CN110800084A - 切割用基体膜 - Google Patents

切割用基体膜 Download PDF

Info

Publication number: CN110800084A
Authority: CN; China
Prior art keywords: dicing; layer; base film; film; surface layer
Prior art date: 2017-08-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201880043105.1A

Other languages

English (en)

Chinese (zh)

Inventor

栗原启太

末藤壮一

塚田章一

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Gunze Ltd

Original Assignee

Gunze Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-08-25

Filing date

2018-08-06

Publication date

2020-02-14

2018-08-06 Application filed by Gunze Ltd filed Critical Gunze Ltd

2020-02-14 Publication of CN110800084A publication Critical patent/CN110800084A/zh

Status Pending legal-status Critical Current

Links

239000010410 layer Substances 0.000 claims abstract description 116
239000002344 surface layer Substances 0.000 claims abstract description 52
239000011342 resin composition Substances 0.000 claims abstract description 25
229920013716 polyethylene resin Polymers 0.000 claims abstract description 23
229920005749 polyurethane resin Polymers 0.000 claims abstract description 19
239000005038 ethylene vinyl acetate Substances 0.000 claims description 23
229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 23
229920005989 resin Polymers 0.000 claims description 23
239000011347 resin Substances 0.000 claims description 23
229920002803 thermoplastic polyurethane Polymers 0.000 claims description 17
229920001684 low density polyethylene Polymers 0.000 claims description 14
239000004702 low-density polyethylene Substances 0.000 claims description 14
229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 10
239000002356 single layer Substances 0.000 claims description 9
239000004433 Thermoplastic polyurethane Substances 0.000 claims description 7
239000012790 adhesive layer Substances 0.000 claims description 7
229920006225 ethylene-methyl acrylate Polymers 0.000 claims description 6
229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 claims description 5
229920000092 linear low density polyethylene Polymers 0.000 claims description 4
239000004707 linear low-density polyethylene Substances 0.000 claims description 4
QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 claims description 3
229920006245 ethylene-butyl acrylate Polymers 0.000 claims description 3
229920006244 ethylene-ethyl acrylate Polymers 0.000 claims description 3
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
229920012753 Ethylene Ionomers Polymers 0.000 claims 1
238000011084 recovery Methods 0.000 abstract description 20
239000004065 semiconductor Substances 0.000 description 28
238000000034 method Methods 0.000 description 17
239000004814 polyurethane Substances 0.000 description 11
239000002216 antistatic agent Substances 0.000 description 10
238000011156 evaluation Methods 0.000 description 8
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 6
238000009864 tensile test Methods 0.000 description 6
150000002009 diols Chemical class 0.000 description 5
238000001125 extrusion Methods 0.000 description 5
238000000465 moulding Methods 0.000 description 5
229920005862 polyol Polymers 0.000 description 5
150000003077 polyols Chemical class 0.000 description 5
239000000758 substrate Substances 0.000 description 5
WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
239000000155 melt Substances 0.000 description 4
239000000203 mixture Substances 0.000 description 4
229920005906 polyester polyol Polymers 0.000 description 4
239000005056 polyisocyanate Substances 0.000 description 4
229920001228 polyisocyanate Polymers 0.000 description 4
239000002904 solvent Substances 0.000 description 4
239000004970 Chain extender Substances 0.000 description 3
229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 3
239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
230000015572 biosynthetic process Effects 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
238000001816 cooling Methods 0.000 description 3
-1 polypropylene Polymers 0.000 description 3
239000002994 raw material Substances 0.000 description 3
UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
125000001931 aliphatic group Chemical group 0.000 description 2
239000002981 blocking agent Substances 0.000 description 2
125000004432 carbon atom Chemical group C* 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
230000008602 contraction Effects 0.000 description 2
239000000498 cooling water Substances 0.000 description 2
230000007547 defect Effects 0.000 description 2
230000000694 effects Effects 0.000 description 2
RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
230000001771 impaired effect Effects 0.000 description 2
229920000554 ionomer Polymers 0.000 description 2
238000005259 measurement Methods 0.000 description 2
239000002736 nonionic surfactant Substances 0.000 description 2
239000003960 organic solvent Substances 0.000 description 2
229920000909 polytetrahydrofuran Polymers 0.000 description 2
238000012545 processing Methods 0.000 description 2
CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
229920002554 vinyl polymer Polymers 0.000 description 2
DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
229940035437 1,3-propanediol Drugs 0.000 description 1
SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
229940043375 1,5-pentanediol Drugs 0.000 description 1
VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
VEOIIOUWYNGYDA-UHFFFAOYSA-N 2-[2-(6-aminopurin-9-yl)ethoxy]ethylphosphonic acid Chemical compound NC1=NC=NC2=C1N=CN2CCOCCP(O)(O)=O VEOIIOUWYNGYDA-UHFFFAOYSA-N 0.000 description 1
WTPYFJNYAMXZJG-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=C(OCCO)C=C1 WTPYFJNYAMXZJG-UHFFFAOYSA-N 0.000 description 1
RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
SPBDXSGPUHCETR-JFUDTMANSA-N 8883yp2r6d Chemical compound O1[C@@H](C)[C@H](O)[C@@H](OC)C[C@@H]1O[C@@H]1[C@@H](OC)C[C@H](O[C@@H]2C(=C/C[C@@H]3C[C@@H](C[C@@]4(O[C@@H]([C@@H](C)CC4)C(C)C)O3)OC(=O)[C@@H]3C=C(C)[C@@H](O)[C@H]4OC\C([C@@]34O)=C/C=C/[C@@H]2C)/C)O[C@H]1C.C1C[C@H](C)[C@@H]([C@@H](C)CC)O[C@@]21O[C@H](C\C=C(C)\[C@@H](O[C@@H]1O[C@@H](C)[C@H](O[C@@H]3O[C@@H](C)[C@H](O)[C@@H](OC)C3)[C@@H](OC)C1)[C@@H](C)\C=C\C=C/1[C@]3([C@H](C(=O)O4)C=C(C)[C@@H](O)[C@H]3OC\1)O)C[C@H]4C2 SPBDXSGPUHCETR-JFUDTMANSA-N 0.000 description 1
239000005977 Ethylene Substances 0.000 description 1
239000005058 Isophorone diisocyanate Substances 0.000 description 1
OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
235000011037 adipic acid Nutrition 0.000 description 1
239000001361 adipic acid Substances 0.000 description 1
230000002411 adverse Effects 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
125000000129 anionic group Chemical group 0.000 description 1
239000003945 anionic surfactant Substances 0.000 description 1
229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
229920001400 block copolymer Polymers 0.000 description 1
230000000903 blocking effect Effects 0.000 description 1
MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
125000002091 cationic group Chemical group 0.000 description 1
239000003093 cationic surfactant Substances 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
150000001991 dicarboxylic acids Chemical class 0.000 description 1
125000005442 diisocyanate group Chemical group 0.000 description 1
230000005611 electricity Effects 0.000 description 1
239000010419 fine particle Substances 0.000 description 1
238000011835 investigation Methods 0.000 description 1
NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
150000002596 lactones Chemical class 0.000 description 1
239000000463 material Substances 0.000 description 1
238000002156 mixing Methods 0.000 description 1
239000008188 pellet Substances 0.000 description 1
238000006068 polycondensation reaction Methods 0.000 description 1
229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920000098 polyolefin Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
229920000166 polytrimethylene carbonate Polymers 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
230000003068 static effect Effects 0.000 description 1
229920003048 styrene butadiene rubber Polymers 0.000 description 1
229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
150000005846 sugar alcohols Polymers 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
238000012360 testing method Methods 0.000 description 1
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Physics & Mathematics (AREA)
Power Engineering (AREA)
Dicing (AREA)
Adhesive Tapes (AREA)
Adhesives Or Adhesive Processes (AREA)
Laminated Bodies (AREA)
Polishing Bodies And Polishing Tools (AREA)
Wire Bonding (AREA)

CN201880043105.1A 2017-08-25 2018-08-06 切割用基体膜 Pending CN110800084A (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2017162613		2017-08-25
JP2017-162613		2017-08-25
PCT/JP2018/029385 WO2019039253A1 (ja)	2017-08-25	2018-08-06	ダイシング用基体フィルム

Publications (1)

Publication Number	Publication Date
CN110800084A true CN110800084A (zh)	2020-02-14

Family

ID=65438882

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201880043105.1A Pending CN110800084A (zh)	2017-08-25	2018-08-06	切割用基体膜

Country Status (5)

Country	Link
JP (2)	JP7421339B2 (ja)
KR (2)	KR20230157537A (ja)
CN (1)	CN110800084A (ja)
TW (1)	TWI813582B (ja)
WO (1)	WO2019039253A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN113122160A (zh) *	2021-04-29	2021-07-16	东莞市金恒晟新材料科技有限公司	一种新型热增粘保护膜的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2021061325A (ja) *	2019-10-07	2021-04-15	倉敷紡績株式会社	ダイシングシートおよびダイシングシート用基材フィルム

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CN1395602A (zh) *	2000-11-22	2003-02-05	三井化学株式会社	晶片机械加工粘结带及其制造和使用方法
JP2004122758A (ja) *	2002-07-26	2004-04-22	Nitto Denko Corp	多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP2015185591A (ja) *	2014-03-20	2015-10-22	日立化成株式会社	ウエハ加工用テープ

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JP4510954B2 (ja) *	1998-08-10	2010-07-28	リンテック株式会社	ダイシングテープ及びダイシング方法
CN101157406B (zh) *	2007-10-30	2010-12-29	中国石化扬子石油化工有限公司	一种包装弹性收缩膜及制备方法
JP5314308B2 (ja) *	2008-03-25	2013-10-16	リンテック株式会社	レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法
JP6299315B2 (ja)	2014-03-20	2018-03-28	日立化成株式会社	ウエハ加工用テープ
JP6703485B2 (ja) *	2014-09-29	2020-06-03	リンテック株式会社	半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法

2018
- 2018-08-06 KR KR1020237038440A patent/KR20230157537A/ko not_active Application Discontinuation
- 2018-08-06 CN CN201880043105.1A patent/CN110800084A/zh active Pending
- 2018-08-06 KR KR1020197036854A patent/KR20200045444A/ko active Application Filing
- 2018-08-06 JP JP2019538045A patent/JP7421339B2/ja active Active
- 2018-08-06 WO PCT/JP2018/029385 patent/WO2019039253A1/ja active Application Filing
- 2018-08-21 TW TW107129168A patent/TWI813582B/zh active
2023
- 2023-10-24 JP JP2023182491A patent/JP2024008947A/ja active Pending

Patent Citations (3)

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Publication number	Priority date	Publication date	Assignee	Title
CN1395602A (zh) *	2000-11-22	2003-02-05	三井化学株式会社	晶片机械加工粘结带及其制造和使用方法
JP2004122758A (ja) *	2002-07-26	2004-04-22	Nitto Denko Corp	多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP2015185591A (ja) *	2014-03-20	2015-10-22	日立化成株式会社	ウエハ加工用テープ

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Publication number	Priority date	Publication date	Assignee	Title
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Also Published As

Publication number	Publication date
JP7421339B2 (ja)	2024-01-24
JP2024008947A (ja)	2024-01-19
TWI813582B (zh)	2023-09-01
KR20230157537A (ko)	2023-11-16
KR20200045444A (ko)	2020-05-04
TW201912416A (zh)	2019-04-01
WO2019039253A1 (ja)	2019-02-28
JPWO2019039253A1 (ja)	2020-08-06

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2020-02-14	PB01	Publication
2020-02-14	PB01	Publication
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2020-03-10	SE01	Entry into force of request for substantive examination

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JP2002226610A (ja)	2002-08-14	離型用ポリプロピレンフィルム
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CN110800084A - 切割用基体膜 - Google Patents

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