CN110957287A - High-power radiator and preparation method thereof - Google Patents
High-power radiator and preparation method thereof Download PDFInfo
- Publication number
- CN110957287A CN110957287A CN201911301282.8A CN201911301282A CN110957287A CN 110957287 A CN110957287 A CN 110957287A CN 201911301282 A CN201911301282 A CN 201911301282A CN 110957287 A CN110957287 A CN 110957287A
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- China
- Prior art keywords
- layer
- oxide layer
- heat sink
- oxide
- depositing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
Description
Test sample | Thermode temperature (. degree.C.) | Cold cathode temperature (. degree. C.) | Heat quantity (W) | Pressure (Psi) |
1 | 79.99 | 67.55 | 78.22 | 79.95 |
2 | 80.00 | 65.80 | 73.60 | 79.95 |
Test sample | Thermal resistance (m)2K/W) | Thermal resistance (K/W) | Thickness of the whole plate (mm) | Whole plate coefficient of thermal conductivity |
1 | 0.0000516 | 0.081 | 1.01 | 19.57 |
2 | 0.0000435 | 0.045 | 1.01 | 23.22 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911301282.8A CN110957287A (en) | 2019-12-17 | 2019-12-17 | High-power radiator and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911301282.8A CN110957287A (en) | 2019-12-17 | 2019-12-17 | High-power radiator and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110957287A true CN110957287A (en) | 2020-04-03 |
Family
ID=69982073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201911301282.8A Pending CN110957287A (en) | 2019-12-17 | 2019-12-17 | High-power radiator and preparation method thereof |
Country Status (1)
Country | Link |
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CN (1) | CN110957287A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114567967A (en) * | 2020-11-27 | 2022-05-31 | 核工业西南物理研究院 | Preparation method of high-thermal-conductivity insulating heat-conducting layer |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101545587A (en) * | 2009-06-08 | 2009-09-30 | 刘素霞 | A preparation method of high-performance heat-radiating semiconductor planar light source |
CN101661977A (en) * | 2008-08-27 | 2010-03-03 | 北京盘天新技术有限公司 | Preparation method of insulating metal substrate for high-power LED packaging |
CN102159024A (en) * | 2011-02-28 | 2011-08-17 | 任正义 | Aluminum base printed circuit board and preparation method thereof |
-
2019
- 2019-12-17 CN CN201911301282.8A patent/CN110957287A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101661977A (en) * | 2008-08-27 | 2010-03-03 | 北京盘天新技术有限公司 | Preparation method of insulating metal substrate for high-power LED packaging |
CN101545587A (en) * | 2009-06-08 | 2009-09-30 | 刘素霞 | A preparation method of high-performance heat-radiating semiconductor planar light source |
CN102159024A (en) * | 2011-02-28 | 2011-08-17 | 任正义 | Aluminum base printed circuit board and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
赵永久: "《中国优秀硕士学位论文全文数据库信息科技辑》", 《中国优秀硕士学位论文全文数据库信息科技辑》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114567967A (en) * | 2020-11-27 | 2022-05-31 | 核工业西南物理研究院 | Preparation method of high-thermal-conductivity insulating heat-conducting layer |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Liao Bin Inventor after: OuYang Xiaoping Inventor after: Luo Jun Inventor after: Chen Lin Inventor after: Zhang Xu Inventor after: Wu Xianying Inventor after: Pang Pan Inventor after: Han Ran Inventor after: Yingminju Inventor before: Liao Bin Inventor before: Han Ran Inventor before: Yingminju Inventor before: OuYang Xiaoping Inventor before: He Guangyu Inventor before: He Weifeng Inventor before: Luo Jun Inventor before: Chen Lin Inventor before: Zhang Xu Inventor before: Wu Xianying Inventor before: Pang Pan |
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CB03 | Change of inventor or designer information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200403 |
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RJ01 | Rejection of invention patent application after publication |