CN110493950A - A kind of substrate and preparation process of the flex circuit application on lithium battery - Google Patents
A kind of substrate and preparation process of the flex circuit application on lithium battery Download PDFInfo
- Publication number
- CN110493950A CN110493950A CN201910673548.5A CN201910673548A CN110493950A CN 110493950 A CN110493950 A CN 110493950A CN 201910673548 A CN201910673548 A CN 201910673548A CN 110493950 A CN110493950 A CN 110493950A
- Authority
- CN
- China
- Prior art keywords
- substrate
- preparation process
- lithium battery
- flex circuit
- circuit application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
The substrate and preparation process of the embodiment of the invention provides a kind of on lithium battery flex circuit application.The substrate includes the polyimide film being sequentially connected, epoxyn layer and aluminium foil layer, the substrate applications are in the flex circuit application of electric automobile lithium battery, cost is relatively low, meets assembling flexural property, while can directly encapsulate, packaging cost is lower, the preparation process of the substrate, processing step is simple, can be directly realized by existing equipment, without additionally adding social portion, it is appropriate for industrial upgrading and popularization.
Description
Technical field
The invention belongs to technical field of lithium batteries, and in particular to a kind of substrate and system of the flex circuit application on lithium battery
Standby technique.
Background technique
Flex circuit application (Flexible Printed Circuit Board, abridge FPC) is also known as flexible printed circuit
Plate or flexible printed wiring board.According to the definition of IPC, flexible printed-circuit board is in a manner of printing, in flexible substrate
The product of design and the production of line pattern is carried out above.
The fast development of electric automobile market drives the growth in lithium battery market.With the driving in market, lithium battery
Capacity and power are continuously improved, and the conductor thickness of the flex circuit application applied to lithium battery is also continuously increased, and the thickness of conductor is
Through being increased to 70~150um.It is mainly at present copper foil applied to the substrate conductor of lithium battery, conductor thickness is increased to 70~
After 150um, copper foil does not allow easy processing, and the copper foil of this thickness is expensive；The flexural property of thick copper foil is poor, is also unable to satisfy lithium electricity
Pond group reload request；Assembling process flex circuit application needs first to press aluminium sheet, and the assembly process is complicated.
Summary of the invention
To solve the problem of to exist for the flex circuit application of lithium battery in the prior art, the purpose of the embodiment of the present invention
One of be to provide the substrate of flex circuit application on lithium battery a kind of, the substrate include the polyimide film being sequentially connected,
Epoxyn layer and aluminium foil layer, the substrate applications are in the flex circuit application of electric automobile lithium battery, and cost is relatively low, full
Foot assembling flexural property, while can directly encapsulate, simple process, packaging cost is lower.The second purpose of the embodiment of the present invention
It is to provide the preparation process of above-mentioned substrate.
To achieve the above object, the embodiment of the present invention uses following technical scheme:
A kind of substrate of the flex circuit application on lithium battery, including polyimide film, the epoxy resin being sequentially connected
Gluing oxidant layer and aluminium foil layer, the polyimide film with a thickness of 25~50 μm, the thickness of the epoxyn layer
Degree be 12~25 μm, the aluminium foil layer with a thickness of 70~150 μm.
Although having the relevant technologies of aluminium substitution copper in the prior art, then
Preferably, the Kapton that the polyimides is 15~22ppm/ DEG C of thermal expansion coefficient.
Preferably, the epoxy resin is bisphenol A epoxide resin.
The preparation process of above-mentioned substrate, step include:
S1: epoxyn is applied on the polyimide film, presses and winds with aluminium foil after dry, rolled up
Material；
S2: by solidification after coiled material loose winding obtained by step S1 to get the substrate.
Preferably, the temperature of the drying is 70~160 DEG C.
Preferably, the time of the drying is 50~100s.
Preferably, the temperature of the pressing winding is 70~100 DEG C.
Preferably, the cured temperature is 50~180 DEG C.
Preferably, the cured time is 24~36h.
Beneficial effects of the present invention
1, the substrate of a kind of flex circuit application on lithium battery provided in an embodiment of the present invention, the substrate include successively phase
Polyimide film, epoxyn layer and aluminium foil layer even, the substrate applications are in the flexibility of electric automobile lithium battery
Wiring board, cost is relatively low, meets assembling flexural property, while can directly encapsulate, packaging cost is lower；
2, the preparation process of the substrate of a kind of flex circuit application on lithium battery provided in an embodiment of the present invention, the technique
Step is simple, can be directly realized by existing equipment, without additional addition portion, society, is appropriate for industrial upgrading and pushes away
Extensively.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the substrate of flex circuit application on lithium battery.
Specific embodiment
To solve the problem of to exist for the flex circuit application of lithium battery in the prior art, the purpose of the embodiment of the present invention
One of be to provide the substrate of flex circuit application on lithium battery a kind of, the substrate include the polyimide film being sequentially connected,
Epoxyn layer and aluminium foil layer, the substrate applications are in the flex circuit application of electric automobile lithium battery, and cost is relatively low, full
Foot assembling flexural property, while can directly encapsulate, simple process, packaging cost is lower.The second purpose of the embodiment of the present invention
It is to provide the preparation process of above-mentioned substrate.
The following is specific embodiments of the present invention, and further retouches to technical solution of the present invention work in conjunction with the embodiments
It states, however, the present invention is not limited to these examples.
Embodiment 1
The substrate of this example provides a kind of on lithium battery flex circuit application, structure is as shown in Figure 1, include being sequentially connected
Polyimide film 1, epoxyn layer 2 and aluminium foil layer 3, the polyimide film 1 with a thickness of 25~50 μ
M, the epoxyn layer 2 with a thickness of 12~25 μm, the aluminium foil layer 3 with a thickness of 70~150 μm.
Wherein, the Kapton that polyimides is 15~22ppm/ DEG C of thermal expansion coefficient.Epoxy resin is bisphenol-A ring
Oxygen resin.
Embodiment 2
A kind of preparation process of the substrate of the flex circuit application on lithium battery, step include:
S1: epoxyn is applied on the polyimide film, presses and winds with aluminium foil after dry, rolled up
Material；
S2: by solidification after coiled material loose winding obtained by step S1 to get the substrate.
Dry temperature is 70~160 DEG C.The dry time is 50~100s.The temperature of pressing winding is 70~100 DEG C.
Cured temperature is 50~180 DEG C.The cured time is 24~36h.
Detect example
The preparation process that the substrate mechanism and embodiment 2 provided according to embodiment 1 provides, this example are prepared for three kinds of substrate samples
Product and two kinds of contrast samples, specific thicknesses of layers are as shown in table 1.
1 substrate sample of table and contrast sample table
Three kinds of substrate samples and two kinds of contrast samples to table 1 carry out flexibility test and cost accounting, as a result such as 2 institute of table
Show.
The cost of 2 substrate sample of table and contrast sample and flexibility compare
As can be seen from Table 1, it is substantially better than contrast sample using the flexural property of substrate of the embodiment of the present invention, simultaneously
Cost is lower.
Claims (9)
1. a kind of substrate of the flex circuit application on lithium battery, which is characterized in that including be sequentially connected polyimide film,
Epoxyn layer and aluminium foil layer, the polyimide film with a thickness of 25~50 μm, the epoxy resin gluing
Oxidant layer with a thickness of 12~25 μm, the aluminium foil layer with a thickness of 70~150 μm.
2. substrate according to claim 1, which is characterized in that the polyimides is 15~22ppm/ DEG C of thermal expansion coefficient
Kapton.
3. substrate according to claim 1, which is characterized in that the epoxy resin is bisphenol A epoxide resin.
4. the preparation process of described in any item substrates according to claim 1~3, which is characterized in that step includes:
S1: epoxyn is applied on the polyimide film, presses and winds with aluminium foil after dry, obtain coiled material；
S2: by solidification after coiled material loose winding obtained by step S1 to get the substrate.
5. the preparation process of substrate according to claim 4, which is characterized in that the temperature of the drying is 70~160 DEG C.
6. the preparation process of substrate according to claim 4, which is characterized in that the time of the drying is 50~100s.
7. the preparation process of substrate according to claim 4, which is characterized in that the temperature of the pressing winding is 70~100
℃。
8. the preparation process of substrate according to claim 4, which is characterized in that the cured temperature is 50~180 DEG C.
9. the preparation process of substrate according to claim 4, which is characterized in that the cured time is 24~36h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910673548.5A CN110493950A (en) | 2019-07-24 | 2019-07-24 | A kind of substrate and preparation process of the flex circuit application on lithium battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910673548.5A CN110493950A (en) | 2019-07-24 | 2019-07-24 | A kind of substrate and preparation process of the flex circuit application on lithium battery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110493950A true CN110493950A (en) | 2019-11-22 |
Family
ID=68548219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910673548.5A Pending CN110493950A (en) | 2019-07-24 | 2019-07-24 | A kind of substrate and preparation process of the flex circuit application on lithium battery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110493950A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201769428U (en) * | 2010-09-29 | 2011-03-23 | 莱芜金鼎电子材料有限公司 | Manufacturing system for single-side flexible copper-clad plate |
| TW201132795A (en) * | 2010-03-31 | 2011-10-01 | Fujifilm Corp | Method of plate pretreatment and production method of surface metal film material |
| CN105102221A (en) * | 2013-04-16 | 2015-11-25 | 东洋纺株式会社 | Metal foil laminate |
| CN106584988A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Composite metal-clad plate for flexible printed circuit board and preparation method of composite cover film |
-
2019
- 2019-07-24 CN CN201910673548.5A patent/CN110493950A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201132795A (en) * | 2010-03-31 | 2011-10-01 | Fujifilm Corp | Method of plate pretreatment and production method of surface metal film material |
| CN201769428U (en) * | 2010-09-29 | 2011-03-23 | 莱芜金鼎电子材料有限公司 | Manufacturing system for single-side flexible copper-clad plate |
| CN105102221A (en) * | 2013-04-16 | 2015-11-25 | 东洋纺株式会社 | Metal foil laminate |
| CN106584988A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Composite metal-clad plate for flexible printed circuit board and preparation method of composite cover film |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191122 |