JP2011216729A - Semiconductor wafer conveying apparatus - Google Patents

Semiconductor wafer conveying apparatus Download PDF

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JP2011216729A
JP2011216729A JP2010084415A JP2010084415A JP2011216729A JP 2011216729 A JP2011216729 A JP 2011216729A JP 2010084415 A JP2010084415 A JP 2010084415A JP 2010084415 A JP2010084415 A JP 2010084415A JP 2011216729 A JP2011216729 A JP 2011216729A
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wafer
unit
light
reflector
detection
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Toru Saeki
亨 佐伯
Yasumichi Mieno
靖理 三重野
Yuji Urabe
雄士 占部
Koichi Hashimoto
浩一 橋本
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Sinfonia Technology Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor wafer conveying apparatus facilitating optical axis adjustment of a light projecting function and a light emitting function and capable of detecting a storage state including the existence/absence of a wafer.SOLUTION: The semiconductor wafer conveying apparatus includes a detection unit 4 for detecting a storage state of a wafer 7 when inserting/ejecting the wafer 7 into/from a wafer storage case and conveying the wafer 7. The detection unit 4 includes a light emitting/receiving part 44 and a reflector 43 which are separately arranged so as to sandwich at least two arbitrary points of a peripheral edge part of the wafer 7, and is configured so as to reflect detection light emitted from the light emitting/receiving part 44 by the wafer 7 or the reflector 43, and then receive the reflected light by the light emitting/receiving part 44.

Description

本発明は、ウェハ収納ケース内における半導体ウェハの検知を適正化した半導体ウェハ搬送装置に関するものである。   The present invention relates to a semiconductor wafer transfer apparatus in which detection of a semiconductor wafer in a wafer storage case is optimized.

従来、半導体を製造する際に用いられる、シリコン製で薄い円盤状のウェハが、ＦＯＵＰ（Front
Open Unified Pod）と呼ばれるウェハ収納ケースの中に納められており、当該ウェハ収納ケース内には、当該ウェハを所定ピッチで数十枚程度収めるべく、受け面が多段に設けられている。このウェハ収納ケースから１枚ずつウェハを取り出して搬送する装置が、半導体ウェハ搬送装置として知られている。 Conventionally, silicon-made thin disk-shaped wafers used in the manufacture of semiconductors are called FOUP (Front
It is housed in a wafer storage case called “Open Unified Pod”, and a receiving surface is provided in multiple stages in the wafer storage case so as to store several tens of wafers at a predetermined pitch. An apparatus for taking out and carrying wafers one by one from this wafer storage case is known as a semiconductor wafer carrying apparatus.

この半導体ウェハ搬送装置は、特許文献１及び２にも挙げられているように、搬送基台にウェハを保持するための保持部を設けて、この保持部をウェハ収納ケースの中に挿入して当該ケース内に収納されているウェハを当該保持部の上面に移し替えて保持し、この状態で搬送基台を適宜の装置まで移動させることにより、ウェハの搬送を行うものである。   As described in Patent Documents 1 and 2, this semiconductor wafer transfer apparatus is provided with a holding unit for holding a wafer on a transfer base, and the holding unit is inserted into a wafer storage case. The wafer stored in the case is transferred to and held on the upper surface of the holding unit, and the wafer is transferred by moving the transfer base to an appropriate apparatus in this state.

この際に、ウェハ収納ケース内における収納状態を、保持部とは別体に設けられた検知機構によって検知するようにしている。   At this time, the storage state in the wafer storage case is detected by a detection mechanism provided separately from the holding unit.

特許文献１は、ウェハの搬送装置にウェハ保持手段と透過式センサによるウェハ検出機構を備え、センサ受光手段の出力情報によりウェハ収納ケース内のウェハ収納状態を判定するものである。具体的にウェハ検出機構は、一対のアームにそれぞれ投光部および受光部を離間させて設け、ウェハを挟む位置に移動させた一対のアーム間において投光部の投光した光を受光部に受光させるように構成して、そのアームを上下に移動させることで、光がウェハに遮断される間隔を通じて得られるウェハの見掛け上の厚みからウェハの傾きを検知するようにしている。   Japanese Patent Application Laid-Open No. 2004-228561 includes a wafer transfer device including a wafer detection mechanism using a wafer holding unit and a transmission sensor, and determines the wafer storage state in the wafer storage case based on output information from the sensor light receiving unit. Specifically, the wafer detection mechanism is provided with a light projecting unit and a light receiving unit spaced apart from each other on a pair of arms, and the light projected by the light projecting unit is moved between the pair of arms moved to a position sandwiching the wafer. It is configured to receive light, and by moving the arm up and down, the tilt of the wafer is detected from the apparent thickness of the wafer obtained through the interval at which light is blocked by the wafer.

特許文献２は、収納容器の側面方向からウェハの周縁部に向けてビームを投光可能に設け、投光したビームをウェハで反射させて、その反射光量を検出することで、ウェハの割れや重なり等を検出するようにしている。   Patent Document 2 discloses that a beam can be projected from the side surface direction of the storage container toward the peripheral edge of the wafer, the projected beam is reflected by the wafer, and the amount of reflected light is detected. An overlap or the like is detected.

特許２８６８６４５号公報Japanese Patent No. 2868645 特開２００３−９２３３８号公報JP 2003-92338 A

しかしながら、かかる特許文献１の構成では、投光部及び受光部のセンサ光軸を一直線に合わせる必要があるために、各々の投光部及び受光部の設置の向き及び位置の調整に手間がかかるという問題がある。また、投光部及び受光部がそれぞれ別経路に設けられているため、それぞれに配線スペースをアーム上に確保する必要があり、構成が煩雑なものとなる。   However, in the configuration of Patent Document 1, since it is necessary to align the sensor optical axes of the light projecting unit and the light receiving unit in a straight line, it takes time to adjust the installation direction and position of each light projecting unit and the light receiving unit. There is a problem. Further, since the light projecting unit and the light receiving unit are provided in different paths, it is necessary to secure a wiring space on the arm for each, and the configuration becomes complicated.

一方、特許文献２の構成では、半導体製造過程におけるウェハ表面に形成される膜によって表面が曇ることがあり、またやウェハ材料によっては反射光量が一律ではないために、計測対象物に反射させて反射光を受光する構造のものでは、投光量の調整を行わなければウェハ有無の検出にも利用できない場合がある。   On the other hand, in the configuration of Patent Document 2, the surface may be clouded by a film formed on the wafer surface in the semiconductor manufacturing process, and the reflected light quantity is not uniform depending on the wafer material. A structure that receives reflected light may not be used for detecting the presence or absence of a wafer unless the amount of light emitted is adjusted.

本発明は、このような課題に着目してなされたものであって、光軸調整を容易にし、搬送装置の配線や構成をシンプルにした半導体ウェハ搬送装置を新たに提供することを目的としている。   The present invention has been made paying attention to such problems, and it is an object of the present invention to newly provide a semiconductor wafer transfer apparatus that facilitates optical axis adjustment and simplifies the wiring and configuration of the transfer apparatus. .

本発明は、かかる目的を達成するために、次のような手段を講じたものである。   In order to achieve this object, the present invention takes the following measures.

すなわち、本発明に係る半導体ウェハ搬送装置は、ウェハ収納ケースに対してウェハの出し入れ、搬送を行うためのものであって、前記ウェハの収納状態を検知するための検知部を具備し、前記検知部は前記ウェハの終端部の任意の２点を少なくとも挟み込むように離間配置させた投受光部及びリフレクタを備え、前記投受光部が投光した光をウェハ又はリフレクタで反射させた後、その反射光を当該投受光部で受光するようにしていることを特徴とする。   That is, the semiconductor wafer transfer apparatus according to the present invention is for carrying in and out the wafer and transferring the wafer to and from the wafer storage case, and includes a detection unit for detecting the storage state of the wafer. The light emitting / receiving part and the reflector are arranged so as to be spaced apart so as to sandwich at least two arbitrary points at the end part of the wafer, and the light projected by the light projecting / receiving part is reflected by the wafer or the reflector and then reflected. The light is received by the light projecting / receiving unit.

このように構成すると、リフレクタは投受光部から投光された光軸に向かって反射する特性を持つため、光軸調整時にリフレクタ側の向きを微調整する必要がなく、投受光部の厳密な角度及び位置調整も不要となる。   With this configuration, the reflector has a characteristic of reflecting toward the optical axis projected from the light projecting / receiving unit, so there is no need to finely adjust the direction of the reflector when adjusting the optical axis, and the strictness of the light projecting / receiving unit is determined. Angle and position adjustments are also unnecessary.

また、投光機能と受光機能を一つにまとめて投受光部として設置したため、検知部に設けられた電力供給や検知信号の伝達を行う配線の設置スペースを減らすことができ、搬送装置の配線の簡略化も図ることができる。   In addition, since the light projecting function and the light receiving function are combined and installed as a light projecting / receiving unit, it is possible to reduce the installation space of the wiring for supplying power and transmitting the detection signal provided in the detection unit. Can be simplified.

本発明は、以上説明したように、投光と受光の機能を一つにまとめて投受光部とし、この投受光部をリフレクタと対をなして用いるようにしたので、光軸の微調整が不要となり、加えて配線及び配線スペースの削減、さらには複数組の反射式センサを用いる必要のない簡易な構成を実現した半導体ウェハ搬送装置を提供できるという優れた効果が奏される。   In the present invention, as described above, the light projecting and receiving functions are combined into a light projecting / receiving unit, and the light projecting / receiving unit is used in a pair with a reflector. In addition, there is an excellent effect that a semiconductor wafer transfer apparatus can be provided that realizes a simple configuration that eliminates the need for wiring and wiring space and that does not require the use of a plurality of sets of reflective sensors.

本発明の一実施形態に係る半導体ウェハ搬送装置を示す全体斜視図。1 is an overall perspective view showing a semiconductor wafer transfer device according to an embodiment of the present invention. 図１に対応する側面図。The side view corresponding to FIG. 同実施形態における制御系要素の機能構成を示すブロック図。The block diagram which shows the function structure of the control system element in the embodiment. 本発明の変形例を示す平面図。The top view which shows the modification of this invention. 図４に対応し、保持部を取り外して前方から見た斜視図。The perspective view corresponding to FIG. 4 which removed the holding | maintenance part and was seen from the front.

以下、本発明の一実施形態を図面を参照して説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１及び図２は、本実施形態の半導体ウェハ搬送装置を示している。この半導体ウェハ搬送装置は、土台となる搬送基台１と、この搬送基台１に設けられた昇降移動部１１と、基端２１aが昇降移動部１１に支持された状態で先端２２ｂを水平面内で移動可能とした水平移動部２と、水平移動部２の先端２２ｂに設けられて回転支点を挟んだ対向位置に一体となって設けられた保持部３及び検知部４と、これらを制御する制御手段５（図３参照）とで構成されており、ウェハ収納ケース６内にウェハ７を収納し、また収納されているウェハ７を取り出して搬送するようにしている。   1 and 2 show the semiconductor wafer transfer apparatus of this embodiment. The semiconductor wafer transfer apparatus includes a transfer base 1 serving as a base, an up-and-down moving unit 11 provided on the transfer base 1, and a tip 22b in a horizontal plane with a base end 21a supported by the up-and-down moving unit 11. The horizontal movement unit 2 that can be moved at the same time, the holding unit 3 and the detection unit 4 that are provided at the front end 22b of the horizontal movement unit 2 and that are integrally provided at opposite positions across the rotation fulcrum, and these are controlled. The control unit 5 (see FIG. 3) is configured to store the wafer 7 in the wafer storage case 6 and to take out the transferred wafer 7 and transport it.

具体的に説明すると、搬送基台１は、搬送を要する場所に固定状態で設置される。   If it demonstrates concretely, the conveyance base 1 will be installed in the fixed state in the place which needs conveyance.

昇降移動部１１は、内蔵されているモータ１１ａによって、上端側に取り付けられた水平移動部２を昇降移動する。   The elevating / lowering unit 11 moves up and down the horizontal moving unit 2 attached to the upper end side by a built-in motor 11a.

水平移動部２は、第１のアーム２１と第２のアーム２２を備えている。具体的には、第１のアーム２１の基端２１ａを昇降移動部１１の上端側に回転支軸を介して取り付け（ここを第１関節部２Ａとする）、第１のアーム２１の先端２１ｂに第２のアーム２２の基端２２ａを上側から重合する状態で回転支軸を介して取り付け（ここを第２関節部２Ｂとする）、第２のアーム２２の先端２２ｂに検知部４と保持部３の間を接続する接続部３４を上方から被せるようにして回転支軸を介して取り付けてある（ここを第３関節部２Ｃとする）。これら第１、第２、第３関節部２Ａ、２Ｂ、２Ｃを駆動するために、図示しない駆動部（例えば、モータ、ギヤ、エアシリンダ、ボールネジ、ベルト等）が搬送基台１や第１、第２のアーム２１、２２内に各々設けられており、それぞれが独立して回転し、アーム２１、２２の角度を変更することができる。   The horizontal movement unit 2 includes a first arm 21 and a second arm 22. Specifically, the base end 21a of the first arm 21 is attached to the upper end side of the lifting / lowering moving unit 11 via a rotation support shaft (this is referred to as the first joint portion 2A), and the distal end 21b of the first arm 21 is attached. The base end 22a of the second arm 22 is attached to the top end of the second arm 22 via the rotation support shaft in a state of overlapping from the upper side (this is referred to as the second joint portion 2B), and the detection portion 4 is held on the tip end 22b of the second arm 22 The connection part 34 which connects between the parts 3 is attached via the rotation spindle so that it may cover from upper direction (this is set as the 3rd joint part 2C). In order to drive the first, second, and third joint portions 2A, 2B, and 2C, a drive unit (not shown) (for example, a motor, a gear, an air cylinder, a ball screw, a belt, and the like) is connected to the transport base 1, the first, They are respectively provided in the second arms 21 and 22 and can rotate independently to change the angles of the arms 21 and 22.

保持部３は、上面の一部に円弧状の段部３１ｘを備え、その先端側に位置する凹部３１にウェハ７を載置するようにしている。   The holding portion 3 includes an arc-shaped step portion 31x on a part of the upper surface, and the wafer 7 is placed in the concave portion 31 located on the tip side thereof.

検知部４は、二股に枝分かれした状態の第１の突起部４１と第２の突起部４２が所定距離を隔てて略平行に延在しており、それぞれの先端部４１ａ、４２ａ間の間隔Δは、図３に模式的な平面図として示すウェハ収納ケース６内に進入可能かつウェハ７の直径７ｒよりも狭くなるように構成されている。そして、それらの突起部４１、４２の対応位置に、リフレクタ４３と投受光部４４が対向して設けられている。これら投受光部４４及びリフレクタ４３は、前記ウェハ７の周端部７ａの任意の２点を少なくとも挟み込むように離間配置される。   In the detection unit 4, the first protrusion 41 and the second protrusion 42 that are bifurcated extend substantially parallel to each other with a predetermined distance, and the interval Δ between the respective tip portions 41 a and 42 a. Is configured to be able to enter the wafer storage case 6 shown as a schematic plan view in FIG. 3 and to be narrower than the diameter 7 r of the wafer 7. And the reflector 43 and the light projection / reception part 44 are provided in the corresponding position of those projection parts 41 and 42 facing each other. The light projecting / receiving unit 44 and the reflector 43 are spaced apart so as to sandwich at least two arbitrary points on the peripheral end 7 a of the wafer 7.

リフレクタ４３は、入力された光の光軸ΔＸに沿って光を反射する反射板であり、光の反射率が良く光量が安定し、例えば自転車の安全表示や道路工事の警告表示などに用いられる一般的なものである。   The reflector 43 is a reflecting plate that reflects light along the optical axis ΔX of input light, has a good light reflectivity and a stable light quantity, and is used for, for example, a bicycle safety display or a road construction warning display. It is general.

投受光部４４は、反射型の光電センサ等によって構成されるもので、図３に示すように、検知光αを投光するとともに投光した検知光αに対する反射光βが返ってきた場合にこれを光学的に検知する機能を併せ持つ。ここで図１に示す符合４４ａは、当該投受光部４４に電力供給や検知信号の伝達を行うために一方の突出部４２に設けられた配線を指し示しており、リフレクタ４３側の突出部４３には給電の必要がないことから配線は設けられていない。   The light projecting / receiving unit 44 is configured by a reflective photoelectric sensor or the like, and as shown in FIG. 3, when the detection light α is projected and the reflected light β with respect to the projected detection light α is returned. It also has a function to detect this optically. Here, reference numeral 44 a shown in FIG. 1 indicates a wiring provided on one projecting portion 42 for supplying power and transmitting a detection signal to the light projecting and receiving unit 44, and is provided on the projecting portion 43 on the reflector 43 side. Since no power supply is required, no wiring is provided.

図３に示す制御手段５は、ＣＰＵ、メモリ及びインターフェイスを具備する通常のマイクロコンピュータユニットにより構成されて、メモリ内に搬送制御ルーチン等の所要のプログラムが書き込まれており、ＣＰＵは適宜必要なプログラムを呼び出して実行することにより、周辺ハードリソースと協働して、所期の搬送動作が実現される。   The control means 5 shown in FIG. 3 is composed of a normal microcomputer unit having a CPU, a memory, and an interface, and a necessary program such as a transfer control routine is written in the memory. By calling and executing, the desired transport operation is realized in cooperation with peripheral hardware resources.

具体的に制御手段５は、投受光部４４へ信号を入出力してウェハ７の有無を判定する判定制御部５１と、昇降移動部１１及び水平移動部２を制御して保持部３や検知部４を所定の位置に移動させるアーム制御部５２とを具備し且つこれらの制御を司るように構成されている。   Specifically, the control means 5 inputs / outputs a signal to / from the light projecting / receiving unit 44 to determine the presence / absence of the wafer 7, and controls the raising / lowering moving unit 11 and the horizontal moving unit 2 to control the holding unit 3 and detection. An arm control unit 52 that moves the unit 4 to a predetermined position, and is configured to control these operations.

以下、このような半導体ウェハ搬送装置を用いて、ウェハ収納ケース６内に収納されたウェハ７の有無を含む収納状態を検出する処理手順を、ウェハ収納ケース６内からウェハ７を取り出して搬送する処理手順を主として例示して説明する。   Hereinafter, a processing procedure for detecting a storage state including the presence / absence of the wafer 7 stored in the wafer storage case 6 using such a semiconductor wafer transfer apparatus is taken out of the wafer storage case 6 and transferred. The processing procedure will be mainly described as an example.

まず、制御手段５は、アーム制御部５２を介して水平移動部２や昇降移動部１１に制御信号を発し、検知部４を図２に示すウェハ収納ケース６内の底壁６１近くに挿入させる。図１及び図２は、水平移動部２に支持される保持部３及び検知部４のうち、保持部３の方が先端に位置した状態を示しているが、検知部４を作動させる際には第３間接部Ｃを中心に接続部３４を１８０°回転させて検知部４を先端側に位置づけておく。この結果、検知部４の第１突起部４１及び第２突起部４２にそれぞれ設けたリフレクタ４３及び投受光部４４が図３に示すようにウェハ収納ケース６内に挿入される。そして、判定制御部５１とアーム制御部５２とを連動して起動させて、アームの高さを変えながら判定制御部によってウェハ７の有無を判定する。   First, the control unit 5 issues a control signal to the horizontal moving unit 2 and the lifting / lowering moving unit 11 via the arm control unit 52, and inserts the detecting unit 4 near the bottom wall 61 in the wafer storage case 6 shown in FIG. . 1 and 2 show a state in which the holding unit 3 is positioned at the tip of the holding unit 3 and the detection unit 4 supported by the horizontal moving unit 2, but when the detection unit 4 is operated. Rotate the connecting portion 180 degrees around the third indirect portion C to position the detecting portion 4 on the tip side. As a result, the reflector 43 and the light projecting / receiving unit 44 provided on the first projection 41 and the second projection 42 of the detection unit 4 are inserted into the wafer storage case 6 as shown in FIG. Then, the determination control unit 51 and the arm control unit 52 are activated in conjunction with each other, and the presence / absence of the wafer 7 is determined by the determination control unit while changing the height of the arm.

例えば、第１の突起部４１と第２の突起部４２との間にウェハ７が存在していなければ、投受光部４４からの検知光αはリフレクタ４３に達した後、光軸ΔＸに沿った反射光βとなって、投受光部４４に再帰して受光し、判定制御部５１はウェハによる遮光無しと判定するが、投受光部４４からの検知光αがウェハ７の周端部７ａで遮断されると、投受光部４４は反射光βを検出せず、判定制御部５１は、その位置はウェハ７により遮光されていることを検知することができる。   For example, if the wafer 7 does not exist between the first protrusion 41 and the second protrusion 42, the detection light α from the light projecting / receiving unit 44 reaches the reflector 43 and then follows the optical axis ΔX. The reflected light β is recursively received by the light projecting / receiving unit 44, and the determination control unit 51 determines that there is no light shielding by the wafer, but the detection light α from the light projecting / receiving unit 44 is the peripheral edge 7a of the wafer 7. If the light is blocked, the light projecting / receiving unit 44 does not detect the reflected light β, and the determination control unit 51 can detect that the position is shielded by the wafer 7.

このようにして、検知部４をウェハ収納ケース６内の最上段の収納位置の高さまで上昇させることで、ウェハ収納ケース６内の各段についてウェハ７の有無や収納状態を検知する。収納状態とは、ウェハが複数枚重なっていないか、段違いで収納されていないか等をいう。   In this way, by raising the detection unit 4 to the height of the uppermost storage position in the wafer storage case 6, the presence / absence and storage state of the wafer 7 is detected for each stage in the wafer storage case 6. The storage state refers to whether a plurality of wafers are stacked or not stored in different levels.

検出が終了すると、制御手段５は、アーム制御部５２を介して水平移動部２を駆動して検知部４をウェハ収納ケース６内から取り外した後、第３関節部２Ｃを中心に接続部３４を１８０°回転させて保持部３が先端側を向くように姿勢変更する。そして、アーム制御部５２は、保持部３をウェハ収納ケース６内に前進させて、ウェハ７の収納が確認されている段から、ウェハ７の下側に非接触状態で保持部３を挿入し、続いて、昇降移動部１１を用いて保持部３を上昇させることにより、ウェハ７を保持部３に設けられた円弧状の凹部３１に載置する。そして、水平移動部２が保持部３を搬送基台１側に後退させる。最後に、ウェハ７を適宜の装置へ搬送して処理を終了する。   When the detection is completed, the control unit 5 drives the horizontal movement unit 2 via the arm control unit 52 to remove the detection unit 4 from the wafer storage case 6 and then connects the connection unit 34 around the third joint 2C. Is rotated 180 ° to change the posture so that the holding part 3 faces the tip side. Then, the arm control unit 52 advances the holding unit 3 into the wafer storage case 6 and inserts the holding unit 3 in a non-contact state below the wafer 7 from the stage where the storage of the wafer 7 is confirmed. Subsequently, the holding unit 3 is lifted by using the up-and-down moving unit 11 to place the wafer 7 on the arc-shaped recess 31 provided in the holding unit 3. Then, the horizontal movement unit 2 retracts the holding unit 3 toward the conveyance base 1 side. Finally, the wafer 7 is transferred to an appropriate apparatus and the process is terminated.

以上のように、本実施形態の半導体ウェハ搬送装置は、ウェハ収納ケース６に対してウェハ７の出し入れ、搬送を行うにあたり、前記ウェハ７の収納状態を検知するための検知部４を具備し、前記検知部４は前記ウェハ７との周端部の任意の２点を少なくとも挟み込むように離間配置させた投受光部４４及びリフレクタ４３を備え、前記投受光部４４が投光した検知光αをウェハ７又はリフレクタ４３で反射させた後、その反射光βを当該投受光部４４で受光するようにしているものである。   As described above, the semiconductor wafer transfer apparatus according to the present embodiment includes the detection unit 4 for detecting the storage state of the wafer 7 when the wafer 7 is put in and out of the wafer storage case 6 and transferred. The detection unit 4 includes a light projecting / receiving unit 44 and a reflector 43 that are spaced apart so as to sandwich at least two arbitrary points on the peripheral edge with the wafer 7, and the detection light α projected by the light projecting / receiving unit 44. After being reflected by the wafer 7 or the reflector 43, the reflected light β is received by the light projecting / receiving unit 44.

そして、リフレクタ４３は投受光部４４から投光された光軸ΔＸに向かって反射する特性を持つため、光軸ΔＸの調整時にリフレクタ側の向きを微調整する必要がなく、投受光部４４が配置された第２の突起部４２のみの光軸ΔＸの調整を実施するだけで済むとともに、投受光部４４の厳密な角度及び位置調整も不要になるため、組み付けやセッティングを極めて簡素に行うことが可能となる。   Since the reflector 43 has a characteristic of reflecting toward the optical axis ΔX projected from the light projecting / receiving unit 44, there is no need to finely adjust the direction of the reflector side when adjusting the optical axis ΔX. It is only necessary to adjust the optical axis ΔX of only the second projecting portion 42 arranged, and it is not necessary to strictly adjust the angle and position of the light projecting / receiving portion 44, so that assembly and setting are extremely simple. Is possible.

また、投光機能と受光機能を一つにまとめて投受光部４４として設置したため、検知部４に設けられた電力供給や検知信号の伝達を行う配線４４ａの設置スペースを減らすことができ、搬送装置の配線４４ａ及びその配線処理の簡略化も図ることができる。   In addition, since the light projecting function and the light receiving function are combined and installed as the light projecting / receiving unit 44, the installation space for the wiring 44a for supplying power and transmitting the detection signal provided in the detection unit 4 can be reduced, The wiring 44a of the device and its wiring processing can be simplified.

さらに、リフレクタ４３からの反射光βを検出に用い、この反射光βが入光するか遮られるかによってウェハ７の有無やウェハ７の状態を検出するようにしているため、ウェハ７の周端部７ａからの反射光βを利用する場合や、リフレクタ４３を設置せずに第１の突起部４１だけからの反射光βを利用する場合に比べて、検出精度も有効に向上させることができる。勿論、ウェハ７が存在する場合には投受光部４４に入光しないのが通例であるが、乱反射して入光する場合があっても、光の強度からリフレクタ４３で反射したのかウェハ７で反射したのかを識別させることは容易である。   Further, since the reflected light β from the reflector 43 is used for detection and the presence or absence of the wafer 7 and the state of the wafer 7 are detected depending on whether the reflected light β is incident or blocked, the peripheral edge of the wafer 7 is detected. Compared to the case where the reflected light β from the portion 7a is used or the case where the reflected light β from only the first protrusion 41 is used without installing the reflector 43, the detection accuracy can be effectively improved. . Of course, when the wafer 7 is present, it is usual that the light does not enter the light projecting / receiving unit 44. However, even if the light is diffusely reflected and incident, it is reflected by the reflector 43 from the intensity of the light. It is easy to identify the reflection.

加えて、投光部と受光部を別々に複数組で設ける必要がなくなることにより、半導体ウェハ搬送装置の製造コスト削減及び装置全体の構成の一層の簡略化を図ることが可能となる。   In addition, since it is not necessary to separately provide a plurality of sets of light projecting units and light receiving units, it is possible to reduce the manufacturing cost of the semiconductor wafer transfer device and further simplify the configuration of the entire device.

さらに、ウェハ７を保持する保持部３が、検知部４とともに第３関節部２Ｃを構成する回転支点を挟んで対向する位置に一体で備えられて、前記回転支点の回りに反転可能であるとともに、共通の昇降移動部１１及び水平移動部２に支持されているので、半導体ウェハ搬送装置の機構や制御をよりシンプルにすることができる。   Further, the holding unit 3 that holds the wafer 7 is integrally provided at a position facing the detection unit 4 across the rotation fulcrum that constitutes the third joint portion 2C, and can be reversed around the rotation fulcrum. Since it is supported by the common up-and-down moving unit 11 and the horizontal moving unit 2, the mechanism and control of the semiconductor wafer transfer device can be further simplified.

特に、ウェハ７の製造工程において、ウェハ７が高温状態であったり、ウェハ７の表面に薬剤が塗布されている場合等があり、保持部３上のウェハ７が載置されるアーム３１に検知部４を設けると、検知部４を構成する受光部等に悪影響が及ぶ恐れがあるが、本実施形態において検知部４は保持部３に対して離間した位置に設けてあるため、このような不具合も有効に回避することができる。   In particular, in the manufacturing process of the wafer 7, there are cases where the wafer 7 is in a high temperature state or a chemical is applied to the surface of the wafer 7, and the arm 31 on which the wafer 7 on the holding unit 3 is placed is detected. If the portion 4 is provided, there is a possibility that the light receiving portion and the like constituting the detection portion 4 may be adversely affected. However, in the present embodiment, the detection portion 4 is provided at a position separated from the holding portion 3. Problems can be avoided effectively.

以上、本発明の一実施形態について説明したが、各部の具体的な構成は、上述した実施形態のみに限定されるものではない。   As mentioned above, although one Embodiment of this invention was described, the specific structure of each part is not limited only to embodiment mentioned above.

例えば、図４及び図５に示すのは、別異の半導体ウェハ搬送装置であり、図４が当該半導体ウェハ搬送装置の平面図を示し、図５が保持部１０３を取り外して前方から見た斜視図である。   For example, FIGS. 4 and 5 show different semiconductor wafer transfer apparatuses, FIG. 4 shows a plan view of the semiconductor wafer transfer apparatus, and FIG. 5 is a perspective view as seen from the front with the holding unit 103 removed. FIG.

具体的に説明すると、この半導体ウェハ搬送装置は、基台レール１００に沿って移動可能な搬送基台１０１と、当該搬送基台１０１内に設けられた昇降移動部１１１と、当該昇降移動部１１１の上部に設けられた水平移動部１０２と、図示しない制御手段とから構成されており、さらに保持部１０３と検知部１０４が、本実施形態ではそれぞれ独立した状態で構成されている。   More specifically, the semiconductor wafer transfer apparatus includes a transfer base 101 that can move along the base rail 100, an up-and-down movement unit 111 provided in the transfer base 101, and the up-and-down movement unit 111. In this embodiment, the holding unit 103 and the detection unit 104 are configured independently of each other.

水平移動部１０２は、左右対称に設けられた第１のアーム１２１と第２のアーム１２２を備えている。より詳細には、昇降移動部１１１の直上に第１のアーム１２１の基端１２１ａが回転支軸を介して取り付けられており、(ここを第１関節部１０２Ａとする)、第１のアーム１２１の先端１２１ｂの上側に第２のアーム１２２の基端１２２ａが回転支軸を介して取り付けられている（ここを第２関節部１０２Ｂとする）。そして、一対の第２のアーム１２２の先端１２２ｂに、保持部１０３が回転支軸を介して備えられている（ここを第３関節部１０２Ｃとする）。   The horizontal moving unit 102 includes a first arm 121 and a second arm 122 provided symmetrically. More specifically, the base end 121a of the first arm 121 is attached via a rotation support shaft directly above the lifting and lowering moving unit 111 (this is referred to as the first joint portion 102A), and the first arm 121 is attached. The base end 122a of the second arm 122 is attached to the upper side of the distal end 121b of the second arm 122 via a rotation support shaft (this is referred to as a second joint portion 102B). And the holding | maintenance part 103 is provided in the front-end | tip 122b of a pair of 2nd arm 122 via the rotation spindle (this is made into the 3rd joint part 102C).

これらの第１、第２のアーム１２１、１２２は、それぞれの内部に図示しない駆動部（例えば、モータ、ギヤ、エアシリンダ、ボールネジ、ベルト等）が備わっており、第１、第２、第３関節部１０２Ａ、１０２Ｂ、１０２Ｃを駆動して、保持部１０３を基台レールレール１００と直交する方向に水平移動可能にしている。   Each of the first and second arms 121 and 122 is provided with a driving unit (not shown) (for example, a motor, a gear, an air cylinder, a ball screw, a belt, etc.) inside each of the first and second arms 121 and 122. The joint portions 102 </ b> A, 102 </ b> B, and 102 </ b> C are driven so that the holding portion 103 can be horizontally moved in a direction orthogonal to the base rail rail 100.

検知部１０４は、昇降移動部１１１の上端側において第１のアーム１２１、１２１の基端１２１ａ、１２１ａ間に設けられた中間レール１４５に沿って前記保持部１０３の移動方向と同一方向への進退移動を可能にしている。そして、この検知部１０４は、一実施形態と同様に二股に分かれており、当該検知部１０４の第１、第２の突起部１４１、１４２に、リフレクタ１４３と投受光部１４４をそれぞれ備えている。これら投受光部１４４及びリフレクタ１４３は、前記実施形態と同様、ウェハの周端部の任意の２点を少なくとも挟み込むように離間配置される。   The detection unit 104 advances and retreats in the same direction as the movement direction of the holding unit 103 along the intermediate rail 145 provided between the base ends 121a and 121a of the first arms 121 and 121 on the upper end side of the up-and-down movement unit 111. It is possible to move. The detection unit 104 is divided into two branches as in the embodiment, and the first and second protrusions 141 and 142 of the detection unit 104 are provided with a reflector 143 and a light projecting / receiving unit 144, respectively. . The light projecting / receiving unit 144 and the reflector 143 are spaced apart so as to sandwich at least two arbitrary points on the peripheral edge of the wafer, as in the above embodiment.

そして、電力供給や検知信号を当該投受光部１４４に伝達する配線１４４ａが、検知部１０４の第２の突起部１４２上に設けられている。   A wiring 144 a that transmits power supply and detection signals to the light projecting and receiving unit 144 is provided on the second protrusion 142 of the detection unit 104.

以上のような半導体ウェハ搬送装置を用いて図示しないウェハ収納ケース内のウェハの有無を含む収納状態を検知する場合は、制御手段が、水平移動部１０２によって保持部１０３を後退させた状態で、検知部１０４を中間レール１４５に沿って前進させ、一実施形態と同様に昇降移動部１１１によってウェハ収納ケースの最下段から最上段まで検知部１０４を上昇させながら、リフレクタ１４３における反射を利用した投受光部１４４での検知光の投受光により、制御手段内に設けられた判定制御部によってウェハの有無を含む収納状態の判定を行うものである。   When detecting the storage state including the presence or absence of a wafer in a wafer storage case (not shown) using the semiconductor wafer transfer apparatus as described above, the control means is in a state where the holding unit 103 is retracted by the horizontal moving unit 102, The detection unit 104 is advanced along the intermediate rail 145, and the projection using the reflection at the reflector 143 is performed while the detection unit 104 is raised from the lowermost stage to the uppermost stage of the wafer storage case by the up-and-down moving unit 111 as in the embodiment. Based on the projection and reception of the detection light by the light receiving unit 144, the determination control unit provided in the control means determines the storage state including the presence or absence of the wafer.

このように構成しても、簡易な構成を通じて前記実施形態と同様の作用効果を得ることができる。   Even if comprised in this way, the effect similar to the said embodiment can be acquired through a simple structure.

その他の構成も、本発明の趣旨を逸脱しない範囲で種々変形が可能である。   Other configurations can be variously modified without departing from the spirit of the present invention.

４、１０４…検知部
６…ウェハ収納ケース
７…ウェハ
４３、１４３…リフレクタ
４４、１４４…投受光部
α…検知光
β…反射光 4, 104 ... detection unit 6 ... wafer storage case 7 ... wafer 43, 143 ... reflector 44, 144 ... light projecting / receiving unit α ... detection light β ... reflected light

Claims (1)

ウェハ収納ケースに対してウェハの出し入れ、搬送を行うための半導体ウェハ搬送装置であって、
前記ウェハの収納状態を検知するための検知部を具備し、
前記検知部は前記ウェハの周端部の任意の２点を少なくとも挟み込むように離間配置させた投受光部及びリフレクタを備え、前記投受光部が投光した光をウェハ又はリフレクタで反射させた後、その反射光を当該投受光部で受光するようにしていることを特徴とする半導体ウェハ搬送装置。
A semiconductor wafer transfer device for transferring wafers in and out of a wafer storage case,
Comprising a detector for detecting the storage state of the wafer;
The detection unit includes a light projecting / receiving unit and a reflector that are spaced apart so as to sandwich at least two arbitrary points on the peripheral edge of the wafer, and the light projected by the light projecting / receiving unit is reflected by the wafer or the reflector. A semiconductor wafer transfer apparatus characterized in that the reflected light is received by the light projecting / receiving unit.
JP2010084415A 2010-03-31 2010-03-31 Semiconductor wafer conveying apparatus Pending JP2011216729A (en)

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CN113885090A (en) * 2021-08-30 2022-01-04 上海广川科技有限公司 Wafer detection device

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