CN102006731A - Method for determining tin-soldering paste amount of glue dispenser on pads - Google Patents
Method for determining tin-soldering paste amount of glue dispenser on pads Download PDFInfo
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- CN102006731A CN102006731A CN 201010573803 CN201010573803A CN102006731A CN 102006731 A CN102006731 A CN 102006731A CN 201010573803 CN201010573803 CN 201010573803 CN 201010573803 A CN201010573803 A CN 201010573803A CN 102006731 A CN102006731 A CN 102006731A
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Abstract
The invention relates to a method for determining the tin-soldering paste amount of a glue dispenser on pads, which is characterized by comprising the following steps of: firstly, estimating the total tin-soldering paste amount Y on the pads; and secondly, respectively determining tin-soldering point number n on the pads and the tin paste weight m of each soldering point according to different pad areas, and then determining the values of n and m when the areas x of the pads are greater than 1mm<2> and not greater than 2 mm<2> or greater than 2 mm<2> according to different situations that the pads are pads of resistors and other lower devices or the pads of capacitors and other higher devices. The method has the advantages that with the provided spot-coating parameters, the bad phenomenon of welding can be effectively reduced, and favorable welding reliability can be ensured.
Description
Technical field
The invention belongs to surface installation technique (SMT) field, be specifically related to a kind of definite point gum machine is coated with amount of solder paste on pad method.
Background technology
Along with the requirement of development of electronic technology and electronic product high reliability, increasing Surface Mount components and parts (SMC/SMD) are extensive use of in type product, and surface installation technique (SMT) also arises at the historic moment.The SMT circuit assembly comprises operations such as preliminary treatment, tin cream coating, paster, the reflow welding before the dress weldering connects, and the setting of each procedure technology parameter and the control of critical process have determined the welding quality of product.
The use of surface mounting component has limited traditional manual welding method.Because the too high phenomenons such as surface mounting component pin breakage that cause easily of local temperature.In the product development process, printed board is changed comparatively frequent, adopts the mode welding of silk screen printing directly to cause cost too high.Point gum machine is the equipment that is used for the spot printing colloid, the function of point gum machine is expanded, make its function that possesses the spot printing solder(ing) paste, satisfied the development model on the one hand and changed frequent, cost-effective requirement, avoided on the other hand because the problem of the aspects such as device failure that manual welding causes.But for the quantity that in spot printing solder(ing) paste process, how accurately to be coated with solder(ing) paste, neither one reasonable approach comparatively all always, to such an extent as to often occur producing cavity, solder joint crackle, skew, perpendicular upright stone tablet in the spot printing solder(ing) paste process, fall phenomenons such as part, bridging, soldered ball and tin sweat(ing), cause the success rate of Surface Mount production welding not high, even cause device to reprocess.
Summary of the invention
The present invention is directed to the problem that the tin cream use amount of point gum machine in spot printing solder(ing) paste process can't accurately be determined, proposed a kind of definite point gum machine is coated with amount of solder paste on pad method.
For solving the problems of the technologies described above, technical scheme of the present invention is:
A kind of definite point gum machine is coated with the method for amount of solder paste on pad, it is characterized in that, comprises following steps:
The first step is estimated solder(ing) paste total amount Y on the pad earlier, tries to achieve according to following formula:
Y=0.06541x
5-1.6465?x
4+13.6382x
3-44.6417x2+83.0335x?-26.206
Wherein: Y: the amount of spot printing tin cream, the mg of unit,
X: the area of pad, the mm2 of unit, span is 1 mm2--20 mm2;
Second step, according to different bonding pad areas, determine the count tin cream weight m of n and each solder joint of scolding tin on the pad respectively, Y=mn then, pad size is: x=AB, A≤B wherein, A is the pad minor face, B is the long limit of pad,
1, when bonding pad area 1 mm2＜x≤2 mm2, determine the numerical value of n earlier, determine the numerical value of m again, promptly
N ≈ B/A rounds again,
N≤5 o'clock need to satisfy m=Y/n≤40 simultaneously,
N 〉=5, then n gets 5, determines m again;
2, when bonding pad area x＞2 mm2,
(1) if the pad of other low devices such as resistance suitably reduces tin cream consumption 10%--20%,
Get m=15 or 20, n ≈ Y/m rounds again,
(2) if the pad of other higher devices such as electric capacity,
Y=m1n1+m2n2, n1=n2+1 wherein,
This moment, m1 got 15 or 20, and m2 gets 10.
One of preferably, the value of the weight m of described single-point spot printing is 0.7,1,2.5,4,5,7,10,12,15,20,25,40.
The invention has the beneficial effects as follows that the spot printing parameter that provides can effectively reduce the failure welding phenomenon, and can guarantee good soldering reliability.
Specific embodiment
When the point gum machine that uses model as Asymtek D-585 carried out operation to printed board spot printing tin cream, we choose following embodiment, and the present invention is described further:
1, first embodiment, pad size are 1.1 * 1.1P,
This moment bonding pad area 1 mm2＜x≤2 mm2,
As calculated, Y=29.7,
N=B/A=1, m selects immediate value 25 in preferred value, and then the soldering paste of direct spot printing 25mg gets final product on pad.
2, second embodiment, pad size are 1.0 * 3.0P
The first step: estimation Y value, by calculating Y=72
(1) if high device as electric capacity, can be selected this value, desirable 70, at this moment
Y=m1·n1?+?m2·n2，
N1=n2+1 wherein, this moment, m1 got 15 or 20, and m2 gets 10, when
A) m1 gets 15, and m2 gets 10
70=15(n2+1)+and 10n2, get n2 ≈ 2, n1=3
Promptly on pad, put the point of 3 15mg and 2 10mg.
B) m1 gets 20, and m2 gets 10
70=20(n2+1)+and 10n2, then the n2 value is unreasonable, casts out.
(2) if low device such as resistance then suitably reduces the tin cream amount, value is 60,
If m gets 15, n=4 then, can be on pad the point of 4 15mg of point.
If m gets 20, n=3 then, can be on pad the point of 3 20mg of point.
Explanation is at last, above specific embodiment is unrestricted in order to technical scheme of the present invention to be described, although describe the present invention with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not breaking away from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (2)
1. a definite point gum machine is coated with the method for amount of solder paste on pad, it is characterized in that, comprises following steps:
The first step is estimated solder(ing) paste total amount Y on the pad earlier, tries to achieve according to following formula:
Y=0.06541x
5-1.6465?x
4+13.6382x
3-44.6417x2+83.0335x?-26.206
Wherein: Y: the amount of spot printing tin cream, the mg of unit,
X: the area of pad, the mm2 of unit, span is 1 mm2--20 mm2;
Second step, according to different bonding pad areas, determine the count tin cream weight m of n and each solder joint of scolding tin on the pad respectively, Y=mn then, pad size is: x=AB, A≤B wherein, A is the pad minor face, B is the long limit of pad,
1, when bonding pad area 1 mm2＜x≤2 mm2, determine the numerical value of n earlier, determine the numerical value of m again, promptly
N ≈ B/A rounds again,
N≤5 o'clock need to satisfy m=Y/n≤40 simultaneously,
N 〉=5, then n gets 5, determines m again;
2, when bonding pad area x＞2 mm2,
(1) if the pad of other low devices such as resistance suitably reduces tin cream consumption 10%-20%,
Get m=15 or 20, n ≈ Y/m rounds again,
(2) if the pad of other higher devices such as electric capacity,
Y=m1n1+m2n2, n1=n2+1 wherein,
This moment, m1 got 15 or 20, and m2 gets 10.
One of 2. a kind of definite point gum machine according to claim 1 is coated with the method for amount of solder paste on pad, it is characterized in that, the value of the weight m of described single-point spot printing is 0.7,1,2.5,4,5,7,10,12,15,20,25,40.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105738038A CN102006731B (en) | 2010-12-06 | 2010-12-06 | Method for determining tin-soldering paste amount of glue dispenser on pads |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105738038A CN102006731B (en) | 2010-12-06 | 2010-12-06 | Method for determining tin-soldering paste amount of glue dispenser on pads |
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| Publication Number | Publication Date |
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| CN102006731A true CN102006731A (en) | 2011-04-06 |
| CN102006731B CN102006731B (en) | 2012-07-04 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105979719A (en) * | 2016-06-20 | 2016-09-28 | 努比亚技术有限公司 | Welding method for printed circuit board |
| TWI682294B (en) * | 2018-09-12 | 2020-01-11 | 台達電子工業股份有限公司 | Soldering process parameters suggestion method |
| CN110797271A (en) * | 2019-11-06 | 2020-02-14 | 扬州万方电子技术有限责任公司 | BGA chip rapid ball mounting method |
| CN114918505A (en) * | 2022-04-29 | 2022-08-19 | 中国电子科技集团公司第三十八研究所 | Solder paste spot coating method of electric connector |
| US11599803B2 (en) | 2018-09-12 | 2023-03-07 | Delta Electronics, Inc. | Soldering process parameter suggestion method and system thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101604812A (en) * | 2009-03-05 | 2009-12-16 | 苏州万旭电子元件有限公司 | Point gum machine and control method thereof |
| CN101661004A (en) * | 2009-07-21 | 2010-03-03 | 湖南大学 | Visible detection method of welding quality of circuit board based on support vector machine |
-
2010
- 2010-12-06 CN CN2010105738038A patent/CN102006731B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101604812A (en) * | 2009-03-05 | 2009-12-16 | 苏州万旭电子元件有限公司 | Point gum machine and control method thereof |
| CN101661004A (en) * | 2009-07-21 | 2010-03-03 | 湖南大学 | Visible detection method of welding quality of circuit board based on support vector machine |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105979719A (en) * | 2016-06-20 | 2016-09-28 | 努比亚技术有限公司 | Welding method for printed circuit board |
| TWI682294B (en) * | 2018-09-12 | 2020-01-11 | 台達電子工業股份有限公司 | Soldering process parameters suggestion method |
| US11599803B2 (en) | 2018-09-12 | 2023-03-07 | Delta Electronics, Inc. | Soldering process parameter suggestion method and system thereof |
| CN110797271A (en) * | 2019-11-06 | 2020-02-14 | 扬州万方电子技术有限责任公司 | BGA chip rapid ball mounting method |
| CN114918505A (en) * | 2022-04-29 | 2022-08-19 | 中国电子科技集团公司第三十八研究所 | Solder paste spot coating method of electric connector |
| CN114918505B (en) * | 2022-04-29 | 2023-07-04 | 中国电子科技集团公司第三十八研究所 | Solder paste spot coating method of electric connector |
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| CN102006731B (en) | 2012-07-04 |
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Owner name: HUBEI SANJIANG AEROSPACE HONGFENG CONTROL CO., LTD Free format text: FORMER NAME: STATE HONGFENG MACHINERY FACTORY |
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Address after: 432000 Hubei city of Xiaogan province Beijing Road No. 8 gate Patentee after: Hubei Sanjiang Aerospace Hongfeng Control Co., Ltd. Address before: 432000 Hubei city of Xiaogan province Beijing Road No. 8 gate Patentee before: State Hongfeng Machinery Factory |