CN102159024A - Aluminum base printed circuit board and preparation method thereof - Google Patents
Aluminum base printed circuit board and preparation method thereof Download PDFInfo
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- CN102159024A CN102159024A CN2011100472210A CN201110047221A CN102159024A CN 102159024 A CN102159024 A CN 102159024A CN 2011100472210 A CN2011100472210 A CN 2011100472210A CN 201110047221 A CN201110047221 A CN 201110047221A CN 102159024 A CN102159024 A CN 102159024A
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Abstract
The invention discloses an aluminum base printed circuit board and a preparation method thereof, which solves the technical problem that the insulating, temperature resistant and withstand voltage values and the scratch fineness of the printed circuit board are improved. An insulating layer is formed on the surface of an aluminum base plate; a copper conducting layer is covered on the insulating layer; and a transition layer and a copper conducting film are arranged between the insulating layer and the copper conducting layer. The preparation method comprises the steps of depositing a transition layer chromium, nickel or chrome-nickel alloy film on the insulating layer of the aluminum base plate, depositing the copper conducting film on the transition layer, and electroplating the copper conducting layer on the copper conducting film. Compared with the prior art, the aluminum base printed circuit board has the advantages that as the aluminum base plate is adopted, aluminum oxide of the aluminum base plate forms the insulating layer, as the nano transition layer is adopted, the adhesive force between the conducting layer and the base plate is greatly improved, and when traditional typographies, such as photograph and chemical corrosion, are adopted, scratch is finer, the manufacture is more precise, and the requirements on large power and high integration to the printed circuit board are satisfied, so that the large power and high integration of the printed circuit board are realized.
Description
Technical field
The present invention relates to a kind of printed circuit board and preparation method thereof, particularly a kind of aluminum-base printed circuit board and preparation method thereof.
Background technology
Along with computer, communication and Space Science and Technology industrial expansion, urgent day by day to the demand of high-power and highly integrated high-end printed circuit board.The common metal substrate printed circuit board of prior art is to adopt thick aluminium sheet after machining, and order covers insulating barrier in its machined grooves, copper-foil conducting electricity forms; Apply system because of its insulating barrier utilizes liquid spraying method under normal pressure, have defectives such as bubble, sand holes inevitably, it is punctured from fault location by the above high pressure of 500V easily; Owing to also under normal pressure, adopt heat-conducting glue bonding, cause that its heatproof is not enough, adhesive force is low between copper-foil conducting electricity and the substrate; Corrosion groove above the copper-foil conducting electricity can not be too thin, cause installing on the printed circuit board, being welded with high power device, single or double welding on the printed circuit board, when extensive, very lagre scale integrated circuit (VLSIC) piece is installed, can't satisfy the requirement of high power device and the fine wire bonds of large scale integrated circuit piece to printed circuit board.
Summary of the invention
The purpose of this invention is to provide a kind of aluminum-base printed circuit board and preparation method thereof, the technical problem that solve is to improve the insulation heat resisting and pressure resisting value and the groove fineness of printed circuit board.
The present invention is by the following technical solutions: a kind of aluminum-base printed circuit board, be provided with aluminum substrate, the surface of aluminum substrate is formed with the alundum (Al insulating barrier, be coated with the copper conductive layer on the insulating barrier, be provided with transition zone and copper conducting film between described insulating barrier and the copper conductive layer, transition zone is coated in the surface of insulating barrier, and transition zone is chromium, nickel or the chrome-nickel film of thickness 30nm to 80nm, being coated with thickness on the transition zone is copper conducting film more than the 300nm, and the copper conductive layer covers on the copper conducting film.
Aluminum substrate thickness of the present invention is 1.5mm to 5mm, and described thickness of insulating layer is 10 μ m to 20 μ m.
Copper conductive layer thickness of the present invention is 25 μ m to 50 μ m.
The insulating barrier of aluminum substrate of the present invention one side is provided with transition zone, copper conducting film and copper conductive layer, on conductive layer and the insulating barrier of the another side of aluminum substrate be coated with matcoveredn.
Be respectively equipped with transition zone, copper conducting film and copper conductive layer on the insulating barrier on aluminum substrate of the present invention two sides, be coated with matcoveredn above the copper conductive layer.
A kind of preparation method of aluminum-base printed circuit board, may further comprise the steps: be that 1.5mm to 5mm aluminum substrate, its two sides are formed with on the single or double of alundum (Al insulating barrier that thickness is 10 μ m to 20 μ m one, at thickness, deposit thickness is transition zone chromium, nickel or the chrome-nickel film of 30nm to 80nm, deposition adopts magnetron sputtering, and base vacuum pressure is 3 * 10
-3Below the Pa, charge into argon gas, make operating pressure 1.5～2.5 * 10
-1Pa, target surface is of a size of 120 * 800mm, target surface magnetic field intensity 300 Gausses, sputtering power is 6kw; Two, on transition zone, the copper conducting film that deposit thickness 300nm is above, deposition adopts magnetron sputtering, and operating pressure is 1.5～2.5 * 10
-1Pa, the target surface size is 120 * 800mm, target surface magnetic field intensity 300 Gausses, sputtering power is 10kw; Three, on the copper conducting film, electroplating thickness is the copper conductive layer of 25 μ m to 50 μ m; Four, on the insulating barrier and on the copper conductive layer, or on two-sided copper conductive layer, spraying protective layer.
The purity of method argon gas of the present invention is more than 99.99%.
Method target-substrate distance of the present invention is 60mm～90mm.
Method magnetron sputtering apparatus of the present invention is the structure of sheet surge chamber, sputtering chamber, tail end surge chamber three Room word orders into, and aluminum substrate print translational speed is 0.2～2.5 meter/minute.
The density of method chromium target of the present invention is not less than 6.8 gram per centimeters
3, the chrome-nickel target adopts Cr20Ni80, and the copper target adopts red copper T4.
The present invention compared with prior art, adopt the good aluminium sheet of heat radiation, and utilize himself oxide alundum (Al to form densification, high temperature resistant, corrosion-resistant and the good ceramic-like insulating barrier of insulation property, overcome the defective that common metal base printed board insulating barrier easily is broken down by high-voltage effectively, adopt the nanometer transition zone, adhesive force between conductive layer and substrate is improved greatly, take a picture thereby make to adopt, during traditional printing technologies such as chemical corrosion, groove is meticulousr, make more accurate, satisfy high-power and highly integrated requirement, thereby realize that printed circuit board is high-power and highly integrated printed board.
Description of drawings
Fig. 1 is the section of structure of embodiment of the invention single-clad board.
Fig. 2 is the section of structure of embodiment of the invention two sided pcb.
Fig. 3 is the equipment schematic that the embodiment of the invention adopts.
Embodiment
Below in conjunction with drawings and Examples the present invention is described in further detail.
As shown in Figure 1, aluminum-base printed circuit board of the present invention, when one side print is shaped on circuit board, being provided with thickness is the aluminum substrate 1 of 1.5mm to 5mm, and two surfaces of substrate 1 adopt prior art to form fine and close, high temperature resistant, corrosion-resistant after anodic oxidation and insulation property are good, thickness is the alundum (Al Al of 10 μ m to 20 μ m
2O
3Ceramic insulating layer 2; on the surface of insulating barrier 2 simultaneously, be coated with transition zone 3 by gas-phase deposition; can adopt the vacuum evaporation of physical vapour deposition (PVD); vacuum magnetic-control sputtering or vacuum ionic depositing process; transition zone 3 is the chromium of thickness 30nm to 80nm; nickel or chrome-nickel film; being coated with thickness with gas-phase deposition on transition zone 3 is copper conducting film 4 more than the 300nm; can adopt the vacuum evaporation of physical vapour deposition (PVD); vacuum magnetic-control sputtering or vacuum ionic depositing process; be coated with the copper conductive layer 5 that thickness is 25 μ m to 50 μ m with electroplating technology on the copper conducting film 4; be coated with protective layer 6 on conductive layer 5 and on the insulating barrier 2 of another side, protective layer 6 adopts the printed wiring board varnish of prior art.
As shown in Figure 2, aluminum-base printed circuit board of the present invention, when perfecting is shaped on circuit board, being provided with thickness is the aluminum substrate 1 of 1.5mm to 5mm, two surfaces of substrate 1 adopt form fine and close, high temperature resistant, corrosion-resistant after the prior art anodic oxidations and insulation property well, thickness is the alundum (Al Al of 10 μ m to 20 μ m
2O
3Ceramic insulating layer 2; be coated with transition zone 3 on two surfaces of insulating barrier 2 by gas-phase deposition respectively; can adopt the vacuum evaporation of physical vapour deposition (PVD); vacuum magnetic-control sputtering or vacuum ionic depositing process; transition zone 3 is the chromium of thickness 30nm to 80nm; nickel or chrome-nickel film; being coated with thickness with gas-phase deposition on transition zone 3 is copper conducting film 4 more than the 300nm; can adopt the vacuum evaporation of physical vapour deposition (PVD); vacuum magnetic-control sputtering or vacuum ionic depositing process; be coated with the copper conductive layer 5 that thickness is 25 μ m to 50 μ m with electroplating technology on the copper conducting film 4; be coated with protective layer 6 on conductive layer 5, protective layer 6 adopts the printed wiring board varnish of prior art.
The preparation method of aluminum-base printed circuit board of the present invention may further comprise the steps:
One, be that 1.5mm to 5mm aluminum substrate carries out anodic oxidation by prior art with thickness, forming thickness on the two sides of aluminum substrate is the alundum (Al Al of 10 μ m to 20 μ m
2O
3Insulating barrier also can directly be bought suitable, the Al of business-like thickness
2O
3Insulating barrier reaches the anodic oxidation aluminium plate of requirement of withstand voltage 2000v.
Two, on insulating barrier single or double insulating barrier, the transition zone chromium of deposit thickness 30nm to 80nm, nickel or chrome-nickel film.
As shown in Figure 3, equipment adopts the magnetic control sputtering vacuum coating machine, for advancing the structure of sheet surge chamber, sputtering chamber, tail end surge chamber three Room word orders, middle sputtering chamber top is provided with 4 sputter target position, 1 Cr target, 1 NiCr target and 2 copper Cu targets are housed respectively, the Cr target is made through the powder metallurgy mode of pure chromium, and density is not less than 6.8 gram per centimeters
3, the NiCr target adopts Cr20Ni80, and the Cu target adopts red copper T4; Target surface magnetic field intensity 300 Gausses; The target surface size is 120 * 800mm; Shielding power supply is 3 20kw vacuum coating direct magnetic control power supplys of Zhuhai Sheng Pu Electrosource, Inc.; The target position below is provided with from advancing the sheet surge chamber and can comes and goes mobile pallet to the tail end surge chamber, and translational speed is 0.2～2.5 meter/minute, and is adjustable; Target-substrate distance is 60mm～90mm, and embodiment 1-6 adopts 80mm.Substrate adopts the exterior wall/curtain wall of Shanghai Atotech Aluminum Co., Ltd production with outdoor grade anodic oxidation aluminium sheet, is thickness 1.5mm, width 1250mm, and the coiled material of oxide thickness 8～12 μ m divides to be cut to 500 * 500mm print, and monolithic is placed on the mobile pallet.
Specific embodiment is as follows: print is put pallet through ultrasonic waves for cleaning and after drying, and sends into and be parked in into sheet surge chamber, and advancing the sheet surge chamber is the vacuum lock chamber, and surge chamber is evacuated to vacuum pressure 3 * 10
-1Below the Pa, vacuum lock chamber valve open advances the sheet surge chamber and is communicated with sputtering chamber, to base vacuum pressure 3 * 10
-3Below the Pa, charge into the argon Ar of purity more than 99.99%, make the sputtering chamber operating pressure 1.5～2.5 * 10 with the mass flowmenter of range 1000sccm
-1Pa, the shielding power supply of connection Cr or NiCr target, starting voltage-500V improves sputtering current gradually to the target working stability, and sputtering power is 6kw; Starting the pallet variable frequency drive motors just changes, print from advance the sheet surge chamber at the uniform velocity by sputtering chamber to the tail end surge chamber, the variable frequency drive motors counter-rotating, print at the uniform velocity is back to into sheet surge chamber by sputtering chamber from the tail end surge chamber; Come and go mobile print like this more than 1 time, reach 30nm～80nm scope shutoff shielding power supply to depositing thickness.Can regulate the sputtering power of target by regulating the constant current output current of vacuum coating direct magnetic control power supply, regulate tray movement speed and/or print simultaneously and come and go mobile number of times, come the transition zone thickness of depositing and setting.The single rete of plating takes out print and measurement point resistance earlier, adopts general universal instrument, two test pencil contact spacings are fixed as 10mm, directly are pressed in face and measure, resistance is more than 1 kilo-ohm, show as insulating properties, after determining and optimizing technological parameter, only control during practical operation by each parameter.
Three, on transition zone, the copper conducting film that deposit thickness 300nm is above.
Behind completing steps two, print does not expose atmosphere, adopt identical vacuum environment, workpiece translational speed and technological parameter, connect the shielding power supply of two T4 copper targets respectively, starting voltage-400V improves sputtering current gradually to sputtering power 10kw, to the target working stability, repeat above-mentioned circulation, reach and close shielding power supply more than the 300nm to depositing thickness.Equally, can regulate the sputtering power of target, regulate tray movement speed and/or print simultaneously and come and go mobile number of times, come the copper conducting film thickness of depositing and setting by regulating the constant current output current of vacuum coating direct magnetic control power supply.The single rete of plating takes out print and measurement point resistance earlier, adopts general universal instrument, two test pencil contact spacings are fixed as 10mm, directly are pressed in face and measure, resistance is below 50 ohm, show as good conductivity, determine and optimize various parameters, only control during practical operation by each parameter.
As be double-clad board, then after finishing two, three steps, need print is taken out and turn-over, repeat the process of above-mentioned two, three steps after putting into again.
Four, on the copper conducting film, be the copper conductive layer of 25 μ m to 50 μ m by existing electro-coppering technology electroplating thickness, very thin as the groove of back operation, also can thicken the copper conductive layer.
Five,, or on two-sided copper conductive layer,, form protective layer by prior art spraying printed wiring board varnish on the insulating barrier and on the copper conductive layer.
The aluminum-base printed circuit board of method preparation of the present invention, constitute the insulating resistance value at reinforced insulation layer both sides (between aluminium base and copper conductive layer the two poles of the earth) jointly with common megohmmeter test transition zone and insulating barrier, in order to the high-voltage breakdown performance of evaluation aluminum-base printed circuit board.Use the pressure zone mensuration: at the optional 25.4 * 25.4mm of face
2Scope, draw the 2cm line of long (surpassing tape width) equably with art designing's blade, 3M adhesive tape (vertical with line) is cemented on the face with the finger compacting, and along almost leaving behind rapidly with face parallel direction carrier tape traction adhesive one end, have or not rete to come off on the observation adhesive tape, increase the quantity and the density of line gradually, the rete that obviously comes off is arranged on adhesive tape, judge adhesive force quality between copper conductive layer and substrate with this, many more, the close more then adhesive force of ruling is good more.Become more meticulous and integrated performance in order to estimate the aluminum-base printed circuit board groove.
Embodiment 1-6 is by choosing different targets, sputtering power, coming and going translational speed and monolateral coating times; on the print of ultrasonic waves for cleaning and oven dry, depositing different transition zone and conductive copper films by aforementioned process; re-plating copper conductive layer is finished behind the last sprayed protection varnish.
The concrete process data of embodiment 1-6 sees Table 1.Contrast each embodiment again; with identical print; do not plate transition zone; by identical copper conductive layer and electroplating technology Direct Electroplating copper conductive layer (not spraying protection varnish); press preceding method, the scribe line pitch when obviously coming off rete to have on the 3M adhesive tape is come the adhesive force between test judgement copper conductive layer and substrate.The test result of embodiment 1-6 and Comparative Examples sees Table 2.
Because print is cut with the anodic oxidation aluminium sheet, its peripheral otch does not have insulating oxide, so its periphery need be made plastic packaging or block processing before plated film, and removes before the spray protective paint after electro-coppering.Anodised again aluminium sheet after cutting as use, or the conductive copper layer of periphery is removed about 3mm during the operation corrosion of back, then can not do this processing.
Printed wiring board of the present invention has that thermal diffusivity is good, price is low, in light weight, evenness good, easily processing and advantages of high strength.Because of its insulating barrier densification, corrosion-resistant, and insulation property are good, overcome the defective that common metal base printed board insulating barrier easily is broken down by high-voltage effectively, adopt technique for vacuum coating diffusion depositing nano order of magnitude transition zone, the copper conducting film, rete thermal stress between anodic oxidation aluminium base and the copper conductor and the Van der Waals force between nano particle have been improved, adhesive force between copper conductive layer and substrate is improved greatly, thereby make groove meticulousr, make more accurate, also more the photoetching mask-making technology of environmental protection can replace the photograph of prior art, chemical corrosion printed wiring board technology, the power of raising printed wiring board and integrated.In addition, printed wiring board of the present invention also has anti-interference and characteristics shielding electromagnetic wave, is specially adapted to communication and national defense industry.
The concrete process data of table 1 embodiment 1-6 single-sided printed board
The test result of table 2 embodiment 1-6 and Comparative Examples
Claims (10)
1. aluminum-base printed circuit board, be provided with aluminum substrate (1), the surface of aluminum substrate (1) is formed with alundum (Al insulating barrier (2), be coated with copper conductive layer (5) on the insulating barrier (2), it is characterized in that: be provided with transition zone (3) and copper conducting film (4) between described insulating barrier (2) and the copper conductive layer (5), transition zone (3) is coated in the surface of insulating barrier (2), transition zone (3) is the chromium of thickness 30nm to 80nm, nickel or chrome-nickel film, be coated with thickness and be the copper conducting film (4) more than the 300nm on transition zone (3), copper conductive layer (5) covers on the copper conducting film (4).
2. aluminum-base printed circuit board according to claim 1 is characterized in that: described aluminum substrate (1) thickness is 1.5mm to 5mm, and described insulating barrier (2) thickness is 10 μ m to 20 μ m.
3. aluminum-base printed circuit board according to claim 2 is characterized in that: described copper conductive layer (5) thickness is 25 μ m to 50 μ m.
4. aluminum-base printed circuit board according to claim 3; it is characterized in that: the insulating barrier (2) of described aluminum substrate (1) one side is provided with transition zone (3), copper conducting film (4) and copper conductive layer (5), on conductive layer (5) and the insulating barrier (2) of the another side of aluminum substrate (1) be coated with matcoveredn (6).
5. aluminum-base printed circuit board according to claim 3; it is characterized in that: be respectively equipped with transition zone (3), copper conducting film (4) and copper conductive layer (5) on the insulating barrier (2) on described aluminum substrate (1) two sides, be coated with matcoveredn (6) above the copper conductive layer (5).
6. the preparation method of an aluminum-base printed circuit board, may further comprise the steps: be that 1.5mm to 5mm aluminum substrate, its two sides are formed with on the single or double of alundum (Al insulating barrier that thickness is 10 μ m to 20 μ m one, at thickness, deposit thickness is transition zone chromium, nickel or the chrome-nickel film of 30nm to 80nm, deposition adopts magnetron sputtering, and base vacuum pressure is 3 * 10
-3Below the Pa, charge into argon gas, make operating pressure 1.5～2.5 * 10
-1Pa, target surface is of a size of 120 * 800mm, target surface magnetic field intensity 300 Gausses, sputtering power is 6kw; Two, on transition zone, the copper conducting film that deposit thickness 300nm is above, deposition adopts magnetron sputtering, and operating pressure is 1.5～2.5 * 10
-1Pa, the target surface size is 120 * 800mm, target surface magnetic field intensity 300 Gausses, sputtering power is 10kw; Three, on the copper conducting film, electroplating thickness is the copper conductive layer of 25 μ m to 50 μ m; Four, on the insulating barrier and on the copper conductive layer, or on two-sided copper conductive layer, spraying protective layer.
7. the preparation method of aluminum-base printed circuit board according to claim 6, it is characterized in that: the purity of described argon gas is more than 99.99%.
8. the preparation method of aluminum-base printed circuit board according to claim 7, it is characterized in that: described target-substrate distance is 60mm～90mm.
9. the preparation method of aluminum-base printed circuit board according to claim 8, it is characterized in that: described magnetron sputtering apparatus is the structure of sheet surge chamber, sputtering chamber, tail end surge chamber three Room word orders into, and aluminum substrate print translational speed is 0.2～2.5 meter/minute.
10. the preparation method of aluminum-base printed circuit board according to claim 9, it is characterized in that: the density of described chromium target is not less than 6.8 gram per centimeters
3, the chrome-nickel target adopts Cr20Ni80, and the copper target adopts red copper T4.
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| CN103533767A (en) * | 2013-10-23 | 2014-01-22 | 江苏通驰自动化***有限公司 | Method for performing three-proofing treatment on circuit board by using ultrasonic waves |
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| CN108055790A (en) * | 2017-12-06 | 2018-05-18 | 陈旺寿 | A kind of circuit board and preparation method thereof and application |
| CN110016648A (en) * | 2018-01-10 | 2019-07-16 | 核工业西南物理研究院 | It is a kind of to be dielectrically separated from coating production suitable for high-temperature piezoelectric sensor |
| CN110957287A (en) * | 2019-12-17 | 2020-04-03 | 北京师范大学 | High-power radiator and preparation method thereof |
| CN112410742A (en) * | 2020-10-30 | 2021-02-26 | 东莞市烽元科技有限公司 | In Al2O3Method for plating nano-scale copper film on surface of ceramic substrate by magnetron sputtering |
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Application publication date: 20110817 |