CN110512246A - A kind of preparation process of the foam metal for cooling electronic component system - Google Patents
A kind of preparation process of the foam metal for cooling electronic component system Download PDFInfo
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- CN110512246A CN110512246A CN201910935033.8A CN201910935033A CN110512246A CN 110512246 A CN110512246 A CN 110512246A CN 201910935033 A CN201910935033 A CN 201910935033A CN 110512246 A CN110512246 A CN 110512246A
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- foam metal
- polyurethane
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- Chemical Kinetics & Catalysis (AREA)
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- Electroplating Methods And Accessories (AREA)
Abstract
A kind of preparation process of the foam metal for cooling electronic component system, the following steps are included: the pretreatment of polyurethane, setting conductive filament, preplating, electronickelling, the modification of foam metal, the pretreatment of polyurethane is to carry out conductive treatment to polyurethane with conducting resinl method, it is uniformly distributed with conductive filament in polyurethane matrix after the pre-treatment, then carries out preplating, electronickelling, the modification of foam metal.The preparation process of foam metal of the present invention for cooling electronic component system, simple process, flexibility is high, first carries out conductive treatment using conducting resinl method, at low cost, simple process, by the improvement to parameters such as voltage, current density, plating solution composition, temperature, the smooth degree and mechanical property of the coating surface of the foam metal are improved, finally foam metal is modified, the heating conduction of material is significantly improved, there is good development prospect.
Description
Technical field
The invention belongs to technical field of novel materials, and in particular to a kind of foam gold for cooling electronic component system
The preparation process of category.
Background technique
With the development of modern society's industrial information, automation, intelligentized trend more shows.Either public clothes
Business, the people's livelihood and medical education or even military affairs all have higher requirement to the further development of electronic technology.
The power consumption of hyundai electronics component is increasing, and power is higher and higher, these variations bring more fever shadows
It rings.This is proposed very more challenges to the power ascension and safety issue of electronic component.Heat-sinking capability is first device
One of the bottleneck of part power consumption and safety, enhancing heat-sinking capability no matter the promotion or safety for electronic component performance
Guarantee suffers from very great meaning.
Want heat radiation ability, the cooling system of complete set is necessary and necessary.Auxiliary is designed into from configuration to dissipate
The regulation of thermal, it is necessary to have stringent and suitable design.In view of application range, thermal extremes and extreme low temperature
Influence should also be as being related to wherein.While factor more than consideration, the miniaturization of cooling system should be also taken into account, reduces function
It consumes, while promoting maintainability could really reach the result of raising efficiency and safety in conjunction with the device to be radiated.
And foam metal is a kind of solid metal of eucaryotic cell structure composition, the in general volume of most is pore-body
Product.Pore can seal (closed-cell foam) or interconnection (open celled foam).The defined feature of metal foam is high porosity: usually only
The volume of 5-25% is metal, these ultra-lightweight materials is made to have totally different mechanical performance and excellent heat dissipation performance.
Need to be bonded the shape of electronic component itself in the cooling system of electronic component due to applying foam metal
Shape feature has certain structural strength, buckle resistance and stability, while in order to promote safety, can should cope with simultaneously
The special circumstances such as shock resistance vibration.Therefore, a kind of foam metal for the cooling system with electronic component is developed very
It is necessary to.Also, it is also immature for the Study on Preparation of foam metal at present, and for different application and difference
The difference of the foam metal preparation process of type is larger.
Chinese Patent Application No. is that CN201820930241.X discloses a kind of cooling electronic component piece, electronic component
Cooling fin is set on electronic component, will be conducted to heat dissipation thunder by heating column after the heat absorption of electronic component generation
It reaches, then is dissipated the heat to the air by the radar that radiates, the heat that electronic component generates is distributed in time, ensures electricity
Sub- component trouble free service.The patent improves to improve heat-sinking capability simply by the structure to cooling system, does not relate to
And the use material of cooling system.
Summary of the invention
Goal of the invention: in order to overcome the above deficiency, the object of the present invention is to provide one kind to be used for cooling electronic component system
The preparation process of the foam metal of system, simple process, flexibility is high, first carries out conductive treatment using conducting resinl method, at low cost,
Simple process improves the plating of the foam metal by the improvement to parameters such as voltage, current density, plating solution composition, temperature
The smooth degree and mechanical property of layer surface, are finally modified foam metal, significantly improve the thermal conductivity of material
Can, there is good development prospect.
The purpose of the present invention is what is be achieved through the following technical solutions:
A kind of preparation process of the foam metal for cooling electronic component system, which is characterized in that including following step
It is rapid:
(1) conductive treatment the pretreatment of polyurethane: is carried out to polyurethane with conducting resinl method；
(2) conductive filament is set: being uniformly distributed with conductive filament in polyurethane matrix after the pre-treatment；
(3) a titanium basket preplating: is placed into as positive, the nickel of placement phase homogenous quantities in the titanium basket in coating bath both sides respectively
Block；Above-mentioned polyurethane is fixed on aqueduct center, after connecting electrode, power supply is set as pressure stabilizing, sets voltage as 4V；Foam is poly-
Urethane has close to voltage is adjusted to 6V, current density 2.5A/dm2 when nickel layer on a half mulching；Until electric current stabilization, poly- ammonia
When ester surface uniformly covers one layer of nickel layer, preplating process terminates；
(4) electronickelling: filling up plating solution on the outside of aqueduct, and the temperature of the plating solution is 4050 DEG C, and the plating solution is addition
There are lauryl sodium sulfate, saccharin, benzene sulfinic acid sodium salt, Isosorbide-5-Nitrae-diacetylene mixed liquor, and lauryl sodium sulfate is 0.1g/
L, saccharin 1g/L, benzene sulfinic acid sodium salt 0.04g/L, Isosorbide-5-Nitrae-diacetylene are 0.3g/L；Open ultrasonic wave vibration plate, strobe pulse formula
Ultrasonic wave, the frequency of the ultrasonic wave is 48kHZ, takes out the foam metal after the completion of electro-deposition, is washed with deionized water
After dry.
The preparation process of foam metal of the present invention for cooling electronic component system first uses conducting resinl method
Carry out conductive treatment, at low cost, simple process, by the improvement to parameters such as voltage, current density, plating solution composition, temperature,
Improve the smooth degree and mechanical property of the coating surface of the foam metal.Additive in plating solution containing in the plating solution
Very little is measured, but effect is but very big, takes part in redox reaction and co-deposition, has reached refinement crystal grain and crystalline growth orientation
Arrangement generates the effect of lamellar tissue, can not only make the smooth light of coating surface, to the shadow of the mechanically and chemically performance of coating
It rings also very big.Wherein, saccharin plays the role of stress elimination and light simultaneously；Lauryl sodium sulfate is wetting agent, it be yin from
Sub- surfactant, can be adsorbed on cathode surface makes hydrogen be difficult to be detained, and reduces pin hole and point；Saccharin and benzene sulfinic acid sodium salt
It is primary brightener, the sulfonyl of these substances contains unsaturated carbon bond, can be adsorbed on cathode, increases cathodic polarization, reduces brilliant
Particle size.The additive can be embedded in coating in electric discharge, be mingled in lattice, increase intercrystalline electric current, to increase
Surface smoothness.But it can make that there are compression in coating simultaneously；Isosorbide-5-Nitrae-diacetylene is second-class brightener, has leveling effect,
The pit with certain geometrical shape can be filled up, and compression can be offset.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, the polyurethane
For three-dimensional through hole structure, hole density 12PPI, pore-size distribution is between 2.0~2.4mm.
Hole density and the pore-size distribution distribution of timbering material of the polyurethane as nickel foam, polyurethane determine foam metal
Hole density and pore-size distribution, uniform pore-size distribution have the uniformity for the mechanical property for being easy to foam metal.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, the step (3)
In titanium basket in place nickel block total sectional area be equal to polyurethane sectional area.
When the total sectional area of nickel block is equal to the sectional area of foamed polyurethane, both positive and negative anodes area ratio was 1:1, at this time could
Obtain the electro-deposition electric current of stability and high efficiency.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system and, the step
(2) soft copper silk that the conductive filament in is 0.5mm, is respectively uniformly distributed 5 conductive filaments in polyurethane length and width direction.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, the polyurethane
Pretreatment, comprising the following steps:
(1) be cleaned by ultrasonic oil removing: by polyurethane immerse in degreasing fluid in being placed in ultrasonic machine continuous wash 10 minutes and
Polyurethane is pressed with abundant oil removing with cleaning rod, and the supersonic frequency, which is cleaned after being 28khz with pure water, dries；
(2) it is roughened: above-mentioned polyurethane is immersed in clear water and carries out roughening treatment, coarsening time 1min in coarsening solution；
(3) it coats conducting resinl: above-mentioned polyurethane being totally submerged in conducting resinl, under ultrasound condition, repeatedly extrudes, holds
It after 2 minutes continuous, take out polyurethane and extracts extra conducting resinl completely, until the hole not blocked by conducting resinl, repeat this
After operation three times, 60 DEG C of drying.
Because polyurethane be it is nonconducting, first to polyurethane carry out conductive treatment, due to electroless plating method toxicity
Greatly, and it is at high cost, therefore the present invention carries out conductive treatment to polyurethane using conducting resinl method.Due to polyurethane production and transport
During inevitably in surface contamination grease stain, in order to avoid being impacted to subsequent technique, need to polyurethane carry out
Oil removal treatment；Roughening step before coating conducting resinl is that polyurethane is made to form coarse surface, advantageously forms leading of more thickening
Electric glue coat, to enhance electric conductivity.The present invention uses strong oxidizing property coarsening solution.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, the degreasing fluid
For Na2CO3、Na3PO4, NaOH, OP-10 mixed liquor；The Na2CO3For 20-30g/L, the Na3PO4For 1030g/L, institute
Stating NaOH is 10-20g/L, and the OP-10 is 0.5ml/L.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, the coarsening solution
For H2SO4、KMnO4、NiSO46H2O、NiCl26H2The mixed liquor of O；The H2SO4For 13ml/L, the KMnO47g/L, it is described
NiSO46H2O is 250-300g/L, the NiCl26H2O is 30-50g/L.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, the conducting resinl
For graphite latex, the content of graphite of the graphite latex is 20%wt, and the partial size of the graphite is 10 μm.
Increase content of graphite, reduction graphite partial size can make conducting resinl keep lower viscosity and increase electric conductivity.Poly-
The conductive adhesive layer electric conductivity that urethane surface is formed is better, and electro-deposition nickel layer will be more uniform.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, further includes as follows
The modification of step (5) foam metal: the foam metal that step (4) obtains is immersed in the ethyl alcohol of silane-containing coupling agent 3%
In dilution, drying is sufficiently taken out after infiltration, heating is maintained at 90 DEG C；By the paraffin of liquid and boron carbide with the ratio of weight 3:1
Example mixing, mechanical stirring 300n/min is stirred 10 minutes under keeping warm mode, and temperature is reduced to 60 DEG C after mixing, is obtained
The blend melt；Then above-mentioned foam metal is immersed in the blend melt, and pressing shake foam metal excludes bubble；It puts
Enter in vacuum oven, is evacuated to negative pressure -0.8MPa, it is 3 hours cooling, extra paraffin is taken out and removed, the bubble is obtained
Foam metal.
The mechanical property of polyurethane, nickel coating in foam metal has dominated its mechanical property, and paraffin and boron carbide rise
Invigoration effect is arrived, the heating conduction of modified foam metal is 2~4 times of unmodified foam metal, adds boron carbide
Later thermal coefficient greatly increases, and foam metal forms complete thermal conducting path, significantly improves the heating conduction of material.
Further, the preparation process of the above-mentioned foam metal for cooling electronic component system, the step (5)
In boron carbide be immersed in the ethanol solution of silane-containing coupling agent 3%, sufficiently infiltration after take out drying, heating be maintained at 90
℃。
Boron carbide plays the role of absorbing thermal neutron in the foam metal, while boron carbide is to the mechanics of foam metal
Performance also plays invigoration effect.But if boron carbide disperses unevenly, to will lead to the leakage of neutron, can also lead in the base
Endeavour to learn reduced performance.The ethanol solution that boron carbide is immersed in silane-containing coupling agent 3% is surface-treated, silane coupling agent
Change the wetability for improving boron carbide and paraffin, so as to improve dispersibility of the boron carbide in paraffin.
Compared with prior art, the present invention have it is following the utility model has the advantages that
(1) preparation process of the foam metal disclosed by the invention for cooling electronic component system, first using conduction
Glue method carries out conductive treatment, and opposite electroless plating method toxicity is big, at high cost, and conducting resinl method is at low cost, simple process, by removing
Oil, roughening solve the problems, such as that the coating of conducting resinl method is non-uniform；In preplating, electro-nickel process, by close to voltage, electric current
The improvement of the parameters such as degree, plating solution composition, temperature improves the smooth degree and mechanical property of the coating surface of the foam metal
Energy；Foam metal is improved using paraffin and boron carbide, enhances mechanical property, substantially increases thermal coefficient；
(2) preparation process of the foam metal proposed by the present invention for cooling electronic component system, simple process, and
With very high flexibility, meet the needs of different occasions, there is good development prospect；
(3) preparation process of the foam metal proposed by the present invention for cooling electronic component system adds into plating solution
Additive is entered, although the content very little of additive in the plating solution, effect is but very big, takes part in redox reaction and is total to
Deposition has haved the function that refining crystal grain and crystalline growth aligns and generate lamellar tissue, can not only make coating surface light
It is sliding bright, also improve the mechanically and chemically performance of coating.
Specific embodiment
Below in conjunction with specific experiment data, the technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, those skilled in the art's all other implementation obtained without making creative work
Example, belongs to protection scope of the present invention.
Following embodiment provides a kind of preparation process of foam metal for cooling electronic component system, described poly-
Urethane is three-dimensional through hole structure, and hole density 12PPI, pore-size distribution is between 2.0~2.4mm.
Further, the total sectional area that nickel block is placed in the titanium basket in the step (3) is equal to the sectional area of polyurethane.
Further, the conductive filament in the step (2) is the soft copper silk of 0.5mm, in the polyurethane length and width
Direction is respectively uniformly distributed 5 conductive filaments.
Also, the degreasing fluid is Na2CO3、Na3PO4, NaOH, OP-10 mixed liquor；The Na2CO3For 20-30g/L,
The Na3PO4It is 10-20g/L for 1030g/L, the NaOH, the OP-10 is 0.5ml/L.
Further, the coarsening solution is H2SO4、KMnO4、NiSO46H2O、NiCl26H2The mixed liquor of O；The H2SO4For
13ml/L, the KMnO47g/L, the NiSO46H2O is 250-300g/L, the NiCl26H2O is 30-50g/L.
In addition, the conducting resinl is graphite latex, the content of graphite of the graphite latex is 20%wt, described
The partial size of graphite is 10 μm.
Embodiment 1
The preparation of unmodified foam metal:
(1) conductive treatment the pretreatment of polyurethane: is carried out to polyurethane with conducting resinl method；
1) it is cleaned by ultrasonic oil removing: polyurethane is immersed into degreasing fluid the continuous wash 10 minutes in being placed in ultrasonic machine and is used
Cleaning rod presses polyurethane with abundant oil removing, and the supersonic frequency, which is cleaned after being 28khz with pure water, dries；
2) it is roughened: above-mentioned polyurethane is immersed in clear water and carries out roughening treatment, coarsening time 1min in coarsening solution；
(3) it coats conducting resinl: above-mentioned polyurethane being totally submerged in conducting resinl, under ultrasound condition, repeatedly extrudes, holds
It after 2 minutes continuous, take out polyurethane and extracts extra conducting resinl completely, until the hole not blocked by conducting resinl, repeat this
After operation three times,
60 DEG C of drying；
(2) conductive filament is set: being uniformly distributed with conductive filament in polyurethane matrix after the pre-treatment；
(3) a titanium basket preplating: is placed into as positive, the nickel of placement phase homogenous quantities in the titanium basket in coating bath both sides respectively
Block；Above-mentioned polyurethane is fixed on aqueduct center, after connecting electrode, power supply is set as pressure stabilizing, sets voltage as 4V；Foam is poly-
Urethane has close to voltage is adjusted to 6V, current density 2.5A/dm when nickel layer on a half mulching2；Until electric current stabilization, poly- ammonia
When ester surface uniformly covers one layer of nickel layer, preplating process terminates；
(4) electronickelling: filling up plating solution on the outside of aqueduct, and the temperature of the plating solution is 40-50 DEG C, the plating solution be added with
Lauryl sodium sulfate, saccharin, benzene sulfinic acid sodium salt, Isosorbide-5-Nitrae-diacetylene mixed liquor, and lauryl sodium sulfate is 0.1g/L,
Saccharin is 1g/L, and benzene sulfinic acid sodium salt 0.04g/L, Isosorbide-5-Nitrae-diacetylene is 0.3g/L；Ultrasonic wave vibration plate is opened, strobe pulse formula
Ultrasonic wave, the frequency of the ultrasonic wave are 48kHZ, the foam metal are taken out after the completion of electro-deposition, after being washed with deionized water
Drying.
Embodiment 2
The preparation of modified foam metal:
(1) conductive treatment the pretreatment of polyurethane: is carried out to polyurethane with conducting resinl method；
(2) conductive filament is set: being uniformly distributed with conductive filament in polyurethane matrix after the pre-treatment；
(3) a titanium basket preplating: is placed into as positive, the nickel of placement phase homogenous quantities in the titanium basket in coating bath both sides respectively
Block；Above-mentioned polyurethane is fixed on aqueduct center, after connecting electrode, power supply is set as pressure stabilizing, sets voltage as 4V；Foam is poly-
Urethane has close to voltage is adjusted to 6V, current density 2.5A/dm2 when nickel layer on a half mulching；Until electric current stabilization, poly- ammonia
When ester surface uniformly covers one layer of nickel layer, preplating process terminates；
(4) electronickelling: filling up plating solution on the outside of aqueduct, and the temperature of the plating solution is 40-50 DEG C, the plating solution be added with
Lauryl sodium sulfate, saccharin, benzene sulfinic acid sodium salt, Isosorbide-5-Nitrae-diacetylene mixed liquor, and lauryl sodium sulfate is 0.1g/L,
Saccharin is 1g/L, and benzene sulfinic acid sodium salt 0.04g/L, Isosorbide-5-Nitrae-diacetylene is 0.3g/L；Ultrasonic wave vibration plate is opened, strobe pulse formula
Ultrasonic wave, the frequency of the ultrasonic wave are 48kHZ, the foam metal are taken out after the completion of electro-deposition, after being washed with deionized water
Drying.
(5) foam metal that step (4) obtains the modification of foam metal: is immersed in silane-containing coupling agent 3%
In ethyl alcohol dilution, drying is sufficiently taken out after infiltration, heating is maintained at 90 DEG C；Boron carbide is immersed in silane-containing coupling agent 3%
Ethanol solution in, sufficiently infiltration after take out drying, heating be maintained at 90 DEG C；By the paraffin of liquid and above-mentioned boron carbide with weight
The ratio of 3:1 mixes, and mechanical stirring 300n/min is stirred 10 minutes under keeping warm mode, and temperature is reduced to 60 after mixing
DEG C, obtain the blend melt；Then above-mentioned foam metal is immersed in the blend melt, and pressing shake foam metal excludes
Bubble；It is put into vacuum oven, is evacuated to negative pressure -0.8MPa, it is 3 hours cooling, extra paraffin is taken out and removed, is obtained
The foam metal.
Compliance test result:
According to following standards to the foam for cooling electronic component system obtained by above-described embodiment 1, embodiment 2
Metal carries out performance detection, and test result is as shown in table 1.
Heating conduction: the test method of thermal coefficient is heat flow method, and the heat conduction coefficient tester used is that DRL- III is thermally conductive
Coefficient test macro, the foam metal sample for being used for cooling electronic component system that above-described embodiment 1, embodiment 2 are obtained
The cylindrical body of 10cm × 20cm is made, heat source is set as 60 DEG C, the mixture of ice and water that cold end is 0 DEG C.In order to avoid heat source and material
The bad contact of material, at sample both ends, coated with thermally conductive silicone grease is to enhance thermo-contact.Retest is averaged three times.
Mechanics Performance Testing: it is obtained using dynamic thermomechanical analysis apparatus (DMAQ800) test by above-described embodiment 1, embodiment 2
The tensile strength of the foam metal for cooling electronic component system arrived, the range of power: 0.0001~18N；The sensitivity of power:
0.00001N；Dynamic deformation range: 0.5 μm~10mm；Static deformation range: 0.5 μm~26mm.Sample originate clip position away from
From for 2cm, intermediate small width is 3mm, with a thickness of 1mm.Stove is opened, stretching clamp is installed, sample is mounted on folder
On tool.Set a series of frequencies for being applied on sample fix and the size of power with the increased dynamic force of a fixed step size, every group of examination
Sample records data three times.Test environment temperature is set as 26 DEG C, tensile speed 9N/min, the resolution ratio of strain is 1nm.Sample
In dumbbell shaped, only in the sample between narrow parallel section fracture just it is effective.
1 properties of sample test result of table
There are many concrete application approach of the present invention, the above is only a preferred embodiment of the present invention.More than it should be pointed out that
Embodiment is merely to illustrate the present invention, and the protection scope being not intended to restrict the invention.For the common skill of the art
For art personnel, without departing from the principle of the present invention, several improvement can also be made, these improvement also should be regarded as this hair
Bright protection scope.
Claims (10)
1. a kind of preparation process of the foam metal for cooling electronic component system, which is characterized in that it is characterized in that, packet
Include following steps:
(1) conductive treatment the pretreatment of polyurethane: is carried out to polyurethane with conducting resinl method；
(2) conductive filament is set: being uniformly distributed with conductive filament in polyurethane matrix after the pre-treatment；
(3) a titanium basket preplating: is placed into as positive, the nickel block of placement phase homogenous quantities in the titanium basket in coating bath both sides respectively；
Above-mentioned polyurethane is fixed on aqueduct center, after connecting electrode, power supply is set as pressure stabilizing, sets voltage as 4 V；Foam is poly-
Urethane has close to voltage is adjusted to 6 V, current density 2.5A/dm2 when nickel layer on a half mulching；Until electric current stabilization, gather
When urethane surface uniformly covers one layer of nickel layer, preplating process terminates；
(4) electronickelling: filling up plating solution on the outside of aqueduct, and the temperature of the plating solution is 4050 DEG C, and the plating solution is added with ten
Sodium dialkyl sulfate, saccharin, benzene sulfinic acid sodium salt, Isosorbide-5-Nitrae-diacetylene mixed liquor, and lauryl sodium sulfate is 0.1g/L,
Saccharin is 1g/L, and benzene sulfinic acid sodium salt 0.04g/L, Isosorbide-5-Nitrae-diacetylene is 0.3g/L；Open ultrasonic wave vibration plate, strobe pulse formula
Ultrasonic wave, the frequency of the ultrasonic wave is 48kHZ, takes out the foam metal after the completion of electro-deposition, is washed with deionized water
After dry.
2. the preparation process of the foam metal according to claim 1 for cooling electronic component system, feature exist
In the polyurethane is three-dimensional through hole structure, and hole density is 12 PPI, and pore-size distribution is between 2.0 ~ 2.4 mm.
3. the preparation process of the foam metal according to claim 1 for cooling electronic component system, feature exist
In the total sectional area for placing nickel block in the titanium basket in the step (3) is equal to the sectional area of polyurethane.
4. the preparation process of the foam metal according to claim 1 for cooling electronic component system, feature exist
In the soft copper silk that the conductive filament in the step (2) is 0.5 mm is distinguished uniform in polyurethane length and width direction
It is distributed 5 conductive filaments.
5. the preparation process of the foam metal according to claim 1 for cooling electronic component system, feature exist
In the pretreatment of the polyurethane, comprising the following steps:
(1) it is cleaned by ultrasonic oil removing: polyurethane is immersed into degreasing fluid the continuous wash 10 minutes in being placed in ultrasonic machine and is used
Cleaning rod presses polyurethane with abundant oil removing, and the supersonic frequency, which is cleaned after being 28khz with pure water, dries；
(2) it is roughened: above-mentioned polyurethane is immersed in clear water and carries out roughening treatment, coarsening time 1min in coarsening solution；
(3) it coats conducting resinl: above-mentioned polyurethane being totally submerged in conducting resinl, under ultrasound condition, repeatedly extrudes, continues 2
It after minute, takes out polyurethane and extracts extra conducting resinl completely, until the hole not blocked by conducting resinl, repeat this behaviour
After making three times, 60 DEG C of drying.
6. the preparation process of the foam metal according to claim 5 for cooling electronic component system, feature exist
In the degreasing fluid is Na2CO3、Na3PO4, NaOH, OP-10 mixed liquor；The Na2CO3For 20-30g/L, the Na3PO4
It is 10-20 g/L for 1030 g/L, the NaOH, the OP-10 is 0.5ml/L.
7. the preparation process of the foam metal according to claim 5 for cooling electronic component system, feature exist
In the coarsening solution is H2SO4、KMnO4 、NiSO46H2O、NiCl26H2The mixed liquor of O；The H2SO4 is 13 ml/L, institute
State KMnO47 g/L, the NiSO46H2O is 250-300 g/L, the NiCl26H2O is 30-50g/L.
8. the preparation process of the foam metal according to claim 5 for cooling electronic component system, feature exist
In the conducting resinl is graphite latex, and the content of graphite of the graphite latex is 20%wt, the partial size of the graphite
It is 10 μm.
9. the treatment process described in item for the foam metal of cooling electronic component system, feature exist according to claim 1
In further including the modification of following steps (5) foam metal: the foam metal that step (4) obtains is immersed in silane-containing idol
In the ethyl alcohol dilution for joining agent 3%, drying is sufficiently taken out after infiltration, heating is maintained at 90 DEG C；By the paraffin and boron carbide of liquid
It is mixed with the ratio of weight 3:1,300 n/min of mechanical stirring stirring 10 minutes under keeping warm mode, after mixing
Temperature is reduced to 60 DEG C, obtains the blend melt；Then above-mentioned foam metal is immersed in the blend melt, pressing
It shakes foam metal and excludes bubble；It is put into vacuum oven, is evacuated to -0.8 MPa of negative pressure, it is 3 hours cooling, it takes out simultaneously
Extra paraffin is removed, the foam metal is obtained.
10. the treatment process according to claim 9 for the foam metal of cooling electronic component system, feature exist
In, the boron carbide in the step (5) is immersed in the ethanol solution of silane-containing coupling agent 3%, drying sufficiently is taken out after infiltration,
Heating is maintained at 90 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910935033.8A CN110512246B (en) | 2019-09-29 | 2019-09-29 | Preparation process of foam metal for electronic component heat dissipation system |
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Citations (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101270493A (en) * | 2007-03-23 | 2008-09-24 | 富士胶片株式会社 | Method and apparatus for producing conductive material |
| CN101818367A (en) * | 2010-04-23 | 2010-09-01 | 常德力元新材料有限责任公司 | Porous metal material and preparation method thereof |
| KR20100103171A (en) * | 2009-03-13 | 2010-09-27 | 주식회사 마이크로글로브 | Method of treating surface of the engineering plastic and method of plating the engineering plastic using the same |
| CN102234748A (en) * | 2010-04-21 | 2011-11-09 | 太原科技大学 | Galvanizing carbon fiber foamed light metal and preparation method thereof |
| CN103217877A (en) * | 2012-01-20 | 2013-07-24 | 富士施乐株式会社 | Electronic photographic photoreceptor, manufacturing method thereof, processing cartridge and imaging device |
| EP2681154A1 (en) * | 2011-03-01 | 2014-01-08 | Joachim Dr. Karthäuser | Methods to produce metallized carbon nano particles |
| FR2993578A1 (en) * | 2012-07-18 | 2014-01-24 | Auris | Protective plating, useful for magnet of neodymium-iron-boron, nickel layer and titanium nitride layer, where chromium layer is disposed between nickel layer and titanium nitride layer and titanium nitride layer is covered by lacquer layer |
| CN103668375A (en) * | 2013-12-24 | 2014-03-26 | 梧州三和新材料科技有限公司 | Method for continuously plating nickel on conductive metal band material |
| CN103726087A (en) * | 2013-05-28 | 2014-04-16 | 太仓派欧技术咨询服务有限公司 | Method of pulse electrodeposition on nickel coating by carbon fiber preform |
| CN103789798A (en) * | 2014-01-08 | 2014-05-14 | 菏泽天宇科技开发有限责任公司 | Nickel foam production process |
| CN103952738A (en) * | 2013-08-02 | 2014-07-30 | 太仓派欧技术咨询服务有限公司 | Nickel foam and preparation method thereof |
| CN103950234A (en) * | 2013-08-02 | 2014-07-30 | 太仓派欧技术咨询服务有限公司 | Foamed nickel with surface encapsulation layer and preparation method of foamed nickel |
| CN104087975A (en) * | 2013-12-19 | 2014-10-08 | 浙江工商大学 | Preparation method of foamed copper |
| CN104157816A (en) * | 2014-08-25 | 2014-11-19 | 深圳市星源材质科技股份有限公司 | Inorganic nano particle hybridized polyolefin microporous membrane and preparation method thereof |
| EP2996817A1 (en) * | 2013-05-15 | 2016-03-23 | SRG Global, Inc. | Organometallic adhesion promoters for paint-over-chrome plated polymers |
| CN105780093A (en) * | 2016-03-10 | 2016-07-20 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Composite electroplating technology of high-wear-resisting nano diamond alkene |
| CN105887150A (en) * | 2014-10-11 | 2016-08-24 | 重庆巴王环保新材料有限公司 | Preparation method of metalized short carbon fiber material in sliced and netted shape |
| CN106757195A (en) * | 2016-12-05 | 2017-05-31 | 浙江工业大学 | A kind of process for protecting surface of high activity concrete dynamic modulus class material |
| CN106757237A (en) * | 2015-11-24 | 2017-05-31 | 常德力元新材料有限责任公司 | A kind of filtering oil smoke preparation method of porous foam alloy material |
| CN106801157A (en) * | 2015-11-26 | 2017-06-06 | 常德力元新材料有限责任公司 | A kind of preparation method of high compactness nickel foam |
| CN107452433A (en) * | 2016-06-01 | 2017-12-08 | 益阳市菲美特新材料有限公司 | A kind of all-directional conductive sponge and preparation method thereof |
| CN107636207A (en) * | 2015-06-09 | 2018-01-26 | 新日铁住金株式会社 | Surface treated steel plate |
| CN108456795A (en) * | 2018-04-02 | 2018-08-28 | 无锡荣峻环保科技有限公司 | A kind of foam metal preparation method effectively improving specific surface area |
| CN108456904A (en) * | 2018-04-02 | 2018-08-28 | 无锡荣峻环保科技有限公司 | A kind of superhigh specific surface area foam metal preparation method |
| CN109021261A (en) * | 2018-04-28 | 2018-12-18 | 苏州迪诺美特包装科技有限公司 | A kind of preparation method of antistatic film |
| CN109778255A (en) * | 2017-11-13 | 2019-05-21 | 乐山创新智谷工业设计有限公司 | A kind of method that electrochemical deposition method prepares foamed iron |
| WO2019099061A1 (en) * | 2017-11-15 | 2019-05-23 | Nanotek Instruments, Inc. | Graphene-mediated metal-plated polymer article and production method |
| WO2019124865A1 (en) * | 2017-12-22 | 2019-06-27 | 주식회사 포스코 | Solution composition for surface treatment of steel sheet and steel sheet surface-treated using same |
-
2019
- 2019-09-29 CN CN201910935033.8A patent/CN110512246B/en active Active
Patent Citations (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101270493A (en) * | 2007-03-23 | 2008-09-24 | 富士胶片株式会社 | Method and apparatus for producing conductive material |
| KR20100103171A (en) * | 2009-03-13 | 2010-09-27 | 주식회사 마이크로글로브 | Method of treating surface of the engineering plastic and method of plating the engineering plastic using the same |
| CN102234748A (en) * | 2010-04-21 | 2011-11-09 | 太原科技大学 | Galvanizing carbon fiber foamed light metal and preparation method thereof |
| CN101818367A (en) * | 2010-04-23 | 2010-09-01 | 常德力元新材料有限责任公司 | Porous metal material and preparation method thereof |
| EP2681154A1 (en) * | 2011-03-01 | 2014-01-08 | Joachim Dr. Karthäuser | Methods to produce metallized carbon nano particles |
| CN103217877A (en) * | 2012-01-20 | 2013-07-24 | 富士施乐株式会社 | Electronic photographic photoreceptor, manufacturing method thereof, processing cartridge and imaging device |
| FR2993578A1 (en) * | 2012-07-18 | 2014-01-24 | Auris | Protective plating, useful for magnet of neodymium-iron-boron, nickel layer and titanium nitride layer, where chromium layer is disposed between nickel layer and titanium nitride layer and titanium nitride layer is covered by lacquer layer |
| EP2996817A1 (en) * | 2013-05-15 | 2016-03-23 | SRG Global, Inc. | Organometallic adhesion promoters for paint-over-chrome plated polymers |
| CN103726087A (en) * | 2013-05-28 | 2014-04-16 | 太仓派欧技术咨询服务有限公司 | Method of pulse electrodeposition on nickel coating by carbon fiber preform |
| CN103952738A (en) * | 2013-08-02 | 2014-07-30 | 太仓派欧技术咨询服务有限公司 | Nickel foam and preparation method thereof |
| CN103950234A (en) * | 2013-08-02 | 2014-07-30 | 太仓派欧技术咨询服务有限公司 | Foamed nickel with surface encapsulation layer and preparation method of foamed nickel |
| CN104087975A (en) * | 2013-12-19 | 2014-10-08 | 浙江工商大学 | Preparation method of foamed copper |
| CN103668375A (en) * | 2013-12-24 | 2014-03-26 | 梧州三和新材料科技有限公司 | Method for continuously plating nickel on conductive metal band material |
| CN103789798A (en) * | 2014-01-08 | 2014-05-14 | 菏泽天宇科技开发有限责任公司 | Nickel foam production process |
| CN104157816A (en) * | 2014-08-25 | 2014-11-19 | 深圳市星源材质科技股份有限公司 | Inorganic nano particle hybridized polyolefin microporous membrane and preparation method thereof |
| CN105887150A (en) * | 2014-10-11 | 2016-08-24 | 重庆巴王环保新材料有限公司 | Preparation method of metalized short carbon fiber material in sliced and netted shape |
| CN107636207A (en) * | 2015-06-09 | 2018-01-26 | 新日铁住金株式会社 | Surface treated steel plate |
| CN106757237A (en) * | 2015-11-24 | 2017-05-31 | 常德力元新材料有限责任公司 | A kind of filtering oil smoke preparation method of porous foam alloy material |
| CN106801157A (en) * | 2015-11-26 | 2017-06-06 | 常德力元新材料有限责任公司 | A kind of preparation method of high compactness nickel foam |
| CN105780093A (en) * | 2016-03-10 | 2016-07-20 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Composite electroplating technology of high-wear-resisting nano diamond alkene |
| CN107452433A (en) * | 2016-06-01 | 2017-12-08 | 益阳市菲美特新材料有限公司 | A kind of all-directional conductive sponge and preparation method thereof |
| CN106757195A (en) * | 2016-12-05 | 2017-05-31 | 浙江工业大学 | A kind of process for protecting surface of high activity concrete dynamic modulus class material |
| CN109778255A (en) * | 2017-11-13 | 2019-05-21 | 乐山创新智谷工业设计有限公司 | A kind of method that electrochemical deposition method prepares foamed iron |
| WO2019099061A1 (en) * | 2017-11-15 | 2019-05-23 | Nanotek Instruments, Inc. | Graphene-mediated metal-plated polymer article and production method |
| WO2019124865A1 (en) * | 2017-12-22 | 2019-06-27 | 주식회사 포스코 | Solution composition for surface treatment of steel sheet and steel sheet surface-treated using same |
| CN108456795A (en) * | 2018-04-02 | 2018-08-28 | 无锡荣峻环保科技有限公司 | A kind of foam metal preparation method effectively improving specific surface area |
| CN108456904A (en) * | 2018-04-02 | 2018-08-28 | 无锡荣峻环保科技有限公司 | A kind of superhigh specific surface area foam metal preparation method |
| CN109021261A (en) * | 2018-04-28 | 2018-12-18 | 苏州迪诺美特包装科技有限公司 | A kind of preparation method of antistatic film |
Non-Patent Citations (5)
| Title |
|---|
| HAN, FEI 等: ""A crack-based nickel@graphene-wrapped polyurethane sponge ternary hybrid obtained byelectrodeposition for highly sensitive wearable strain sensors"", 《JOURNAL OF MATERIALS CHEMISTRY C》 * |
| ZHANG, JIAN 等: ""Polyurethane and polyaniline foam-derived nickel oxide-incorporated porous carbon composite for high-performance supercapacitors"", 《JOURNAL OF MATERIALS SCIENCE》 * |
| *** 等: ""电沉积法制备泡沫Ni-Mo-Co合金"", 《金属功能材料》 * |
| 田庆华 等: ""微孔聚氨酯泡沫超声强化化学镀铜的研究"", 《中南大学学报(自然科学版)》 * |
| 黄正根: ""泡沫铜翅片散热器的散热性能研究"", 《中国优秀硕士学位论文全文数据库 工程科技II辑》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111378998A (en) * | 2020-04-09 | 2020-07-07 | 烟台东方新程科技有限公司 | Foam metal processing technology |
| CN111378998B (en) * | 2020-04-09 | 2022-03-01 | 烟台东方新程科技有限公司 | Foam metal processing technology |
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