CN110592557B - Internal CVD deposition three-dimensional composite ceramic heater - Google Patents

Internal CVD deposition three-dimensional composite ceramic heater Download PDF

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Publication number
CN110592557B
CN110592557B CN201910998143.9A CN201910998143A CN110592557B CN 110592557 B CN110592557 B CN 110592557B CN 201910998143 A CN201910998143 A CN 201910998143A CN 110592557 B CN110592557 B CN 110592557B
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coating
pbn
circuit
strip
composite ceramic
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CN110592557A (en
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刘汝强
王殿春
吴思华
孙蕾
赵旭荣
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Shandong Guojing New Material Co ltd
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Shandong Guojing New Material Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/342—Boron nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic

Abstract

The invention relates to an internal CVD deposition three-dimensional composite ceramic heater, belonging to the technical field of heaters, and the device comprises a PBN substrate, a PG coating circuit and a PBN coating protective layer; the PBN substrate is hollow, the PG coating circuit is arranged on the inner wall of the PBN substrate, the PG coating circuit is attached to the inner surface of the PBN substrate, the PBN coating protective layer is attached to the PG coating circuit, the PBN substrate is prepared through chemical vapor deposition, the circuit is prepared through carving and depositing the PG coating, and the heater with the inner surface heated is finally obtained.

Description

Internal CVD deposition three-dimensional composite ceramic heater
Technical Field
The invention relates to an internal CVD deposition three-dimensional composite ceramic heater, in particular to a Pyrolytic Boron Nitride (PBN) -Pyrolytic Graphite (PG) three-dimensional composite heater, and belongs to the technical field of heaters.
Background
With the continuous development of the industrial level, the requirement of the heater heating uniformity in many technical fields is higher and higher. The three-dimensional composite heaters on the market are heated on the outer surface of a base body, the heating mode has the defects of more heat dissipation of the outer surface and high energy consumption of the heater, and the temperature uniformity of an internal heating area of the heater is poor due to the difference of heat conduction of different areas of the base body and the difference of heat dissipation of different areas of the outer surface. The applicant has also filed a patent application (application No. 201810752512.1) disclosing a cylindrical composite heater, which is not meeting the market demand, and there is a strong need to find another method for improving the heating uniformity of the three-dimensional composite heater.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the three-dimensional composite heater with the inner surface heated, and the heater can obviously improve the heating uniformity of the heater, and simultaneously can reduce the heat loss and the energy consumption.
The technical scheme of the invention is as follows:
an internal CVD deposition three-dimensional composite ceramic heater comprises a PBN substrate, a PG coating circuit and a PBN coating protective layer from outside to inside;
the PBN substrate is hollow, the inner wall of the PBN substrate is provided with a PG coating circuit, the PG coating circuit is attached to the inner surface of the PBN substrate, and the PBN coating protective layer is attached to the PG coating circuit.
Preferably, the PBN substrate is cylindrical or hollow truncated cone-shaped or cylindrical with irregular and variable diameter.
Preferably, the PBN matrix has a diameter of 30mm-300mm, a height of 50mm-500mm and a thickness of 0.1mm-5mm, and the deviation of the inner diameter can be controlled within 0.05mm by controlling the PBN matrix mould.
Preferably, the PG coating circuit pattern comprises a bar-shaped circuit which is folded back and forth, the folded back position of the bar-shaped circuit is a folded back part, the PG coating circuit comprises at least two folded back parts, two adjacent folded back parts are not communicated with each other and a gap is reserved between the two adjacent folded back parts, and two end points of the bar-shaped circuit are provided with electrodes.
Except the folding part, other strip circuits are arranged along the circumference of the PBN substrate or in the direction similar to the circumference, the widths of the strip circuits can be the same or different, and gaps among the strip circuits can be the same or different.
More preferably, the widths of the strip circuits of the PG coating circuit patterns are both 12mm, the gaps between two adjacent strip circuits are both 2mm, the total number of the strip circuits is 6, and the gaps between two adjacent strip circuits are both 3 mm; two end points of the circuit are respectively provided with a circular through hole electrode, the outer diameter of the circular through hole electrode is 20mm, and the diameter of the circular through hole electrode is 8 mm.
Preferably, the thickness of the PBN coating protective layer is 50 microns to 500 microns.
Preferably, the PG coated circuit has a thickness of 100 μm.
The PG coating circuit can be formed by depositing a PG coating layer on the inner surface of a PBN substrate by a chemical vapor deposition method, then finely engraving a PG coating circuit pattern on the PG coating layer on the inner surface of the PBN by a laser or a machining method, and then depositing a PBN coating protective layer to protect the PG coating circuit.
The invention has the beneficial effects that:
1. the internal surface of this application PBN base member need not to carry out the coping and handles, and the internal diameter just can reach the deviation within 0.05mm, avoids the surface damage that the PBN base member coping brought to reduce the risk that the heater fracture rises layer, thereby improve the yields of heater greatly, save the coping step simultaneously, cost and time all can reduce and shorten.
The PG coating circuit is positioned on the inner surface of the PBN substrate, the PG coating heating circuit is closer to a heated area, the uniformity of heat of the internal heating area is better controlled, the PG coating circuit is prepared by engraving the circuit, and simultaneously, due to the action of the PBN substrate, the heat generated by the PG coating circuit is greatly reduced in dissipation, so that the heating uniformity of the heater is greatly improved, the heat loss is low, and the energy consumption is low.
Drawings
FIG. 1 is a perspective view of the overall construction of a heater;
FIG. 2 is an expanded view of the heater PG coating pattern;
wherein, 1, electrode, 2, folded part.
Detailed Description
The present invention will be further described by way of examples, but not limited thereto, with reference to the accompanying drawings.
Example 1:
an internal CVD deposited three-dimensional composite ceramic heater comprises a PBN substrate, a PG coating circuit and a PBN coating protection layer.
The PBN substrate is cylindrical, as shown in figure 1, the PBN substrate is hollow, a PG coating circuit is arranged on the inner wall of the PBN substrate, the PG coating circuit is attached to the inner surface of the PBN substrate, and a PBN coating protective layer is attached to the PG coating circuit.
Example 2:
an internal CVD deposited three-dimensional composite ceramic heater is constructed as described in example 1, except that the PBN substrate is hollow truncated cone.
Example 3:
an internal CVD deposited three-dimensional composite ceramic heater is constructed as described in example 1, except that the PBN substrate is cylindrical with irregular diameter, and the diameter of the PBN substrate is reduced from top to bottom and then increased.
Example 4:
an internal CVD deposited three-dimensional composite ceramic heater is constructed as described in example 1, except that the PBN substrate has a diameter of 100mm, a height of 150mm and a thickness of 2mm, the deviation of the inner diameter can be controlled within 0.04mm by controlling the PBN substrate mold, the thickness of the PBN coating protection layer is 100 microns, and the thickness of the PG coating circuit is 100 microns.
Example 5:
an internal CVD deposited three-dimensional composite ceramic heater was constructed as described in example 4, except that the PBN substrate had a diameter of 30mm, a height of 50mm and a thickness of 0.1mm, and the deviation of the inner diameter was controlled within 0.05mm by controlling the PBN substrate mold. The thickness of the PBN coating protective layer was 50 microns.
Example 6:
an internal CVD deposited three-dimensional composite ceramic heater is constructed as described in example 4, except that the PBN substrate has a diameter of 300mm, a height of 500mm and a thickness of 5mm, and the deviation of the inner diameter can be controlled within 0.05mm by controlling the PBN substrate mold. The thickness of the PBN coating protective layer was 500 microns.
Example 7:
an internal CVD deposited three-dimensional composite ceramic heater is constructed as described in embodiment 4, except that the PG coated circuit pattern comprises strip-shaped circuits folded back and forth, the folded back parts of the strip-shaped circuits are folded back parts, as shown in figure 2, the PG coated circuit comprises six folded back parts, two adjacent folded back parts are not communicated with each other, gaps are left between the two adjacent folded back parts, and two end points of the strip-shaped circuits are provided with electrodes. Except the folding part, other strip circuits are arranged along the circumference of the PBN substrate or in the direction similar to the circumference, the widths of the strip circuits can be the same or different, and gaps among the strip circuits can be the same or different.
Example 8:
an internal CVD deposited three-dimensional composite ceramic heater, which is constructed as described in example 7, except that the width of each strip circuit of the PG coated circuit is 12mm, the gap between each two adjacent strip circuits is 2mm, the total number of the folded parts is 6, the gap between each two adjacent folded parts is 3mm, each of the two end points of the circuit has a circular through hole electrode, the outer diameter of the through hole electrode is 20mm, and the diameter of the through hole electrode is 8 mm.
Examples of the experiments
With the heater having the PG coating on the inner surface as described in example 8, compared to the heater having the coating on the outer surface: the comparison table of the heat uniformity, the heat dissipation degree, the temperature rise rate and the yield is shown in table 1. From this, it is understood that the heater for heating the inner surface manufactured by the present application has an excellent effect.
TABLE 1 comparison of internal and external heater effects
Parameter comparison term Heater with PG pattern layer on inner surface Heater with PG pattern layer on outer surface
Uniformity of heat 1000±30℃ 1000±100℃
Degree of heat loss 150℃/h 200℃/h
Rate of temperature rise 100℃/min 80℃/min
Yield of good products 80％ 65％

Claims (5)

1. An internal CVD deposition three-dimensional composite ceramic heater is characterized by comprising a PBN substrate, a PG coating circuit and a PBN coating protective layer from outside to inside;
the PBN substrate is hollow, a PG coating circuit is arranged on the inner wall of the PBN substrate, and a PBN coating protective layer is attached to the PG coating circuit;
the PG coating circuit pattern comprises a strip-shaped circuit which is folded back and forth, the folded back position of the strip-shaped circuit is a folded back part, the PG coating circuit comprises at least two folded back parts, two adjacent folded back parts are not communicated with each other and a gap is reserved between the two adjacent folded back parts, and two end points of the strip-shaped circuit are provided with electrodes;
the width of each strip-shaped circuit of the PG coating circuit pattern is 12mm, the gap between every two adjacent strip-shaped circuits is 2mm, the total number of the strip-shaped circuits is 6, and the gap between every two adjacent strip-shaped circuits is 3 mm; two end points of the circuit are respectively provided with a circular through hole electrode, the outer diameter of the circular through hole electrode is 20mm, and the diameter of the circular through hole electrode is 8 mm.
2. The internal CVD deposited solid composite ceramic heater according to claim 1, wherein the PBN substrate is cylindrical or hollow truncated cone or cylindrical with irregular diameter.
3. The internal CVD deposited solid composite ceramic heater according to claim 1, wherein the PBN substrate has a diameter of 30mm to 300mm, a height of 50mm to 500mm, a thickness of 0.1mm to 5mm, and an internal diameter deviation within 0.05 mm.
4. The internal CVD deposited solid composite ceramic heater according to claim 1, wherein the PBN coating protective layer has a thickness of 50-500 microns.
5. The internal CVD deposited solid composite ceramic heater according to claim 1, wherein the PG coating circuitry has a thickness of 100 microns.
CN201910998143.9A 2019-10-21 2019-10-21 Internal CVD deposition three-dimensional composite ceramic heater Active CN110592557B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112853276A (en) * 2020-12-31 2021-05-28 凯盛光伏材料有限公司 Oxidation-resistant and pollution-resistant durable compound evaporation source
CN112822798B (en) * 2020-12-31 2022-11-25 博宇（天津）半导体材料有限公司 Vertical ceramic heater

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03280382A (en) * 1990-03-28 1991-12-11 Toshiba Lighting & Technol Corp Infrared heater
CN101067996A (en) * 2006-03-17 2007-11-07 通用电气公司 Semiconductor batch heating subassembly
CN101490491A (en) * 2006-07-12 2009-07-22 应用材料股份有限公司 Multizone heater for furnace
CN104427666A (en) * 2013-08-21 2015-03-18 信越化学工业株式会社 Three-dimensional ceramic heater
CN105379415A (en) * 2013-07-15 2016-03-02 莫门蒂夫性能材料股份有限公司 Coated graphite heater configuration
CN109156049A (en) * 2016-03-18 2019-01-04 莫门蒂夫性能材料股份有限公司 Cylindrical heater

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03280382A (en) * 1990-03-28 1991-12-11 Toshiba Lighting & Technol Corp Infrared heater
CN101067996A (en) * 2006-03-17 2007-11-07 通用电气公司 Semiconductor batch heating subassembly
CN101490491A (en) * 2006-07-12 2009-07-22 应用材料股份有限公司 Multizone heater for furnace
CN105379415A (en) * 2013-07-15 2016-03-02 莫门蒂夫性能材料股份有限公司 Coated graphite heater configuration
CN104427666A (en) * 2013-08-21 2015-03-18 信越化学工业株式会社 Three-dimensional ceramic heater
CN109156049A (en) * 2016-03-18 2019-01-04 莫门蒂夫性能材料股份有限公司 Cylindrical heater

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