JP 3199181B2
- Authority
- JP
- Japan
- Prior art keywords
- optical waveguide
- optical
- housing
- waveguide chip
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光導波路チップ及びこ
れに接続する光ファイバを一体化した信頼性の高い光導
波回路モジュールに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a highly reliable optical waveguide circuit module in which an optical waveguide chip and an optical fiber connected thereto are integrated.
【０００２】[0002]
【従来の技術】近年の光通信技術の進展に伴い、光分岐
素子や光合波器等の光導波回路に高い信頼性が求められ
てきている。この種の光導波回路は、光導波路チップの
端面に光入出力用の光ファイバを接続した形態で構成す
ることが一般的である。これらの光導波回路を構成する
上で、接着剤は極めて頻繁に使用される材料であり、部
品の信頼性を決定付ける重要な要素である。2. Description of the Related Art With the recent development of optical communication technology, high reliability is required for optical waveguide circuits such as optical branching elements and optical multiplexers. Generally, this type of optical waveguide circuit is configured in such a manner that an optical fiber for optical input / output is connected to an end face of an optical waveguide chip. In forming these optical waveguide circuits, the adhesive is an extremely frequently used material and is an important factor that determines the reliability of components.
【０００３】図２及び３は従来の光導波回路モジュール
の一例を示すもので、シリコン基板上に形成した石英系
の光導波路チップ１を光導波路チップ用筐体２に保持・
固定し、また、光入出力用の光ファイバ、ここでは４芯
テープファイバ３及び４の端部をそれぞれ光ファイバ端
部用筐体５及び６に保持・固定した後、光導波路チップ
１の端面に４芯テープファイバ３及び４の光軸が一致す
る如く、光導波路チップ用筐体２と光ファイバ端部用筐
体５及び６とを紫外線硬化型の接着剤７を介して接続し
てなっている。FIGS. 2 and 3 show an example of a conventional optical waveguide circuit module. A quartz optical waveguide chip 1 formed on a silicon substrate is held in an optical waveguide chip housing 2.
After fixing and holding the optical input / output optical fibers, in this case, the ends of the four-core tape fibers 3 and 4 to the optical fiber end casings 5 and 6, respectively, the end face of the optical waveguide chip 1 is held. The optical waveguide chip housing 2 and the optical fiber end housings 5 and 6 are connected via an ultraviolet curing adhesive 7 such that the optical axes of the four-core tape fibers 3 and 4 coincide with each other. ing.
【０００４】なお、前記筐体２，５及び６はそれぞれパ
イレックスガラスからなる断面略コの字形状の枠体２
ａ，５ａ及び６ａと、同じくパイレックスガラスからな
る固定板２ｂ，５ｂ及び６ｂとからなっており、これら
はそれぞれ接着剤２ｃ，５ｃ及び６ｃにより接着・固定
されている。The housings 2, 5 and 6 are each made of Pyrex glass and have a substantially U-shaped cross section.
a, 5a and 6a and fixing plates 2b, 5b and 6b also made of Pyrex glass, which are bonded and fixed by adhesives 2c, 5c and 6c, respectively.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記光
導波回路モジュールでは接着剤７が水分の存在下、特に
高温高湿条件下で吸湿し、経時的に接着力が低下し、こ
のため、光透過率が低下したり、著しい場合には光導波
路チップ用筐体２と光ファイバ端部用筐体５及び６とが
剥離するという問題があった。また、接着剤２ｃ，５ｃ
及び６ｃも同様にして経時的に接着力が低下するため、
信頼性が低いという問題があった。However, in the above-mentioned optical waveguide circuit module, the adhesive 7 absorbs moisture in the presence of moisture, particularly under high temperature and high humidity conditions, and the adhesive strength decreases with time. If the rate is lowered or is extremely high, there is a problem that the optical waveguide chip housing 2 and the optical fiber end housings 5 and 6 are separated. Also, the adhesives 2c, 5c
And 6c also have a similar decrease in adhesion over time,
There was a problem that reliability was low.
【０００６】なお、光導波路チップ用筐体２と光ファイ
バ端部用筐体５及び６とをＹＡＧレーザ溶接により、接
着剤を用いることなく接続するようになしたものも提案
されているが、各筐体２，５及び６においては前記同様
に接着剤が使用されているため、高い信頼性が得られな
いという問題があった。It has been proposed to connect the optical waveguide chip housing 2 and the optical fiber end housings 5 and 6 by YAG laser welding without using an adhesive. Since an adhesive is used in each of the housings 2, 5, and 6 in the same manner as described above, there is a problem that high reliability cannot be obtained.
【０００７】本発明は前記従来の問題点に鑑み、高温高
湿条件下においても長期に亘って高い信頼性を確保し得
る光導波回路モジュールを提供することを目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, it is an object of the present invention to provide an optical waveguide circuit module capable of ensuring high reliability over a long period of time even under high temperature and high humidity conditions.
【０００８】[0008]
【課題を解決するための手段】本発明では前記目的を達
成するため、光導波路チップと、該光導波路チップの端
面にその光軸が一致する如く取付けられる光入出力用の
光ファイバとを備えた光導波回路モジュールにおいて、
光導波路チップ及び光入出力用の光ファイバの端部をそ
れぞれ光導波路チップ用筐体及び光ファイバ端部用筐体
に保持・固定するとともに、該光導波路チップ用筐体及
び光ファイバ端部用筐体を、光導波路チップの端面に光
入出力用の光ファイバの光軸が一致する如く接続し、さ
らにこれら全体を外部筐体中に収納し、該光導波路チッ
プ用筐体及び光ファイバ端部用筐体と外部筺体との間
に、光導波路チップ用筐体及び光ファイバ端部用筐体と
外部筐体とが接触することのないように、ガラス転移温
度が使用環境温度０℃〜６０℃の下限以下であるゴム状
樹脂組成物を充填して封止した光導波回路モジュールを
提案する。In order to achieve the above object, the present invention comprises an optical waveguide chip and an optical input / output optical fiber which is attached to an end face of the optical waveguide chip so that its optical axis coincides. Optical waveguide circuit module,
The optical waveguide chip and the end of the optical fiber for optical input / output are held and fixed to the housing for the optical waveguide chip and the housing for the end of the optical fiber, respectively. The housing is connected to the end face of the optical waveguide chip such that the optical axes of the optical fibers for inputting and outputting light coincide with each other, and furthermore, the entirety is housed in an external housing, and the housing for the optical waveguide chip and the optical fiber end are connected. The glass transition temperature is 0 ° C. or less so that the optical waveguide chip housing and the optical fiber end housing and the external housing do not come into contact between the external housing and the external housing. The present invention proposes an optical waveguide circuit module in which a rubber-like resin composition having a temperature of 60 ° C. or lower is filled and sealed.
【０００９】[0009]
【作用】本発明によれば、光導波路チップ用筐体及び光
ファイバ端部用筐体間で使用される接着剤のみならず、
各筐体内部において使用される接着剤に対する水分の浸
入を確実に防止でき、その接着力の低下を防ぐことがで
きるとともに、気密封止を行う場合と比較して、封止に
伴うコストの上昇を抑制でき、部品の経済化を図ること
ができ、さらに、ゴム状樹脂組成物のガラス転移に伴う
応力が外部筐体内の各部品に加わる恐れがなく、損失が
増加したり、破損したりする恐れがない。According to the present onset bright, not adhesive only be used between housing for optical waveguide chip and the optical fiber end housing,
Intrusion of moisture for adhesives used in the housing portion can be reliably prevented, both when ∎ You can <br/> in preventing a decrease in the adhesive force, as compared with the case of a hermetic seal, can suppress an increase in costs associated with sealing, it is possible to economy of parts, further, there is no possibility that the stress caused by the glass transition of the rubber-like resin composition is applied to each component of the external housing, increase losses There is no danger of being damaged or damaged.
【００１０】[0010]
【実施例】図１及び４は本発明の光導波回路モジュール
の第１の実施例を示すもので、図中、従来例と同一構成
部分は同一符号をもって表す。即ち、１は光導波路チッ
プ、２は光導波路チップ用筐体、３，４は４芯テープフ
ァイバ、５，６は光ファイバ端部用筐体、７は接着剤、
１０は外部筐体、２０は樹脂組成物、ここではジェリー
状樹脂である。1 and 4 show a first embodiment of an optical waveguide circuit module according to the present invention. In the drawings, the same components as those of the conventional example are denoted by the same reference numerals. That is, 1 is an optical waveguide chip, 2 is an optical waveguide chip housing, 3 and 4 are 4-core tape fibers, 5 and 6 are optical fiber end housings, 7 is an adhesive,
Reference numeral 10 denotes an outer casing, 20 denotes a resin composition, here a jelly-like resin.
【００１１】前記光導波路チップ１、光導波路チップ用
筐体２、４芯テープファイバ３，４及び光ファイバ端部
用筐体５，６は従来例の場合と同様に組立てられ、接着
剤７により接着・固定され、基本モジュールＡを構成す
る。The optical waveguide chip 1, the optical waveguide chip housing 2, the four-core tape fibers 3, 4 and the optical fiber end housings 5, 6 are assembled in the same manner as in the conventional example. The basic module A is bonded and fixed.
【００１２】外部筐体１０は同様な形状を有する２つの
ユニット１１及び１２からなり、該ユニット１１及び１
２は互いに組合された時に前述した基本モジュールＡを
ある程度の余裕をもって収納し得る凹部１１ａ及び１２
ａと、４芯テープファイバ３，４の取出し用の切欠部１
１ｂ及び１２ｂとを備えている。なお、ユニット１１及
び１２は耐湿性を考慮して金属、例えばステンレスで形
成されている。The outer casing 10 comprises two units 11 and 12 having the same shape.
2 are recesses 11a and 12 which when combined with each other can accommodate the above-described basic module A with a certain margin.
a and a cutout 1 for taking out the 4-core tape fibers 3 and 4
1b and 12b. The units 11 and 12 are made of metal, for example, stainless steel in consideration of moisture resistance.
【００１３】ジェリー状樹脂２０は外部筐体１０の内
部、即ち凹部１１ａ及び１２ａと基本モジュールＡとの
間を充填・封止するためのものであり、ここでは吸水性
が小さく、且つ、ガラス転移温度が−１０℃のオレフィ
ン系のジェリー状樹脂を用いている。The jelly-like resin 20 is for filling and sealing the inside of the outer casing 10, that is, between the recesses 11a and 12a and the basic module A. Here, the jelly-like resin 20 has a low water absorption and a glass transition. An olefin-based jelly-like resin having a temperature of −10 ° C. is used.
【００１４】前記基本モジュールＡは外部筐体１０のユ
ニット１１及び１２の内部にジェリー状樹脂２０を介し
て収納・封止されている。ユニット１１とユニット１２
とは接着剤１３により接続されるが、この際、切欠部と
４芯テープファイバ３，４との隙間も該接着剤１３によ
り充填される。なお、接着剤１３としてはビスフェノー
ル系エポキシ樹脂を用いている。The basic module A is housed and sealed inside the units 11 and 12 of the outer casing 10 via the jelly resin 20. Unit 11 and Unit 12
Are connected with the adhesive 13 at this time, and at this time, the gap between the cutout portions and the four-core tape fibers 3 and 4 is also filled with the adhesive 13. Note that a bisphenol-based epoxy resin is used as the adhesive 13.
【００１５】ここで、ガラス転移温度が−１０℃のジェ
リー状樹脂２０を用いたのは熱膨張によって光導波路チ
ップ２等の部品や光導波路チップ用筐体２と光ファイバ
端部用筐体５，６との接続部に応力がかかることを防ぐ
ためである。Here, the jelly-like resin 20 having a glass transition temperature of -10 ° C. is used because components such as the optical waveguide chip 2 or the optical waveguide chip housing 2 and the optical fiber end housing 5 due to thermal expansion. , 6 are prevented from being stressed.
【００１６】即ち、光導波回路モジュールは各種の環境
下で用いられるが、この際、室温あるいはそれ以上の温
度であれば樹脂組成物の熱的性質に関して特に制限はな
い。ところが、室温より低温の環境で用いられる場合は
部品を構成するシリコンやガラス等の線膨脹係数と樹脂
組成物の線膨脹係数との相違により、光導波路チップ２
や接続部等に応力が加わり、損失が増加する場合があ
る。これを避けるために樹脂組成物として本モジュール
を使用する環境温度の下限以下のガラス転移温度（Ｔ
ｇ）を有する材料、具体的には本モジュールが温度範囲
０℃〜６０℃で使用されることを想定して、前述したよ
うにガラス転移温度が−１０℃のジェリー状樹脂２０を
用いた。なお、樹脂組成物が明確なガラス転移温度Ｔｇ
を持たない場合には代りに軟化温度が適用される。That is, the optical waveguide circuit module is used in various environments. At this time, the thermal properties of the resin composition are not particularly limited as long as the temperature is room temperature or higher. However, when the optical waveguide chip 2 is used in an environment at a temperature lower than room temperature, the difference between the linear expansion coefficient of silicon or glass constituting the component and the linear expansion coefficient of the resin composition results.
In some cases, stress may be applied to the connection or the connection portion, and the loss may increase. In order to avoid this, the glass transition temperature (T
Assuming that the material having g), specifically, this module is used in a temperature range of 0 ° C. to 60 ° C., the jelly-like resin 20 having a glass transition temperature of −10 ° C. as described above was used. The resin composition has a clear glass transition temperature Tg.
If not, the softening temperature is applied instead.
【００１７】図５は本実施例及び従来例の光導波回路モ
ジュールを７０℃、９０％の高温高湿環境下に放置した
時の損失増加量の変化を測定した結果を示すもので、図
中、３１は本実施例の特性を示し、また、３２は従来例
の特性を示す。FIG. 5 shows the results of measuring the change in the amount of increase in loss when the optical waveguide circuit modules of this embodiment and the conventional example were left in a high-temperature and high-humidity environment of 70 ° C. and 90%. , 31 indicate the characteristics of this embodiment, and 32 indicates the characteristics of the conventional example.
【００１８】前記図５より、従来例では放置時間が１０
０時間を越えると損失が急激に増加するが、本実施例で
は７５０時間まで損失の増加が０．２ｄＢ以下に抑えら
れることがわかる。これより、本実施例の光導波回路モ
ジュールによれば、部品の耐湿特性を大幅に向上できる
ことがわかる。According to FIG. 5, in the conventional example, the leaving time is 10
When the time exceeds 0 hours, the loss sharply increases. However, in this example, it can be seen that the increase in the loss can be suppressed to 0.2 dB or less until 750 hours. This shows that the optical waveguide circuit module of the present embodiment can significantly improve the moisture resistance of the components.
【００１９】また、本実施例の光導波回路モジュールに
対してヒートサイクル試験を行ったところ、−２０℃〜
＋７０℃の温度範囲に亘って損失変動は０．１ｄＢ以下
と小さく、封止材としてジェリー状樹脂を用いたことの
効果が確認された。Further, when a heat cycle test was performed on the optical waveguide circuit module of the present embodiment,
The loss fluctuation was as small as 0.1 dB or less over the temperature range of + 70 ° C., and the effect of using the jelly resin as the sealing material was confirmed.
【００２０】また、前記第１の実施例では外部筐体１０
に収納・封止する基本モジュールとして、光導波路チッ
プ用筐体と光ファイバ端部用筐体とを接着剤で接続した
ものを用いたが、ＹＧＡ溶接により接続したものを用い
ても良い。In the first embodiment, the outer casing 10
As the basic module to be housed and sealed in the module, a module in which an optical waveguide chip housing and an optical fiber end housing are connected by an adhesive is used, but a module connected by YGA welding may be used.
【００２１】図６は光導波路チップ用筐体と光ファイバ
端部用筐体とをＹＧＡ溶接により接続した基本モジュー
ルを用いた場合における図５と同様な測定結果を示すも
ので、図中、３３は第１の実施例と同様に外部筐体中に
収納・封止した場合の特性を示し、また、３４は従来例
と同様に外部筐体がない場合の特性を示す。FIG. 6 shows a measurement result similar to FIG. 5 when a basic module in which the optical waveguide chip housing and the optical fiber end housing are connected by YGA welding is used. Indicates the characteristic when housed and sealed in the external housing as in the first embodiment, and 34 indicates the characteristic when there is no external housing as in the conventional example.
【００２２】前記図６より、従来例では放置時間が５０
０時間を越えると損失が緩やかに増加することがわか
る。これは光ファイバ端部用筐体内において、光ファイ
バを同筐体中に固定する接着剤が湿度により劣化したた
めと考えられる。これに対して、本実施例では１０００
時間を越えて高湿高温環境下に放置しても損失は増加せ
ず、極めて高い信頼性が得られることがわかる。As shown in FIG. 6, in the conventional example, the leaving time is 50
It can be seen that the loss gradually increases after 0 hours. This is presumably because the adhesive for fixing the optical fiber in the optical fiber end housing has deteriorated due to humidity. On the other hand, in the present embodiment, 1000
Even if it is left in a high-humidity and high-temperature environment for a long time, the loss does not increase, and it can be seen that extremely high reliability can be obtained.
【００２３】図７は本発明の第２の実施例を示すもの
で、ここでは基本モジュールを収納・封止するための外
部筐体として熱収縮チューブを用いた例を示す。即ち、
図中、４０は熱収縮チューブからなる外部筐体であり、
基本モジュールＡをある程度の余裕をもって収納し得る
内径を有し、４芯テープファイバ３及び４に対応した端
部４１及び４２に外部から熱を加えることによって収縮
させ、基本モジュールＡを収納・封止する如くなってい
る。また、外部筐体４０と基本モジュールＡとの間には
前記同様なジェリー状樹脂が充填・封止されている。ま
た、外部筐体４０と４芯テープファイバ３，４との隙間
は前記接着剤１３と同様なシール材４３により封止され
ている。なお、熱収縮チューブとしては、例えばフッソ
樹脂、ポリオレフィンゴム、ネオプレンゴム等が用いら
れる。FIG. 7 shows a second embodiment of the present invention. Here, an example is shown in which a heat-shrinkable tube is used as an external housing for housing and sealing a basic module. That is,
In the figure, reference numeral 40 denotes an external housing made of a heat-shrinkable tube,
The internal module A has an inside diameter capable of accommodating the basic module A with a certain margin, and is shrunk by applying heat from the outside to the ends 41 and 42 corresponding to the 4-core tape fibers 3 and 4, thereby accommodating and enclosing the basic module A. It is like doing. A jelly-like resin similar to that described above is filled and sealed between the outer casing 40 and the basic module A. The gap between the outer casing 40 and the four-core tape fibers 3 and 4 is sealed by a sealing material 43 similar to the adhesive 13. As the heat-shrinkable tube, for example, fluorine resin, polyolefin rubber, neoprene rubber, or the like is used.
【００２４】本実施例に対して図５及び図６について説
明した測定を行ったところ、第１の実施例の場合とほぼ
同様な耐湿特性が得られることが確認された。The measurements described with reference to FIGS. 5 and 6 were performed on the present embodiment, and it was confirmed that substantially the same moisture resistance as that of the first embodiment was obtained.
【００２５】なお、前述した各実施例では封止剤として
オレフィン系のジェリー状樹脂を用いたが、これに限定
されるものではなく、各種の樹脂組成物が適用できる。
具体的には、シリコーンオイル等のオイル状樹脂組成
物、シリコーンゴム、フッ素ゴム等のゴム状樹脂組成
物、シリコーンゲルやアクリルゲル等のゲル状樹脂組成
物、エポキシ樹脂や合成ゴムを主成分とする接着剤等が
例示される。In each of the embodiments described above, an olefinic jelly-like resin is used as a sealant. However, the present invention is not limited to this, and various resin compositions can be applied.
Specifically, an oil-based resin composition such as silicone oil, a rubber-based resin composition such as silicone rubber and fluororubber, a gel-based resin composition such as silicone gel and acrylic gel, an epoxy resin and a synthetic rubber as main components And the like.
【００２６】[0026]
【発明の効果】以上説明したように本発明によれば、光
導波路チップと、該光導波路チップの端面にその光軸が
一致する如く取付けられる光入出力用の光ファイバとを
備えた光導波回路モジュールにおいて、光導波路チップ
及び光入出力用の光ファイバの端部をそれぞれ光導波路
チップ用筐体及び光ファイバ端部用筐体に保持・固定す
るとともに、該光導波路チップ用筐体及び光ファイバ端
部用筐体を、光導波路チップの端面に光入出力用の光フ
ァイバの光軸が一致する如く接続し、さらにこれら全体
を外部筐体中に収納し、該光導波路チップ用筐体及び光
ファイバ端部用筐体と外部筺体との間に、光導波路チッ
プ用筐体及び光ファイバ端部用筐体と外部筐体とが接触
することのないように、ガラス転移温度が使用環境温度
０℃〜６０℃の下限以下であるゴム状樹脂組成物を充填
して封止したため、光導波路チップ用筐体及び光ファイ
バ端部用筐体間で使用される接着剤のみならず、各筐体
内部において使用される接着剤に対する水分の浸入を確
実に防止でき、その接着力の低下を防ぐことができると
ともに、部品の経済化を図ることができ、さらに、ゴム
状樹脂組成物のガラス転移に伴う応力が外部筐体内の各
部品に加わる恐れがなく、損失が増加したり、破損した
りする恐れがなく、信頼性を大幅に向上することができ
る。As described above, according to the present invention, there is provided an optical waveguide having an optical waveguide chip and an optical fiber for optical input / output which is attached to an end face of the optical waveguide chip so that its optical axis is aligned. In the circuit module, the ends of the optical waveguide chip and the optical fiber for optical input / output are held and fixed to the optical waveguide chip housing and the optical fiber end housing, respectively. The fiber end housing is connected to the end face of the optical waveguide chip such that the optical axes of the optical fibers for inputting and outputting light coincide with each other. The glass transition temperature is set so that the optical waveguide chip housing and the optical fiber end housing do not come into contact with the external housing between the optical fiber end housing and the external housing. temperature
Since the rubber-like resin composition having the lower limit of 0 ° C. to 60 ° C. or less was filled and sealed, not only the adhesive used between the optical waveguide chip housing and the optical fiber end housing, but also each housing. The penetration of moisture into the adhesive used inside the body can be reliably prevented, the adhesive strength can be prevented from lowering, the parts can be economical, and the glass transition of the rubber-like resin composition can be further improved. Therefore, there is no possibility that the stress caused by the above will be applied to each component in the outer casing, there is no possibility that the loss will increase or there is no possibility of breakage, and the reliability can be greatly improved.
【００２７】[0027]
【００２８】[0028]
【図１】本発明の光導波回路モジュールの第１の実施例
を示す構成図FIG. 1 is a configuration diagram showing a first embodiment of an optical waveguide circuit module of the present invention.
【図２】従来の光導波回路モジュールの一例を示す構成
図FIG. 2 is a configuration diagram showing an example of a conventional optical waveguide circuit module.
【図３】図２の光導波回路モジュールの分解斜視図FIG. 3 is an exploded perspective view of the optical waveguide circuit module of FIG. 2;
【図４】図１の光導波回路モジュールの分解斜視図FIG. 4 is an exploded perspective view of the optical waveguide circuit module of FIG. 1;
【図５】光導波路チップ用筐体と光ファイバ端部用筐体
とを接着剤で接続した場合の耐湿特性の測定結果を示す
グラフFIG. 5 is a graph showing measurement results of moisture resistance characteristics when an optical waveguide chip housing and an optical fiber end housing are connected with an adhesive.
【図６】光導波路チップ用筐体と光ファイバ端部用筐体
とをＹＡＧ溶接により接続した場合の耐湿特性の測定結
果を示すグラフFIG. 6 is a graph showing measurement results of moisture resistance characteristics when the optical waveguide chip housing and the optical fiber end housing are connected by YAG welding.
【図７】本発明の光導波回路モジュールの第２の実施例
を示す構成図FIG. 7 is a configuration diagram showing a second embodiment of the optical waveguide circuit module of the present invention.
１…光導波路チップ、２…光導波路チップ用筐体、３，
４…４芯テープファイバ、５，６…光ファイバ端部用筐
体、７…接着剤、１０，４０…外部筐体、２０…ジェリ
ー状樹脂。DESCRIPTION OF SYMBOLS 1 ... Optical waveguide chip, 2 ... Housing for optical waveguide chip, 3,
4 ... four-core tape fiber, 5,6 ... housing for optical fiber end, 7 ... adhesive, 10,40 ... outer housing, 20 ... jelly resin.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉澤 鐵夫 東京都千代田区内幸町一丁目１番６号 日本電信電話株式会社内 (56)参考文献 特開 昭62−170913（ＪＰ，Ａ) 特開 平２−77704（ＪＰ，Ａ) 特開 昭60−52804（ＪＰ，Ａ) 特開 昭64−44905（ＪＰ，Ａ) 特開 昭63−70208（ＪＰ，Ａ) 特開 昭56−43610（ＪＰ，Ａ) 特開 昭63−142309（ＪＰ，Ａ) 実開 昭59−161122（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) G02B 6/00 - 6/54 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tetsuo Yoshizawa 1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (56) References JP-A-62-170913 (JP, A) 2-77704 (JP, A) JP-A-60-52804 (JP, A) JP-A-64-44905 (JP, A) JP-A-63-70208 (JP, A) JP-A-56-43610 (JP, A A) JP-A-63-142309 (JP, A) JP-A-59-161122 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) G02B 6/00-6/54
Claims (1)
端面にその光軸が一致する如く取付けられる光入出力用
の光ファイバとを備えた光導波回路モジュールにおい
て、 光導波路チップ及び光入出力用の光ファイバの端部をそ
れぞれ光導波路チップ用筐体及び光ファイバ端部用筐体
に保持・固定するとともに、 該光導波路チップ用筐体及び光ファイバ端部用筐体を、
光導波路チップの端面に光入出力用の光ファイバの光軸
が一致する如く接続し、 さらにこれら全体を外部筐体中に収納し、 該光導波路チップ用筐体及び光ファイバ端部用筐体と外
部筺体との間に、光導波路チップ用筐体及び光ファイバ
端部用筐体と外部筐体とが接触することのないように、
ガラス転移温度が使用環境温度０℃〜６０℃の下限以下
であるゴム状樹脂組成物を充填して封止したことを特徴
とする光導波回路モジュール。1. An optical waveguide circuit module comprising: an optical waveguide chip; and an optical input / output optical fiber attached to an end face of the optical waveguide chip so that its optical axis coincides with the optical waveguide chip. Holding and fixing the ends of the optical fibers for use in the optical waveguide chip housing and the optical fiber end housing, respectively.
The optical waveguide chip is connected to the end face of the optical waveguide chip so that the optical axes of the optical fibers for inputting and outputting light coincide with each other. Further, the entirety is housed in an external housing, and the optical waveguide chip housing and the optical fiber end housing are provided. Between the and the external housing, so that the optical waveguide chip housing and the optical fiber end housing and the external housing do not contact,
An optical waveguide circuit module, wherein a rubber-like resin composition whose glass transition temperature is lower than or equal to a lower limit of an ambient temperature of 0 ° C. to 60 ° C. is filled and sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16722991A JP3199181B2 (en) | 1991-07-08 | 1991-07-08 | Optical waveguide circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16722991A JP3199181B2 (en) | 1991-07-08 | 1991-07-08 | Optical waveguide circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0527139A JPH0527139A (en) | 1993-02-05 |
| JP3199181B2 true JP3199181B2 (en) | 2001-08-13 |
Family
ID=15845848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16722991A Expired - Lifetime JP3199181B2 (en) | 1991-07-08 | 1991-07-08 | Optical waveguide circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3199181B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0792342A (en) * | 1993-07-29 | 1995-04-07 | Sumitomo Electric Ind Ltd | Optical waveguide module |
| FR2730820B1 (en) * | 1995-02-17 | 1997-06-06 | Corning Inc | PROTECTIVE HOUSING FOR INTEGRATED OPTICAL COMPONENT |
| JPH08286073A (en) * | 1995-04-18 | 1996-11-01 | Sumitomo Electric Ind Ltd | Package structure for packaging optical waveguide |
| CA2214982A1 (en) * | 1996-01-26 | 1997-07-31 | Sumitomo Electric Industries, Ltd. | Optical waveguide module |
| US6567603B1 (en) * | 1998-03-12 | 2003-05-20 | Tomoegawa Paper Co., Ltd. | Optical interconnection apparatus and process for fabrication of the same |
| KR100362570B1 (en) * | 2000-06-23 | 2002-11-29 | 삼성전자 주식회사 | Hermetic optical wavelength division multi/demutiplexer package |
| JP2005250115A (en) * | 2004-03-04 | 2005-09-15 | Fujikura Ltd | Optical waveguide module |
| JP2006011243A (en) * | 2004-06-29 | 2006-01-12 | Fujikura Ltd | Optical component protective structure and lens type optical component |
| JP5086755B2 (en) * | 2007-10-03 | 2012-11-28 | アンリツ株式会社 | Waveguide type optical device module and manufacturing method thereof |
| CN102035277B (en) * | 2009-10-07 | 2014-08-20 | 阿斯莫有限公司 | Motor |
| DE102012021109B4 (en) | 2011-10-31 | 2023-04-27 | Denso Corporation | rotor and engine |
-
1991
- 1991-07-08 JP JP16722991A patent/JP3199181B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0527139A (en) | 1993-02-05 |
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