CN110797271A - BGA chip rapid ball mounting method - Google Patents
BGA chip rapid ball mounting method Download PDFInfo
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- CN110797271A CN110797271A CN201911078107.7A CN201911078107A CN110797271A CN 110797271 A CN110797271 A CN 110797271A CN 201911078107 A CN201911078107 A CN 201911078107A CN 110797271 A CN110797271 A CN 110797271A
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- bga chip
- bga
- solder paste
- ball
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a BGA chip rapid ball mounting method in the technical field of BGA chip repair. The BGA chip rapid ball-planting method comprises an automatic glue dispenser and a hot air gun, wherein a solder paste is filled in a glue storage bin in the glue dispenser, and the BGA chip rapid ball-planting method further comprises the following steps: 1, calculating the volume value of the type of solder paste required to be used on a BGA chip bonding pad; 2, placing the BGA chip on a track of an automatic dispenser, setting a program on the automatic dispenser, and then operating the automatic dispenser to spot-coat a certain volume of solder paste on a bonding pad of the BGA chip; 3, heating the solder paste on the BGA chip bonding pad by a hot air gun, and thermally melting the solder paste on the BGA chip bonding pad into a spherical shape; and 4, cooling, cleaning and drying. The BGA chip rapid ball-planting method simplifies the BGA ball-planting repair process, improves the production efficiency, meets the requirements of different BGA chips on the sizes of the planted balls, and reduces the ball-planting repair cost.
Description
Technical Field
The invention relates to the technical field of BGA chip repair, in particular to a method for quickly mounting a ball on a BGA chip.
Background
With the increasing requirements of people on miniaturization, multiple functions and reliability of electronic products, the chip volume is smaller and smaller, the number of chip pins is increased, and the use of surface mount devices in the form of BGA (Ball Grid Array) is also increased. Because the chip pins are not distributed around the chip but on the bottom surface of the package, the pins led out from the four original surfaces of the substrate of the package shell are actually changed into Pb/Sn convex ball pins distributed in an area array, so that more I/O (input/output) numbers can be accommodated.
In order to solve the above problem, a utility model is disclosed in the prior art, the patent name is: the utility model provides a chip is reprocessed and is planted ball anchor clamps in batches, application number is: 201620644478.2. although the prior art improves the efficiency and success rate of ball mounting and reduces the cost of ball mounting by using an automatic batch ball mounting mode, the operation is still complex and the efficiency is low for a small amount of BGA chips.
Disclosure of Invention
The invention aims to provide a BGA chip rapid ball mounting method with high efficiency and low cost.
In order to achieve the purpose, the invention provides a BGA chip rapid ball-planting method which adopts the following technical scheme:
a BGA chip fast ball-planting method comprises an automatic glue dispenser and a hot air gun, wherein a glue storage bin in the glue dispenser is filled with solder paste, and the method also comprises the following steps:
s1: calculating the specific volume of the ball of the BGA chip according to the radius of the original ball of the BGA chip, and obtaining the volume value of the required type of solder paste on the bonding pad of the BGA chip according to the volume ratio of the metal content of the type of solder paste, wherein the required amount V of the solder paste is (4/3) pi rTin bead 3Theta; wherein θ: the volume of the metal content of the tin paste is proportional to the volume of the tin paste;
s2: placing the BGA chip on a track of an automatic dispenser, setting a program which corresponds to a pad array pattern on the BGA chip and dispenses a quantitative volume of solder paste on the automatic dispenser, and then operating the automatic dispenser to dispense the quantitative volume of solder paste on a pad of the BGA chip;
s3: heating the solder paste on the BGA chip bonding pad by using a hot air gun, and thermally melting the solder paste on the BGA chip bonding pad into a spherical shape;
s4: and after the BGA chip is cooled to the room temperature, cleaning and drying the BGA chip. The method simplifies the ball mounting operation process of the BGA chip, and the automatic glue dispenser is adopted and the glue dispensing program is utilized to control the volume and the array pattern of the solder paste, so that a special screen plate is not required to be manufactured, finished solder balls with various diameters are not required to be prepared, the cost is saved, and the ball mounting repair efficiency is greatly improved; furthermore, the solder paste is dispensed according to the volume required by the solder balls of the BGA chip, the height of the solder balls formed by the solder paste is basically consistent with that of the original device, the height of the solder balls of different BGA chips is realized, and the universality is high.
Further, the step S2 is preceded by removing the oxide layer and the contaminants on the surface of the BGA chip pad.
Further, in step S2, the BGA chip is fixedly mounted on a carrier plate, and then the carrier plate is placed on the track of the automatic dispenser. The BGA chip is positioned and fixed on the track of the automatic dispenser through the carrier plate.
Further, the support plate includes the base, the base be provided with automatic point gum machine track complex mounting hole, be provided with the platform of placing the BGA chip on the base, the platform is provided with anchor clamps all around.
Further, step S3 is preceded by inspecting the solder paste on each BGA pad for missing solder paste or bridging.
Further, after the step S4, the quality of the mounted ball needs to be further checked.
Compared with the prior art, the invention has the beneficial effects that: simplify BGA and plant the ball and reprocess the process, improve production efficiency, satisfy the demand of different BGA chips to the ball size moreover, reduce the cost of repairing of planting the ball.
Drawings
FIG. 1 is a schematic flow diagram of the present invention;
fig. 2 is a schematic structural diagram of a carrier.
Wherein, 1 base, 2 mounting holes, 3 platforms, 4 anchor clamps, 5BGA chips.
Detailed Description
The present invention is further illustrated by the following detailed description, which is to be construed as merely illustrative and not limitative of the remainder of the disclosure, and modifications and variations such as those ordinarily skilled in the art are intended to be included within the scope of the present invention as defined in the appended claims.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "vertical", "peripheral surface" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed when used, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or the element to which the present invention is directed must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the term "vertical" or the like does not imply that the components are required to be absolutely horizontal or overhanging, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In describing the invention, it is not necessary for a schematic representation of the above terminology to be directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples of the invention and features of different embodiments or examples described herein may be combined and combined by those skilled in the art without contradiction.
As shown in fig. 1-2, a BGA chip fast ball-planting method includes an automatic dispenser, a carrier plate and a hot air gun, wherein a solder paste is filled in a glue storage bin in the dispenser, the carrier plate includes a base 1, the base is provided with a mounting hole 2 matched with a track of the automatic dispenser, the base is provided with a platform 3 for placing a BGA chip, the platform is provided with a clamp 4 around, the clamp is used for clamping a BGA chip 5, and the method further includes the following steps:
s1: calculating the specific volume of the ball to be planted on the BGA chip according to the radius of the original solder ball of the BGA chip, and obtaining the volume value of the solder paste of the required type on the bonding pad of the BGA chip according to the volume ratio of the metal content of the solder paste of the required type, wherein the required solder paste amount V is (4/3) pi rTin bead 3Theta; wherein θ: the volume of the metal content of the tin paste is proportional to the volume of the tin paste;
s2: removing an oxide layer and pollutants on the surface of the BGA chip bonding pad;
s3: fixedly installing the BGA chip on a carrier plate, and then installing the carrier plate on an automatic dispenser track;
s4: writing a solder paste dispensing program for an automatic dispensing machine according to the corresponding pad array pattern on the BGA chip and the volume of the dispensed solder paste, and then operating an automatic dispenser to dispense the solder paste with a quantitative volume on the pad of the BGA chip;
s5: inspecting the solder paste on each BGA pad to see if there is solder paste missing or bridging;
s6: heating the solder paste on the BGA chip bonding pad by adopting a hot air gun of a hot air welding station, thermally melting the solder paste on the BGA chip bonding pad into a spherical shape, slowly moving the heated BGA chip from left to right in a heating mode in which the air outlet of the hot air gun is perpendicular to the bottom surface of the BGA chip line by line, and enabling the distance between the air outlet of the hot air gun and the bottom surface of the BGA chip to be between 10 and 20 mm;
s7: after the BGA chip is cooled to room temperature, cleaning and drying the BGA chip;
s8: checking the ball mounting quality;
s9: and finishing ball planting.
Example 1:
a domestic BGA chip has a bottom ball grid array of 51 × 51, a tin ball diameter of 0.6mm and a spacing of 1mm, and needs to be replanted with balls due to repair.
1. Calculating the required solder paste amount V (4/3) pi r for ball mounting of BGA chipTin bead 3/θ＝0.2828mm3(ii) a In the formula: r isTin beadThe volume ratio of theta to the metal content of the tin paste is 0.4; calculating the required ball-planting volume of the BGA chip to be 0.2828mm according to the content3Writing a solder paste spot coating program according to the ball grid array of 51 multiplied by 51;
2. placing the BGA chip on a platform of a carrier plate, fixing the BGA chip by using a carrier plate clamp, then placing the carrier plate on a track of an automatic dispenser, and fixing the carrier plate by using a carrier plate mounting hole; then operating the automatic dispenser to dispense solder paste, selecting the diameter of a dispensing needle tube of the automatic dispenser to be 0.7mm, and dispensing 0.2828mm on a bonding pad of the BGA chip3The solder paste of (1); checking the quantity of the tin paste on each BGA bonding pad, whether the tin paste is deficient or not or bridging exists, and after no error is detected, heating by adopting a hot air gun of a hot air welding table, wherein the tin paste on the BGA bonding pad is in a spherical shape due to the surface tension of the molten tin paste; cooling the BGA chip to room temperature, and then cleaning and drying the BGA chip;
3. actually measuring: the diameter of the tin ball of the BGA chip after ball planting is phi 0.60 +/-0.03 mm, and the requirement of repairing the BGA chip on ball planting welding is met.
Example 2:
a BGA chip, the bottom ball grid array is 16 x 16, the diameter phi of tin ball is 0.5mm, the interval is 0.8mm, because repair, need to plant the ball again.
1. Calculating the required solder paste amount V (4/3) pi r for ball mounting of BGA chip Tin bead3/θ＝0.1636mm3(ii) a In the formula: r isTin bead0.25mm, theta is the type of solder paste usedThe volume ratio of the metal content is 0.4; the required ball-planting volume of the BGA chip is calculated to be 0.1636mm according to the content3Writing a solder paste spot coating program according to the ball grid array of 16 multiplied by 16;
2. removing an oxide layer and pollutants on the surface of the bonding pad of the BGA chip, and then positioning and fixing the BGA chip on a track of an automatic dispenser; then operating the automatic dispenser to dispense solder paste, selecting the diameter of a dispensing needle tube of the automatic dispenser to be 0.6mm, and dispensing 0.1636mm on a bonding pad of the BGA chip3The solder paste of (1); inspecting the solder paste on each BGA bonding pad, and if the solder paste is not defective or bridged, heating by using a hot air gun after the solder paste is inspected to be free from errors, and forming the solder paste on the BGA bonding pad into a spherical shape; cooling the BGA chip to room temperature, and then cleaning and drying the BGA chip;
3. actually measuring: the diameter of the tin ball of the BGA chip after ball planting is phi 0.50 +/-0.03 mm, and the requirement of repairing the BGA chip on ball planting welding is met.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (7)
1. A BGA chip fast ball-planting method is characterized in that: including automatic point gum machine and hot-blast rifle, be equipped with the solder paste in the storage storehouse of gluing in the point gum machine, still include the following step:
s1: calculating the specific volume of the ball of the BGA chip according to the radius of the original ball of the BGA chip, and then obtaining the volume value of the solder paste of the required model on the bonding pad of the BGA chip according to the volume ratio of the metal content of the solder paste of the used model;
s2: placing the BGA chip on a track of an automatic dispenser, setting a program which corresponds to a pad array pattern on the BGA chip and dispenses a quantitative volume of solder paste on the automatic dispenser, and then operating the automatic dispenser to dispense the quantitative volume of solder paste on a pad of the BGA chip;
s3: heating the solder paste on the BGA chip bonding pad by using a hot air gun, and thermally melting the solder paste on the BGA chip bonding pad into a spherical shape;
s4: and cleaning and drying the BGA chip after the BGA chip is cooled.
2. The BGA chip rapid ball mounting method of claim 1, wherein: the step S2 is preceded by removing the oxide layer and the contaminants on the surface of the BGA chip pad.
3. The BGA chip rapid ball mounting method of claim 2, wherein: in the step S2, the BGA chip is fixedly mounted on a carrier plate, and then the carrier plate is placed on the track of the automatic dispenser.
4. The BGA chip rapid ball mounting method of claim 3, wherein: the support plate comprises a base, the base is provided with a mounting hole matched with the automatic glue dispenser track, a platform for placing BGA chips is arranged on the base, and clamps are arranged on the periphery of the platform.
5. The BGA chip rapid ball mounting method of claim 2, wherein: the step S3 is preceded by inspecting each solder paste on the BGA pads for missing solder paste or bridging.
6. The BGA chip rapid ball mounting method of claim 2, wherein: in the step S3, the distance from the air outlet of the heat gun to the bottom surface of the BGA chip is between 10mm and 20 mm.
7. The BGA chip rapid ball mounting method of claim 2, wherein: after the step S4, the quality of the mounted ball needs to be further checked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911078107.7A CN110797271A (en) | 2019-11-06 | 2019-11-06 | BGA chip rapid ball mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911078107.7A CN110797271A (en) | 2019-11-06 | 2019-11-06 | BGA chip rapid ball mounting method |
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| CN110797271A true CN110797271A (en) | 2020-02-14 |
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| CN201911078107.7A Pending CN110797271A (en) | 2019-11-06 | 2019-11-06 | BGA chip rapid ball mounting method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114192925A (en) * | 2022-02-15 | 2022-03-18 | 南通中铁华宇电气有限公司 | Automatic tin device that brushes of core solder joint based on visual positioning |
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| JPS62257750A (en) * | 1986-04-30 | 1987-11-10 | Fujitsu Ltd | Forming method for bump electrode |
| US20020084315A1 (en) * | 1997-05-27 | 2002-07-04 | Mackay John | Ball bumping substrates, particuarly wafers |
| CN101604812A (en) * | 2009-03-05 | 2009-12-16 | 苏州万旭电子元件有限公司 | Point gum machine and control method thereof |
| CN102006731A (en) * | 2010-12-06 | 2011-04-06 | 国营红峰机械厂 | Method for determining tin-soldering paste amount of glue dispenser on pads |
| CN103855041A (en) * | 2012-12-06 | 2014-06-11 | 北京普源精电科技有限公司 | Chip reballing device and method |
| CN106098575A (en) * | 2016-06-23 | 2016-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
| CN109148306A (en) * | 2018-09-04 | 2019-01-04 | 深圳市诚朗科技有限公司 | A kind of Rework Technics of BGA Package component |
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2019
- 2019-11-06 CN CN201911078107.7A patent/CN110797271A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62257750A (en) * | 1986-04-30 | 1987-11-10 | Fujitsu Ltd | Forming method for bump electrode |
| US20020084315A1 (en) * | 1997-05-27 | 2002-07-04 | Mackay John | Ball bumping substrates, particuarly wafers |
| CN101604812A (en) * | 2009-03-05 | 2009-12-16 | 苏州万旭电子元件有限公司 | Point gum machine and control method thereof |
| CN102006731A (en) * | 2010-12-06 | 2011-04-06 | 国营红峰机械厂 | Method for determining tin-soldering paste amount of glue dispenser on pads |
| CN103855041A (en) * | 2012-12-06 | 2014-06-11 | 北京普源精电科技有限公司 | Chip reballing device and method |
| CN106098575A (en) * | 2016-06-23 | 2016-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
| CN109148306A (en) * | 2018-09-04 | 2019-01-04 | 深圳市诚朗科技有限公司 | A kind of Rework Technics of BGA Package component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114192925A (en) * | 2022-02-15 | 2022-03-18 | 南通中铁华宇电气有限公司 | Automatic tin device that brushes of core solder joint based on visual positioning |
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Application publication date: 20200214 |
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