CN110634962A - Solar cell and preparation method thereof - Google Patents

Solar cell and preparation method thereof Download PDF

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Publication number
CN110634962A
CN110634962A CN201810557031.5A CN201810557031A CN110634962A CN 110634962 A CN110634962 A CN 110634962A CN 201810557031 A CN201810557031 A CN 201810557031A CN 110634962 A CN110634962 A CN 110634962A
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China
Prior art keywords
thin film
film layer
layer
based thin
doped silicon
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CN201810557031.5A
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Chinese (zh)
Inventor
郁操
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Deyun Chuangxin (Beijing) Technology Co.,Ltd.
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Beijing Juntai Innovation Technology Co Ltd
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Priority to CN201810557031.5A priority Critical patent/CN110634962A/en
Priority to PCT/CN2018/107685 priority patent/WO2019227804A1/en
Priority to US16/157,822 priority patent/US20190371954A1/en
Priority to KR1020180122619A priority patent/KR20190137664A/en
Priority to EP18200324.4A priority patent/EP3576160A1/en
Priority to JP2018004005U priority patent/JP3220300U/en
Priority to AU2018253508A priority patent/AU2018253508A1/en
Publication of CN110634962A publication Critical patent/CN110634962A/en
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Abstract

The invention discloses a solar cell and a preparation method thereof, and belongs to the field of solar cells. The solar cell includes: a crystalline silicon substrate; the intrinsic thin film layer, the doped silicon-based thin film layer, the transparent conducting layer and the electrode are sequentially arranged on at least one surface of the crystalline silicon substrate; the area of the doped silicon-based thin film layer is smaller than that of the intrinsic thin film layer. According to the solar cell provided by the embodiment of the invention, the area of the doped silicon-based thin film layer is smaller than that of the intrinsic thin film layer, so that part of incident light can directly enter the crystalline silicon substrate through the transparent conducting layer and the intrinsic thin film layer without passing through the doped silicon-based thin film layer, the absorption loss of the doped silicon-based thin film layer to short-wave light in the incident light is reduced, and the efficiency of the cell is improved.

Description

Solar cell and preparation method thereof
Technical Field
The invention relates to the field of solar cells, in particular to a solar cell and a preparation method thereof.
Background
A solar cell is a device that directly converts light energy into electrical energy through a photoelectric effect or a photochemical effect.
In the prior art, a solar cell includes a crystalline silicon substrate, an intrinsic thin film, a doped silicon-based thin film, and an electrode sequentially disposed on the crystalline silicon substrate. Wherein, the doped silicon-based film is completely deposited on the intrinsic amorphous silicon-based film and covers the intrinsic film.
The inventor finds that at least the following problems exist in the prior art:
the doped silicon-based film has the function of short wave absorption, when incident light irradiates the solar cell, the doped silicon-based film can absorb a part of short wave (the wavelength is 300-600nm), so that the improvement of External Quantum Efficiency (EQE) is hindered, and the improvement of the cell efficiency is further limited.
Disclosure of Invention
The invention provides a solar cell and a preparation method thereof, which can solve the technical problems.
Specifically, the method comprises the following technical scheme:
in one aspect, the present invention provides a solar cell, comprising:
a crystalline silicon substrate;
the intrinsic thin film layer, the doped silicon-based thin film layer, the transparent conducting layer and the electrode are sequentially arranged on at least one surface of the crystalline silicon substrate;
the area of the doped silicon-based thin film layer is smaller than that of the intrinsic thin film layer.
In one possible design, the regions of the intrinsic thin film layer not covered by the doped silicon-based thin film layer are filled with a transparent conductive layer.
In one possible design, the doped silicon-based thin film layer includes at least two doped silicon-based thin film units, and the at least two doped silicon-based thin film units are discontinuous.
In one possible design, the discontinuous region of the at least two doped silicon-based thin film units is filled with a transparent conductive layer.
In one possible design, the doped silicon-based thin film units are strip-shaped.
In one possible design, the doped silicon-based thin film layer includes a hollow-out region.
In one possible design, the hollowed-out area is filled with a transparent conductive layer.
In one possible design, the doped silicon-based thin film layer is an n-type doped layer or a p-type doped layer.
In one possible design, the crystalline silicon substrate is an n-type monocrystalline silicon wafer or a p-type monocrystalline silicon wafer; and/or the intrinsic thin film layer comprises an intrinsic amorphous silicon thin film; and/or the transparent conductive layer comprises a transparent conductive oxide layer; and/or the electrode comprises a silver grid and/or a copper electrode.
In one possible design, the doped silicon-based thin film layers on different sides of the crystalline silicon substrate are of different conductivity types.
In another aspect, the present invention further provides a method for manufacturing a solar cell, including:
forming an intrinsic thin film layer on at least one side of the crystalline silicon substrate;
forming a doped silicon-based thin film layer with the area smaller than that of the intrinsic thin film layer on the intrinsic thin film layer;
forming the transparent conducting layer on the doped silicon-based thin film layer;
and forming an electrode on the transparent conductive layer.
In one possible design, the method of making further comprises: and forming the transparent conductive layer on the intrinsic thin film layer in the area which is not covered with the doped silicon-based thin film layer.
In one possible design, the forming a doped silicon-based thin film layer with an area smaller than that of the intrinsic thin film layer on the intrinsic thin film layer includes:
arranging a protective layer on the doped silicon-based thin film layer, and arranging a pattern on the protective layer;
removing the doped silicon-based thin film layer on the pattern;
and removing the protective layer.
In one possible design, the preparing an electrode on the transparent conductive layer includes:
and forming a silver grid and/or a copper electrode on the transparent conducting layer.
The technical scheme provided by the embodiment of the invention has the beneficial effects that at least:
according to the solar cell provided by the embodiment of the invention, the area of the doped silicon-based thin film layer is smaller than that of the intrinsic thin film layer, so that part of incident light can directly enter the crystalline silicon substrate through the transparent conducting layer and the intrinsic thin film layer without passing through the doped silicon-based thin film layer, the absorption loss of the doped silicon-based thin film layer to short-wave light is reduced, and the efficiency of the cell is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a solar cell according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another solar cell according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another solar cell according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a solar cell based on FIG. 3;
FIG. 5 is a schematic structural diagram of another solar cell based on FIG. 3;
FIG. 6 is a schematic view of a process for fabricating the solar cell of FIG. 3;
FIG. 7 is a schematic view of a process for fabricating the solar cell of FIG. 4;
fig. 8 is a schematic view of a process for manufacturing the solar cell of fig. 5.
The reference numerals in the drawings denote:
a 1-crystalline silicon substrate;
2-an intrinsic thin film layer;
3-doping a silicon-based thin film layer;
4-a transparent conductive layer;
5-an electrode;
6-protective layer.
Detailed Description
In order to make the technical solutions and advantages of the present invention clearer, the following will describe embodiments of the present invention in further detail with reference to the accompanying drawings. Unless defined otherwise, all technical terms used in the examples of the present invention have the same meaning as commonly understood by one of ordinary skill in the art.
In a first aspect, an embodiment of the present invention provides a solar cell, as shown in fig. 1, the solar cell includes: a crystalline silicon substrate 1;
an intrinsic thin film layer 2, a doped silicon-based thin film layer 3, a transparent conductive layer 4 and an electrode 5 which are sequentially arranged on at least one surface of a crystalline silicon substrate 1;
the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2.
It is understood that the intrinsic thin film layer 2, the doped silicon-based thin film layer 3, and the transparent conductive layer 4 are sequentially laminated on at least one side of the crystalline silicon substrate 1, and the electrode 5 is disposed on the transparent conductive layer 4.
When incident light irradiates the solar cell, because the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2, part of the incident light can directly enter the crystalline silicon substrate 1 through the transparent conductive layer 4 and the intrinsic thin film layer 2, when the incident light irradiates a PN junction formed by the crystalline silicon substrate 1 and the doped silicon-based thin film layer 3, carriers are generated, and the carriers are collected in the transparent conductive layer 4 through the intrinsic thin film layer 2 and the doped silicon-based thin film layer 3 and then are led out through the electrode 5. Wherein, the intrinsic thin film layer 2 is used for passivating the surface defects of the crystalline silicon substrate 1.
According to the solar cell provided by the embodiment of the invention, the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2, so that part of incident light can directly enter the crystalline silicon substrate 1 through the transparent conducting layer 4 and the intrinsic thin film layer 2 without passing through the doped silicon-based thin film layer 3, the absorption loss of the doped silicon-based thin film layer 3 to short-wave light in the incident light is reduced, and the efficiency of the cell is improved.
In the above solar cell, the doped silicon-based thin film layer 3 is stacked on the intrinsic thin film layer 2, and the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2, it can be understood that the intrinsic thin film layer 2 has a region not covered by the doped silicon-based thin film layer 3, that is, there may be a blank region on the layer where the doped silicon-based thin film layer 3 is located, and a part of incident light may enter the crystalline silicon substrate 1 through the blank region.
The region of the intrinsic thin film layer 2 not covered by the doped silicon-based thin film layer 3 may be a blank region or may be filled with other materials. In consideration of convenience in the preparation of the solar cell, the region of the intrinsic thin film layer 2 not covered with the doped silicon-based thin film layer 3 may be filled with the transparent conductive layer 4. The transparent conductive layer 4 allows incident light to pass smoothly without causing absorption loss of short-wave light.
In the above solar cell, the area of the doped silicon-based thin film layer 3 is smaller than the area of the intrinsic thin film layer 2, which can be realized in various ways.
In one possible embodiment, as shown in fig. 1, the area of the doped silicon-based thin film layer 3 may be smaller than the area of the intrinsic thin film layer 2 by reducing the area of the periphery of the doped silicon-based thin film layer 3 to form a blank area around the doped silicon-based thin film layer 3.
Furthermore, the transparent conductive layer 4 can be filled around the doped silicon-based thin film layer 3 corresponding to the blank area of the intrinsic thin film layer 2.
When the solar cell is applied, part of incident light can penetrate through the transparent conducting layer 4, directly enters the crystalline silicon substrate 1 through the intrinsic thin film layer 2 through the blank areas around the doped layer silicon-based thin film layer 3, so that the part of light does not pass through the doped layer silicon-based thin film layer 3, the absorption loss of the doped layer silicon-based thin film layer 3 to short-wave light in the incident light is reduced, and the efficiency of the cell is improved.
In another possible embodiment, as shown in fig. 2, the doped silicon-based thin film layer 3 may include a hollow-out region. That is, a blank area may be formed inside the doped silicon-based thin film layer 3, so that the doped silicon-based thin film layer 3 forms a continuous thin film having a hollow area, and the area of the doped silicon-based thin film layer 3 is smaller than the area of the intrinsic thin film layer 2.
Wherein, the technician can set up the shape of this fretwork district as required. Illustratively, the hollow-out area may be a blank rectangle or a blank circle (as shown in fig. 2) located inside the doped silicon-based thin film layer 3.
Further, the hollow area may be filled with the transparent conductive layer 4.
When the solar cell is applied, part of incident light can penetrate through the transparent conducting layer 4, directly enters the crystalline silicon substrate 1 through the intrinsic thin film layer 2 through the hollow-out area on the doped layer silicon-based thin film layer 3, so that the part of light does not pass through the doped layer silicon-based thin film layer 3, the absorption loss of the doped layer silicon-based thin film layer 3 to short-wave light in the incident light is reduced, and the efficiency of the cell is improved.
In yet another possible embodiment, as shown in fig. 3, the doped silicon-based thin film layer 3 may further include at least two doped silicon-based thin film units, and the at least two doped silicon-based thin film units are discontinuous. That is, the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2 by having a gap between two adjacent doped silicon-based thin film units.
The doped silicon-based thin film units may be in the shape of a square ring or a circular ring, and the doped silicon-based thin film units may be in the shape of a plurality of square rings or a plurality of circular rings, which are sleeved together to form the doped silicon-based thin film layer 3. In addition, in consideration of the convenience of the preparation process, the doped silicon-based thin film unit may also be in a stripe shape (as shown in fig. 3), and for example, the doped silicon-based thin film unit may be in a straight stripe shape, or an arc stripe shape. So set up, not only be convenient for technology preparation, also be convenient for follow-up electrode 5 of setting up in order to collect the carrier.
Further, the discontinuous region of at least two doped silicon-based thin film units can be filled with a transparent conductive layer 4.
When the solar cell is applied, part of incident light can penetrate through the transparent conducting layer 4, directly enters the crystalline silicon substrate 1 through the intrinsic thin film layer 2 through a gap between two adjacent doped silicon-based thin film units, so that the part of light does not pass through the doped silicon-based thin film layer 3, the absorption loss of the doped silicon-based thin film layer 3 to short-wave light in the incident light is reduced, and the efficiency of the cell is improved.
In the solar cell, in order to facilitate the collection and extraction of carriers, the electrode 5 may correspond to the doped silicon-based thin film layer 3.
When the doped silicon-based thin film layer doped electrode is applied, the transparent conducting layer 4 is formed on the doped silicon-based thin film layer 3 and covers the region, which is not covered with the doped silicon-based thin film layer 3, on the intrinsic thin film layer 2, and the electrode 5 is formed on the transparent conducting layer 4, so that the electrode 5 is positioned above the doped silicon-based thin film layer 3 and corresponds to the doped silicon-based thin film layer 3. In one possible embodiment, the electrodes 5 may be in one-to-one correspondence with the doped silicon-based thin film elements.
In the solar cell, the doped silicon-based thin film layer 3 may be formed on one surface of the crystalline silicon substrate 1, or may be formed on both surfaces of the crystalline silicon substrate 1. A PN junction is formed between the impurity silicon-based thin film layer 3 and the crystalline silicon substrate 1, the crystalline silicon substrate 1 can be a p-type monocrystalline silicon piece or an n-type monocrystalline silicon piece, and correspondingly, the doped silicon-based thin film layer 3 can be an n-type doped layer or a p-type doped layer. The solar cell covered above is exemplified below.
In one possible embodiment, as shown in fig. 1-3, the solar cell comprises: a crystalline silicon substrate 1;
an intrinsic thin film layer 2, a doped silicon-based thin film layer 3, a transparent conductive layer 4 and an electrode 5 which are sequentially arranged on one surface of a crystalline silicon substrate 1; the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2.
When the crystalline silicon substrate 1 is selected as a p-type monocrystalline silicon wafer, the doped silicon-based thin film layer 3 can be an n-type doped layer; when the crystalline silicon substrate 1 is selected to be an n-type monocrystalline silicon wafer, the doped silicon-based thin film layer 3 may be a p-type doped layer.
When the solar cell is applied, one surface of the doped silicon-based thin film layer 3 is used as an illuminated surface, and as the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2, part of incident light can directly enter the crystalline silicon substrate 1 through the transparent conducting layer 4 and the intrinsic thin film layer 2 without passing through the doped silicon-based thin film layer 3, the absorption loss of the doped silicon-based thin film layer 3 to short-wave light in the incident light can be reduced, and the improvement of the cell efficiency is.
It should be noted that: fig. 1 to 3 show only the structure of a first side of the solar cell, and the structure of a second side opposite to the first side is not shown; the structure on the second side of the solar cell in fig. 1-3 may be prior art or may be the same as the structure on the first side.
In another possible embodiment, as shown in fig. 4, the solar cell includes: a crystalline silicon substrate 1;
the intrinsic thin film layer 2, the doped silicon-based thin film layer 3, the transparent conducting layer 4 and the electrode 5 are sequentially arranged on two sides of the crystalline silicon substrate 1; the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2.
The crystalline silicon substrate 1 may be a p-type monocrystalline silicon wafer or an n-type monocrystalline silicon wafer, and the silicon-based thin film layers 3 formed on different surfaces of the crystalline silicon substrate 1 have different conductivity types, that is, an n-type doped layer is formed on one surface of the crystalline silicon substrate 1, and a p-type doped layer is formed on the opposite surface of the crystalline silicon substrate 1.
When the solar cell is applied, any one surface of the doped silicon-based thin film layer 3 is used as a light receiving surface (the other opposite surface is a backlight surface), and as the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2, part of incident light can directly enter the crystalline silicon substrate 1 through the transparent conducting layer 4 and the intrinsic thin film layer 2 which are positioned at two sides of the cell and does not pass through the doped silicon-based thin film layer 3, the absorption loss of the doped silicon-based thin film layer 3 to short-wave light in the incident light can be reduced. By the arrangement, the light absorption loss of the light receiving surface and the backlight surface of the battery can be reduced simultaneously, and the battery efficiency is improved.
In fact, considering that the solar cell has less incident light contacting the backlight surface, in order to save the process and the manufacturing cost, the doped silicon-based thin film layer 3 on the backlight surface may not be processed, that is, as shown in fig. 5, the area of the doped silicon-based thin film layer 3 on the backlight surface is the same as the area of the intrinsic thin film layer 2, and only the area of the doped silicon-based thin film layer 3 on the light receiving surface is smaller than the area of the intrinsic thin film layer 2.
The doped silicon-based thin film layer 3 can be any one of a-Si H, a-SiOx H, μ c-SiOx H and the like, and is preferably a-Si: H.
In addition, the intrinsic thin film layer 2 may include an intrinsic amorphous silicon thin film. Illustratively, the intrinsic thin film layer 2 may be selected from an amorphous silicon film (a-Si: H) or an amorphous silicon oxygold film (a-SiOx: H), or the like.
In addition, the transparent conductive layer 4 may include a transparent conductive oxide layer, and the transparent conductive layer 4 may be exemplarily selected from an ITO film (tin-doped indium oxide transparent conductive film), an IWO film (tungsten-doped indium oxide transparent conductive film), an ICO film (cesium-doped indium oxide transparent conductive film), or the like.
In addition, the electrode 5 may comprise a silver grid and/or a copper electrode.
Compared with the existing solar cell, the solar cell provided by the invention can obviously improve the optical response of the cell in the whole wave band, and particularly improves the shortwave current density of the cell by 0.5mA/cm in the range of shortwave 300-600nm2Thereby improving the battery efficiency.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a solar cell, where the method includes:
step 101, forming an intrinsic thin film layer 2 on at least one surface of a crystalline silicon substrate 1;
102, forming a doped silicon-based thin film layer 3 with the area smaller than that of the intrinsic thin film layer 2 on the intrinsic thin film layer 2;
103, forming a transparent conducting layer 4 on the doped silicon-based thin film layer 3;
step 104, forming an electrode 5 on the transparent conductive layer 4.
The preparation method provided by the embodiment of the invention can obtain the solar cell with the area of the doped silicon-based thin film layer 3 smaller than that of the intrinsic thin film layer 2, and the solar cell enables part of incident light to directly enter the crystalline silicon substrate 1 through the transparent conducting layer 4 and the intrinsic thin film layer 2 without passing through the doped silicon-based thin film layer 3, so that the absorption loss of the doped silicon-based thin film layer 3 to short-wave light in the incident light is reduced, and the improvement of the cell efficiency is promoted; and the preparation method is simple and convenient for production.
For step 101, an intrinsic thin film layer 2 may be deposited on at least one side of a crystalline silicon substrate 1 by a chemical vapor deposition method (e.g., PECVD deposition method), wherein the crystalline silicon substrate 1 may be an n-type monocrystalline silicon wafer or a p-type monocrystalline silicon wafer, preferably, an n-type monocrystalline silicon wafer is used as the crystalline silicon substrate 1, and the n-type monocrystalline silicon wafer has a thickness of 90-300 μm and a resistivity of 1-12 Ωcm. The intrinsic thin film layer 2 can be selected from amorphous silicon film (a-Si: H) or amorphous silicon oxygold film (a-SiO)xH) and the thickness of the intrinsic thin film layer 2 may be 3-15 nm.
In addition, it can be understood that before the deposition of the intrinsic thin film layer 2, the crystalline silicon substrate 1 may be subjected to a damage layer, alkali texturing, RCA cleaning, etc. to form pyramid sizes on the surface of the silicon wafer, reduce the reflection loss of the surface light of the cell, and remove the contamination of organic matters, particles, metal ions, etc. on the surface of the silicon wafer.
For step 102, a doped silicon-based thin film layer 3 may first be deposited on the intrinsic thin film layer 2.
In the above preparation method, the doped silicon-based thin film layer 3 may be deposited on one side of the crystalline silicon substrate 1, or may be deposited on both sides of the crystalline silicon substrate 1. When the doped silicon-based thin film layer 3 is deposited on one surface of the crystalline silicon substrate 1, the doped silicon-based thin film layer 3 can be selected to be an n-type doped silicon-based thin film or a p-type doped silicon-based thin film based on the type of the crystalline silicon substrate 1 so as to form a PN junction with the crystalline silicon substrate 1; and when the doped silicon-based thin film layer 3 is deposited on two sides of the crystalline silicon substrate 1, an n-type doped layer can be deposited on one side of the crystalline silicon substrate 1, and a p-type doped layer can be deposited on the opposite side of the crystalline silicon substrate 1.
The doped silicon-based thin film layer 3 may be selected from any one of a-Si H, a-SiOx H, μ c-SiOx H, etc., and the doped silicon-based thin film layer 3 may have a thickness of 4-20nm when it is an n-type doped silicon-based thin film, and a thickness of 5-30nm when it is a p-type doped silicon-based thin film.
Then the area of the doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2, and the process can be realized in various ways.
In a possible embodiment, the doped silicon-based thin film layer 3 may be etched by a laser method or a photolithography method, so that a blank area is formed on the doped silicon-based thin film layer 3, and thus the area of the formed doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2.
In another possible embodiment, this can also be achieved by setting a mask:
illustratively, a protective layer 6 may be disposed on the doped silicon-based thin film layer 3, and a pattern may be disposed on the protective layer 6;
removing the doped silicon-based thin film layer 3 in the pattern;
the protective layer 6 is removed.
The passivation layer 6 may be a SiOx film, and it is understood that the pattern is disposed on the passivation layer 6 by removing the passivation layer 6 in the disposed pattern to expose the doped silicon-based thin film layer 3.
During preparation, a protective layer 6 can be deposited on the doped silicon-based thin film layer 3 on one surface or two surfaces of the crystalline silicon substrate 1 according to actual needs, and then a required pattern is scribed on the protective layer 6 by adopting a laser scribing method; and then, immersing the surface of the crystalline silicon substrate 1 provided with the protective layer 6 into a first etching solution (such as alkali solution and deionized water) by adopting a chemical etching method to remove the doped silicon-based thin film layer 3 in the pattern (i.e. not covered by the protective layer 6), and then immersing the surface into a second etching solution (such as HF solution) to remove the protective layer 6, so that the area of the formed doped silicon-based thin film layer 3 is smaller than that of the intrinsic thin film layer 2.
Wherein the deposition temperature of the SiOx film can be 180-240 ℃, the radio frequency power is 13.56MHz or 40MHz, and the power density is 0.03W/cm2-25W/cm2In addition, CO2/SiH4＝0.5-10,H2/SiH4＝1-1000。
The pattern scribed on the protective layer 6 may divide the protective layer 6 into protective units that are continuous or discontinuous with respect to each other. Accordingly, under the mask action of the protective layer 6, the formed doped silicon-based thin film layer 3 may be a continuous thin film or a discontinuous thin film.
Illustratively, the pattern may be a rectangle or a circle in the middle of the protection layer 6, and thus the doped silicon-based thin film layer 3 may form a continuous thin film with a hollow area; the pattern may also be a plurality of strips that are located on the protection layer 6 and penetrate through the protection layer 6, or a plurality of long frames or rings that are located on the protection layer 6 and have different sizes, so that the doped silicon-based thin film layer 3 may be formed as a discontinuous thin film having a plurality of doped silicon-based thin film units.
For step 103, a transparent conductive layer 4 may be deposited on the doped silicon-based thin film layer 3 by a chemical vapor deposition method, wherein the transparent electrode layer 4 may be a transparent conductive oxide layer, such as an ITO film, an IWO film, or an ICO film, and the thickness of the transparent conductive layer 4 may be 70-80 nm.
In view of the convenience of actual preparation, the preparation method may further comprise: a transparent conductive layer 4 is formed on the intrinsic thin film layer 2 in a region not covered with the doped silicon-based thin film layer 3. The transparent conductive layer 4 allows incident light to pass smoothly without causing absorption loss for short wavelengths.
In preparation, when the transparent conductive layer 4 is deposited on the doped silicon-based thin film layer 3, the transparent conductive layer 4 is also formed on the intrinsic thin film layer 2 in a region not covered with the doped silicon-based thin film layer 3 and fills the region.
For step 104, preparing the electrode 5 on the conductive layer 4 may include:
a silver grid and/or copper electrodes are formed on the transparent conductive layer 4.
During preparation, a silver grid can be printed on the transparent electrode layer 4 through screen printing; and/or a copper electrode is prepared on the transparent electrode layer 4 by electroplating. A silver grid and/or a copper electrode as electrode 5.
In order to more clearly illustrate the manufacturing method provided by the present invention, the following exemplary processes for manufacturing the solar cell shown in fig. 3 to 5 are described.
Fig. 3 shows a solar cell with a doped silicon-based thin film layer 3 deposited on one side of a crystalline silicon substrate 1, and the preparation process thereof is shown in fig. 6 and may include the following steps:
depositing an intrinsic thin film layer 2 on one surface of a crystalline silicon substrate 1, and depositing a doped silicon-based thin film layer 3 on the intrinsic thin film layer 2;
depositing a protective layer 6 on the doped silicon-based thin film layer 3, and scribing a plurality of discontinuous strip-shaped patterns on the protective layer 6, so that the protective layer 6 forms a plurality of discontinuous strip-shaped protective units and the doped silicon-based thin film layer 3 is exposed;
immersing the surface with the protective layer 6 into a first etching solution by adopting a single-surface etching method, and removing the exposed (not covered by the protective layer 6) doped silicon-based thin film layer 3;
then the surface is immersed into a second etching solution to remove the protective layer 6;
depositing a transparent conducting layer 4 on the doped silicon-based thin film layer 3, wherein the deposited transparent conducting layer 4 fills the region which is not covered by the doped silicon-based thin film layer 3 on the intrinsic thin film layer 2;
the electrode 5 is prepared on the transparent conductive layer 4 by means of screen printing or electroplating, and the solar cell shown in fig. 3 can be obtained.
Fig. 4 shows a solar cell with doped silicon-based thin film layers 3 deposited on both sides of a crystalline silicon substrate 1, and the manufacturing process thereof is shown in fig. 7 and may include the following steps:
depositing intrinsic thin film layers 2 on two sides of a crystalline silicon substrate 1 respectively, and depositing doped silicon-based thin film layers 3 on the intrinsic thin film layers 2 respectively, wherein one side is an n-type doped layer, and the other opposite side is a p-type doped layer;
respectively depositing a protective layer 6 on the doped silicon-based thin film layer 3, and scribing a plurality of discontinuous strip-shaped patterns on the protective layer 6, so that the protective layer 6 forms a plurality of discontinuous strip-shaped protective units, and the doped silicon-based thin film layer 3 is exposed;
respectively immersing two sides of the crystalline silicon substrate 1 into a first etching solution by adopting an etching method, and removing the exposed (not covered by the protective layer 6) doped silicon-based thin film layer 3;
then, the two surfaces are respectively immersed into a second etching solution to remove the protective layer 6;
respectively depositing transparent conducting layers 4 on the doped silicon-based thin film layers 3, wherein the deposited transparent conducting layers 4 fill the regions, which are not covered by the doped silicon-based thin film layers 3, on the intrinsic thin film layer 2;
the electrodes 5 are respectively prepared on the transparent conductive layer 4 by means of screen printing or electroplating, and the solar cell shown in fig. 4 can be obtained.
Considering that the solar cell has less incident light on the back surface, in order to save the process and the manufacturing cost, the doped silicon-based thin film layer 3 on the back surface may not be processed, as shown in fig. 5, the manufacturing process of the solar cell is shown in fig. 8, and may include the following steps:
depositing intrinsic thin film layers 2 on two sides of a crystalline silicon substrate 1 respectively, and depositing doped silicon-based thin film layers 3 on the intrinsic thin film layers 2 respectively, wherein one side is an n-type doped layer, and the other opposite side is a p-type doped layer;
depositing a protective layer 6 on the doped silicon-based thin film layer 3 on one surface, and scribing a plurality of discontinuous strip-shaped patterns on the protective layer 6, so that the protective layer 6 forms a plurality of discontinuous strip-shaped protective units, and the doped silicon-based thin film layer 3 is exposed;
immersing the surface with the protective layer 6 into a first etching solution by adopting a single-surface etching method, and removing the exposed (not covered by the protective layer 6) doped silicon-based thin film layer 3;
then, the surface is immersed into a second etching solution, and the protective layer 6 is removed;
depositing a transparent conducting layer 4 on the doped silicon-based thin film layer 3, wherein the deposited transparent conducting layer 4 fills the region which is not covered by the doped silicon-based thin film layer 3 on the intrinsic thin film layer 2;
the electrode 5 is prepared on the transparent conductive layer 4 by means of screen printing or electroplating, and the solar cell shown in fig. 5 can be obtained.
Compared with the existing solar cell, the solar cell prepared by the preparation method provided by the invention can obviously improve the optical response of the cell in the whole wave band, and particularly improve the shortwave current density of the cell by 0.5mA/cm in the range of shortwave 300-2Thereby improving the battery efficiency.
It is understood that x may be 1 to 2 for SiOx referred to in the examples of the present invention.
The above description is only for facilitating the understanding of the technical solutions of the present invention by those skilled in the art, and is not intended to limit the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (14)

1. A solar cell, comprising:
a crystalline silicon substrate (1);
the intrinsic thin film layer (2), the doped silicon-based thin film layer (3), the transparent conducting layer (4) and the electrode (5) are sequentially arranged on at least one surface of the crystalline silicon substrate (1);
the area of the doped silicon-based thin film layer (3) is smaller than that of the intrinsic thin film layer (2).
2. Solar cell according to claim 1, characterized in that the regions of the intrinsic thin film layer (2) not covered by the doped silicon based thin film layer (3) are filled with a transparent conductive layer (4).
3. Solar cell according to claim 1, characterized in that said doped silicon based thin film layer (3) comprises at least two doped silicon based thin film units, and said at least two doped silicon based thin film units are discontinuous.
4. Solar cell according to claim 3, characterized in that the discontinuous regions of said at least two doped silicon-based thin film units are filled with a transparent conductive layer (4).
5. The solar cell of claim 3, wherein the doped silicon-based thin film units are in the shape of stripes.
6. The solar cell according to claim 1, characterized in that the doped layer silicon-based thin film layer (3) comprises hollowed-out areas.
7. Solar cell according to claim 6, characterized in that the hollowed-out area is filled with a transparent conductive layer (4).
8. Solar cell according to claim 1, characterized in that said doped silicon based thin film layer (3) is an n-doped layer or a p-doped layer.
9. The solar cell according to claim 1, characterized in that the crystalline silicon substrate (1) is an n-type monocrystalline silicon wafer or a p-type monocrystalline silicon wafer; and/or the intrinsic thin film layer (2) comprises an intrinsic amorphous silicon thin film; and/or the transparent conductive layer (4) comprises a transparent conductive oxide layer; and/or said electrode (5) comprises a silver grid and/or a copper electrode.
10. Solar cell according to claim 1, characterized in that the conductivity type of the doped silicon based thin film layer (3) on different sides of the crystalline silicon substrate (1) is different.
11. A method of fabricating a solar cell, the method comprising:
forming an intrinsic thin film layer (2) on at least one surface of a crystalline silicon substrate (1);
forming a doped silicon-based thin film layer (3) with the area smaller than that of the intrinsic thin film layer (2) on the intrinsic thin film layer (2);
forming the transparent conducting layer (4) on the doped silicon-based thin film layer (3);
and forming an electrode (5) on the transparent conductive layer (4).
12. The method of manufacturing according to claim 11, further comprising: and forming the transparent conductive layer (4) on the intrinsic thin film layer (2) in the region which is not covered by the doped silicon-based thin film layer (3).
13. The method of manufacturing according to claim 11, wherein the forming of the doped silicon-based thin film layer (3) having a smaller area than the intrinsic thin film layer (2) on the intrinsic thin film layer (2) comprises:
arranging a protective layer (6) on the doped silicon-based thin film layer (3), and arranging a pattern on the protective layer (6);
removing the doped silicon-based thin film layer (3) on the pattern;
removing the protective layer (6).
14. The method of manufacturing according to claim 11, wherein the manufacturing of the electrode (5) on the transparent conductive layer (4) comprises:
forming a silver grid and/or a copper electrode on the transparent conductive layer (4).
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