CN110527474A - A kind of silane modified polyether Conductive sealant and preparation method thereof - Google Patents
A kind of silane modified polyether Conductive sealant and preparation method thereof Download PDFInfo
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- CN110527474A CN110527474A CN201910844091.XA CN201910844091A CN110527474A CN 110527474 A CN110527474 A CN 110527474A CN 201910844091 A CN201910844091 A CN 201910844091A CN 110527474 A CN110527474 A CN 110527474A
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- modified polyether
- silane modified
- mixture
- conductive sealant
- silane
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The present invention also provides a kind of silane modified polyether Conductive sealants and preparation method thereof, preparation method includes the following steps: for conductive filler, plasticizer, thixotropic agent, light stabilizer and heat stabilizer to be added in kneader, and vacuum kneading handles 1 to 3 hour and obtains the first mixture at 110 to 120 DEG C of temperature range；First mixture is cooled to 40 to 50 DEG C, the first mixture after cooling is placed in high speed disperser, silane modified polyether, fire resistant resin and water absorbing agent are continuously added into high speed disperser, and high speed dispersion processing obtains the second mixture in 1 to 3 hour in a nitrogen atmosphere；Second mixture is cooled to not higher than 30 DEG C, silane coupling agent and catalyst are added into the second mixture, obtains silane modified polyether Conductive sealant within decentralized processing 30 to 60 minutes under vacuum conditions.
Description
Technical field
Invention is related to chemical field more particularly to a kind of environment-friendly type silane modified polyether Conductive sealant and its preparation side
Method.
Background technique
Conductive sealant, abbreviation conducting resinl are that one kind can effectively be bonded substrate and the sealant of conductive energy.In
In electronics industry, conducting resinl has become a kind of essential functional material.With the rapid development of electronics industry and right
Environmental requirement is further harsh, and conducting resinl will be used wider and wider.Conducting resinl is the ideal substitute of tin-lead solder, conducting resinl with
Tin-lead solder is a variety of compared to having the advantages that: 1, environmentally friendly, conducting resinl is free of toxic heavy metal lead, and the lead in traditional tin-lead solder is
Noxious material is detrimental to health, pollutes environment.2, conducting resinl has lower solidification temperature, more simplified preparation process.3,
Input/output interface (I/O) quantity on electronic component unit area is increasing, and conducting resinl can provide thinner particle
Size, more stable performance comply with growth requirement of the electronic product to miniaturization.
Conducting resinl can be divided into two kinds according to structure difference: one is structural type, conductive group is contained in product；Another kind is
Conductive materials are added in filled-type in sealant.Conducting resinl product on domestic market is largely filled-type, filling
Type conducting resinl is generally made of matrix and conductive filler two large divisions, matrix generally by polymeric matrix, curing accelerator and its
Its auxiliary agent etc. is formulated, and polymeric matrix is the chief component of conducting resinl, the mechanical property and adhesive property of conducting resinl
Mainly determined by it.The common performed polymer of polymeric matrix includes epoxies, organic silicon, polyurethanes and phenolic resinoid
Deng.Epoxies conducting resinl is high with adhesive strength, bonding range is big, corrosion resistance is strong, shrinking percentage is low, stability is good and can add
The advantages that work is strong, but epoxies conducting resinl also has many defects, such as impact resistance is poor, and bonding part is easy to crack, the feature of environmental protection
Difference, priming reaction generates irritation or noxious material further may cause human skin allergy etc..Organic silicon conducting resinl tool
There are good elasticity, heat resistance and weatherability, low contamination resistance and tearing strength is poor.Polyurethanes conducting resinl has intensity
It is high, chemical adhesion is strong, endurance and the advantages that low-temperature curable, but polyurethanes conducting resinl solidification process releases titanium dioxide
Carbon further causes adverse effect to the mechanical property of material, sealing performance and anti-Hou Xingneng.Phenolic conducting resinl has intensity
The advantages that high, water resistance is by force, flame resistance and corrosion resistance are strong, but higher temperature and pressure are needed when phenolic conducting resinl curing molding
Power, curing time is longer and has by-product generation, there are weatherabilities it is poor, condensate performance is poor the disadvantages of.
Silane modified polyether has both the excellent of organosilicon conductive adhesive and conductive polyurethane glue as a kind of novel product structure
Point, shows excellent electric conductivity, corrosion resistance, weatherability and caking property, and silane modified polyether conducting resinl can realize that room temperature is fast
Speed solidification, does not influence properties of product while having many advantages, such as environmentally protective and excellent workability.
How to provide the novel silane modified polyether conducting resinl for meeting electronics industry development need of one kind is ability
Field technique personnel are in need of consideration.
Summary of the invention
In view of this, the present invention provides a kind of silane modified polyether Conductive sealant and preparation method thereof, the silane changes
Property polyethers Conductive sealant have excellent electric conductivity, good adhesive strength, surface high abrasion, strong operability etc. it is excellent
Point, and it is environmentally protective without containing heavy metal contaminants, meet electronics industry development need.
The present invention provides a kind of silane modified polyether Conductive sealant, comprises the following components in parts by weight:
Further, the silane modified polyether is isocyanate alkoxysilane blocking modification polyethers, the isocyanide
The skeleton symbol of the alkoxysilane-terminated modified polyether of perester radical are as follows:
Wherein, R is-CH3 or-CH3CH2, and R1 is-H or-CH3, and k is integer 2 or 3, and m is more than or equal to 1 and to be less than or equal to
3 integer, n are the integer more than or equal to 30 and less than or equal to 500, the isocyanate alkoxysilane blocking modification polyethers
Viscosity be 2000 to 50000mPa.s.
Further, the fire resistant resin is liquid rosin resin, liquid terpene resins and hydrogenated liquid rosin resin
At least one of.
Further, the conductive filler be conductive black, graphite, silver powder, silvering powder, copper powder and carbon fiber at least
It is a kind of.
Further, the plasticizer is polypropylene glycol, dioctyl phthalate, diisononyl phthalate and neighbour
At least one of phthalic acid diisodecyl ester.
Further, the thixotropic agent is in polyamide wax, hydroxy silicon oil, fumed silica and nano silicone diatomaceous earth
It is at least one.
Further, the silane coupling agent be γ-aminopropyltrimethoxysilane, gamma-aminopropyl-triethoxy-silane,
3- (2,3- the third oxygen of epoxy) propyl trimethoxy silicane, N- (β-aminoethyl)-γ-aminopropyltrimethoxysilane and N- (β-ammonia
At least one of ethyl)-gamma-aminopropyl-triethoxy-silane.
Further, the light stabilizer is 2- (5- chloro (2H)-benzotriazole -2- base) -4- (methyl) -6- (tertiary fourth
Base) phenol, 2- (2 "-hydroxyls -3 ", 5 "-di-tert-butyl-phenyls) -5- chlorinated benzotriazole, 2- (2H- benzotriazole -2- base) -4,6-
Two tert-amyl phenols and 2,2'- methylene two are (in 6- (2H- benzotriazole -2- base) -4- (1,1,3,3- tetramethyl butyl) phenol
At least one.
Further, the heat stabilizer is 2,6- di-tert-butyl-4-methy phenol, tert-butylhydroquinone, β-(3,5-
Di-tert-butyl-hydroxy phenyl) propionic acid octadecanol ester, four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] Ji Wusi
At least one of alcohol ester and the different monooctyl ester of 3,5- di-t-butyl -4- hydroxy phenylpropionic acid.
Further, the water absorbing agent is vinyltrimethoxysilane, vinyltriethoxysilane, vinyl-dimethyl
At least one of oxysilane, dodecyl triethoxysilane and dodecyltrimethoxysilane.
Further, the catalyst is dibutyl tin dilaurate, tin dilaurate diheptyl tin, stannous octoate, the pungent last of the ten Heavenly stems
At least one of sour zinc and butyl titanate.
The present invention also provides a kind of preparation methods of above-mentioned silane modified polyether Conductive sealant, which is characterized in that including
Following steps:
The conductive filler, plasticizer, thixotropic agent, light stabilizer and heat stabilizer are added in a kneader, in temperature
Vacuum kneading handles 1 to 3 hour and obtains one first mixture at 110 to 120 DEG C of range；
First mixture is cooled to 40 to 50 DEG C, first mixture after cooling is placed in a high speed dispersion
In machine, the silane modified polyether, fire resistant resin and water absorbing agent are continuously added in Xiang Suoshu high speed disperser, and in nitrogen gas
High speed dispersion handles 1 to 3 hour and obtains one second mixture under atmosphere；And
Second mixture is cooled to not higher than 30 DEG C, the silane coupling agent is added in the second mixture of Xiang Suoshu
And catalyst, the silane modified polyether Conductive sealant is obtained within decentralized processing 30 to 60 minutes under vacuum conditions.
Silane modified polyether Conductive sealant of the invention can quick surface drying, ambient temperature curable, have superior electrical conductivity energy,
Good adhesive strength, surface high abrasion, strong operability.
Detailed description of the invention
Fig. 1 is the production process schematic diagram of the silane modified polyether Conductive sealant of one embodiment of the invention.
Main element symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar application, therefore the present invention is not limited by the specific embodiments disclosed below.
The present invention provides a kind of silane modified polyether Conductive sealant, comprises the following components in parts by weight:
Specifically, the silane modified polyether can be isocyanate alkoxysilane blocking modification polyethers, isocyanic acid
The viscosity of the alkoxysilane-terminated modified polyether of ester group is 2000 to 50000mPa.s, and isocyanate alkoxysilane sealing end changes
The skeleton symbol of property polyethers are as follows:
Wherein, R is-CH3Or-CH3CH2, R1For-H or-CH3, k is integer 2 or 3, and m is more than or equal to 1 and to be less than or equal to 3
Integer, n be more than or equal to 30 and be less than or equal to 500 integer.
Specifically, the fire resistant resin can be liquid rosin resin, liquid terpene resins and hydrogenated liquid rosin tree
At least one of rouge.
Specifically, the conductive filler can in conductive black, graphite, silver powder, silvering powder, copper powder and carbon fiber extremely
Few one kind.
Specifically, the plasticizer can for polypropylene glycol, dioctyl phthalate, diisononyl phthalate and
At least one of diisooctyl phthalate.
Specifically, the thixotropic agent can be in polyamide wax, hydroxy silicon oil, fumed silica and nano silicone diatomaceous earth
At least one.
Specifically, the silane coupling agent can be γ-aminopropyltrimethoxysilane, gamma-aminopropyl-triethoxy silicon
Alkane, 3- (2,3- the third oxygen of epoxy) propyl trimethoxy silicane, N- (β-aminoethyl)-γ-aminopropyltrimethoxysilane and N- (β-
At least one of aminoethyl)-gamma-aminopropyl-triethoxy-silane.
Specifically, the light stabilizer can be 2- (5- chloro (2H)-benzotriazole -2- base) -4- (methyl) -6- (uncle
Butyl) phenol, 2- (2 "-hydroxyls -3 ", 5 "-di-tert-butyl-phenyls) -5- chlorinated benzotriazole, 2- (2H- benzotriazole -2- base) -4,
Bis- tert-amyl phenol of 6- and (6- (2H- benzotriazole -2- base) -4- (1,1,3,3- tetramethyl butyl) phenol of 2,2'- methylene two
At least one of.
Specifically, the heat stabilizer can for 2,6- di-tert-butyl-4-methy phenol, tert-butylhydroquinone, β-(3,
5- di-tert-butyl-hydroxy phenyl) propionic acid octadecanol ester, four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] seasons penta
At least one of four alcohol esters and the different monooctyl ester of 3,5- di-t-butyl -4- hydroxy phenylpropionic acid.
Specifically, the water absorbing agent can be vinyltrimethoxysilane, vinyltriethoxysilane, vinyl two
At least one of methoxy silane, dodecyl triethoxysilane and dodecyltrimethoxysilane.
Specifically, the catalyst can be dibutyl tin dilaurate, tin dilaurate diheptyl tin, stannous octoate, pungent
At least one of capric acid zinc and butyl titanate.
Silane modified polyether Conductive sealant provided by the present invention can be applied to electronics industry.
The present invention also provides a kind of preparation methods of above-mentioned silane modified polyether Conductive sealant, are as shown in Figure 1 this hair
The preparation flow schematic diagram of bright silane modified polyether Conductive sealant, the system of silane modified polyether Conductive sealant of the invention
Standby process includes the following steps:
S1: each component object is weighed by silane modified polyether Conductive sealant above-mentioned proportion, by the conductive filler, plasticising
Agent, thixotropic agent, light stabilizer and heat stabilizer are added in a kneader, and vacuum kneading is handled at 110 to 120 DEG C of temperature range
Obtain within 1 to 3 hour one first mixture；
S2: being cooled to 40 to 50 DEG C for first mixture, and first mixture after cooling is placed in a high speed
In dispersion machine, the silane modified polyether, fire resistant resin and water absorbing agent are continuously added in Xiang Suoshu high speed disperser, and in nitrogen
High speed dispersion handles 1 to 3 hour and obtains one second mixture under gas atmosphere；
S3: second mixture is cooled to not higher than 30 DEG C, and it is even that the silane is added in the second mixture of Xiang Suoshu
Join agent and catalyst, obtains within decentralized processing 30 to 60 minutes the silane modified polyether Conductive sealant under vacuum conditions.
Embodiment 1:
A kind of environment-friendly type silane modified polyether Conductive sealant is prepared by following raw material:
Each component object is weighed by said ratio, by silver powder, silvering powder, diisononyl phthalate, polyamide wax, 2-
(5- chloro (2H)-benzotriazole -2- base) -4- (methyl) -6- (tert-butyl) phenol, β-(3,5- di-tert-butyl-hydroxy phenyl)
Propionic acid octadecanol ester is added in a kneader, and vacuum kneading handles 1 to 3 hour and obtains one at 110 to 120 DEG C of temperature range
First mixture；
First mixture is cooled to 40 to 50 DEG C, first mixture after cooling is placed in a high speed dispersion
In machine, continuously added in Xiang Suoshu high speed disperser silane modified polyether (viscosity about 18000mPa.s), liquid rosin resin and
Vinyltrimethoxysilane, and high speed dispersion processing obtains one second mixture in 1 to 3 hour in a nitrogen atmosphere；
Second mixture is cooled to not higher than 30 DEG C, γ-aminopropyl front three is added in the second mixture of Xiang Suoshu
Oxysilane and dibutyl tin dilaurate, decentralized processing 30 to 60 minutes, filling and sealing storage obtain institute under vacuum conditions
State silane modified polyether Conductive sealant.
Embodiment 2:
A kind of environment-friendly type silane modified polyether Conductive sealant is prepared by following raw material:
Each component object is weighed by said ratio, by conductive black, dioctyl phthalate, hydroxy silicon oil, gas phase dioxy
SiClx, 2- (2 "-hydroxyls -3 ", 5 "-di-tert-butyl-phenyls) -5- chlorinated benzotriazole, 3,5- di-t-butyl -4- hydroxy phenylpropionic acid
Different monooctyl ester is added in a kneader, and vacuum kneading, which is handled, at 110 to 120 DEG C of temperature range obtains one first mixing for 1 to 3 hour
Object；
First mixture is cooled to 40 to 50 DEG C, first mixture after cooling is placed in a high speed dispersion
In machine, continuously added in Xiang Suoshu high speed disperser silane modified polyether (viscosity about 30000mPa.s), liquid terpene resins and
Vinyltriethoxysilane, and high speed dispersion processing obtains one second mixture in 1 to 3 hour in a nitrogen atmosphere；
Second mixture is cooled to not higher than 30 DEG C, three second of γ-aminopropyl is added in the second mixture of Xiang Suoshu
Oxysilane, 3- (2,3- the third oxygen of epoxy) propyl trimethoxy silicane and tin dilaurate diheptyl tin, disperse under vacuum conditions
Processing 30 to 60 minutes, filling and sealing storage, obtains the silane modified polyether Conductive sealant.
Embodiment 3:
A kind of environment-friendly type silane modified polyether Conductive sealant is prepared by following raw material:
Each component object is weighed by said ratio, conductive black, graphite, polypropylene glycol -2000, phthalic acid two is pungent
Ester, polyamide wax, hydroxy silicon oil, bis- tert-amyl phenol of 2- (2H- benzotriazole -2- base) -4,6- and four [β-(3,5- bis- tertiary fourths
Base -4- hydroxy phenyl) propionic acid] pentaerythritol ester be added a kneader in, at 110 to 120 DEG C of temperature range at vacuum kneading
Reason obtains one first mixture in 1 to 3 hour；
First mixture is cooled to 40 to 50 DEG C, first mixture after cooling is placed in a high speed dispersion
In machine, silane modified polyether (viscosity about 20000mPa.s), hydrogenated liquid rosin tree are continuously added in Xiang Suoshu high speed disperser
Rouge, vinyltrimethoxysilane and dodecyl triethoxysilane, and high speed dispersion processing 1 to 3 is small in a nitrogen atmosphere
When obtain one second mixture；
Second mixture is cooled to not higher than 30 DEG C, γ-aminopropyl front three is added in the second mixture of Xiang Suoshu
Oxysilane, N- (β-aminoethyl)-gamma-aminopropyl-triethoxy-silane and dibutyl tin dilaurate, divide under vacuum conditions
Processing 30 to 60 minutes is dissipated, filling and sealing storage obtains the silane modified polyether Conductive sealant.
Embodiment 4:
A kind of environment-friendly type silane modified polyether Conductive sealant is prepared by following raw material:
Each component object is weighed by said ratio, by copper powder, diisooctyl phthalate, polyamide wax, gas phase titanium dioxide
Silicon, the (6- (2H- benzotriazole -2- of 2,2'- methylene two
Base) -4- (1,1,3,3- tetramethyl butyl) phenol, 2,6 di tert butyl 4 methyl phenol and 3,5- di-t-butyl -
The different monooctyl ester of 4- hydroxy phenylpropionic acid is added in a kneader, and vacuum kneading is handled 1 to 3 hour at 110 to 120 DEG C of temperature range
To one first mixture；
First mixture is cooled to 40 to 50 DEG C, first mixture after cooling is placed in a high speed dispersion
In machine, silane modified polyether (viscosity about 40000mPa.s), liquid rosin resin, liquid are continuously added in Xiang Suoshu high speed disperser
Body hydrogenated rosin resin, vinyltriethoxysilane and dodecyltrimethoxysilane, and high speed point in a nitrogen atmosphere
It dissipates processing and obtains one second mixture in 1 to 3 hour；
Second mixture is cooled to not higher than 30 DEG C, γ-aminopropyl front three is added in the second mixture of Xiang Suoshu
Oxysilane, gamma-aminopropyl-triethoxy-silane and stannous octoate, decentralized processing 30 to 60 minutes, filling under vacuum conditions
Sealed storage obtains the silane modified polyether Conductive sealant.
Table 1 lists the performance parameter of the silane modified polyether Conductive sealant of embodiment 1 to 4, wherein the measurement of each parameter
Mode are as follows: surface drying time GB/T 13477.5-2002, tensile strength and elongation at break ISO 37, hardness ISO 868, volume
Resistivity GB/T 2439.
The type silane modified polyether Conductive sealant performance parameter of 1. embodiment 1 to 4 of table
As can be seen from Table 1 the silane modified polyether Conductive sealant of embodiment 1 to 4 can quick surface drying, can room temperature it is solid
Change, there is superior electrical conductivity energy, good adhesive strength, surface high abrasion, strong operability.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (12)
1. a kind of silane modified polyether Conductive sealant, it is characterised in that: comprise the following components in parts by weight:
2. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the silane modified polyether
For isocyanate alkoxysilane blocking modification polyethers, the structure of the isocyanate alkoxysilane blocking modification polyethers
Skeleton symbol are as follows:
Wherein, R is-CH3Or-CH3CH2, R1For-H or-CH3, k is integer 2 or 3, and m is whole more than or equal to 1 and less than or equal to 3
Number, n are the integer more than or equal to 30 and less than or equal to 500, and the isocyanate alkoxysilane blocking modification polyethers glues
Degree is 2000 to 50000mPa.s.
3. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the fire resistant resin is
At least one of liquid rosin resin, liquid terpene resins and hydrogenated liquid rosin resin.
4. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the conductive filler is to lead
At least one of electric carbon black, graphite, silver powder, silvering powder, copper powder and carbon fiber.
5. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the plasticizer is poly- third
At least one of glycol, dioctyl phthalate, diisononyl phthalate and diisooctyl phthalate.
6. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the thixotropic agent is polyamides
At least one of amine wax, hydroxy silicon oil, fumed silica and nano silicone diatomaceous earth.
7. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the silane coupling agent is
γ-aminopropyltrimethoxysilane, gamma-aminopropyl-triethoxy-silane, 3- (2,3- the third oxygen of epoxy) propyl trimethoxy silicane,
In N- (β-aminoethyl)-γ-aminopropyltrimethoxysilane and N- (β-aminoethyl)-gamma-aminopropyl-triethoxy-silane extremely
Few one kind.
8. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the light stabilizer is 2-
(5- chloro (2H)-benzotriazole -2- base) -4- (methyl) -6- (tert-butyl) phenol, 2- (2 "-hydroxyls -3 ", 5 "-di-tert-butyls
Base) -5- chlorinated benzotriazole, two tert-amyl phenol of 2- (2H- benzotriazole -2- base) -4,6- and two (6- of 2,2'- methylene
At least one of (2H- benzotriazole -2- base) -4- (1,1,3,3- tetramethyl butyl) phenol.
9. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the heat stabilizer is 2,
6- di-tert-butyl-4-methy phenol, tert-butylhydroquinone, β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid octadecanol
Ester, four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol esters and 3,5- di-t-butyl -4- hydroxy phenylpropionic acid are different
At least one of monooctyl ester.
10. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the water absorbing agent is second
Alkenyl trimethoxy silane, vinyltriethoxysilane, vinyl dimethoxysilane, dodecyl triethoxysilane and
At least one of dodecyltrimethoxysilane.
11. a kind of silane modified polyether Conductive sealant as described in claim 1, it is characterised in that: the catalyst is two
At least one of dibutyl tin laurate, tin dilaurate diheptyl tin, stannous octoate, pungent capric acid zinc and butyl titanate.
12. a kind of preparation method of the silane modified polyether Conductive sealant as described in claim 1 to 11 any one, special
Sign is, includes the following steps:
The conductive filler, plasticizer, thixotropic agent, light stabilizer and heat stabilizer are added in a kneader, in temperature range
Vacuum kneading handles 1 to 3 hour and obtains one first mixture at 110 to 120 DEG C；
First mixture is cooled to 40 to 50 DEG C, first mixture after cooling is placed in a high speed disperser
In, the silane modified polyether, fire resistant resin and water absorbing agent are added in Xiang Suoshu high speed disperser, and high in a nitrogen atmosphere
Fast decentralized processing obtains one second mixture for 1 to 3 hour；And
Second mixture is cooled to not higher than 30 DEG C, the silane coupling agent is added in the second mixture of Xiang Suoshu and is urged
Agent, decentralized processing 30 to 60 minutes, obtain the silane modified polyether Conductive sealant under vacuum conditions.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682217A (en) * | 2020-07-08 | 2020-09-18 | 重庆金美新材料科技有限公司 | Conductive adhesive solution and battery pole piece |
| CN115926712A (en) * | 2022-12-30 | 2023-04-07 | 广州市白云化工实业有限公司 | Bi-component silane modified polyether conductive sealant and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005181478A (en) * | 2003-12-17 | 2005-07-07 | Fuji Xerox Co Ltd | Carrier for electrostatic latent image developer, electrostatic latent image developer, and image forming method |
| CN106566452A (en) * | 2016-10-20 | 2017-04-19 | 马鞍山市盛力锁业科技有限公司 | Electroconductive one-component moisture-curable silane-terminated polyurethane sealant and preparation method thereof |
| CN107163896A (en) * | 2017-07-07 | 2017-09-15 | 东莞市德聚胶接技术有限公司 | Silicane-modified polyurethane Conductive sealant and preparation method thereof |
| CN110041872A (en) * | 2019-05-06 | 2019-07-23 | 华东理工大学 | Modified MS sealant of a kind of graphene and preparation method thereof |
-
2019
- 2019-09-06 CN CN201910844091.XA patent/CN110527474A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005181478A (en) * | 2003-12-17 | 2005-07-07 | Fuji Xerox Co Ltd | Carrier for electrostatic latent image developer, electrostatic latent image developer, and image forming method |
| CN106566452A (en) * | 2016-10-20 | 2017-04-19 | 马鞍山市盛力锁业科技有限公司 | Electroconductive one-component moisture-curable silane-terminated polyurethane sealant and preparation method thereof |
| CN107163896A (en) * | 2017-07-07 | 2017-09-15 | 东莞市德聚胶接技术有限公司 | Silicane-modified polyurethane Conductive sealant and preparation method thereof |
| CN110041872A (en) * | 2019-05-06 | 2019-07-23 | 华东理工大学 | Modified MS sealant of a kind of graphene and preparation method thereof |
Non-Patent Citations (4)
| Title |
|---|
| 张军 编著: "《橡塑制鞋材料及应用》", 28 February 1999, 中国轻工业出版社 * |
| 方铭中等: "建筑用硅烷改性聚氨酯密封胶研究进展", 《中国建筑防水》 * |
| 许铎宾等: "用于汽车玻璃的高强度MS胶研究 ", 《有机硅材料》 * |
| 赵苗等: "硅烷改性聚醚密封胶的研究进展 ", 《粘接》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682217A (en) * | 2020-07-08 | 2020-09-18 | 重庆金美新材料科技有限公司 | Conductive adhesive solution and battery pole piece |
| CN115926712A (en) * | 2022-12-30 | 2023-04-07 | 广州市白云化工实业有限公司 | Bi-component silane modified polyether conductive sealant and preparation method thereof |
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Application publication date: 20191203 |