CN110662397B

CN110662397B - Heat dissipation design method and heat dissipation structure of electronic equipment and electronic equipment

Info

Publication number: CN110662397B
Application number: CN201910920118.9A
Authority: CN
Inventors: 张恩利; 李阳; 李剑波
Original assignee: Shenzhen Skyworth Digital Technology Co Ltd
Current assignee: Shenzhen Skyworth Digital Technology Co Ltd
Priority date: 2019-09-26
Filing date: 2019-09-26
Publication date: 2020-12-08
Anticipated expiration: 2039-09-26
Also published as: CN110662397A

Abstract

The invention relates to the technical field of electronic product heat dissipation, and discloses a heat dissipation design method and a heat dissipation structure of electronic equipment and the electronic equipment. The heat dissipation design method of the electronic equipment comprises the following steps: obtaining a thermal distribution map of the working state of the PCB through thermal simulation; acquiring a heating source point according to the thermal distribution diagram, laying a heat dissipation copper foil on the periphery of the heating source point on the PCB, and forming a heat dissipation through hole on the PCB at the bottom of the heating source point; the metal casing is provided with a plurality of metal bulges, one part of the metal bulges is used for fixing the PCB and enabling the heating source point to be close to the bulges, and the other part of the metal bulges is used for being in contact with the heating source point. The heat emitted by the heating source point is conducted to the casing through the heat dissipation part, the heat is emitted through the casing, the heat dissipation part is in good contact with the heating source point, the heat dissipation area is large, the heat dissipation reliability is good, the heat dissipation part is arranged on the casing and is convenient to process, and the heat dissipation cost of the set top box is reduced.

Description

Heat dissipation design method and heat dissipation structure of electronic equipment and electronic equipment

Technical Field

The present invention relates to the field of heat dissipation technologies for electronic products, and in particular, to a heat dissipation design method for an electronic device, a heat dissipation structure for an electronic device, and an electronic device.

Background

With the rapid development of the electronic industry, the operation speed of electronic components is continuously increased, and a large amount of heat is generated during operation, so that the temperature of the electronic components and the temperature of a system are increased, and the stability of the system is further influenced. In order to ensure the normal operation of the electronic components, a heat dissipation device is usually mounted on the electronic components to dissipate the heat generated by the electronic components.

However, some electronic products have relatively small heat-generating source points such as thermosensitive devices mounted on the PCB and have a flat shape, so that the conventional heat sink cannot be effectively contacted with the electronic products, and the cost of the special heat sink is relatively high. In the prior art, a PCB heat dissipation method is to keep a thermosensitive device or a heating point away from a high heat flux density region, a cutting groove cuts off heat from the high heat flux density region to be conducted to the thermosensitive device or the heating point and a heat sink on the heating point of the thermosensitive device, and the design of the PCB is limited. If the bottom of the thermosensitive device or the heating point is connected with the shell bottom of the electronic product by adding the heat conducting gasket, the thickness of the heat conducting sheet is increased, the heat dissipation cost of the electronic product is improved, and the reliability is lower.

Disclosure of Invention

The invention aims to provide a heat dissipation design method and a heat dissipation structure of electronic equipment and the electronic equipment, which reduce the heat dissipation cost of the electronic equipment and have high reliability.

In order to achieve the purpose, the invention adopts the following technical scheme:

a heat dissipation design method of electronic equipment comprises the following steps:

obtaining a thermal distribution map of the working state of the PCB through thermal simulation;

acquiring a heat source point according to the heat distribution map, laying a heat dissipation copper foil on the periphery of the heat source point on the PCB, and forming a heat dissipation through hole on the PCB at the bottom of the heat source point;

the PCB heating device comprises a metal shell, a plurality of metal bulges and a plurality of heating source points, wherein the metal shell is provided with the plurality of metal bulges, one part of the bulges are used for fixing the PCB and enabling the heating source points to be close to the bulges, and the other part of the bulges are used for being in contact with the heating source points.

Preferably, the laying area of the heat dissipation copper foil is more than or equal to three times of the area of the heat generation source point.

A heat dissipation structure of electronic equipment is manufactured by adopting the heat dissipation design method of the electronic equipment, and comprises a metal casing, wherein a plurality of metal protruding parts protruding towards the inner side of the casing are arranged on the surface of the casing, each protruding part comprises a fixing part for fixing a PCB and at least one heat dissipation part in contact with a heating source point on the PCB, and the fixing part is arranged close to the heating source point. Preferably, the heat dissipation part includes a first convex hull formed by stamping from the outer surface of the casing to the inner side of the casing, and the heat generation source point is in contact with the first convex hull.

Preferably, the first convex hull comprises two first inclined plates which are symmetrically arranged and a first transverse plate of which two ends are connected with the two first inclined plates, and the heat generating source point is in contact with the surface of the first transverse plate.

Preferably, the first transverse plate is provided with heat dissipation holes, and heat conduction members are arranged in the heat dissipation holes.

Preferably, the heat conducting member is heat conducting silica gel injected into the heat radiating hole.

Preferably, the heat dissipation portion further includes at least one heat dissipation boss formed by stamping the outer surface of the casing towards the inner side of the casing, and a heat conduction gasket is arranged on the heat dissipation boss.

Preferably, a heat dissipation copper foil is laid on the periphery of the heat source point on the PCB, and a heat dissipation through hole is formed in the heat dissipation copper foil.

An electronic device comprises the heat dissipation structure of the electronic device.

The invention has the beneficial effects that: according to the invention, the heat emitted by the heating source point is conducted to the shell through the protruding part, the heat is emitted through the shell, the heat dissipation part is in good contact with the heating source point, the heat dissipation area is large, the heat dissipation reliability is good, the protruding part can play a role in fixing the PCB and also can play a role in heat dissipation, the heat dissipation cost of the electronic equipment is reduced, and the protruding part is arranged on the shell and is convenient to process.

Drawings

Fig. 1 is a flowchart of a heat dissipation design method for an electronic device according to an embodiment of the present invention;

fig. 2 is a schematic view of a connection structure between a PCB and a housing of an electronic device according to a second embodiment of the present invention;

fig. 3 is a schematic structural diagram of a housing according to a second embodiment of the present invention;

FIG. 4 is an enlarged schematic view at A of FIG. 3;

fig. 5 is an enlarged schematic view at B of fig. 3.

In the figure:

1. a housing; 2. a first convex hull; 21. a first sloping plate; 22. a first transverse plate; 23. heat dissipation holes; 3. a heat conductive member; 4. a second convex hull; 41. a second swash plate; 42. a second transverse plate; 5. a fixing hole; 6. a PCB; 7. a heat source point; 8. a heat sink pad; 9. the heat dissipation boss.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Example one

The embodiment provides a heat dissipation design method for electronic equipment, as shown in fig. 1, which mainly includes the following steps:

step one, obtaining a thermal distribution map of the working state of the PCB 6 through thermal simulation.

And step two, acquiring a heat source point 7 according to the heat distribution map, laying a heat dissipation copper foil on the periphery of the heat source point 7 on the PCB 6, and forming a heat dissipation through hole on the PCB 6 at the bottom of the heat source point 7.

Specifically, the heat generation source point 7 having a large amount of heat generation is acquired from the heat distribution map, and the heat dissipation area of the heat generation source point 7 having a large amount of heat generation needs to be additionally increased. In order to increase the heat dissipation area of the heat source point 7, a heat dissipation copper foil is laid on the periphery of the heat source point 7 on the PCB 6, and the area of the heat dissipation copper foil is more than or equal to three times of the area of the heat source point 7. A heat dissipation through hole is formed in the PCB 6 at the bottom of the heating source point 7, and heat of the heating source point 7 is conducted to the surface, opposite to the heating source point 7, of the PCB 6 through the heat dissipation through hole. In this embodiment, the aperture of the thermal dissipating via is set to 10-12 mils, and the distance between two adjacent thermal dissipating vias is 40 mils.

And step three, arranging a plurality of metal bulges on the metal casing 1, wherein one part of the bulges is used for fixing the PCB 6, the heating source point 7 is arranged close to the bulges, and the other part of the bulges is used for contacting with the heating source point 7.

Specifically, the fixed orifices have been seted up on some bulges, set up threaded hole on PCB 6's the heat dissipation copper foil, and PCB 6 passes through the bolt fastening on the bulge, and the heat that generates heat source point 7 gived off conducts to PCB 6's bottom through the heat dissipation via hole, and rethread heat dissipation copper foil conducts to the bolt, conducts the heat to the bulge through the bolt, then gives out through casing 1.

The other part of the protruding part is directly contacted with the heating source point 7, the heat of the heating source point 7 is conducted to the bottom of the PCB 6 through the heat dissipation through hole, then conducted to the protruding part through the heat dissipation copper foil, and then dissipated out through the casing 1, and the protruding part is directly used for heat dissipation of the heating source point 7, so that the heat dissipation area of the heating source point 7 is increased.

Example two

As shown in fig. 2 and fig. 3, the present embodiment provides a heat dissipation structure of an electronic device, which includes a chassis made of a metal material, a plurality of protruding portions protruding toward the inside of the chassis 1 are disposed on the surface of the chassis 1, the protruding portions are made of a metal material, and each protruding portion includes a fixing portion for fixing the PCB 6 and a heat dissipation portion contacting with a heat source point 7 on the PCB 6. The heat source 7 may be a critical device such as a heat sensitive device or the like.

After the PCB 6 is fixed with sufficient strength, the remaining protrusion can be used as a heat conduction component, the heat source point 7 on the PCB 6 can be designed above the protrusion, and the heat source point 7 is in contact with the protrusion after the PCB 6 is mounted. The heat of the heat source point 7 can be conducted to the protruding part through the heat dissipation through hole and then conducted to the casing 1 made of metal through the protruding part.

In this embodiment, a heat dissipation copper foil is laid on the periphery of the heat generation source point 7 on the PCB 6, and a heat dissipation via hole is formed on the PCB 6 at the bottom of the heat generation source point 7. The part is sent the heat source point 7 and can be close to the fixed part setting, has seted up the fixed orifices on the heat dissipation copper foil, and PCB 6 passes through the fixed orifices to be installed on the fixed part, and the heat that the source point 7 that generates heat distributes is conducted to the fixed part through the heat dissipation copper foil is fixed on, is conducted to casing 1 by the fixed part again, and the heat distributes away through casing 1. Part of the heat source points 7 are in contact with the heat dissipation part, and the heat dissipation part is in good contact with the heat source points 7, so that the heat dissipation area is large, and the heat dissipation reliability is good. The protruding part can play the effect of fixed PCB 6, can play radiating effect again, has reduced electronic equipment's heat dissipation cost, and the protruding part setting is convenient for process on casing 1.

In this embodiment, referring to fig. 3 and 4, the fixing portion includes at least one second convex hull 4 formed by stamping from the outer surface of the casing 1 to the inner side of the casing 1, and the second convex hull 4 is provided with a fixing hole 5. The second convex hull 4 that the inside punching press formed on casing 1 replaces the screw post of fixed PCB 6, plays the effect of supporting and connecting PCB 6, and second convex hull 4 passes through stamping forming, and processing is convenient, has reduced electronic equipment's installation cost.

In this embodiment, with reference to fig. 3, three second convex hulls 4 are provided on the chassis 1, the three second convex hulls 4 are distributed on the chassis 1 in a triangular shape, the three second convex hulls 4 support the PCB 6, and the PCB 6 is fixedly mounted on the chassis 1 by a connecting member passing through the fixing hole 5 and the mounting hole on the PCB 6. The provision of the three second convex hulls 4 improves the stability of fixing the PCB 6 and simplifies the mounting structure of the PCB 6.

In this embodiment, with reference to fig. 4, the second convex hull 4 includes two second inclined plates 41 symmetrically disposed and a second transverse plate 42 having two ends connected to the second inclined plates 41, one end of the second inclined plates 41 is connected to the casing 1, the other ends of the two second inclined plates 41 are both inclined inward, and the second transverse plate 42 is provided with a fixing hole 5. The structure is beautiful, and the inclined mode of the second inclined plate 41 provides enough space for assembling the PCB 6, thereby improving the installation efficiency.

In other embodiments, the inner surface of the casing 1 may further be provided with a boss protruding from the surface of the casing 1, the boss may be integrally connected with the casing 1, or may be connected with the casing 1 through a screw or other components, the PCB 6 is mounted on the boss, and the boss plays a role in supporting and fixing the PCB 6.

In general, a heat source point 7 is mounted on a PCB 6 of an electronic device, and it is inconvenient to connect a component having a heat dissipation function, such as a heat sink, to the heat source point 7 because the heat source point 7 has a small size. In this embodiment, in addition to being disposed close to the second convex hull, with reference to fig. 3 and 5, in order to solve the problem of heat dissipation of the heat source point 7, the heat source point 7 on the PCB 6 may be in contact with a heat dissipation part, and the heat dissipated by the heat source point 7 is dissipated through the heat dissipation part. The heat dissipation part and the fixing part have the same structure, after the PCB 6 is stably mounted on the casing 1, the protruding part arranged on the casing 1 is used as the heat dissipation part, and the heat dissipation part is arranged corresponding to the heating source point on the PCB 6. The heat dissipation part comprises at least one first convex hull 2 formed by stamping from the outer surface of the machine shell 1 to the inner side of the machine shell 1, and the heat generation source point 7 is in contact with the first convex hull 2. The first convex hull 2 and the shell 1 are integrally formed, and the structure is simple and the processing is convenient.

In order to improve the heat dissipation efficiency, the casing 1 is made of a metal material. Preferably, the casing 1 is made of iron, the iron has good heat conduction performance, and the iron first convex hull 2 is in contact with the heat source point 7 on the PCB 6 to reduce the heat flux density of the PCB 6 and control the temperature rise of the PCB 6. The heat that generates heat source point 7 and distribute on PCB 6 is conducted to first convex closure 2 through the heat dissipation via hole on PCB 6, and first convex closure 2 is with heat conduction to casing 1 on, and the heat distributes away through casing 1, and the radiating effect is good, and heat radiation structure is simple, has reduced electronic equipment's heat dissipation cost.

In the present embodiment, as shown in fig. 5, the first convex hull 2 includes two first inclined plates 21 symmetrically disposed and a first horizontal plate 22 having two ends connected to the first inclined plates 21, and the heat source point 7 is in contact with the surface of the first horizontal plate 22. The structure of the first convex hull 2 is the same as that of the second convex hull 4, the first convex hull 2 and the second convex hull 4 can be machined by using the same machining tool, the machining process is simplified, and the structure is simple and convenient to machine.

In other embodiments, the inner surface of the casing 1 may further be provided with a heat dissipating boss 9 protruding from the surface of the casing 1, the heat dissipating boss 9 may be integrally connected with the casing 1, or may be connected with the casing 1 through a screw or other parts, and the material of the heat dissipating boss 9 is preferably metal iron and is consistent with the material of the casing 1. Be equipped with heat conduction gasket 8 on the boss 9 that dispels the heat, PCB 6 generates heat source point 7 and heat conduction gasket 8 contact, and the heat loops through heat conduction gasket 8 and heat dissipation boss 9 and transmits for casing 1, and casing 1 distributes away the heat.

In order to reduce the thermal contact resistance between the PCB 6 and the first convex hull 2, as shown in fig. 5, heat dissipation holes 23 are formed in the first horizontal plate 22 of the first convex hull 2, heat conduction members 3 are disposed in the heat dissipation holes 23, and the heat conduction members 3 can also assist in conducting the heat from the heat source point 7 to the first convex hull 2.

In the present embodiment, the heat conducting member 3 is a heat conducting silicone, and the heat conducting silicone is injected into the heat dissipation hole 23. Heat conduction silica gel has the characteristic of rapid-curing cutback, and after heat conduction silica gel is dry, heat conduction silica gel can not only assist and give off the heat, can also connect PCB 6 and first convex closure 2, has improved the stability that PCB 6 and casing 1 are connected.

In this embodiment, the heat source point 7 on the PCB 6 is dissipated through the first convex hull 2 integrally formed with the casing 1, and the heat conductive silica gel is injected into the heat dissipation hole 23, so that the thermal contact resistance between the heat source point 7 and the first convex hull 2 can be reduced, and meanwhile, the viscosity of the heat conductive silica gel can play a role in fixing, thereby improving the stability of the structure and reducing the production cost of the electronic device. In addition, the structure has good heat dissipation effect, the temperature rise of the PCB 6 can be reduced from the original 17 ℃ to 15.7 ℃, and the heat dissipation effect is obvious.

In other embodiments, the heat dissipation holes 23 of the first convex hull 2 can be set to be threaded holes except for injecting heat-conducting silica gel, the first convex hull 2 and the PCB 6 are connected through metal screws, heat emitted from the heat source point 7 can be transmitted to the first convex hull 2 through the metal screws, and then transmitted to the case 1, and the metal screws play a role in heat dissipation and also play a role in fixing the PCB 6.

In other embodiments, a heat conducting member may also be provided on the first convex hull 2, with which the heat generating source point 7 is in contact. Especially, on the premise that the volume of the heat source point 7 is relatively large, the first convex hull 2 matched with the heat source point 7 is arranged on the shell 1, and then a heat conducting member for heat dissipation is arranged on the inner side of the first convex hull 2.

The embodiment also provides electronic equipment comprising the heat dissipation structure of the electronic equipment.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A heat dissipation design method of electronic equipment is characterized by comprising the following steps:

obtaining a thermal distribution map of the working state of the PCB (6) through thermal simulation;

acquiring a heat source point (7) according to the thermal distribution map, paving a heat dissipation copper foil on the periphery of the heat source point (7) on the PCB (6), and forming a heat dissipation through hole on the PCB (6) at the bottom of the heat source point (7);

a plurality of metal bulges are arranged on the metal casing (1), one part of the bulges is used for fixing the PCB (6) and enabling the heating source point (7) to be close to the bulges, and the other part of the bulges is used for contacting with the heating source point (7).

2. The heat dissipation design method of an electronic device according to claim 1, wherein a layout area of the heat dissipation copper foil is three times or more an area of the heat generation source point (7).

3. A heat dissipation structure of an electronic device, characterized by being manufactured by the heat dissipation design method of the electronic device according to any one of claims 1 to 2;

the heat dissipation structure comprises a metal casing (1), wherein a plurality of metal protruding parts protruding towards the inner side of the casing (1) are arranged on the surface of the casing (1), each protruding part comprises a fixing part for fixing a PCB (6) and a heat dissipation part in contact with a heat source point (7) on the PCB (6), and the fixing parts are arranged close to the heat source points (7);

and a heat dissipation copper foil is laid on the periphery of the heat source point (7) on the PCB (6), and a heat dissipation through hole is formed in the heat dissipation copper foil.

4. The heat dissipation structure of electronic equipment according to claim 3, wherein the heat dissipation part comprises a first convex hull (2) formed by stamping from the outer surface of the casing (1) to the inner side of the casing (1), and the heat source point (7) is in contact with the first convex hull (2).

5. The heat dissipation structure of electronic equipment according to claim 4, wherein the first convex hull (2) comprises two first inclined plates (21) symmetrically arranged and a first horizontal plate (22) having two ends connected to the two first inclined plates (21), and the heat source point (7) is in contact with a surface of the first horizontal plate (22).

6. The heat dissipation structure of electronic equipment according to claim 5, wherein the first horizontal plate (22) is provided with heat dissipation holes (23), and the heat dissipation holes (23) are provided with heat conducting members (3).

7. The heat dissipation structure of electronic equipment according to claim 6, wherein the heat conducting member (3) is a heat conducting silicone injected into the heat dissipation hole (23).

8. The heat dissipation structure of electronic equipment according to claim 3, wherein the heat dissipation part further comprises at least one heat dissipation boss (9) formed by stamping the outer surface of the casing (1) towards the inner side of the casing (1), and the heat dissipation boss (9) is provided with a heat conduction gasket (8).

9. An electronic device characterized by comprising the heat dissipation structure of the electronic device according to any one of claims 3 to 8.