CN109148306A - A kind of Rework Technics of BGA Package component - Google Patents
A kind of Rework Technics of BGA Package component Download PDFInfo
- Publication number
- CN109148306A CN109148306A CN201811022190.1A CN201811022190A CN109148306A CN 109148306 A CN109148306 A CN 109148306A CN 201811022190 A CN201811022190 A CN 201811022190A CN 109148306 A CN109148306 A CN 109148306A
- Authority
- CN
- China
- Prior art keywords
- bga package
- package component
- pad
- glass plate
- tin cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000006071 cream Substances 0.000 claims abstract description 64
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000003854 Surface Print Methods 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000007791 dehumidification Methods 0.000 claims 2
- 238000011282 treatment Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000155 melt Substances 0.000 description 6
- 230000035939 shock Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses a kind of Rework Technics of BGA Package component, at least include the following steps: by wait reprocess plant ball BGA Package component have pad carry out on one side cleaning and it is smooth, and be inverted BGA Package component, make BGA Package component that there is the one side of pad upward；It is identical as the layout of the pad of BGA Package component in the layout of the surface printing tin cream of quartz glass plate, tin cream, and by quartz glass plate be printed with tin cream one down；Tin cream on quartz glass plate is aligned with the pad locations of BGA Package component；Heating is carried out to quartz glass plate until tin cream is melted and is adhered on the pad of BGA Package component, is cooled and shaped later.Rework Technics provided by the invention no longer need tin ball to carry out planting ball exercise work, and the function and effect that tin ball can be realized on pad are adhered to using the tin cream of fusing, reduce costs and reprocess efficiency with complex procedures degree, raising.
Description
Technical field
The present invention relates to technical field of semiconductors more particularly to a kind of Rework Technics of BGA Package component.
Background technique
With the development and extensive use of the BGA Package component package of ball grid array structure, will become highly dense
Degree, high-performance, multi-functional encapsulation optimal selection.Due to the special packing forms of BGA Package component, solder joint is located at
Package bottom and be tin ball hemispherical, in the welding process, tin club and tin cream fuse into one, by packaging body and
Pcb board pad connects together, but if welding appearance is bad, then needs to be disassembled to reprocess, the ball grid array envelope after disassembly
Dress component tin club is removed by pcb board, leaves solder joint not of uniform size, therefore, thinks secondary use BGA Package member device
Part must just carry out it planting ball processing, that is, scolding tin is added on solder joint again, keep the ball size on solder joint consistent.
And operating procedure in ball-establishing method is more, and the production cycle is long for current reprocessing, and high production cost, dedicated plant ball chuck tool is high
Expensive, low efficiency is merely able to carry out one single chip operation every time.
Summary of the invention
In view of this, the present invention provides a kind of BGA Package components for reducing cost and reducing complex procedures degree
Rework Technics.
The technological means that the present invention uses is as follows:
A kind of Rework Technics of BGA Package component, at least include the following steps:
By wait reprocess plant that the BGA Package component of ball has a pad carry out cleaning and smooth on one side, and by ball bar
Array package component is inverted, and BGA Package component is made to have the one side of pad upward；
In the surface printing tin cream of quartz glass plate, the layout and the weldering of the BGA Package component of the tin cream
The layout of disk is identical, and by quartz glass plate be printed with tin cream one down；
Tin cream on quartz glass plate is aligned with the pad locations of BGA Package component；
Heating is carried out to quartz glass plate until tin cream is melted and is adhered on the pad of BGA Package component, it
After be cooled and shaped.
In the Rework Technics of BGA Package component (BGA) provided by the invention, it is no longer necessary to which tin ball carries out plant ball
Operation, being adhered on BGA Package component pad using the tin cream of the fusing on quartz glass plate can be realized tin ball
Function and effect reduce costs and reprocess efficiency with complex procedures degree, raising；And quartz glass plate need to only be added when heating
The tin cream of heat, the fusing on quartz glass plate can be adhered on BGA Package component pad, no longer directly be directed at ball bar
Array package component is heated, and repeatedly thermal shock of the Rework Technics to BGA Package component is greatly reduced, and is prevented
Only to the secondary damage of BGA Package component；And the quartz glass plate used be it is transparent, human eye is easy to check
Whether it is aligned, it may not be necessary to which accurate tool is just able to carry out alignment, easy to operate.
Detailed description of the invention
Fig. 1 to Fig. 9 is each step of Rework Technics of BGA Package component provided in the embodiment of the present invention
Rapid schematic diagram.
Specific embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
The technological means that the present invention uses is as follows:
A kind of Rework Technics of BGA Package component 10, at least include the following steps:
By wait reprocess plant ball BGA Package component 10 have pad 11 carry out on one side cleaning and it is smooth, and will
BGA Package component 10 is inverted, and BGA Package component 10 is made to have the one side of pad 11 upward；
In the surface printing tin cream 21 of quartz glass plate 20, the layout of the tin cream 21 and the BGA Package member device
The layout of the pad 11 of part is identical, and by quartz glass plate 20 be printed with tin cream 21 one down；
By 11 position alignment of pad of tin cream 21 and BGA Package component 10 on quartz glass plate 20；
Heating is carried out to quartz glass plate 20 until tin cream 21 melts and is adhered to the weldering of BGA Package component 10
On disk 11, it is cooled and shaped later.
In the Rework Technics of BGA Package component 10 provided by the invention, it is no longer necessary to which tin ball carries out plant ball exercise
Make, being adhered on 10 pad 11 of BGA Package component using the tin cream 21 of the fusing on quartz glass plate 20 can be realized
The function and effect of tin ball reduce costs and reprocess efficiency with complex procedures degree, raising；And it only need to be to quartzy glass when heating
Glass plate 20 heats, and the tin cream 21 of the fusing on quartz glass plate 20 can be adhered on 10 pad 11 of BGA Package component,
No longer directly alignment BGA Package component 10 is heated, and greatly reduces Rework Technics to BGA Package member device
The thermal shock repeatedly of part 10, prevents the secondary damage to BGA Package component 10；And the quartz glass plate 20 used
Be it is transparent, human eye is easy to check whether alignment, it may not be necessary to which accurate tool is just able to carry out alignment, easy to operate.
Specifically, a kind of Rework Technics of BGA Package component 10 provided by the invention, specifically include following step
It is rapid:
S1, by wait reprocess plant ball BGA Package component 10 have pad 11 carry out on one side cleaning and it is smooth,
And be inverted BGA Package component 10, make BGA Package component 10 that there is the one side of pad 11 upward.
Specifically, as shown in Figure 1, in this step, after the dismounting of BGA Package component 10, with pad 11
One side still remain the tin ball of part tin ball or incompleteness, need to clean up in incomplete tin ball and 11 table of clean and tidy pad
Face, so that 11 surfacing of pad is clean.When specific operation, one layer is first brushed on the pad 11 of BGA Package component 10
Weld-aiding cream, then remaining tin ball on pad 11 is wiped off with cutter head soldering iron, brushing one layer of weld-aiding cream is to become easy remaining tin ball
Removing, does not injure pad 11；Or 11 surface of pad can also be added using hot air convection either warm table can be used
Then scolding tin after hot melt is siphoned away with tin sucking gun, is then inverted BGA Package component 10, seals ball grid array by heat
Fill one side of the component 10 with pad 11 upward, as shown in Figure 2.
S2, the surface printing tin cream 21 in quartz glass plate 20, the layout and the BGA Package of the tin cream 21
The layout of the pad 11 of component is identical, and by quartz glass plate 20 be printed with tin cream 21 one down.
Specifically, as shown in figure 3, first silk-screen mold is placed on the surface of quartz glass plate 20, then when printing in silk
Stamp has upper print solder paste 21, removes silk-screen mold, the pad with BGA Package component 10 is provided on silk-screen mold
The corresponding through-hole of solder joint on 11, the size phase of the size of the tin cream 21 and the pad 11 of the BGA Package component
Together, tin cream can be thus printed on the corresponding position of each solder joint of the pad 11 of BGA Package component
21.The present invention can use silk-screen mold print solder paste 21, can also using be provided with with BGA Package component 10
Pad 11 on the steel mesh of the corresponding through-hole of solder joint tin cream is filled on silk-screen mold using common process print solder paste 21
21, and pass through the doctor blade tin cream 21 of printing machine, guarantee that each through-hole is filled with tin cream 21, then by extra tin cream
21 scrape, flat surface.Then the quartz glass plate 20 of the tin cream of printing 21 is inverted, makes to be printed with the one of tin cream 21 and faces
Under, as shown in Figure 4.
S3, by quartz glass plate 20 tin cream 21 and BGA Package component 10 11 position alignment of pad.
Specifically, as shown in figure 5, in the present invention since quartz glass plate 20 is transparent, so this step is aligned
It is easy to operate, is also easy to check the effect of alignment, directly with the naked eye can be aligned and check, directly pass through transparent institute
State quartz glass plate 20 by tin cream 21 respectively with the bond pad locations on the pad 11 of the BGA Package component 10 one by one
Alignment, it is easy to operate, and do not need accurate tool and be aligned.
In addition, it in the present invention, can also be aligned by precisely operating, laser can be used the quartz glass
Tin cream 21 on plate 20 is aligned with 11 position of pad of BGA Package component 10, is included the following steps, such as Fig. 6 institute
To show, the spot area on the pad 11 of the BGA Package component 10 marks at least three first mark points 31,
At least three first mark points 31 are not point-blank；As shown in fig. 7, on the quartz glass plate 20 with it is described
The corresponding position mark of first mark point 31 goes out the second mark point 32, first mark point 31 and second mark point 32
Quantity it is identical, second mark point 32 on the quartz glass plate 20 is passed perpendicularly through using laser, when laser falls in institute
Tin cream when stating first mark point 31 on the pad 11 of BGA Package component 10, on the quartz glass plate 20
21 can be aligned one by one with the bond pad locations on the pad 11 of the BGA Package component 10, and first label
Point 31 is located at the blank space of the spot area on the pad 11 of the BGA Package component 10, corresponding second mark point
32 also on the position that tin cream 21 prints, but on the gap between tin cream 21 and tin cream 21, avoids laser irradiation
When shelter from laser.In accurate alignment function of the invention, using 3 non-colinear laser alignment methods, in quartz glass plate 20
It is corresponding on the upper and pad 11 of BGA Package component 10 to mark at least three non-colinear laser points respectively, lead to
Laser is crossed to be automatically aligned to, it can be accurately by the tin cream 21 and the BGA Package component 10 on quartz glass plate 20
Bond pad locations on pad 11 are aligned one by one, greatly reduce error.
S4, heating is carried out to quartz glass plate 20 until tin cream 21 melts and is adhered to BGA Package component 10
On pad 11, it is cooled and shaped later.
Specifically, as shown in figure 8, can be added using hot wind or warm table to quartz glass plate 20 in this step
Heat.The present invention directly can heat quartz glass plate 20 using conventional hot wind or warm table, until quartz glass
The tin cream 21 of plate 20 melts, and after the tin cream 21 on quartz plate melts, when touching BGA Package 10 pad 11 of component, melts
The tin cream 21 of change is just adhered on 10 pad 11 of BGA Package component, after wherein tin cream 21 melts, due to gravity,
It will form molten metal drop, simultaneously because both glass/pads 11 are different to the adhesive force of tin melt, drop can be dripped simultaneously
It is adhered on the pad 11 of BGA Package component 10, forms the tin of approximate sphericity on BGA Package component 10
Liquid keeps the state of approximate sphericity, is formed tin ball after cooling, as shown in figure 9, melting in this step since tin cream 21 is undergone
And the tin ball of approximate sphericity is ultimately formed after cooling down, in this way it is no longer necessary to tin ball is used in Rework Technics, using on quartz plate
The tin cream 21 of fusing is adhered on 10 pad 11 of BGA Package component and can use as tin ball, this reduces at
Sheet and complex procedures degree.And in above-mentioned heating stepses, when heating to quartz glass plate 20, hot wind or heat radiation are no longer straight
Alignment 10 element of BGA Package component is connect, and quartz plate need to only be heated, greatly reduces to reprocess and plants ball technique to ball
The thermal shock repeatedly of 10 component of grid array package component, reduces the damage to 10 component of BGA Package component
Wound.
In addition, in above-mentioned heating stepses, the quartz glass plate 20 can be directed through using microwave-infrared line
Tin cream 21 is heated, precisely quartz glass plate 20 is heated, heat source is controllable.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the present invention.
Claims (10)
1. a kind of Rework Technics of BGA Package component, which is characterized in that at least include the following steps:
By wait reprocess plant that the BGA Package component of ball has a pad carry out cleaning and smooth on one side, and by ball grid array
It encapsulates component to be inverted, makes BGA Package component that there is the one side of pad upward；
In the surface printing tin cream of quartz glass plate, layout and the pad of the BGA Package component of the tin cream
Be laid out it is identical, and by quartz glass plate be printed with tin cream one down；
Tin cream on quartz glass plate is aligned with the pad locations of BGA Package component；
Heating is carried out to quartz glass plate until tin cream is melted and is adhered on the pad of BGA Package component, Zhi Houleng
But it forms.
2. the Rework Technics of BGA Package component according to claim 1, which is characterized in that it is described will be wait return
The bottom for repairing the BGA Package component of plant ball carries out in cleaning and smooth step, first in BGA Package component
Pad on brush one layer of weld-aiding cream, then wipe remaining tin ball on pad off with cutter head soldering iron.
3. the Rework Technics of BGA Package component according to claim 1, which is characterized in that in the quartzy glass
In the step of surface printing tin cream of glass plate, first silk-screen mold is placed on the surface of quartz glass plate, then in silk-screen mold
Upper print solder paste removes silk-screen mold, is provided on silk-screen mold and the solder joint pair on the pad of BGA Package component
The through-hole answered, the size of the tin cream are identical as the size of pad of the BGA Package component.
4. the Rework Technics of BGA Package component according to claim 3, which is characterized in that in the quartzy glass
Before the step of surface printing tin cream of glass plate, baking dehumidification treatments first are carried out to quartz glass plate, are using temperature control precision
± 1 DEG C of air dry oven carries out the dehumidification treatments of 125 DEG C, 1~3h to quartz glass plate.
5. the Rework Technics of BGA Package component according to claim 1, which is characterized in that the quartz glass
Plate has the surface of flat transparent.
6. the Rework Technics of BGA Package component according to claim 1, which is characterized in that it is described will be quartzy
In the step of tin cream on glass plate is aligned with the pad locations of BGA Package component, pass through the transparent quartzy glass
Tin cream is aligned with the bond pad locations on the pad of the BGA Package component by glass plate one by one respectively.
7. the Rework Technics of BGA Package component according to claim 6, which is characterized in that use laser by institute
The tin cream stated on quartz glass plate is aligned with the pad locations of BGA Package component, is included the following steps, in institute
It states the spot area on the pad of BGA Package component and marks at least three first mark points, at least three described
Not point-blank, the position mark corresponding with first mark point on the quartz glass plate goes out one mark point
Second mark point, first mark point is identical as the quantity of second mark point, passes perpendicularly through the quartz using laser
Second mark point on glass plate, when first mark on the pad that laser falls in the BGA Package component
When note point, the tin cream on the quartz glass plate and the bond pad locations on the pad of the BGA Package component can one
One alignment.
8. the Rework Technics of BGA Package component according to claim 7, which is characterized in that first label
Point is located at the blank space of the spot area on the pad of the BGA Package component.
9. the Rework Technics of BGA Package component according to claim 1, which is characterized in that using hot wind or
Warm table heats quartz glass plate.
10. the Rework Technics of BGA Package component according to claim 1, which is characterized in that red using microwave
Outside line is directed through the quartz glass plate and heats to tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811022190.1A CN109148306A (en) | 2018-09-04 | 2018-09-04 | A kind of Rework Technics of BGA Package component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811022190.1A CN109148306A (en) | 2018-09-04 | 2018-09-04 | A kind of Rework Technics of BGA Package component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109148306A true CN109148306A (en) | 2019-01-04 |
Family
ID=64826403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811022190.1A Withdrawn CN109148306A (en) | 2018-09-04 | 2018-09-04 | A kind of Rework Technics of BGA Package component |
Country Status (1)
| Country | Link |
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| CN (1) | CN109148306A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797271A (en) * | 2019-11-06 | 2020-02-14 | 扬州万方电子技术有限责任公司 | BGA chip rapid ball mounting method |
| CN112296469A (en) * | 2020-11-16 | 2021-02-02 | 东莞市诚鸿电子科技有限公司 | IC ball mounting process and solder paste |
| CN112378716A (en) * | 2020-09-30 | 2021-02-19 | 中国电子科技集团公司第十三研究所 | Sample preparation method for solderability test of CBGA device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2641823Y (en) * | 2003-08-22 | 2004-09-15 | 威盛电子股份有限公司 | Convex block transferring clamp |
| US20060027632A1 (en) * | 1999-09-02 | 2006-02-09 | Salman Akram | Method for forming metal contacts on a substrate |
| CN104425294A (en) * | 2013-08-23 | 2015-03-18 | 南茂科技股份有限公司 | Ball planting device and ball planting method thereof |
| CN105101668A (en) * | 2015-07-21 | 2015-11-25 | 中国航天科工集团第三研究院第八三五七研究所 | Rapid repairing method for superdense-pitch quad fiat no-lead (QFN) device on printed board assembly |
| CN106098575A (en) * | 2016-06-23 | 2016-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
-
2018
- 2018-09-04 CN CN201811022190.1A patent/CN109148306A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060027632A1 (en) * | 1999-09-02 | 2006-02-09 | Salman Akram | Method for forming metal contacts on a substrate |
| CN2641823Y (en) * | 2003-08-22 | 2004-09-15 | 威盛电子股份有限公司 | Convex block transferring clamp |
| CN104425294A (en) * | 2013-08-23 | 2015-03-18 | 南茂科技股份有限公司 | Ball planting device and ball planting method thereof |
| CN105101668A (en) * | 2015-07-21 | 2015-11-25 | 中国航天科工集团第三研究院第八三五七研究所 | Rapid repairing method for superdense-pitch quad fiat no-lead (QFN) device on printed board assembly |
| CN106098575A (en) * | 2016-06-23 | 2016-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797271A (en) * | 2019-11-06 | 2020-02-14 | 扬州万方电子技术有限责任公司 | BGA chip rapid ball mounting method |
| CN112378716A (en) * | 2020-09-30 | 2021-02-19 | 中国电子科技集团公司第十三研究所 | Sample preparation method for solderability test of CBGA device |
| CN112296469A (en) * | 2020-11-16 | 2021-02-02 | 东莞市诚鸿电子科技有限公司 | IC ball mounting process and solder paste |
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Application publication date: 20190104 |
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