CN110512246B - Preparation process of foam metal for electronic component heat dissipation system - Google Patents
Preparation process of foam metal for electronic component heat dissipation system Download PDFInfo
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- CN110512246B CN110512246B CN201910935033.8A CN201910935033A CN110512246B CN 110512246 B CN110512246 B CN 110512246B CN 201910935033 A CN201910935033 A CN 201910935033A CN 110512246 B CN110512246 B CN 110512246B
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- foam metal
- polyurethane
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Abstract
A process for preparing the foam metal used for the heat radiating system of electronic element includes pretreating polyurethane, setting electrically conducting wires, pre-plating, electroplating Ni, and modifying foam metal. The preparation process of the foam metal for the electronic component heat dissipation system has the advantages of simple process and high flexibility, firstly adopts the conductive adhesive method for conducting treatment, has low cost and simple process, improves the smoothness and the mechanical property of the surface of the coating of the foam metal by improving parameters such as voltage, current density, plating solution components, temperature and the like, and finally modifies the foam metal, thereby greatly improving the heat conduction property of the material and having good development prospect.
Description
Technical Field
The invention belongs to the technical field of novel materials, and particularly relates to a preparation process of foam metal for a heat dissipation system of an electronic component.
Background
With the development of industrial informatization of the modern society, the trend of automation and intellectualization is more and more obvious. Whether public service, civilian and medical education or even military have higher requirements for further development of electronic technology.
Modern electronic components are increasingly large in power consumption and high in power, and the changes bring more heating influences. This presents a significant challenge to both power up and safety issues for electronic components. The heat dissipation capability is one of the bottlenecks of the power consumption and the safety of the components, and the enhancement of the heat dissipation capability has great significance for the improvement of the performance of the electronic components and the guarantee of the safety.
In order to increase the heat dissipation capability, a complete heat dissipation system is necessary and necessary. The regulation from the configuration design to the auxiliary heat sink must be strictly and properly designed. In view of the range of applications, the influence of extremely high temperatures as well as extremely low temperatures should also be taken into account. When the above factors are considered, the miniaturization of the heat dissipation system should be considered, the power consumption is reduced, and the combination of the maintainability and the heat-dissipated device is improved to really achieve the results of improving the efficiency and the safety.
Whereas foam metal is a solid metal composed of cellular structures, a large part of the volume is typically the pore volume. The pores may be sealed (closed cell foam) or interconnected (open cell foam). The metal foam is defined as being characterized by a high porosity, typically only 5-25% by volume of metal, giving these ultra-light materials very different mechanical properties and excellent heat dissipation properties.
Because when using foam metal at electronic components's cooling system, need laminate the shape characteristics of electronic components itself, have certain structural strength, bending resistance and stability, in order to promote the security simultaneously, should deal with special circumstances such as shock-resistant vibrations simultaneously. Therefore, it is necessary to develop a metal foam for a heat dissipation system of electronic components. Moreover, the research on the preparation process of the foam metal is not mature at present, and the preparation process of the foam metal for different application occasions and different types of foam metals is greatly different.
Chinese patent application No. cn201820930241.x discloses an electronic component fin, and electronic component fin cover establishes on electronic component, gives the heat radiation radar through the conduction of heat conduction post after absorbing the heat that electronic component produced, and the rethread heat radiation radar gives off the heat to the air, in time gives off the heat that electronic component produced, ensures electronic component safe work. The patent only improves the heat dissipation capability by improving the structure of the heat dissipation system, and does not relate to the used materials of the heat dissipation system.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects, the invention aims to provide a preparation process of the foam metal for the heat dissipation system of the electronic component, which has the advantages of simple process and high flexibility, adopts a conductive adhesive method for conducting treatment firstly, has low cost and simple process, improves the smoothness and the mechanical property of the surface of a plating layer of the foam metal by improving parameters such as voltage, current density, plating solution components, temperature and the like, and finally modifies the foam metal, greatly improves the heat conductivity of the material and has good development prospect.
The purpose of the invention is realized by the following technical scheme:
a preparation process of foam metal for an electronic component heat dissipation system is characterized by comprising the following steps:
(1) pretreatment of polyurethane: conducting treatment is carried out on polyurethane by a conductive adhesive method;
(2) arranging conductive wires, namely uniformly distributing the conductive wires in the pretreated polyurethane matrix;
(3) pre-plating, namely placing a titanium basket on each side of a plating tank as an anode, and placing nickel blocks with the same mass in the titanium baskets; fixing the polyurethane in the center of a plating bath, connecting electrodes, setting a power supply to be stable and setting the voltage to be 4V; when the foamed polyurethane is approximately half covered with a nickel layer, the voltage is adjusted to 6V, and the current density is 2.5A/dm 2; finishing the pre-plating process until the current is stable and the polyurethane surface is uniformly covered with a nickel layer;
(4) electroplating nickel: filling a plating solution outside the plating tank, wherein the temperature of the plating solution is 40-50 ℃, the plating solution is a mixed solution added with sodium dodecyl sulfate, saccharin, sodium benzene sulfinate and 1, 4-diacetylene, the sodium dodecyl sulfate is 0.1g/L, the saccharin is 1g/L, the sodium benzene sulfinate is 0.04g/L, and the 1, 4-diacetylene is 0.3 g/L; and opening an ultrasonic vibration plate, selecting pulse type ultrasonic waves, taking out the foam metal after electrodeposition is finished, cleaning the foam metal with deionized water, and drying.
The preparation process of the foam metal for the heat dissipation system of the electronic component, disclosed by the invention, adopts the conductive adhesive method for conducting treatment, is low in cost and simple in process, and improves the smoothness and mechanical properties of the coating surface of the foam metal by improving parameters such as voltage, current density, plating solution components, temperature and the like. The additive in the plating solution has small content in the plating solution, but has great effect, participates in oxidation-reduction reaction and codeposition, achieves the effect of refining crystal grains and directionally arranging crystal growth to generate a layered structure, can ensure that the surface of the plating layer is smooth and bright, and has great influence on the mechanical and chemical properties of the plating layer. Wherein saccharin has both stress relief and shine benefits; sodium dodecyl sulfate is a wetting agent, is an anionic surfactant, can be adsorbed on the surface of a cathode to make hydrogen difficult to retain and reduce pinholes and pockmarks; saccharin and sodium benzene sulfinate are primary brighteners, and the sulfonyl groups of these materials contain unsaturated carbon bonds and can adsorb on the cathode, increasing cathode polarization and reducing grain size. The additive can be embedded into a coating during discharge, and is mixed into crystal lattices to increase the current among the crystal grains, so that the surface flatness is increased. But at the same time, the coating is subjected to compressive stress; the 1, 4-diacetylene is a secondary brightening agent, has a leveling effect, can fill pits with certain geometric shapes, and can offset compressive stress.
Further, in the preparation process of the foam metal for the electronic component heat dissipation system, the polyurethane is in a three-dimensional through hole structure, the hole density is 12PPI, and the pore diameter is distributed between 2.0 mm and 2.4 mm.
The polyurethane is used as a support material of the foam nickel, the pore density and the pore size distribution of the polyurethane determine the pore density and the pore size distribution of the foam metal, and the uniform pore size distribution facilitates the uniformity of the mechanical property of the foam metal.
Further, in the above preparation process of the foamed metal for the heat dissipation system of the electronic component, the total sectional area of the nickel blocks placed in the titanium basket in the step (3) is equal to the sectional area of the polyurethane.
When the total sectional area of the nickel block is equal to that of the foamed polyurethane, namely the area ratio of the positive electrode to the negative electrode is 1:1, stable and efficient electrodeposition current can be obtained.
Further, in the preparation process of the foam metal for the electronic component heat dissipation system, the conductive wires in the step (2) are 0.5mm soft copper wires, and 5 conductive wires are uniformly distributed in the length direction and the width direction of the polyurethane respectively.
Further, the preparation process of the foam metal for the electronic component heat dissipation system comprises the following steps of:
(1) ultrasonic cleaning and oil removal: immersing polyurethane in degreasing liquid, continuously cleaning for 10 minutes in an ultrasonic machine, pressing the polyurethane by using a cleaning rod to sufficiently remove oil, and cleaning and drying by using pure water after the ultrasonic frequency is 28 kHZ;
(2) coarsening: immersing the polyurethane into a coarsening solution in clear water for coarsening treatment, wherein the coarsening time is 1 min;
(3) coating conductive adhesive: and (3) completely immersing the polyurethane into the conductive adhesive, repeatedly extruding under the ultrasonic condition, taking out the polyurethane after 2 minutes, completely extruding the polyurethane till the holes are not blocked by the conductive adhesive, repeating the operation for three times, and drying at 60 ℃.
Because the polyurethane is non-conductive, the polyurethane needs to be subjected to conductive treatment, and the chemical plating method has high toxicity and high cost, so the conductive adhesive method is adopted to perform conductive treatment on the polyurethane. Because the surface of the polyurethane is inevitably stained with oil stains in the production and transportation processes of the polyurethane, the polyurethane needs to be subjected to oil removal treatment in order to avoid influencing the subsequent process; the coarsening step before coating the conductive adhesive is to form a rough surface on the polyurethane, so that a thicker conductive adhesive coating layer is formed, and the conductivity is enhanced. The invention adopts the roughening liquid with strong oxidizing property.
Further, in the preparation process of the foam metal for the heat dissipation system of the electronic component, the deoiling liquid is Na2CO3、Na3PO4Mixed solution of NaOH and OP-10; the Na is2CO320-30g/L of the Na3PO410-30g/L, 10-20g/L NaOH and 0.5mL/L OP-10.
Further, in the preparation process of the foam metal for the heat dissipation system of the electronic component, the roughening solution is H2SO4、KMnO4、NiSO4·6H2O、NiCl2·6H2O mixed solution; said H2SO4Is 13mL/L, the KMnO47g/L of said NiSO4·6H2O is 250-300g/L, and the NiCl2·6H2O is 30-50 g/L.
Further, in the preparation process of the foamed metal for the heat dissipation system of the electronic component, the conductive adhesive is graphite conductive latex, the graphite content of the graphite conductive latex is 20 wt%, and the particle size of the graphite is 10 μm.
Increasing the graphite content and reducing the graphite particle size can keep the viscosity of the conductive adhesive lower and increase the conductivity. The better the conductivity of the conductive adhesive layer formed on the surface of the polyurethane, the more uniform the electrodeposited nickel layer will be.
Further, the preparation process of the foam metal for the electronic component heat dissipation system further comprises the following step (5) of modifying the foam metal: immersing the foam metal obtained in the step (4) in an ethanol diluent containing 3% of silane coupling agent, taking out and drying after full infiltration, and heating and keeping at 90 ℃; mixing liquid paraffin and boron carbide in a weight ratio of 3:1, mechanically stirring for 10 minutes at 300n/min under a heat preservation state, and reducing the temperature to 60 ℃ after uniform mixing to obtain the mixed melt; then the foam metal is immersed in the mixed melt, and bubbles are removed by pressing and shaking the foam metal; and putting the foam metal into a vacuum drying oven, vacuumizing to negative pressure of-0.8 MPa, cooling for 3 hours, taking out and removing redundant paraffin to obtain the foam metal.
The mechanical properties of polyurethane and nickel coatings in the foam metal dominate the mechanical properties of the foam metal, paraffin and boron carbide play a role in reinforcement, the heat conductivity of the modified foam metal is 2-4 times that of unmodified foam metal, the heat conductivity coefficient is greatly increased after the boron carbide is added, the foam metal forms a complete heat conduction path, and the heat conductivity of the material is greatly improved.
Further, in the above preparation process of the foam metal for the heat dissipation system of the electronic component, the boron carbide in the step (5) is immersed in a 3% ethanol solution containing a silane coupling agent, sufficiently soaked, taken out, dried, and heated to be maintained at 90 ℃.
The boron carbide plays a role in absorbing thermal neutrons in the foam metal, and simultaneously plays a role in strengthening the mechanical property of the foam metal. However, if the boron carbide is not uniformly dispersed in the matrix, neutron leakage and mechanical property degradation may be caused. Immersing boron carbide in an ethanol solution containing 3% of silane coupling agent for surface treatment, wherein the silane coupling agent changes and improves the wettability of the boron carbide and paraffin, thereby improving the dispersibility of the boron carbide in the paraffin.
Compared with the prior art, the invention has the following beneficial effects:
(1) the invention discloses a preparation process of foam metal for an electronic component heat dissipation system, which comprises the steps of firstly conducting treatment by adopting a conductive adhesive method, wherein the process has the advantages of high toxicity, high cost, low cost and simple process compared with a chemical plating method, and solves the problem of uneven coating of the conductive adhesive method by deoiling and coarsening; in the preplating and nickel electroplating processes, the smoothness and mechanical properties of the surface of the plating layer of the foam metal are improved by improving parameters such as voltage, current density, plating solution components, temperature and the like; the foam metal is improved by adopting paraffin and boron carbide, so that the mechanical property is enhanced, and the heat conductivity coefficient is greatly improved;
(2) the preparation process of the foam metal for the electronic component heat dissipation system is simple in process, high in flexibility, capable of meeting the requirements of different occasions and good in development prospect;
(3) the preparation process of the foam metal for the heat dissipation system of the electronic component, provided by the invention, has the advantages that the additive is added into the plating solution, although the content of the additive in the plating solution is very small, the additive has a very large effect and participates in the redox reaction and codeposition, the effect of refining grains and directionally arranging crystal growth to generate a lamellar structure is achieved, the surface of the plating layer is smooth and bright, and the mechanical and chemical properties of the plating layer are improved.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to specific experimental data, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following embodiment provides a preparation process of a foam metal for a heat dissipation system of an electronic component, wherein the polyurethane is in a three-dimensional through hole structure, the hole density is 12PPI, and the pore diameter is distributed between 2.0 mm and 2.4 mm.
Further, the total cross-sectional area of the nickel blocks placed in the titanium basket in the step (3) is equal to the cross-sectional area of the polyurethane.
Further, the conductive wires in the step (2) are 0.5mm soft copper wires, and 5 conductive wires are uniformly distributed in the length direction and the width direction of the polyurethane respectively.
And the deoiling liquid is Na2CO3、Na3PO4Mixed solution of NaOH and OP-10; the Na is2CO320-30g/L of the Na3PO410-30g/L, 10-20g/L NaOH and 0.5mL/L OP-10.
Further, the roughening solution is H2SO4、KMnO4、NiSO4·6H2O、NiCl2·6H2O mixed solution; said H2SO4Is 13mL/L, the KMnO47g/L of said NiSO4·6H2O is 250-300g/L, and the NiCl2·6H2O is 30-50 g/L.
In addition, the conductive adhesive is graphite conductive latex, the graphite content of the graphite conductive latex is 20 wt%, and the particle size of the graphite is 10 μm.
Example 1
Preparation of unmodified metal foam:
(1) pretreatment of polyurethane: conducting treatment is carried out on polyurethane by a conductive adhesive method;
1) ultrasonic cleaning and oil removal: immersing polyurethane in degreasing liquid, continuously cleaning for 10 minutes in an ultrasonic machine, pressing the polyurethane by using a cleaning rod to sufficiently remove oil, and cleaning and drying by using pure water after the ultrasonic frequency is 28 kHZ;
2) coarsening: immersing the polyurethane into a coarsening solution in clear water for coarsening treatment, wherein the coarsening time is 1 min;
(3) coating conductive adhesive: completely immersing the polyurethane into the conductive adhesive, repeatedly extruding under the ultrasonic condition, taking out the polyurethane after 2 minutes, completely extruding the polyurethane till the holes are not blocked by the conductive adhesive, repeating the operation for three times, and drying at 60 ℃;
(2) arranging conductive wires, namely uniformly distributing the conductive wires in the pretreated polyurethane matrix;
(3) pre-plating, namely placing a titanium basket on each side of a plating tank as an anode, and placing nickel blocks with the same mass in the titanium baskets; fixing the polyurethane in the center of a plating bath, connecting electrodes, setting a power supply to be stable and setting the voltage to be 4V; when the foamed polyurethane has nearly half of the nickel layer covered, the voltage is adjusted to 6V and the current density is 2.5A/dm2(ii) a Finishing the pre-plating process until the current is stable and the polyurethane surface is uniformly covered with a nickel layer;
(4) electroplating nickel: filling a plating solution outside the plating tank, wherein the temperature of the plating solution is 40-50 ℃, the plating solution is a mixed solution added with sodium dodecyl sulfate, saccharin, sodium benzene sulfinate and 1, 4-diacetylene, the sodium dodecyl sulfate is 0.1g/L, the saccharin is 1g/L, the sodium benzene sulfinate is 0.04g/L, and the 1, 4-diacetylene is 0.3 g/L; and opening an ultrasonic vibration plate, selecting pulse type ultrasonic waves, taking out the foam metal after electrodeposition is finished, cleaning the foam metal with deionized water, and drying.
Example 2
Preparing modified foam metal:
(1) pretreatment of polyurethane: conducting treatment is carried out on polyurethane by a conductive adhesive method;
(2) arranging conductive wires, namely uniformly distributing the conductive wires in the pretreated polyurethane matrix;
(3) pre-plating, namely placing a titanium basket on each side of a plating tank as an anode, and placing nickel blocks with the same mass in the titanium baskets; fixing the polyurethane in the center of a plating bath, connecting electrodes, setting a power supply to be stable and setting the voltage to be 4V; when the foamed polyurethane is approximately half covered with a nickel layer, the voltage is adjusted to 6V, and the current density is 2.5A/dm 2; finishing the pre-plating process until the current is stable and the polyurethane surface is uniformly covered with a nickel layer;
(4) electroplating nickel: filling a plating solution outside the plating tank, wherein the temperature of the plating solution is 40-50 ℃, the plating solution is a mixed solution added with sodium dodecyl sulfate, saccharin, sodium benzene sulfinate and 1, 4-diacetylene, the sodium dodecyl sulfate is 0.1g/L, the saccharin is 1g/L, the sodium benzene sulfinate is 0.04g/L, and the 1, 4-diacetylene is 0.3 g/L; and opening an ultrasonic vibration plate, selecting pulse type ultrasonic waves, taking out the foam metal after electrodeposition is finished, cleaning the foam metal with deionized water, and drying.
(5) Modification of the foam metal: immersing the foam metal obtained in the step (4) in an ethanol diluent containing 3% of silane coupling agent, taking out and drying after full infiltration, and heating and keeping at 90 ℃; immersing boron carbide in 3 percent ethanol solution containing silane coupling agent, taking out and drying after full infiltration, and heating and keeping at 90 ℃; mixing liquid paraffin and the boron carbide according to the weight ratio of 3:1, mechanically stirring for 10 minutes at 300n/min under a heat preservation state, and reducing the temperature to 60 ℃ after uniform mixing to obtain the mixed melt; then the foam metal is immersed in the mixed melt, and bubbles are removed by pressing and shaking the foam metal; and putting the foam metal into a vacuum drying oven, vacuumizing to negative pressure of-0.8 MPa, cooling for 3 hours, taking out and removing redundant paraffin to obtain the foam metal.
Effect verification:
the foam metals for the heat dissipation system of electronic components obtained in the above examples 1 and 2 were subjected to performance tests according to the following criteria, and the test results are shown in table 1.
Heat conductivity: the method for testing the heat conductivity coefficient is a heat flow method, the used heat conductivity coefficient tester is a DRL-III heat conductivity coefficient testing system, the foam metal samples for the electronic component heat dissipation system obtained in the embodiment 1 and the embodiment 2 are made into a cylinder of 10cm multiplied by 20cm, the heat source is set to be 60 ℃, and the cold end is ice-water mixture of 0 ℃. To avoid poor contact of the heat source with the material, thermally conductive silicone grease was applied to both ends of the sample to enhance thermal contact. The test was repeated three times to obtain an average value.
And (3) testing mechanical properties: the foam metals for electronic component heat dissipation systems obtained from examples 1 and 2 above were tested for tensile strength, force range, using a dynamic thermomechanical analyzer (DMAQ 800): 0.0001-18N; force sensitivity: 0.00001N; dynamic deformation range: 0.5 μm to 10 mm; static deformation range: 0.5-26 mm. The distance between the initial clamping positions of the samples is 2cm, the width of the middle narrow part is 3mm, and the thickness is 1 mm. The furnace was opened, the tensile fixture was installed, and the specimen was mounted on the fixture. A series of dynamic forces with fixed frequency and increasing force magnitude in steps were set to be applied to the samples and three data were recorded for each set of samples. The test environment temperature is set to be 26 ℃, the stretching speed is 9N/min, and the resolution of strain is 1 nm. The sample is dumbbell-shaped, and the fracture of the narrow parallel part in the middle of the sample is effective.
TABLE 1 sample Performance test results
The invention has many applications, and the above description is only a preferred embodiment of the invention. It should be noted that the above examples are only for illustrating the present invention, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications can be made without departing from the principles of the invention and these modifications are to be considered within the scope of the invention.
Claims (8)
1. A preparation process of foam metal for an electronic component heat dissipation system is characterized by comprising the following steps:
(1) pretreatment of polyurethane: conducting treatment is carried out on polyurethane by a conductive adhesive method;
(2) setting a conductive wire: uniformly distributing conductive wires in the pretreated polyurethane matrix;
(3) pre-plating, namely placing a titanium basket on each side of a plating tank as an anode, and placing nickel blocks with the same mass in the titanium baskets; fixing the polyurethane in the center of a plating bath, connecting electrodes, setting a power supply to be stable and setting the voltage to be 4V; when the foamed polyurethane is approximately half covered with a nickel layer, the voltage is adjusted to 6V, and the current density is 2.5A/dm 2; finishing the pre-plating process until the current is stable and the polyurethane surface is uniformly covered with a nickel layer;
(4) electroplating nickel: filling a plating solution outside the plating tank, wherein the temperature of the plating solution is 40-50 ℃, the plating solution is a mixed solution added with sodium dodecyl sulfate, saccharin, sodium benzene sulfinate and 1, 4-diacetylene, the sodium dodecyl sulfate is 0.1g/L, the saccharin is 1g/L, the sodium benzene sulfinate is 0.04g/L, and the 1, 4-diacetylene is 0.3 g/L; opening an ultrasonic vibration plate, selecting pulse type ultrasonic waves, taking out the foam metal after electrodeposition is finished, cleaning the foam metal with deionized water and drying the foam metal;
(5) modification of the foam metal: immersing the foam metal obtained in the step (4) in an ethanol diluent containing 3% of silane coupling agent, taking out and drying after full infiltration, and heating and keeping at 90 ℃; immersing boron carbide in 3% ethanol diluent containing silane coupling agent, taking out and drying after full infiltration, and heating and keeping at 90 ℃; mixing liquid paraffin and boron carbide in a weight ratio of 3:1, mechanically stirring for 10 minutes at 300n/min under a heat preservation state, and reducing the temperature to 60 ℃ after uniform mixing to obtain the mixed melt; then the foam metal is immersed in the mixed melt, and bubbles are removed by pressing and shaking the foam metal; and putting the foam metal into a vacuum drying oven, vacuumizing to negative pressure of-0.8 MPa, cooling for 3 hours, taking out and removing redundant paraffin to obtain the foam metal.
2. The preparation process of the foam metal for the heat dissipation system of the electronic component as claimed in claim 1, wherein the polyurethane has a three-dimensional through-hole structure, the pore density is 12PPI, and the pore size is distributed between 2.0 mm and 2.4 mm.
3. The process for preparing the foam metal for the heat dissipation system of the electronic components as claimed in claim 1, wherein the total cross-sectional area of the nickel blocks placed in the titanium basket in the step (3) is equal to that of the polyurethane.
4. The process for preparing the foam metal for the heat dissipation system of the electronic components as claimed in claim 1, wherein the conductive wires in the step (2) are 0.5mm soft copper wires, and 5 conductive wires are uniformly distributed in the length direction and the width direction of the polyurethane respectively.
5. The preparation process of the foam metal for the electronic component heat dissipation system according to claim 1, wherein the pretreatment of the polyurethane comprises the following steps:
(1) ultrasonic cleaning and oil removal: immersing polyurethane in degreasing liquid, continuously cleaning for 10 minutes in an ultrasonic machine, pressing the polyurethane by using a cleaning rod to sufficiently remove oil, and cleaning and drying by using pure water after the ultrasonic frequency is 28 kHZ;
(2) coarsening: immersing the polyurethane into a coarsening solution in clear water for coarsening treatment, wherein the coarsening time is 1 min;
(3) coating conductive adhesive: and (3) completely immersing the polyurethane into the conductive adhesive, repeatedly extruding under the ultrasonic condition, taking out the polyurethane after 2 minutes, completely extruding the polyurethane till the holes are not blocked by the conductive adhesive, repeating the operation for three times, and drying at 60 ℃.
6. The preparation process of the foam metal for the heat dissipation system of the electronic components as claimed in claim 5, wherein the degreasing fluid is Na2CO3、Na3PO4Mixed solution of NaOH and OP-10; the Na is2CO320-30g/L of the Na3PO410-30g/L, 10-20g/L NaOH and 0.5mL/L OP-10.
7. The process for preparing the foam metal for the heat dissipation system of the electronic component as claimed in claim 5, wherein the roughening solution is H2SO4、KMnO4、NiSO4·6H2O、NiCl2·6H2O mixed solution; said H2SO4Is 13mL/L, the KMnO47g/L of said NiSO4·6H2O is 250-300g/L, and the NiCl2·6H2O is 30-50 g/L.
8. The process for preparing the foam metal for the heat dissipation system of the electronic component as recited in claim 5, wherein the conductive adhesive is graphite conductive latex, the graphite content of the graphite conductive latex is 20 wt%, and the particle size of the graphite is 10 μm.
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