CN110488177B

CN110488177B - Probe for semiconductor probe test board

Info

Publication number: CN110488177B
Application number: CN201910767291.XA
Authority: CN
Inventors: 施林荣
Original assignee: Shenzhen Senmei Xieer Technology Co ltd
Current assignee: SHENZHEN SENMEI XIEER TECHNOLOGY Co.,Ltd.
Priority date: 2019-08-20
Filing date: 2019-08-20
Publication date: 2021-06-22
Anticipated expiration: 2039-08-20
Also published as: CN110488177A

Abstract

The invention relates to the technical field of integrated circuits and discloses a probe for a semiconductor probe test board, which comprises a sleeve and a needle head, wherein the needle head is arranged at the bottom of the sleeve, a positioning block is fixedly arranged in the sleeve, the end part of the needle head is fixedly connected with a sliding block positioned in the sleeve, and a spring is arranged between the positioning block and the sliding block. Make the syringe needle receive the impact force of plummer, can contract to the inboard in the twinkling of an eye, make the syringe needle by traditional hard contact optimization for elastic contact, make the syringe needle can the position of self-adaptation wafer, make the syringe needle in the use, automatic shrink or expand different positions, the different positions of wafer can be contacted to the syringe needle simultaneously, when the syringe needle receives the impact, the impact force that the automatic shrink slowed down received, utilize the effect of elasticity, slow down the distortion power of syringe needle, make syringe needle in use, keep vertical state throughout, can contact the different positions of wafer simultaneously, thereby improve the accuracy nature of wafer when the test.

Description

Probe for semiconductor probe test board

Technical Field

The invention relates to the technical field of integrated circuits, in particular to a probe for a semiconductor probe test board.

Background

The probe station is mainly applied to the testing of semiconductor industry, photoelectric industry, integrated circuits and packaging, is widely applied to the research and development of precise electrical measurement of complex and high-speed devices, and aims to ensure the quality and reliability and reduce the research and development time and the cost of device manufacturing process.

In the integrated circuit industry chain, the integrated circuit test is the only industry which runs through the whole process of the integrated circuit production and application, and the integrated circuit design can be put into mass production without passing the verification test of a prototype; the finished product after being packaged is tested and tested as the final procedure of the integrated circuit product, only the qualified circuit can be taken as the formal integrated circuit product to leave the factory, and the working principle of the probe for the semiconductor of the existing probe test board is as follows: when in test, the wafer is absorbed on the bearing platform by the vacuum chuck and is aligned with the probe electric detector, then the probe is contacted with each bonding pad of the chip, the electric detector looks at the circuit under the drive of the power supply and records the test result, the quality degree of the wafer is judged, after the probe is used for a period of time, the probe cannot be on the same horizontal plane due to the small difference in the probe processing and using processes, so that the wafer is subjected to the difference of the position height in the test process, part of the probe with lower position can directly contact the wafer, part of the probe with higher position can not contact the wafer, so that the test result is different, part of the wafer can not be tested, when the probe with higher position contacts the wafer, the probe with lower position directly collides the wafer, so that the probe tip punctures the surface layer, and the welding quality of the chip and the packaged finished product pin is poor, the short circuit is easily caused, the final test result is influenced, meanwhile, the position is not on the same horizontal plane, the speed of the lifting of the bearing platform is adjusted too fast by an operator, the wafer directly impacts the probe, the end of the probe is stressed to bend and break, part of the probe directly cracks, the surface is directly pricked after the wafer is stressed, the test of the wafer is further influenced, the accuracy of the measured result cannot be achieved, and the normal judgment of the wafer is influenced.

Disclosure of Invention

Aiming at the defects of the background technology, the invention provides the probe for the semiconductor probe test board, which has the advantages of stable test and strong adaptability and solves the problems in the background technology.

The invention provides the following technical scheme: the probe comprises a sleeve and a needle head, wherein the needle head is installed at the bottom of the sleeve, a positioning block is fixedly installed inside the sleeve, a sliding block which is located inside the sleeve is fixedly connected to the end portion of the needle head, a spring is installed between the positioning block and the sliding block, a magnetic block is installed on the sliding block, supporting rods which are located on two sides of the magnetic block are fixedly connected to the top of the sliding block, a positioning seat is fixedly connected to the side face of each supporting rod, a positioning rod is fixedly connected to the inside of the positioning seat, a positioning plate is fixedly connected to the end portion of the positioning rod, a magnetic ring is fixedly connected to the end portion of the positioning plate.

Preferably, the elastic force of the spring is greater than the force of attraction of the magnetic blocks and the magnetic rings, the number of the magnetic rings is two, the two magnetic rings are both semicircular, and the two magnetic rings are combined to form a circle.

Preferably, the outside fixedly connected with slide bar of magnetic ring, the tip of slide bar rotates and is connected with the holding ring, the top fixedly connected with cutting ferrule of holding ring, the both sides fixedly connected with backup pad of cutting ferrule, the tip and the sheathed tube side fixed connection of backup pad, the buffer block is installed to the bottom of backup pad, the material of buffer block is the rubber piece, and the shape of buffer block bottom is semicircle form.

Preferably, the bottom of the sleeve is fixedly connected with a correction ring, the diameter of the inner ring of the correction ring is matched with that of the outer ring of the needle head, the end part of the positioning rod is in threaded connection with a nut positioned outside the positioning seat, and the diameter of the nut is larger than that of the joint of the positioning seat and the positioning rod.

The invention has the following beneficial effects:

1. this semiconductor probe is probe for testboard, cooperation between through sliding block and spring, when making the syringe needle receive the impact dynamics of plummer, can contract to the inboard in the twinkling of an eye, make the syringe needle optimize for elastic contact by traditional hard contact, make the syringe needle can the position of self-adaptation wafer, make the syringe needle in the use, automatic shrink or expand different positions, the syringe needle can contact the different position of wafer simultaneously, when the syringe needle receives the impact, the automatic shrink slows down the impact force that receives, utilize the effect of elasticity, slow down the distortion power of syringe needle, make syringe needle in use, keep vertical state throughout, can contact the different position of wafer simultaneously, thereby improve the accuracy nature of wafer when the test.

2. This probe for semiconductor probe test platform, through the bracing piece, cooperation between locating lever and the magnetic ring, make the syringe needle at the shrink in-process, resume magnetic ring jack-up to stationary state, make to convert to inter attraction between magnetic ring and the magnetic path, make the elasticity of spring is offset to absorbent dynamics between the magnetic path, speed slows down when making the syringe needle expand downwards, make the tip of syringe needle slowly contact wafer, make to slow down the decurrent dynamics of syringe needle on the one hand, on the other hand stops the syringe needle and pricks the wafer, make the wafer when the test, remain high-efficient throughout, stationary state tests.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a portion of the structure of FIG. 1;

FIG. 3 is a schematic top view of a retaining ring;

fig. 4 is a schematic diagram of a conventional structure.

In the figure: 1. a sleeve; 2. a needle head; 3. a correction ring; 4. positioning blocks; 5. a slider; 6. a spring; 7. a magnetic block; 8. a support bar; 9. positioning seats; 10. positioning a rod; 11. positioning a plate; 12. a magnetic ring; 13. a slide bar; 14. a positioning ring; 15. a nut; 16. a card sleeve; 17. a support plate; 18. and a buffer block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, a probe for a semiconductor probe test bench includes a sleeve 1, a needle 2, the needle 2 is installed at the bottom of the sleeve 1, a positioning block 4 is fixedly installed inside the sleeve 1, the inner wall of the positioning block 4 is slidably connected with the needle 2, so that the needle 2 can slide to different positions, the end of the needle 2 is fixedly connected with a sliding block 5 located inside the sleeve 1, the outer wall of the sliding block 5 is slidably connected with the inner wall of the sleeve 1, so that the sliding block 5 can move to different positions, a spring 6 is installed between the positioning block 4 and the sliding block 5, the spring 6 is in an upward stretching state, the needle 2 is driven to stretch by the resilience of the spring 6, the sliding block 5 is installed with a magnetic block 7, the top of the sliding block 5 is fixedly connected with supporting rods 8 located at two sides of the magnetic block 7, the inside fixedly connected with locating lever 10 of positioning seat 9, the tip fixedly connected with locating plate 11 of locating lever 10, the tip fixedly connected with magnetic ring 12 of locating plate 11, magnetic ring 12 and magnetic path 7 are the different grade looks suction state, utilize the magnetic force of inhaling mutually to offset the resilience force of spring 6, slow down the dynamics that syringe needle 2 glided, avoid syringe needle 2 atress crooked, influence the normal use of syringe needle 2.

The elastic force of the spring 6 is greater than the force of attraction between the magnetic block 7 and the magnetic ring 12, the number of the magnetic rings 12 is two, the two magnetic rings 12 are both semicircular, the support rod 8 can be jacked up to a certain position by utilizing the repulsive force between the two magnetic rings 12, the support rod 8 can move conveniently, the two magnetic rings 12 are combined to form a circle, the magnetic force between the two magnetic rings 12 is overlapped, the magnetic force of the magnetic rings 12 is increased, the magnetic force of the magnetic rings 12 is simultaneously offset by the elastic force of the spring 6, and the needle 2 can also move downwards slowly.

The outer side of the magnetic ring 12 is fixedly connected with a sliding rod 13, the end of the sliding rod 13 is rotatably connected with a positioning ring 14, a clamping sleeve 16 is fixedly connected to the top of the positioning ring 14, supporting plates 17 are fixedly connected to two sides of the clamping sleeve 16, the end of each supporting plate 17 is fixedly connected with the side of the corresponding sleeve 1, a buffer block 18 is installed at the bottom of each supporting plate 17, the bottom of each buffer block 18 is in contact with the end of the corresponding supporting rod 8, the buffer blocks 18 are made of rubber blocks, and the bottom of each buffer block 18 is in a semicircular shape, so that the magnetic ring 12 can move at different angles, limit the supporting rods 8 and control the trend of the needles 2.

The bottom of the sleeve 1 is fixedly connected with a correction ring 3, the diameter of the inner ring of the correction ring 3 is matched with the diameter of the outer ring of the needle head 2, the end part of the positioning rod 10 is in threaded connection with a nut 15 positioned outside the positioning seat 9, the diameter of the nut 15 is larger than the diameter of the joint of the positioning seat 9 and the positioning rod 10, the needle head 2 can be always kept in a vertical state by the correction ring 3, and meanwhile, the needle head 2 can be calibrated by the correction ring 3 with small bending force through the needle head 2, so that the needle head 2 is always kept in a vertical state.

The theory of operation, syringe needle 2 moves down, with syringe needle 2 and wafer contact, in the twinkling of an eye of contact, syringe needle 2 receives the dynamics of wafer contact jack-up upwards, with certain position of sliding block 5 rebound, sliding block 5 drives bracing piece 8 rebound again this moment, then bracing piece 8 drives locating plate 11 downward sloping, drives slide bar 13 again and rotates, becomes parallel state with two magnetic rings 12, then magnetic ring 12 and magnetic path 7 convert inter attraction into, offsets the elasticity of spring 6, with syringe needle 2 slow rebound contact wafer.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a probe for semiconductor probe test platform, includes sleeve pipe (1), syringe needle (2), and the bottom at sleeve pipe (1) is installed in syringe needle (2), its characterized in that: a positioning block (4) is fixedly installed inside the sleeve (1), a sliding block (5) located inside the sleeve (1) is fixedly connected to the end portion of the needle head (2), a spring (6) is installed between the positioning block (4) and the sliding block (5), a magnetic block (7) is installed on the sliding block (5), supporting rods (8) located on two sides of the magnetic block (7) are fixedly connected to the top of the sliding block (5), a positioning seat (9) is fixedly connected to the side face of each supporting rod (8), a positioning rod (10) is fixedly connected inside the positioning seat (9), a positioning plate (11) is fixedly connected to the end portion of the positioning rod (10), a magnetic ring (12) is fixedly connected to the end portion of the positioning plate (11), and the magnetic ring (12) and the magnetic block (7) are in a;

the elasticity of the spring (6) is greater than the attraction force of the magnetic blocks (7) and the magnetic rings (12), the number of the magnetic rings (12) is two, the two magnetic rings (12) are both semicircular, and the two magnetic rings (12) are combined to form a circle;

the magnetic ring is characterized in that a sliding rod (13) is fixedly connected to the outer side of the magnetic ring (12), the end of the sliding rod (13) is rotatably connected with a positioning ring (14), a clamping sleeve (16) is fixedly connected to the top of the positioning ring (14), supporting plates (17) are fixedly connected to two sides of the clamping sleeve (16), the end of each supporting plate (17) is fixedly connected with the side face of the corresponding sleeve (1), a buffer block (18) is installed at the bottom of each supporting plate (17), the buffer blocks (18) are made of rubber blocks, and the bottom of each buffer block (18) is semicircular;

the bottom of the sleeve (1) is fixedly connected with a correction ring (3), the diameter of the inner ring of the correction ring (3) is matched with the diameter of the outer ring of the needle head (2), the end part of the positioning rod (10) is in threaded connection with a nut (15) positioned outside the positioning seat (9), and the diameter of the nut (15) is larger than the diameter of the joint of the positioning seat (9) and the positioning rod (10).