CN110632403A - Method for automatically testing power supply ripple noise - Google Patents
Method for automatically testing power supply ripple noise Download PDFInfo
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- CN110632403A CN110632403A CN201910798262.XA CN201910798262A CN110632403A CN 110632403 A CN110632403 A CN 110632403A CN 201910798262 A CN201910798262 A CN 201910798262A CN 110632403 A CN110632403 A CN 110632403A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/26—Measuring noise figure; Measuring signal-to-noise ratio
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
- G01R31/42—AC power supplies
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Abstract
The invention belongs to the field of ripple noise, in particular to a method for automatically testing power supply ripple noise, which aims at solving the problems that the existing mode for measuring the power supply ripple noise is to use an oscilloscope probe to manually point-contact two ends of an output pin of a single-board power supply module, the power supply ripple noise cannot be accurately measured due to instability, the labor and the time are consumed, and the efficiency is low, and provides the following scheme, which comprises the following steps of S1: firstly, calibrating the oscilloscope, and correctly debugging the original waveform of the oscilloscope before testing, S2: the oscilloscope is set, the oscilloscope probe adopts a single-ended passive probe, and the probe attenuation ratio adopts a 1:1 probe for signals with very small amplitude.
Description
Technical Field
The invention relates to the technical field of ripple noise, in particular to a method for automatically testing power supply ripple noise.
Background
Because the dc regulated power supply is generally formed by an ac power supply through links of rectification, filtering, voltage regulation and the like, some ac components are inevitably carried in the dc voltage, the ac components superposed on the dc regulated voltage are called ripples, and the ripples cannot be completely eliminated, and can only be controlled within an allowable range as much as possible. One kind of high frequency noise that appears beyond the ripple is called noise, and the ripple and noise voltage are one of the parameters that measure the quality of the power supply, so how to measure accurately is an important issue.
The existing method for measuring the power supply ripple noise is to manually touch two ends of an output pin of a single-board power supply module by using an oscilloscope probe, and the method is manual measurement, so that the power supply ripple noise cannot be accurately measured due to instability, manpower and time are consumed, and the efficiency is low.
Disclosure of Invention
Based on the technical problems that the method for measuring the power supply ripple noise in the background technology is to use an oscilloscope probe to manually touch two ends of an output pin of a single-board power supply module, the power supply ripple noise cannot be accurately measured due to instability, manpower and time are consumed, and efficiency is low, the invention provides the method for automatically testing the power supply ripple noise.
The method for automatically testing the ripple noise of the power supply comprises the following steps:
s1: firstly, calibrating an oscilloscope, and correctly debugging the original waveform of the oscilloscope before testing;
s2: setting an oscilloscope, wherein a probe of the oscilloscope adopts a single-ended passive probe, and for a signal with small amplitude, the attenuation ratio of the probe adopts a 1:1 probe;
s3: fixing a single test board on a coordinate moving platform, loading a probe special for an oscilloscope on the coordinate moving platform, and driving the probe by a motor through belt transmission, wherein the probe moves in X, Y, Z three directions;
s4: converting CAD data of a design engineer into a usable test data file;
s5: and moving the two probes to be respectively contacted with the two welding points, and reading feedback data to a computer for analysis.
Preferably, in S2, the length of the front-end connecting wire and the ground wire of the oscilloscope probe is as short as possible to prevent a long loop from introducing more noise interference, the peak-to-peak value is selected from a small range, and the channel coupling mode is selected from AC so that an image captured on the oscilloscope is clearer, and the image is separated according to different bandwidths of ripple and noise.
Preferably, in S3, the coordinates of the device fixed on the coordinate moving platform may be identified with reference to an SMT pick and place machine, where the coordinates of each component of the patch are known as the bit number of the patch capacitor to be tested.
Preferably, in S4, the test data file includes coordinates (X, Y) of each solder point to be tested and a network value of the solder point in the PCB.
Preferably, in S5, the probe is driven by a motor.
The invention has the beneficial effects that:
replacing a probe with two probes, loading the probes on a coordinate moving platform to move at a high speed, adjusting the distance between the two probes through the packaging size of a device or the reserved gap between two bonding pads, and measuring related accurate power supply ripple noise on the basis;
developing mobile test software, identifying image coordinates, and driving hardware to realize coordinate movement;
the integrity of the circuit board is protected while testing, and the circuit board cannot be damaged;
the scheme has the greatest advantages of high efficiency, convenience, quickness, capability of quickly and flexibly switching positions, and greatly improved accuracy and stability of the test;
the scheme can also use a mechanical arm to replace a coordinate moving platform, but the cost is obviously higher, and certain difficulty exists in technical software development.
The scheme can also use two fixed probes which can not adjust the gap to be loaded on the coordinate moving platform to point contact the device pins or the bonding pads, only the oscilloscope probes with various gaps and capable of matching the device packaging size are prepared, but the problem of high cost exists.
Therefore, the scheme has simple layout and low manufacturing cost and is beneficial to the requirement of expanded production.
Drawings
FIG. 1 is a test-work networking diagram proposed by the present invention;
fig. 2 is a flowchart of the testing operation proposed by the present invention.
Detailed Description
The present invention will be further illustrated with reference to the following specific examples.
Referring to fig. 1-2, a method for automatically testing power supply ripple noise includes the following steps:
s1: firstly, calibrating an oscilloscope, and correctly debugging the original waveform of the oscilloscope before testing;
s2: setting an oscilloscope, wherein a probe of the oscilloscope adopts a single-ended passive probe, and for a signal with small amplitude, the attenuation ratio of the probe adopts a 1:1 probe;
s3: fixing a single test board on a coordinate moving platform, loading a probe special for an oscilloscope on the coordinate moving platform, and driving the probe by a motor through belt transmission, wherein the probe moves in X, Y, Z three directions;
s4: converting CAD data of a design engineer into a usable test data file;
s5: and moving the two probes to be respectively contacted with the two welding points, and reading feedback data to a computer for analysis.
In this embodiment, in S2, the length of the front-end connection line and the ground line of the oscilloscope probe is as short as possible to prevent a long loop from introducing more noise interference, the peak-to-peak value is selected from a small-range, and the channel coupling mode is selected from AC so that an image captured on the oscilloscope is clearer, and the image is separated according to the difference in ripple and noise bandwidths.
In this embodiment, in S3, the coordinates of the device fixed on the coordinate moving platform may be identified with reference to an SMT chip mounter, and the coordinates of each chip component on the SMT chip mounter may be known as the bit number of the chip capacitor to be tested.
In this embodiment, in S4, the test data file includes coordinates (X, Y) of each solder joint to be tested and a network value of the solder joint in the PCB.
In this embodiment, in S5, the probe is driven by a motor.
In this embodiment: through the mode of numerical control programming, use two by motor drive, oscilloscope probe that can the rapid movement and with the pin both ends of device or two pad of reserving (many circuit boards can reserve empty pad and supply test and debugging) make its clamp device both ends through the clearance of automatic adjustment two probes, carry out stable contact to obtain a test scheme of accurate, stable wave form on oscilloscope, the concrete implementation step: the invention uses the oscilloscope of Take MSO series to select, the series oscilloscope provides excellent signal fidelity, 2GHz and 10GS/s sampling rate, and has advanced analysis and mathematical functions, the oscilloscope can run the analysis software based on Windows, and the oscilloscope and the logic analyzer are integrated;
before measuring ripples and noises, firstly calibrating an oscilloscope, correctly debugging the original waveform of the oscilloscope before testing, then setting the oscilloscope, wherein a single-ended passive probe is adopted as an oscilloscope probe, and for signals with small amplitude, the probe attenuation ratio is 1:1 probe as much as possible, because if the amplitude of the measured signal is small, the attenuation is 10 times of the attenuation and possibly submerged in the bottom noise of the oscilloscope, the lengths of a connecting wire and a grounding wire at the front end of the oscilloscope probe are as short as possible, so that more noise interference caused by a long loop is prevented, a small-range gear is selected for a peak value, and an AC is selected in a channel coupling mode, so that images captured on the oscilloscope are clearer, and the images are separated according to different bandwidths of the ripples and the noises;
firstly fixing a tested single board on a coordinate moving platform, loading a probe special for an oscilloscope on the coordinate moving platform, driving the probe by a motor through belt transmission, wherein the movement of the probe comprises X, Y, Z three directions, before testing, a test engineer needs to convert CAD data (such as a PCB file) of the design engineer into usable test data files, and the files comprise coordinates (X, Y) of each welding point to be tested and network values of the welding points in the PCB, for example, the data format of the obtained test files is (NET1/X1/Y1/NET2/X1/Y1/NET3/X3/Y3), wherein NET represents the network values of the welding points, X, Y is the coordinates of the welding points, and the difference between the coordinates (X, Y) read each time and the coordinates of the current probe is delta X, delta Y is used for determining the movement direction and distance of the X, Y axis motor, the network value NET determines whether to drive the Z-axis motor, the specific testing form on the testing platform is to move two welding spots with the same network value, the two probes are respectively contacted with the two welding spots, the feedback data is read and sent to a computer for analysis, the identification of the device coordinate can refer to an SMT chip mounter, the coordinate of each chip component can be found on the SMT chip mounter, the position number of a chip capacitor to be tested is known, and the coordinate position of the capacitor is known, so that the probes can be accurately and quickly moved and rotated by operating a software interface, the adjustment of the testing coordinate can also be carried out by using a screen coordinate graph while seeing, the gap between the two probes is adjusted according to the packaging size of different devices to be tested to clamp the probes, and an accurate ripple noise image is obtained on an oscilloscope.
The invention mainly solves the problems of the first technology: firstly, the method is convenient and fast, the stability and the accuracy of the test are much higher than those of manual measurement, and a plurality of modes for measuring the device pins of the PCB (flying probe tester) by using automatic equipment exist in the market, and the scheme considers feasibility and convenient operation as long as the automatic equipment is not applied to measuring the power supply ripple noise.
Automated test equipment also has some drawbacks, such as small pits that may be left in the solder because the test probes make physical contact with the vias and the solder on the test pads, but automated test power supply ripple equipment remains a valuable tool.
The following details the considerations during the test:
1. before testing a PCBA, firstly, knowing all devices to be tested, and not needing to contact the devices to be tested by using a probe so as to avoid circuit faults, wherein the circuit faults can be known by looking up a schematic diagram and the PCB;
2. before testing, the test specification and the test standard are mainly checked, for example, the ripple judgment standard 48V has the output ripple less than or equal to 480mV and the noise judgment standard is less than or equal to 5% Vout;
3. when the probe is connected with a circuit to be tested, a grounding terminal probe of the probe is necessarily connected with a ground wire of the circuit to be tested, a voltage signal input line is connected with a front end probe of the probe and cannot be reversely connected, otherwise, an oscilloscope, the probe or other equipment can be electrically shocked or damaged.
The prior technical scheme is as follows:
at present, no technical scheme for automatically testing the power supply ripple exists in the market, and most of the technical schemes are manually tested, however, there are many automated test equipments very similar to them, such as a flying probe tester, an SMT mounter, the flying probe test is one of the methods for inspecting the electrical performance of a PCB (short open circuit test), the flying probe tester is a system for testing a PCB in a manufacturing environment, the flying probe test uses four to eight independently controlled probes, a unit under test is fixed in the tester, the probes contact test pads and vias to test individual devices of the unit under test, the test probes are connected to drivers (signal generation, power supply, etc.) and sensors (digital multimeters, frequency counters, etc.) through multiplexing to test components on the unit under test, if the flying probe test technology is applied to testing the ripple noise of the power supply, the flying probe test technology is an improvement of the measurement mode.
Abbreviations and key term definitions:
automated testing: the automatic test is a process of converting a test behavior driven by human into machine execution, and in the process, in order to save manpower, time or hardware resources and improve the test efficiency, an automatic test concept is introduced.
Peak-to-peak value: the peak-to-peak value is the value of the difference between the highest value and the lowest value of the signal in a period, i.e. the range between the maximum value and the minimum value, and describes the size of the variation range of the signal value.
A passive probe: passive probes are made of wires and connectors and include resistors and capacitors when compensation or attenuation is required, and there are no active devices (transistors or amplifiers) in the probe and therefore no power is required to power the probe.
PCBA: the PCB blank is processed by SMT and then processed by DIP plug-in components, which is called PCBA for short, and can be understood as a finished product circuit board.
A filter capacitor: the filter capacitor is an energy storage device which is arranged at two ends of the rectifying circuit and used for reducing the alternating current ripple coefficient and improving the high-efficiency smooth direct current output.
Flying probe test: the probe replaces a needle bed, a plurality of electric probes which are driven by a motor and can move quickly are used for contacting pins of a device and carrying out electric measurement, and the principle is utilized for measuring the power supply ripple.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (5)
1. The method for automatically testing the ripple noise of the power supply comprises the following steps:
s1: firstly, calibrating an oscilloscope, and correctly debugging the original waveform of the oscilloscope before testing;
s2: setting an oscilloscope, wherein a probe of the oscilloscope adopts a single-ended passive probe, and for a signal with small amplitude, the attenuation ratio of the probe adopts a 1:1 probe;
s3: fixing a single test board on a coordinate moving platform, loading a probe special for an oscilloscope on the coordinate moving platform, and driving the probe by a motor through belt transmission, wherein the probe moves in X, Y, Z three directions;
s4: converting CAD data of a design engineer into a usable test data file;
s5: and moving the two probes to be respectively contacted with the two welding points, and reading feedback data to a computer for analysis.
2. The method for automatically testing power supply ripple noise according to claim 1, wherein in S2, the length of the connection line and the ground line at the front end of the oscilloscope probe is short, the peak-to-peak value is selected from a small range, the channel coupling mode is selected from AC, and the images are separated according to the difference of the ripple bandwidth and the noise bandwidth.
3. The method according to claim 1, wherein in step S3, the coordinates of the devices fixed on the coordinate moving platform are identified with reference to an SMT pick and place machine, and the coordinates of each pick and place component on the SMT pick and place machine are known as the bit number of the patch capacitor to be tested.
4. The method for automatically testing power supply ripple noise according to claim 1, wherein in the S4, the test data file contains coordinates (X, Y) of each solder point to be tested and a network value of the solder point in the PCB.
5. The method for automatically testing power supply ripple noise according to claim 1, wherein in the S5, the probe is driven by a motor.
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| CN201910798262.XA CN110632403A (en) | 2019-08-27 | 2019-08-27 | Method for automatically testing power supply ripple noise |
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| CN201910798262.XA CN110632403A (en) | 2019-08-27 | 2019-08-27 | Method for automatically testing power supply ripple noise |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111239468A (en) * | 2020-01-21 | 2020-06-05 | 合肥中科离子医学技术装备有限公司 | Test structure of power supply current ripple of beam deflection electromagnet of medical accelerator |
| CN112114204A (en) * | 2020-09-24 | 2020-12-22 | 中车株洲电力机车研究所有限公司 | Power supply ripple and noise auxiliary test system and test method |
| CN116233630A (en) * | 2023-05-05 | 2023-06-06 | 深圳市和惠源电子科技有限公司 | Method, equipment and storage medium for removing ripple noise of CMOS sensor power supply |
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Cited By (3)
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| CN111239468A (en) * | 2020-01-21 | 2020-06-05 | 合肥中科离子医学技术装备有限公司 | Test structure of power supply current ripple of beam deflection electromagnet of medical accelerator |
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| CN116233630A (en) * | 2023-05-05 | 2023-06-06 | 深圳市和惠源电子科技有限公司 | Method, equipment and storage medium for removing ripple noise of CMOS sensor power supply |
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