CN110668188B - Industrial robot - Google Patents
Industrial robot Download PDFInfo
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- CN110668188B CN110668188B CN201910583694.9A CN201910583694A CN110668188B CN 110668188 B CN110668188 B CN 110668188B CN 201910583694 A CN201910583694 A CN 201910583694A CN 110668188 B CN110668188 B CN 110668188B
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 38
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims description 20
- 235000012431 wafers Nutrition 0.000 description 123
- 238000010438 heat treatment Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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Abstract
An industrial robot capable of detecting a mounting state of a conveyance object. The industrial robot (1) is provided with a hand (5) and a detection part (60) for detecting a conveying object (2) on the hand, wherein the hand (5) is provided with a first support part (55), a second support part (56) and a third support part (57) which can support three parts of the back surface of the conveying object, the detection part (60) is provided with a plurality of reflection type optical sensors which are arranged opposite to the outer peripheral surface (22) of the conveying object supported by the first support part, the second support part and the third support part, and a signal processing part (63) for judging the carrying state of the conveying object based on output signals of the plurality of reflection type optical sensors, the plurality of reflective optical sensors include a first sensor (61) provided on one side of a center line (C) passing through the first support section and passing through the middle of the second support section and the third support section, and a second sensor (62) provided on the other side.
Description
Technical Field
The present invention relates to an industrial robot for transporting a transport object such as a semiconductor wafer.
Background
The robot described in patent document 1 is a robot for transporting a semiconductor wafer, and includes magnetic wafer support pins, an elastic body for supporting the wafer support pins, and a magnetic sensor provided in the vicinity of the elastic body, on the surface of a hand (end effector) on which the semiconductor wafer is placed. The elastic body sandwiched between the wafer support pin and the magnetic sensor is compressed by the weight of the semiconductor wafer, and the gap between the wafer support pin and the magnetic sensor is reduced, thereby changing the output of the magnetic sensor. The presence or absence of the semiconductor wafer on the hand is detected based on a change in the output of the magnetic sensor.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2005-268556
Disclosure of Invention
Technical problem to be solved by the invention
In the transfer robot described in patent document 1, only the presence or absence of a semiconductor wafer on the hand is detected. The semiconductor wafer is only placed on the hand and is not fixed to the hand. From the viewpoint of protecting the surface of the semiconductor wafer, the semiconductor wafer is not stably supported by a plurality of wafer support pins including magnetic wafer support pins with gaps between the wafer support pins and the hand placement surface. In the case where the semiconductor wafer is not properly placed on the hand, the semiconductor wafer may fall off the hand due to vibration in transportation or collision with an obstacle, and the semiconductor wafer may be damaged.
The present invention has been made in view of the above circumstances, and an object thereof is to provide an industrial robot capable of detecting a mounting state of a conveyance target object.
Technical scheme for solving technical problem
One aspect of the present invention provides an industrial robot for conveying a plate-like conveyance object, including: a hand on which the conveyance object is placed; and a detection unit that detects the conveyance target object on the hand, the hand having a placement surface, a first support unit, a second support unit, and a third support unit, the first support unit, the second support unit, and the third support unit being capable of supporting three locations of the conveyance target object so that the conveyance target object is disposed along the placement surface with a gap therebetween, the detection unit including: a plurality of reflective optical sensors arranged to face an outer peripheral surface of the object to be conveyed supported by the first support portion, the second support portion, and the third support portion; and a signal processing unit configured to determine a mounting state of the conveyance object based on output signals of the plurality of reflection-type photosensors, the plurality of reflection-type photosensors including a first sensor provided on one side of a center line passing through the first support unit and passing through a middle between the second support unit and the third support unit, and a second sensor provided on the other side of the center line.
One aspect of the present invention provides an industrial robot for conveying a plate-like conveyance object, including: a hand on which the conveyance object is placed; and a detection unit that detects the conveyance object on the hand, the hand having: a carrying surface; and a first support portion, a second support portion, and a third support portion capable of supporting three portions of the object to be conveyed so that the object to be conveyed is disposed along the mounting surface with a gap therebetween, the detection portion including: a plurality of reflective optical sensors arranged to face an outer peripheral surface of the object to be conveyed supported by the first support portion, the second support portion, and the third support portion; and a signal processing unit configured to determine a mounting state of the object to be conveyed based on output signals of the plurality of reflection-type photosensors, wherein the plurality of reflection-type photosensors include a first sensor provided on one side of a center line passing through the first support unit and passing through a middle between the second support unit and the third support unit, and a second sensor provided on the other side of the center line, and the signal processing unit determines that the mounting state of the object to be conveyed is appropriate when both an output signal value of the first sensor and an output signal value of the second sensor are equal to or greater than a predetermined threshold value.
(effect of the invention)
According to the present invention, it is possible to provide an industrial robot capable of detecting a mounting state of a conveyance target.
Drawings
Fig. 1 is a plan view of an example of an industrial robot for explaining an embodiment of the present invention, and is a plan view of a state where an arm is retracted.
Fig. 2 is a plan view of the industrial robot of fig. 1, in which an arm is extended.
Fig. 3 is a front view of the industrial robot of fig. 1.
Fig. 4 is a plan view of a hand of the industrial robot of fig. 1.
Fig. 5 is a cross-sectional view taken along line V-V of fig. 4.
Fig. 6 is a schematic view showing an example of a state in which the conveyance target object is placed.
Fig. 7 is a sectional view taken along line VII-VII of fig. 6.
Fig. 8 is a schematic view of another example of the state in which the object is placed.
Fig. 9 is a sectional view taken along line IX-IX of fig. 8.
Fig. 10 is a schematic view of another example of the state in which the object is placed.
Fig. 11 is a cross-sectional view taken along line XI-XI of fig. 10.
Fig. 12 is a schematic view of another example of the mounting state of the conveyance object.
Description of the reference numerals
1 Industrial robot
2 semiconductor wafer (object to be carried)
3 wafer carrying mechanism
4 first arm
5 hand for sensing
6 second arm
7 arm support part
8 lifting mechanism
9 first support part
10 second support part
21 back side of wafer
21e edge of outer peripheral portion of back surface of wafer
22 outer peripheral surface of wafer
23 surface of wafer
51 proximal end of sensing hand
52 sensing a first arm of a hand
53 second arm for sensing hand
54 carrying surface for sensing hand
55 first support part
56 second support part
57 third support part
58 inclined plane
60 detection part
61 first sensor (reflection type optical sensor)
62 second sensor (reflective optical sensor)
63 Signal processing part
C center line
O center
L light
R triangular region
X first direction
Y second direction
Detailed Description
(Overall Structure of Industrial robot)
Fig. 1 to 3 show an example of an industrial robot for explaining an embodiment of the present invention. An industrial robot 1 (hereinafter referred to as "robot 1") is a robot for conveying a semiconductor wafer 2 (hereinafter referred to as "wafer 2") as a plate-like conveyance object. The robot 1 simultaneously carries out a plurality of wafers 2 from a cassette (not shown) in which the plurality of wafers 2 are stacked and stored at a predetermined pitch, for example. The robot 1 carries the plurality of wafers 2 carried out of the cassette into a heating furnace (not shown) of a semiconductor manufacturing system in which the plurality of wafers 2 are stacked and stored at a predetermined pitch. The robot 1 simultaneously carries out a plurality of wafers 2 from the heating furnace and carries the carried-out wafers 2 into the cassette.
The robot 1 includes: a wafer loading mechanism 3 for loading a plurality of wafers 2, a first arm 4 for rotatably supporting the base end side of the wafer loading mechanism 3, a sensing hand 5 for detecting the storage state of the wafers 2 in the cassette or in the heating furnace, a second arm 6 for rotatably supporting the base end side of the sensing hand 5, an arm support 7 for rotatably supporting the base end sides of the first arm 4 and the second arm 6, and a lifting mechanism 8 for lifting and lowering the arm support 7.
The wafer loading mechanism 3 has a plurality of carrying hands arranged to be overlapped in the vertical direction at a predetermined pitch. The pitch of the wafers 2 stored in the cassette may be different from the pitch of the wafers 2 stored in the heating furnace, and the wafer loading mechanism 3 may be configured to be capable of changing the pitch of a plurality of conveyance hands.
The sensor hand 5 is used to detect the storage state (inclination, protrusion, etc.) of the wafer 2 in the cassette or the heating furnace before the wafer 2 is carried out of the cassette or the like. The sensor hand 5 moves up and down integrally with the arm support 7, and the wafer 2 is placed on the sensor hand 5 in accordance with the up and down movement of the sensor hand 5. The wafer 2 placed on the sensing hand 5 may be transported between the cassette and the heating furnace by the sensing hand 5.
The first arm 4 and the second arm 6 are configured to have two joint portions and to extend and contract as a whole. The base end side of the first arm 4 and the base end side of the second arm 6 are supported by the arm support portion 7 and individually extend and contract. The arm support 7 includes a first support 9 that supports the first arm 4 and the second arm 6, and a second support 10 that supports the first support 9. A rotation mechanism for rotating the first support portion 9 is housed inside the second support portion 10, and the first support portion 9 is rotatably supported by the second support portion 10.
The lifting mechanism 8 is configured using, for example, a linear guide including a feed screw shaft extending in the vertical direction and a support column portion supporting the feed screw shaft, and a nut member screwed to the feed screw shaft is provided on the second support portion 10. The second support part 10 moves up and down along the feed screw shaft in accordance with the rotation of the feed screw shaft by rotating the feed screw shaft by the motor. Thereby, the arm support 7 is lifted and lowered.
(construction of hand for sensing)
Fig. 4 and 5 show the structure of the sensing hand 5. The sensor hand 5 has a base end portion 51 rotatably supported by the second arm 6, and a first arm portion 52 and a second arm portion 53 branched from the base end portion 51 toward the tip end side, and has a Y-shape as a whole. The sensor hand 5 further has a mounting surface 54 facing the back surface 21 of the wafer 2 mounted on the sensor hand 5.
A first support portion 55 is provided on the mounting surface 54 of the base end portion 51, a second support portion 56 is provided on the mounting surface 54 of the tip end of the first arm portion 52, and a third support portion 57 is provided on the mounting surface 54 of the tip end of the second arm portion 53. The first support portion 55, the second support portion 56, and the third support portion 57 can support three portions of the back surface 21 of the wafer 2 so that the wafer 2 is arranged along the placement surface 54 with a gap therebetween.
In this example, each of the first support portion 55, the second support portion 56, and the third support portion 57 has an inclined surface 58 facing the center O of the circumscribed circle of the triangular region R in which the first support portion 55, the second support portion 56, and the third support portion 57 are connected, and each inclined surface 58 is inclined so as to approach the center O as it approaches the placement surface 54. When the wafer 2 is appropriately placed, the edge 21e of the outer peripheral portion of the back surface 21 of the wafer 2 is in contact with the inclined surfaces 58 of the first support portion 55, the second support portion 56, and the third support portion 57, and is supported by these inclined surfaces 58.
Since the outer peripheral portion of the back surface 21 of the wafer 2 is supported by the first support portion 55, the second support portion 56, and the third support portion 57, the center portion of the back surface 21 of the wafer 2 is not in contact with the mounting surface 54, the first support portion 55, the second support portion 56, and the third support portion 57, and the wafer 2 is protected from damage and contamination due to contact with the mounting surface 54 and the like. After that, a plurality of semiconductor devices are formed in the central portion of the wafer 2, but by keeping the central portion of the back surface 21 clean, desired characteristics of the semiconductor devices, for example, can be obtained.
Further, the edge 21e of the outer peripheral portion of the back surface 21 of the wafer 2 is supported by the inclined surfaces 58 of the first support portion 55, the second support portion 56, and the third support portion 57, whereby the movement of the wafer 2 along the placement surface 54 is suppressed. This suppresses the wafer 2 from falling off from one or more of the first support 55, the second support 56, and the third support 57 or the wafer 2 from falling off from the sensing hand 5 due to vibration during conveyance or the like. Even if the wafer 2 is in contact with the inclined surfaces 58 of the first support portion 55, the second support portion 56, and the third support portion 57 in a state of being slightly inclined with respect to the placement surface 54, the wafer 2 can be disposed substantially parallel to the placement surface 54 by, for example, vibration during transportation.
Further, the positions of the first support portion 55, the second support portion 56, and the third support portion 57 are not limited as long as the center of gravity of the wafer 2 is disposed within the triangular region R connecting the first support portion 55, the second support portion 56, and the third support portion 57, but if it is considered that the circular wafer 2 is symmetrical with respect to an arbitrary diameter, it is preferable that the second support portion 56 and the third support portion 57 are disposed symmetrically with respect to each other across the center O of the circumscribed circle connecting the triangular region R and the center line C of the first support portion 55. This enables the wafer 2 to be stably supported.
The hand 5 further includes a detection unit 60 for detecting the wafer 2 on the hand 5, and the detection unit 60 includes a first sensor 61 and a second sensor 62 as reflection type optical sensors, and a signal processing unit 63 for determining a mounting state of the wafer 2 based on output signals of the first sensor 61 and the second sensor 62. Here, the reflective photosensor includes a light emitting element and a light receiving element, and reflects light emitted from the light emitting element by an object, and the light receiving element detects the reflected light and outputs a signal corresponding to the intensity of the detected reflected light. The signal value of the output signal is basically related to the distance between the light emitting element and the light receiving element and the reflecting surface of the object, and the signal value decreases as the distance increases. The signal value is also related to the incident angle of light with respect to the reflecting surface of the object, and the signal value decreases as the incident angle increases. In this example, the light emitting element and the light receiving element constituting the first sensor 61 are arranged to overlap in a direction orthogonal to the XY plane shown in fig. 4, that is, in the thickness direction of the wafer 2. The light L emitted from the light emitting element arranged in this manner is irradiated to the outer peripheral surface 22 of the wafer 2, and the reflected light is incident on the light receiving element (see fig. 7). In addition to the arrangement of the light emitting element and the light receiving element, the light emitting element and the light receiving element may be arranged in the Y direction on the XY plane shown in fig. 4.
When the wafer 2 is appropriately placed, that is, in a state where the edge 21e of the outer peripheral portion of the back surface 21 of the wafer 2 is supported by the inclined surfaces 58 of the first support portion 55, the second support portion 56, and the third support portion 57, the first sensor 61 and the second sensor 62 face the outer peripheral surface 22 of the wafer 2, light emitted from the light emitting elements of the first sensor 61 and the second sensor 62 is reflected by the outer peripheral surface 22 of the wafer 2, and the reflected light is detected by the light receiving elements of the first sensor 61 and the second sensor 62, respectively.
The first sensor 61 is disposed on one side of the center line C, and the second sensor 62 is disposed on the other side of the center line C. This makes it possible to detect the misalignment from the position of the wafer 2 when the wafer 2 is properly placed, in both the first direction X parallel to the center line C and the second direction Y parallel to the placement surface 54 and perpendicular to the center line C. In addition, if considering that the circular wafer 2 is symmetrical with respect to an arbitrary diameter, the first sensor 61 and the second sensor 62 are preferably arranged symmetrically with respect to each other across the center line C, and are provided near both sides of the first support portion 55 extending symmetrically to both sides of the center line C, for example, as shown in fig. 4.
(determination example 1 of Signal processing section 63)
The output signals of the first sensor 61 and the second sensor 62 are input to the signal processing unit 63. Then, the signal processing unit 63 determines whether or not the mounting state of the wafer 2 on the sensing hand 5 is appropriate based on the two input signals. The determination may be performed using a threshold value, and for example, when the signal values of both the output signals of the first sensor 61 and the output signal of the second sensor 62 are equal to or greater than the threshold value, it may be determined that the mounting state of the wafer 2 is proper, and when the signal value of at least one of the output signals is less than the threshold value, it may be determined that the mounting state of the wafer 2 is not proper. The threshold value may be set appropriately according to the output signal value when the mounting state of the wafer 2 is appropriate and the output signal value when the mounting state of the wafer 2 is not appropriate.
Fig. 6 and 7 show an example in which the wafer 2 is appropriately placed. Both the first sensor 61 and the second sensor 62 face the outer peripheral surface 22 of the wafer 2, and the light L from the first sensor 61 and the light from the second sensor 62 are incident on the outer peripheral surface 22 at a very small incident angle. In addition, the distance between the first sensor 61 and the outer peripheral surface 22 and the distance between the second sensor 62 and the outer peripheral surface 22 are both very small. In this case, the signal value of the output signal of both the output signal of the first sensor 61 and the output signal of the second sensor 62 is equal to or greater than the threshold value. Therefore, the signal processing unit 63 determines that the mounting state of the wafer 2 is appropriate.
Fig. 8 and 9 show an example in which the mounting state of the wafer 2 is inappropriate. In the example shown in fig. 8 and 9, the wafer 2 is offset toward the front end side of the sensing hand 5 along the first direction X. The wafer 2 is mounted on the second support portion 56 and the third support portion 57 on the tip side, and is separated from the first support portion 55 on the base side to be in contact with the mounting surface 54. In this case, the first sensor 61 and the second sensor 62 are both offset from the outer peripheral surface 22 of the wafer 2 and face the surface 23, and the light L from the first sensor 61 and the light from the second sensor 62 are both incident on the surface 23 at an angle larger than the incident angle with respect to the outer peripheral surface 22 shown in fig. 7. In addition, the distance between the first sensor 61 and the surface 23 is greater than the distance between the first sensor 61 and the outer circumferential surface 22 shown in fig. 6, and the distance between the second sensor 62 and the surface 23 is also greater than the distance between the second sensor 62 and the outer circumferential surface 22 shown in fig. 6. Therefore, the signal values of the output signals of both the first sensor 61 and the second sensor 62 are smaller than the threshold value. Therefore, the signal processing unit 63 determines that the mounting state of the wafer 2 is not appropriate.
Fig. 10 and 11 show other examples of the state where the wafer 2 is placed. In the example shown in fig. 10 and 11, the wafer 2 is offset toward the proximal end side of the sensing hand 5 along the first direction X. The wafer 2 is mounted on the first support portion 55 at the base end side, and is separated from the second support portion 56 and the third support portion 57 at the tip end side to be in contact with the mounting surface 54. In this case, the first sensor 61 and the second sensor 62 are both offset from the outer peripheral surface 22 of the wafer 2 and face the rear surface 21, and both the light from the first sensor 61 and the light from the second sensor 62 enter the rear surface 21 at an angle larger than the angle of incidence with respect to the outer peripheral surface 22 shown in fig. 7. In addition, the distance between the first sensor 61 and the back surface 21 is larger than the distance between the first sensor 61 and the outer peripheral surface 22 shown in fig. 6, and the distance between the second sensor 62 and the back surface 21 is also larger than the distance between the second sensor 62 and the outer peripheral surface 22 shown in fig. 6. Therefore, the signal values of the output signals of both the first sensor 61 and the second sensor 62 are smaller than the threshold value. Therefore, the signal processing unit 63 determines that the mounting state of the wafer 2 is not appropriate.
Fig. 12 shows another example in which the mounting state of the wafer 2 is inappropriate. In the example shown in fig. 12, the wafer 2 is shifted toward the second support portion 56 side of the center line C along the second direction Y. The wafer 2 is separated from the third support part 57 by the second support part 56 on the tip side and is in contact with the mounting surface 54, but is in contact with the inclined surface 58 of the first support part 55 on the base end side. The inclination of the wafer 2 with respect to the placement surface 54 is smaller than the inclination of the wafer 2 shown in fig. 6 and 7 and the inclination of the wafer 2 shown in fig. 8 and 9, and the first sensor 61 and the second sensor 62 provided near both sides of the first support portion 55 are both opposed to the outer peripheral surface 22 of the wafer 2. The distance between the first sensor 61 positioned on the second support portion 56 side of the center line C and the outer peripheral surface 22 of the wafer 2 is a small distance as the distance between the first sensor 61 and the outer peripheral surface 22 shown in fig. 6, and the signal value of the output signal of the first sensor 61 is equal to or greater than the threshold value. However, the distance between the second sensor 62 on the third support portion 57 side of the center line C and the outer peripheral surface 22 of the wafer 2 is larger than the distance between the second sensor 62 and the outer peripheral surface 22 shown in fig. 6, and the signal value of the output signal of the second sensor 62 is smaller than the threshold value. According to the above determination example, the signal processing unit 63 determines that the mounting state of the wafer 2 is not appropriate.
When it is determined that the state of mounting the wafer 2 on the sensing hand 5 is appropriate, the robot 1 extends the first arm 4, moves the arm support 7 up and down, and carries out the wafer 2 from a cassette or the like by the wafer loading mechanism 3. On the other hand, if it is determined that the mounting state of the wafer 2 on the sensing hand 5 is not appropriate, the robot 1 stops operating, for example.
By disposing the first sensor 61 and the second sensor 62 as reflective photosensors so as to face the outer peripheral surface of the wafer 2 in this manner, for example, as in the mounting state shown in fig. 8 and 9 and the mounting state shown in fig. 10 and 11, the state in which the wafer 2 is tilted can be detected by mounting one or two support portions on the wafer 2. Further, by disposing the first sensor 61 and the second sensor 62 on both sides of the center line C, it is possible to detect a state in which the wafer 2 is shifted to one side of the center line C, as in the mounting state shown in fig. 12. By detecting the placement state of the wafer 2 in this manner, the wafer 2 can be prevented from being conveyed in an inappropriate placement state, and the wafer 2 can be prevented from dropping and from being damaged by dropping.
Preferably, the first sensor 61 and the second sensor 62 are provided at positions symmetrical to each other with respect to the center line C. Thus, the mounting state can be detected equally regardless of the side of the wafer 2 that is offset with respect to the center line C. In addition, it is preferable that the first sensor 61 and the second sensor 62 are provided near both sides of the first support portion 55. This makes it possible to reliably detect a state in which the wafer 2 is tilted by being placed on one or both of the support portions including the first support portion 55 or being deviated from one or both of the support portions including the first support portion 55.
(determination example 2 of Signal processing section 63)
The determination of the mounting state of the wafer 2 by the signal processing unit 63 is not limited to the above example. For example, when the signal value of at least one of the output signal of the first sensor 61 and the output signal of the second sensor 62 is equal to or greater than a threshold value, it may be determined that the mounting state of the wafer 2 is proper, and when the signal values of both the output signals are smaller than the threshold value, it may be determined that the mounting state of the wafer 2 is not proper. According to this example, the mounting state of the wafer 2 with a small inclination with respect to the mounting surface 54 shown in fig. 12 is determined to be appropriate. In this way, the range of the placement state of the wafer 2 that can be considered appropriate can be expanded, which is useful, for example, when the robot 1 frequently stops operating.
Further, the determination mode in which the mounting state of the wafer 2 is determined to be inappropriate when the signal value of at least one of the output signal of the first sensor 61 and the output signal of the second sensor 62 is smaller than the threshold value may be set as the first determination mode, and the determination mode in which the mounting state of the wafer 2 is determined to be appropriate when the signal value of at least one of the output signal of the first sensor 61 and the output signal of the second sensor 62 is equal to or larger than the threshold value may be set as the second determination mode, and the signal processing unit 63 may be configured to be selectively set to the first determination mode or the second determination mode by, for example, a switching operation or the like. This enables the loading state to be changed as appropriate according to the user's request, thereby improving the convenience of the robot 1.
As described above, the industrial robot disclosed in the present specification is an industrial robot for conveying a plate-shaped conveyance object, and includes a hand on which the conveyance object is placed and a detection unit for detecting the conveyance object on the hand, wherein the hand includes a placement surface, a first support unit, a second support unit, and a third support unit, the first support unit, the second support unit, and the third support unit are capable of supporting three portions of a rear surface of the conveyance object so that the conveyance object is disposed along the placement surface with a gap therebetween, the detection unit includes a plurality of reflection-type optical sensors disposed so as to face an outer peripheral surface of the conveyance object supported by the first support unit, the second support unit, and the third support unit, and a signal processing unit for determining a placement state of the conveyance object based on output signals of the plurality of reflection-type optical sensors, the plurality of reflective optical sensors include a first sensor provided on one side of a center line passing through the first support portion and passing through a middle between the second support portion and the third support portion, and a second sensor provided on the other side. According to this configuration, the reflective optical sensor disposed so as to face the outer peripheral surface of the object to be conveyed can detect a state in which the object to be conveyed is tilted by mounting one or two support portions (deviating from one or two support portions). Further, the reflective optical sensors disposed on both sides of the center line can detect a state in which the object to be conveyed is shifted in a direction orthogonal to the center line with respect to the center line. In this way, by detecting the placement state of the conveyance target object, it is possible to prevent the conveyance target object from being conveyed in an inappropriate placement state, and it is possible to prevent the conveyance target object from falling and being damaged by the falling.
As described above, the industrial robot disclosed in the present specification is an industrial robot for conveying a plate-shaped conveyance object, and includes a hand on which the conveyance object is placed and a detection unit for detecting the conveyance object on the hand, wherein the hand includes a placement surface, a first support unit, a second support unit, and a third support unit, the first support unit, the second support unit, and the third support unit are capable of supporting three portions of a rear surface of the conveyance object so that the conveyance object is disposed along the placement surface with a gap therebetween, the detection unit includes a plurality of reflection-type optical sensors disposed so as to face an outer peripheral surface of the conveyance object supported by the first support unit, the second support unit, and the third support unit, and a signal processing unit for determining a placement state of the conveyance object based on output signals of the plurality of reflection-type optical sensors, the plurality of reflective optical sensors include a first sensor provided on one side of a center line passing through the first support section and passing through a middle between the second support section and the third support section, and a second sensor provided on the other side, and the signal processing section determines that the mounting state of the transport object is appropriate when both an output signal value of the first sensor and an output signal value of the second sensor are equal to or greater than a predetermined threshold value. According to this configuration, the state of inclination of the conveyance object caused by the conveyance object being caught by (being deviated from) one or both of the support portions can be detected by the reflective optical sensor disposed so as to face the outer peripheral surface of the conveyance object. Further, the state in which the object to be conveyed is shifted in a direction orthogonal to the center line with respect to the center line can be detected by the reflective optical sensors disposed on both sides of the center line. When both the output signal value of the first sensor and the output signal value of the second sensor are equal to or greater than a predetermined threshold value, it can be determined that the mounting state of the conveyance object (the inclination with respect to the mounting surface and the deviation with respect to the center line) is appropriate.
In the industrial robot disclosed in the present specification, the first sensor and the second sensor are provided at positions symmetrical to each other with respect to the center line. With this configuration, the mounting state can be detected equally regardless of which side the object to be conveyed is offset with respect to the center line.
In the industrial robot disclosed in the present specification, the first sensor and the second sensor are provided in the vicinity of the first support portion. According to this configuration, it is possible to reliably detect a state in which the conveyance target object is tilted by being placed on or deviated from one or both of the support portions including the first support portion.
In the industrial robot disclosed in the present specification, the first support portion, the second support portion, and the third support portion support an outer peripheral portion of the rear surface of the object to be conveyed. According to this configuration, the rear surface of the object to be conveyed can be protected.
In the industrial robot disclosed in the present specification, the first support portion, the second support portion, and the third support portion have inclined surfaces, and the inclined surfaces are in contact with an edge of an outer peripheral portion of the rear surface of the object to be conveyed, and the inclined surfaces are inclined surfaces facing a center of a circumscribed circle of a triangular region obtained by connecting the first support portion, the second support portion, and the third support portion, and are closer to the center as they are closer to the placement surface. With this configuration, displacement of the conveyance target due to vibration or the like accompanying conveyance can be suppressed. Further, the inclined surface may automatically return to the appropriate position if the displacement is extremely small.
In the industrial robot disclosed in the present specification, the signal processing unit determines that the mounting state of the conveyance object is not appropriate when at least one of the output signal value of the first sensor and the output signal value of the second sensor is smaller than the threshold value. With this configuration, the appropriate placement state can be determined strictly.
In the industrial robot disclosed in the present specification, the signal processing unit determines that the mounting state of the object to be conveyed is appropriate when at least one of the output signal value of the first sensor and the output signal value of the second sensor is equal to or greater than the threshold value, and determines that the mounting state of the object to be conveyed is inappropriate when both the output signal value of the first sensor and the output signal value of the second sensor are smaller than the threshold value. With this configuration, the range of the mounting state considered appropriate can be expanded.
In the industrial robot disclosed in the present specification, the signal processing unit may have a first determination mode in which the mounted state of the object to be conveyed is determined to be inappropriate when at least one of an output signal value of the first sensor and an output signal value of the second sensor is smaller than the threshold value, and a second determination mode in which the mounted state of the object to be conveyed is determined to be appropriate when at least one of the output signal value of the first sensor and the output signal value of the second sensor is equal to or larger than the threshold value, and may be selectively set to the first determination mode or the second determination mode, it is determined that the mounting state of the object to be conveyed is not appropriate. With this configuration, the placement state considered appropriate can be changed according to the user's request, and the convenience of the robot 1 is improved.
In the industrial robot disclosed in the present specification, the signal processing unit stops the operation when it is determined that the mounting state of the conveyance object is not appropriate. According to this configuration, the conveyance object can be prevented from being conveyed in an inappropriate placement state, and dropping of the conveyance object and damage due to the dropping can be avoided in advance.
The industrial robot disclosed in the present specification conveys a semiconductor wafer as the object to be conveyed.
Claims (12)
1. An industrial robot for conveying a plate-like conveyance object, comprising:
a hand on which the conveyance object is placed; and
a detection unit that detects the conveyance object on the hand,
the hand has:
a carrying surface; and
a first support portion, a second support portion, and a third support portion capable of supporting three portions of a rear surface of the object to be conveyed so as to be arranged along the placement surface with a gap therebetween,
the detection unit includes:
a plurality of reflective optical sensors arranged to face an outer peripheral surface of the object to be conveyed supported by the first support portion, the second support portion, and the third support portion; and
a signal processing unit that determines a mounting state of the conveyance object based on output signals of the plurality of reflection-type photosensors,
the plurality of reflection type photo sensors includes a first sensor provided on one side of a center line passing through the first support part and passing through a middle of the second support part and the third support part, and a second sensor provided on the other side,
in the reflective photosensor, a light-emitting element and a light-receiving element are arranged to overlap in a thickness direction of the object to be conveyed.
2. The industrial robot of claim 1,
the first sensor and the second sensor are provided at positions symmetrical to each other with respect to the center line.
3. The industrial robot of claim 2, wherein,
the first sensor and the second sensor are disposed near the first support portion.
4. The industrial robot according to any one of claims 1 to 3,
the first support portion, the second support portion, and the third support portion support an outer peripheral portion of the rear surface of the object to be conveyed.
5. The industrial robot of claim 4, wherein,
the first support portion, the second support portion, and the third support portion have inclined surfaces that are inclined toward the center of a circumscribed circle of a triangular region obtained by connecting the first support portion, the second support portion, and the third support portion, and are in contact with an edge of an outer peripheral portion of the rear surface of the object to be conveyed via the inclined surfaces, and the inclined surfaces are closer to the center as they are closer to the placement surface.
6. The industrial robot of claim 4, wherein,
the object to be conveyed is a semiconductor wafer.
7. The industrial robot of claim 5, wherein,
the object to be conveyed is a semiconductor wafer.
8. An industrial robot for conveying a plate-like conveyance object, comprising:
a hand on which the conveyance object is placed; and
a detection unit that detects the conveyance object on the hand,
the hand has:
a carrying surface; and
a first support portion, a second support portion, and a third support portion capable of supporting three portions of a rear surface of the object to be conveyed so as to be arranged along the placement surface with a gap therebetween,
the detection unit includes:
a plurality of reflective optical sensors arranged to face an outer peripheral surface of the object to be conveyed supported by the first support portion, the second support portion, and the third support portion; and
a signal processing unit that determines a mounting state of the conveyance object based on output signals of the plurality of reflection-type photosensors,
the plurality of reflection type photo sensors includes a first sensor provided on one side of a center line passing through the first support part and passing through a middle of the second support part and the third support part, and a second sensor provided on the other side,
the signal processing unit determines that the mounting state of the conveyance object is appropriate when both the output signal value of the first sensor and the output signal value of the second sensor are equal to or greater than a predetermined threshold value,
in the reflective photosensor, a light-emitting element and a light-receiving element are arranged to overlap in a thickness direction of the object to be conveyed.
9. The industrial robot of claim 8, wherein,
when at least one of the output signal value of the first sensor and the output signal value of the second sensor is smaller than the threshold value, the signal processing unit determines that the mounting state of the conveyance object is not appropriate.
10. The industrial robot of claim 8, wherein,
the signal processing unit determines that the mounting state of the conveyance object is appropriate when at least one of the output signal value of the first sensor and the output signal value of the second sensor is equal to or greater than the threshold value,
when both the output signal value of the first sensor and the output signal value of the second sensor are smaller than the threshold value, the signal processing unit determines that the mounting state of the conveyance object is not appropriate.
11. The industrial robot of claim 8, wherein,
the signal processing section has a first determination mode and a second determination mode,
in the first determination mode, when at least one of the output signal value of the first sensor and the output signal value of the second sensor is smaller than the threshold value, it is determined that the mounting state of the transport object is not appropriate,
in the second determination mode, when at least one of the output signal value of the first sensor and the output signal value of the second sensor is equal to or greater than the threshold value, it is determined that the loading state of the transport object is proper, and when both the output signal value of the first sensor and the output signal value of the second sensor are smaller than the threshold value, it is determined that the loading state of the transport object is not proper,
the signal processing unit can be selectively set to the first determination mode or the second determination mode.
12. The industrial robot according to any one of claims 8 to 11,
when the signal processing unit determines that the loading state of the conveyance object is not appropriate, the operation is stopped.
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JP2018127166A JP7191565B2 (en) | 2018-07-03 | 2018-07-03 | industrial robot |
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JP2018142719A JP7191575B2 (en) | 2018-07-30 | 2018-07-30 | industrial robot |
JP2018-142719 | 2018-07-30 |
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JP2022076060A (en) * | 2020-11-09 | 2022-05-19 | 日本電産サンキョー株式会社 | Teaching method for industrial robot |
JP2022116807A (en) * | 2021-01-29 | 2022-08-10 | 日本電産サンキョー株式会社 | industrial robot |
CN114783924B (en) * | 2022-04-06 | 2023-09-01 | 深圳市深科达智能装备股份有限公司 | Wafer carrying device, wafer carrying control method, electric device, and storage medium |
CN114975195B (en) * | 2022-04-06 | 2023-06-30 | 深圳市深科达智能装备股份有限公司 | Wafer cassette, wafer transfer apparatus, wafer transfer control method, electric apparatus, and storage medium |
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JPH10175734A (en) * | 1996-12-18 | 1998-06-30 | Hitachi Ltd | Substrate carrier mechanism |
JP3938247B2 (en) * | 1998-04-16 | 2007-06-27 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
US6256555B1 (en) * | 1998-12-02 | 2001-07-03 | Newport Corporation | Robot arm with specimen edge gripping end effector |
JP5226443B2 (en) * | 2008-09-22 | 2013-07-03 | 株式会社ウインズ | Semiconductor wafer transfer hand |
KR101749075B1 (en) * | 2010-03-19 | 2017-06-20 | 도쿄엘렉트론가부시키가이샤 | Semiconductor wafer carrying hand |
JP5516482B2 (en) * | 2011-04-11 | 2014-06-11 | 東京エレクトロン株式会社 | Substrate transport method, substrate transport apparatus, and coating and developing apparatus |
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JP6522325B2 (en) * | 2014-12-08 | 2019-05-29 | 日本電産サンキョー株式会社 | Industrial robot and teaching method of industrial robot |
JP2016143787A (en) * | 2015-02-03 | 2016-08-08 | 川崎重工業株式会社 | Substrate transfer robot and substrate transfer method |
KR102050149B1 (en) * | 2015-02-13 | 2019-11-28 | 가와사끼 쥬고교 가부시끼 가이샤 | Substrate transfer robot and its driving method |
CN105514010B (en) * | 2015-12-31 | 2018-06-22 | 北京北方华创微电子装备有限公司 | A kind of silicon chip transports method safely |
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