CN101249630B - Automatically cleaning mechanism of test interface of integrated circuit test jack and cleaning method thereof - Google Patents
Automatically cleaning mechanism of test interface of integrated circuit test jack and cleaning method thereof Download PDFInfo
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- CN101249630B CN101249630B CN2008100863763A CN200810086376A CN101249630B CN 101249630 B CN101249630 B CN 101249630B CN 2008100863763 A CN2008100863763 A CN 2008100863763A CN 200810086376 A CN200810086376 A CN 200810086376A CN 101249630 B CN101249630 B CN 101249630B
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Abstract
The invention relates to an automatic cleaning mechanism for the test interfaces of integrated circuit(IC) test sockets and a cleaning method thereof. The automatic cleaning mechanism is applicable to an IC tester system comprising a clamping device of cleaning component and a cleaning component. The clamping device is movably arranged over the IC test socket, and the cleaning component can be separately attached to the bottom surface of the clamping device. The shape of the cleaning component is matched with the shape of a receiving part of the IC test socket for carrying the IC, and the cleaning mechanism is moved relative to the IC test socket through the clamping device. The cleaning component attached to the bottom surface of the cleaning mechanism can reach the function of automatically cleaning the test interface of the IC test socket. The cleaning component consists of a body and a cleaning sheet. The automatic cleaning method can reach the automatic, in-time and effective cleaning of the test interface of the test socket. The test socket does not need to be moved out of the production line to carry out the cleaning. Therefore, the automatic cleaning mechanism can reduce the pause time of the production line, and can also prolong the lifetime of the test interface.
Description
Technical field
The present invention is the cleaning mechanism and the clean method of the test interface of relevant a kind of integrated circuit (IC) test jack, refers to a kind of cleaning mechanism and clean method of IC test jack test interface of tool automatic cleaning function especially.
Background technology
Last processing procedure that semiconductor is made is test, and the test processing procedure can be divided into preliminary test and final test, and its main purpose also will be divided the grade of semiconductor subassembly according to specification except the flaw of finding semiconductor subassembly.At the measuring semiconductor assembly for example in the process of chip, test interface, for example probe, can with semiconductor subassembly on pin, for example weld pad (pad) or tin ball (solder ball) electrically contact, whether testing the associated electrical performance of this semiconductor subassembly, and it is normal to assess its function.
Figure 1 shows that and generally be used for test b GA (Ball Grid Array, the encapsulation of ball bar array) a Chip needle detector system of the chip characteristics of pattern, it comprises the measuring head (Tester Head) 7 of chip testing classifier (Handler) 6, chip bearing device and tester table.Chip testing classifier 6 is positioned at measuring head 7 tops, and chip bearing device is installed on the measuring head 7.This chip bearing device includes a testing circuit board (Load Board) 8 and one test pedestal (Socket Base or DockingPlate) 9.This test pedestal 9 is used to accommodate a corresponding test jack (Socket does not show among the figure).This test jack, transmit a translation interface of contact for the tin ball 101 that connects chip 10 to be measured and the signal on the measuring head 7, be provided with several flexible designed probe (Pogo Pin in it, do not show among the figure), in order to electrically contact with the tin ball 101 of accommodating fixing chip to be measured 10 bottoms within it.Whether this testing circuit board 8 is electrically connected with chip 10 to be measured by the probe in this test jack, normal with the performance of testing this chip 10.This classifier 6 has a holding device 61, and the one end connects a mechanical arm (not shown), and the other end is provided with a vacuum slot 62 can draw a chip 10 to be measured.The work flow of this classifier 6, in regular turn for chip 10 to be measured in district to be measured moves to the test section of tester table, utilize holding device 61 on it that chip to be measured 10 is drawn and moved in the test jack in the test section again and test.In addition, this test pedestal 9 is located at the top of testing circuit board 8, and location hole 63 of corresponding holding device 61 is provided with alignment pin 91 on it.When this holding device 61 was drawn chip 10 to be measured to these testing circuit board 8 do tests, the location hole 63 on it can engage with alignment pin 91, to reach the location.
But,, therefore, when this tin ball 101 is exposed in the air, easily produce oxidation because the tin ball 101 of chip to be measured 10 bottom surfaces is made by metal material.In addition, the organic material in some manufacture processes also may amass on tin ball 101 in Shen.Therefore, in the retest process, probe tip is after contacting tin ball 101 repeatedly, and metal oxide and other material on tin ball 101 can be deposited in probe tip.When these impurity accumulation somes, can influence the characteristic of probe tip, make test result become inaccurate, and then have influence on accuracy of test and test yield.Therefore, probe must be removed the work of the detritus of its needle surface in use for some time, to keep its kilter.If probe tip is comparatively seriously stained, need change whole test jack sometimes even also.
The clean method of probe generally is to utilize instruments such as brush manually to clean.This kind method need with measuring head 7 with remove test pedestal 9 again after classifier 6 separates, so test jack could be taken off and carry out cleaning action, even also must just can carry out behind the mobile classifier 6.After cleaning action is finished, need oppositely repeat above-mentioned action again, finish the action that product is set again, so will cause production line to pause a period of time.If after resetting, still fail to deal with problems, then may repeat above action again, even for the third time, not only lose time and manpower, also have a strong impact on testing efficiency and output.
In sum, earlier by the mode of artificial cleaning test interface have the defective of following four aspects:
1. cleaning opportunity: rely on fully and subjectively artificially judge,, cause test result, relatively also improve its rate of resurveying for the defective products number improves so can not in time clean stained test interface, and then the reduction testing efficiency;
2. clean method: the artificial action of carrying out cleaning, its cleaning quality is uneven, and needs discrete testing head and classifier during cleaning, waste of manpower, time, increases operator's board maintenance load, reduction testing efficiency;
3. test yield and efficient: because of no automation function, need rely on artificial execution fully and judge and the action of cleaning that so cause the phenomenon of test yield instability, yield difference increases, the rate of resurveying raising, testing efficiency descends;
4. useful life of test interface: the mode of artificial cleaning is because cleaning is difficult for holding opportunity and cleaning quality is uneven, so can have influence on the useful life of test interface.
In view of above-mentioned defective, be necessary to provide a kind of cleaning mechanism and clean method of test interface of tool automatic cleaning function.
Summary of the invention
Main purpose of the present invention is to provide a kind of automated cleaning mechanism that utilizes the test interface of cleaning assemblies cleaning IC test jack, and it is simple in structure, easy and simple to handle, can reach to test interface automatically, in time, cleaning efficiently.
Another object of the present invention is to provide a kind of automated cleaning method of utilizing the test interface of cleaning assemblies cleaning IC test jack, with reach to test interface automatically, in time, efficiently the cleaning, with the reduction rate of resurveying, improve testing efficiency, and prolong the useful life of test interface.
The automated cleaning mechanism of the test interface of integrated circuit (IC) test jack that provides according to main purpose of the present invention is to be applied to an IC test machine system, and this automated cleaning mechanism comprises:
One cleaning assemblies clamping device, it is arranged at the top of IC test jack movably, and this clamping device has a bottom surface towards the IC test jack; And
One cleaning assemblies, it depends on the bottom surface of this clamping device separably, and the shape that being used to of the shape of this cleaning assemblies and IC test jack carried the resettlement section of IC is complementary;
Wherein, relative to the moving of IC test jack, this cleaning assemblies that depends on its bottom surface can be reached the automatic cleaning function to the test interface of IC test jack by this clamping device.
According to preferred embodiment of the present invention, wherein, this cleaning assemblies is made up of a body and a cleaning foil, and this cleaning foil sticks in the bottom surface of this body.The shape of the body of this cleaning assemblies is identical with the shape of IC to be measured, and it is an emulation integrated circuit (dummy IC).This cleaning assemblies is deposited in depositing in the buffering area of test section next door of IC test machine system.This cleaning foil can be sand paper or waterproof abrasive paper.
According to preferred embodiment of the present invention, wherein, this clamping device IC test jack relatively does vertically to reach transverse movement, and it is one to be used for the chip holding device of chip testing classifier, by this cleaning assemblies of pull of vacuum sticking.This clamping device comprises a body and is located at an intrinsic suction nozzle, and this body is provided with location hole, is used for combining with the alignment pin of the test pedestal of accommodating the IC test jack.
According to preferred embodiment of the present invention, wherein, the test interface of this IC test jack is several probes.
The automated cleaning method of the test interface of the IC test jack that provides according to another object of the present invention, it is applied to an IC test machine system, and this automated cleaning method comprises the following step:
One cleaning assemblies clamping device is provided, it is arranged at the top of IC test jack, this clamping device has a bottom surface towards the IC test jack;
One cleaning assemblies is provided, and the shape that being used to of its shape and IC test jack carried the resettlement section of IC is complementary;
This cleaning assemblies is depended on separably the bottom surface of this clamping device; And
This clamping device is moved relative to the IC test jack, make this cleaning assemblies that depends on its bottom surface can reach automatic cleaning function the test interface of IC test jack with this.
According to preferred embodiment of the present invention, wherein, this provides the step of a cleaning assemblies to comprise provides a body and a cleaning foil, and pastes the bottom surface of this cleaning foil in this body.The shape of the body of this cleaning assemblies is identical with the shape of IC to be measured, and it is an emulation integrated circuit (dummy IC).This cleaning assemblies is deposited in depositing in the buffering area of test section next door of IC test machine system.
According to preferred embodiment of the present invention, wherein, this clamping device IC test jack is relatively done vertical and transverse movement.This clamping device is the chip holding device that is used for chip testing classifier, and it is by this cleaning assemblies of pull of vacuum sticking.
According to preferred embodiment of the present invention, wherein, this provides the step of a clamping device to comprise provides a body and a suction nozzle is set in this body.This body is provided with location hole, is used for combining with the alignment pin of the test pedestal of accommodating the IC test jack.
Compared with prior art, the automated cleaning mode of the test interface of IC test jack of the present invention can in time clean stained test interface by the automatic setting to tester table, has more ageing and convenience, and cleaning quality is more even, need not discrete testing head and classifier during cleaning.By this automatic cleaning function of board, can improve test yield and testing efficiency, and can prolong the useful life of test interface.
Description of drawings
Fig. 1 shows the end view of existing chip pin survey machine system.
Fig. 2 shows that automated cleaning of the present invention mechanism is applied to the embodiment decomposing schematic representation of Chip needle detector system shown in Figure 1.
The constitutional diagram of Fig. 3 displayed map 2 embodiment.
Fig. 4 and Fig. 5 show the manner of execution schematic diagram of the probe in the relative test jack of automated cleaning mechanism of the present invention.
Fig. 6 has shown that in detail the cleaning foil of cleaning assemblies bottom surface grinds the action schematic diagram of probe tip.
Fig. 7 shows the flow chart of automated cleaning method of the present invention.
Embodiment
The automated cleaning mechanism of the test interface of integrated circuit of the present invention (IC) test jack and clean method are applicable to an IC test machine system, Chip needle detector system for example shown in Figure 1.
Fig. 2 and Fig. 3 show that the automated cleaning mechanism (hereinafter to be referred as automated cleaning mechanism) of the test interface of IC test jack of the present invention is applied to the embodiment schematic diagram of Chip needle detector system shown in Figure 1, and wherein Fig. 2 is an exploded view, and Fig. 3 is the constitutional diagram of Fig. 2.As Fig. 2 and shown in Figure 3, automated cleaning of the present invention mechanism comprises a cleaning assemblies clamping device 1 and a cleaning assemblies 2.This cleaning assemblies clamping device 1 can be arranged at the top of IC test jack 3 movably by mechanical arm, and this clamping device 1 is a holding device, by this cleaning assemblies 2 of pull of vacuum sticking.This clamping device 1 comprises a body 11 and is located at a suction nozzle 12 in the body 11.These body 11 inside are provided with an air pipe line 13 to this suction nozzle 12, provide air-breathing by this air pipe line 13, form the suction of drawing cleaning assemblies 2, cleaning assemblies 2 is adsorbed in its bottom surface 14.These body 11 outer rims more are provided with several location holes 15, be used for the test pedestal 4 of accommodating IC test jack 3 on corresponding alignment pin 41 combine, so that the classifier of Chip needle detector system and measuring head are realized the location between the two, to carry out follow-up chip testing operation.Because this cleaning assemblies holding device 1 its structure and control and make flowing mode and the chip pick-up device (anchor clamps) of the classifier of existing Chip needle detector system basic identical, so no longer further give unnecessary details at this.
This cleaning assemblies 2 is a stand-alone assembly, depends on the bottom surface 14 of this clamping device 1 separably, to carry out the test interface in the test jack 3, the i.e. cleaning action of probe 5.This cleaning assemblies 2 can be deposited in depositing in the buffering area of test section next door of IC test machine system, for clamping device 1 draw and use after deposit.The shape that the shape of this cleaning assemblies 2 and test jack 3 are used to carry the resettlement section 31 of IC to be measured is complementary.This cleaning assemblies 2 is made up of a body 21 and a cleaning foil 22, and this cleaning foil 22 sticks in the bottom surface 23 of this body 21.The shape of the body 21 of this cleaning assemblies 2 is identical with the shape of IC to be measured, and it is one not comprise the emulation integrated circuit (dummy IC) of chip, and its structure also comprises a circuit board 24 and an adhesive body 25 that protrudes out from circuit board 24.This emulation integrated circuit normally be used for newly purchase testing equipment, new system test smelting tool, when newly encapsulating situations such as the IC of factory reaches the standard grade for the first time, make these emulation integrated circuits constantly empty race on mechanism for testing, to do the obstruction test of plugging rate (Jam Rate), the situation that takes place to stop up when making actual test is reduced to minimum, and then avoids causing IC bad order or damage.This cleaning foil 22 can be sand paper or waterproof abrasive paper, and as shown in Figure 6, it comprises sandwich construction, and one of them is a resilient coating 221, and its bottom is implanted with many in order to grind the tiny sand grains 222 of probe 5 to plant the sand technology.This cleaning foil 22 can be buied by the market, as the precision cleaning sheet of Japanese NHK, Minnesota Mining and Manufacturing Company's manufacturing.
Fig. 4 and Figure 5 shows that the manner of execution schematic diagram of the probe 5 in the relative test jack 3 of automated cleaning of the present invention mechanism.Its cleaning operation flow process is in regular turn: cleaning assemblies 2 is moved in the test section of tester table from depositing buffering area, cleaning assemblies 2 is drawn and moved in the test jack 3 in the test section by cleaning assemblies clamping device 1 again, the action of cleaning with the probes 5 in the 22 pairs of test jacks of cleaning foil 3 that utilize cleaning assemblies 2 bottom surfaces.With before probe 5 contacts, the alignment pin 41 corresponding joints on clamping device 1 body 11 on set location hole 15 and the test pedestal 4 are to reach the location at cleaning foil 22.After default cleaning action and number of times were finished, clamping device 1 was put back to cleaning assemblies 2 and is deposited in the buffering area, for use next time or directly give up.
The clamping device 1 of automated cleaning of the present invention mechanism can be drawn the probes 5 that the cleaning foil 22 that drives cleaning assemblies 2 bottom surfaces is relatively arranged in the test jack 3 and do the vertical transverse movement that reaches with default number of times and speed, to clean needle point 51.The default vertical and transverse movement of these of this cleaning assemblies clamping device 1 can be reached by the program of revising tester table.The cleaning of automated cleaning of the present invention mechanism can be set up on their own by the operator opportunity, or sets board and carrying out automatically performing cleaning behind certain chip testing number of times, perhaps sets board and automatically perform cleaning after the chip testing yield drops to a specific percentage point.
Fig. 6 has shown that in detail the cleaning foil 22 of cleaning assemblies 2 bottom surfaces grinds the action schematic diagram at probe 5 tips 51.Shown in arrow among Fig. 6, cleaning foil 22 can preset times and speed under the drive of clamping device 1, and the rough surface that utilizes its bottom sand grains 222 and probe 5 most advanced and sophisticated 51 be surperficial to be contacted and rub, and reaches the effect of automated cleaning needle point 51 surperficial detritus.Moving both vertically of this cleaning foil 22 can be ground needle point 51 surfaces, and its small transverse movement is level and smooth needle point 51 surfaces then.
Figure 7 shows that the flow chart of automated cleaning method of the test interface of IC test jack of the present invention, it comprises the following step:
(1) provide a cleaning assemblies clamping device, it is arranged at the top of IC test jack, this clamping device has a bottom surface towards the IC test jack;
(2) provide a cleaning assemblies, the shape that being used to of its shape and IC test jack carried the resettlement section of IC to be measured is complementary;
(3) this cleaning assemblies is depended on separably the bottom surface of this clamping device; And
(4) this clamping device is moved relative to the IC test jack, make this cleaning assemblies that depends on its bottom surface reach automatic cleaning function the test interface of IC test jack with this.
Wherein, this provides the step of a cleaning assemblies to comprise provides a body and a cleaning foil, and pastes the bottom surface of this cleaning foil in this body.The shape of the body of this cleaning assemblies is identical with the shape of IC to be measured, and it is an emulation integrated circuit.This cleaning assemblies can be deposited in depositing in the buffering area of test section next door of IC test machine system.
This clamping device test jack is relatively done vertical and transverse movement.This clamping device is a holding device, by this cleaning assemblies of pull of vacuum sticking.In preferred embodiment, this clamping device is the chip holding device on the chip testing classifier.
The above-mentioned step that a clamping device is provided comprises to be provided a body and a suction nozzle is set in body.This body is provided with location hole, is used for combining with the alignment pin of the test pedestal of accommodating the IC test jack.
As mentioned above, automated cleaning mechanism provided by the invention and clean method, can reach to the test interface of test jack automatically, in time, cleaning efficiently.This automated cleaning mechanism simple structure, easy and simple to handle, its cleaning assemblies clamping device 1 is the part of the classifier of existing IC test machine system, originally only be used for the IC of clamping desire test, and in the present invention, more can be used to clamping one cleaning assemblies, with the purpose of reaching on-line automatic cleaning IC test interface by the material characteristic and the friction strength of the cleaning foil on the cleaning assemblies, so the present invention has made full use of existing resource, implement to have convenience easily.By on-line automatic cleaning mode of the present invention, test jack does not need can reduce the production line dead time from producing the online action that can clean of shifting out, and can prolong the useful life of test interface simultaneously yet.
In sum, compare with existing artificial cleaning mode, automated cleaning mode of the present invention has the advantage of following four aspects:
1. cleaning opportunity: disobey and subjectively artificially judge, and so the automatic setting by tester table can in time clean stained test interface, has more ageing and convenience, can reduce the rate of resurveying, and then the raising testing efficiency;
2. clean method: according to setting the action that automatically performs cleaning, its cleaning quality is more even by board, and need not discrete testing head and classifier during cleaning, can save manpower, time, improves testing efficiency;
3. test yield and efficient: because of board has according to the function of setting automated cleaning, so the action that can clean timely and effectively, so the test yield is more stable, yield difference is less, and the rate of resurveying descends, the testing efficiency raising;
4. useful life of test interface: the mode of board automated cleaning is because cleaning is held better opportunity and cleaning quality is more even, so can prolong the useful life of test interface.
It should be noted that automated cleaning mechanism of the present invention and clean method are applicable to the various classifier of all kinds of IC test machine system, as P﹠amp; P Handler, Gravity Handler etc., and be not limited to the embodiment that disclosed.The mode that depends on of cleaning assemblies and clamping device is not limited to the mode of vacsorb, and test interface also is not limited to probe interface.Therefore, the present invention has general applicability.
Claims (9)
1. the automated cleaning mechanism of the test interface of an integrated circuit test socket, it is applied to an ic tester system, it is characterized in that: described automated cleaning mechanism comprises a cleaning assemblies clamping device and a cleaning assemblies, described cleaning assemblies clamping device is one to be used for the chip holding device of chip testing classifier, be arranged at the top of integrated circuit test socket movably, described clamping device has a bottom surface towards integrated circuit test socket; Cleaning assemblies depends on the bottom surface of described clamping device separably, the shape of the resettlement section that is used for bearing integrated of the shape of described cleaning assemblies and integrated circuit test socket is complementary, described cleaning assemblies is made up of a body and a cleaning foil, the body of described cleaning assemblies is an emulation integrated circuit, it comprises a circuit board and an adhesive body that protrudes out from circuit board, the shape of described body is identical with the shape of the integrated circuit of the test interface of described integrated circuit test socket institute desire test, and described cleaning foil sticks in the bottom surface of described body; Relative to the moving of integrated circuit test socket, the described cleaning assemblies that depends on its bottom surface can be reached the automatic cleaning function to the test interface of integrated circuit test socket by described clamping device.
2. automated cleaning as claimed in claim 1 mechanism is characterized in that: the next door, test section of described ic tester system is provided with one and deposits buffering area, deposits in described depositing in the buffering area when described cleaning assemblies does not use.
3. automated cleaning as claimed in claim 1 mechanism, it is characterized in that: described clamping device is a holding device, by the described cleaning assemblies of pull of vacuum sticking.
4. automated cleaning as claimed in claim 1 mechanism, it is characterized in that: described clamping device comprises a body and is located at an intrinsic suction nozzle, described body is provided with location hole, described ic tester system comprises the test pedestal of accommodating integrated circuit test socket, described pedestal has alignment pin, and described location hole is used for combining with described alignment pin.
5. automated cleaning as claimed in claim 1 mechanism, it is characterized in that: the test interface of described integrated circuit test socket is several probes.
6. the automated cleaning method of the test interface of an integrated circuit test socket, it is applied to an ic tester system, and described automated cleaning method comprises the following step:
One cleaning assemblies clamping device is provided, and described clamping device is one to be used for the chip holding device of chip testing classifier, and it is arranged at the top of integrated circuit test socket, and described clamping device has a bottom surface towards integrated circuit test socket;
One cleaning assemblies is provided, the shape of the resettlement section that is used for bearing integrated of its shape and integrated circuit test socket is complementary, the described step that a cleaning assemblies is provided comprises provides a body and a cleaning foil, the body of described cleaning assemblies is an emulation integrated circuit, it comprises a circuit board and an adhesive body that protrudes out from circuit board, the shape of described body is identical with the shape of the integrated circuit of the test interface of integrated circuit test socket institute desire test, and pastes the bottom surface of described cleaning foil in described body;
Described cleaning assemblies is depended on separably the bottom surface of described clamping device; And
Described clamping device is moved relative to integrated circuit test socket, make the described cleaning assemblies that depends on its bottom surface test interface automated cleaning integrated circuit test socket with this.
7. automated cleaning method as claimed in claim 6 is characterized in that: the next door, test section of described ic tester system is provided with one and deposits buffering area, deposits in described depositing in the buffering area when described cleaning assemblies does not use.
8. automated cleaning method as claimed in claim 6 is characterized in that: described clamping device integrated circuit test socket relatively moves both vertically or transverse movement.
9. automated cleaning method as claimed in claim 6, it is characterized in that: the described step that a clamping device is provided comprises to be provided a body and a suction nozzle is set in body, described body is provided with location hole, described ic tester system comprises the test pedestal of accommodating integrated circuit test socket, described pedestal has alignment pin, and described location hole is used for combining with described alignment pin.
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| CN2008100863763A CN101249630B (en) | 2008-03-25 | 2008-03-25 | Automatically cleaning mechanism of test interface of integrated circuit test jack and cleaning method thereof |
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| CN2008100863763A CN101249630B (en) | 2008-03-25 | 2008-03-25 | Automatically cleaning mechanism of test interface of integrated circuit test jack and cleaning method thereof |
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| US8534302B2 (en) * | 2008-12-09 | 2013-09-17 | Microchip Technology Incorporated | Prober cleaning block assembly |
| KR101033776B1 (en) * | 2009-08-03 | 2011-05-13 | 주식회사 탑 엔지니어링 | Apparatus for array test with cleaner |
| KR20120077291A (en) * | 2010-12-30 | 2012-07-10 | 주식회사 탑 엔지니어링 | Array test apparatus |
| CN103811378B (en) * | 2012-11-14 | 2016-08-03 | 沈阳芯源微电子设备有限公司 | A kind of automatic mobile device of semiconductor manufacturing facility |
| CN107037742A (en) * | 2016-02-04 | 2017-08-11 | 沈阳晨讯希姆通科技有限公司 | A kind of automatic dust removing method and automatic control system |
| CN105783977A (en) * | 2016-04-18 | 2016-07-20 | 深圳市华腾半导体设备有限公司 | Electronic component transparent medium turntable bearing testing and automatic wiping method |
| CN108916409B (en) * | 2018-08-31 | 2024-03-15 | 东莞市德瑞精密设备有限公司 | Automatic valve and logistics line vacuum butt joint system |
| CN109254014A (en) * | 2018-10-19 | 2019-01-22 | 深圳市鹰眼在线电子科技有限公司 | Camera sensing device chip tester structure and method |
| CN114414862B (en) * | 2020-11-28 | 2023-03-14 | 法特迪精密科技（苏州）有限公司 | Viscous adsorption method for test probe cleaning method |
| CN112557873A (en) * | 2020-12-04 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | Device for automatically cleaning clamp in integrated circuit testing process |
| KR20220167158A (en) * | 2021-06-11 | 2022-12-20 | (주)테크윙 | Apparatus for cleaning socket and method for cleaning socket |
| CN114814440B (en) * | 2022-06-27 | 2022-09-09 | 长春职业技术学院 | Detection mechanism of electric automation equipment |
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