CN110470970B - Method for dynamically monitoring passive intermodulation - Google Patents
Method for dynamically monitoring passive intermodulation Download PDFInfo
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- CN110470970B CN110470970B CN201910613519.XA CN201910613519A CN110470970B CN 110470970 B CN110470970 B CN 110470970B CN 201910613519 A CN201910613519 A CN 201910613519A CN 110470970 B CN110470970 B CN 110470970B
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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Abstract
The invention discloses a method for dynamically monitoring passive intermodulation, which comprises the steps of determining a secondary shunt network line in a calibration network graph, copying the secondary shunt network line to a board edge test strip, and arranging a plurality of grounding holes around the secondary shunt network line; a load hole is arranged at one end close to the width of the coupling slit, and a power supply hole is arranged at the other end far away from the width of the coupling slit; arranging a power plug-in hole and a power shielding hole around the power hole; arranging a load bonding pad and a load isolating ring at the load hole, and arranging a power supply bonding pad and a power supply isolating ring at the power supply hole; and testing through a cable welding load bonding pad and a power supply bonding pad to obtain a passive intermodulation value. The passive intermodulation monitoring system automatically adds the secondary shunt network line to the board edge test strip by identifying and calibrating the network graph, and sets the grounding hole and the load hole according to a certain rule to realize dynamic monitoring of passive intermodulation. Moreover, the design of the board edge test strips is adopted, so that the pattern is small, the space of the jointed boards is saved, and the utilization rate of the jointed boards is improved; meanwhile, only the passive intermodulation value of the board edge test strip needs to be detected, so that the actual production unit cannot be scrapped, and the scrapping cost is saved.
Description
Technical Field
The invention relates to the technical field of passive intermodulation, in particular to a method for dynamically monitoring the passive intermodulation.
Background
Passive intermodulation: meaning that two or more frequencies mix together in a nonlinear device to produce spurious signals.
As 5G commercial deployment times approach, the construction of 5G infrastructure will become increasingly sophisticated. According to the data of the china industry information network, the number of 5G base stations will reach 1400 ten thousand in 2024, and the number of base station antennas will also increase greatly. In the face of the real-time and large-volume data transmission demands of users, a massive MIMO antenna array system 1000 times of the network capacity of a 4G LTE system and 1ms of extremely low delay is considered as the most potential 5G transmission technology. The feed network of the large-scale MIMO antenna array comprises a power division network and a calibration network. To achieve signal consistency, the calibration network has higher requirements for Printed Circuit Board (PCB) dielectric thickness consistency, Dk consistency, coupling gap width consistency, Passive Intermodulation (PIM) and other technologies.
The monitoring methods of dielectric thickness consistency, Dk consistency and coupling gap width consistency are basically consistent aiming at different calibration network designs, but because the passive intermodulation is comprehensively influenced by factors such as materials, design and processing, the passive intermodulation is difficult to realize uniform monitoring for the graphs of different calibration network designs.
Disclosure of Invention
In order to solve the technical problem, the invention provides a method for dynamically monitoring passive intermodulation, which can automatically identify and calibrate network patterns and test passive intermodulation values.
The technical scheme adopted by the invention is as follows: a method of dynamically monitoring passive intermodulation, comprising the steps of:
determining a secondary shunt network line in the calibration network graph;
copying the secondary shunt network line to a board edge test strip area;
a plurality of grounding holes are arranged around the secondary shunt network line;
a load hole is arranged at one end of the secondary shunt network line close to the coupling slit width, a power supply hole is arranged at the other end of the secondary shunt network line far away from the coupling slit width, and the coupling slit width is a slit between the secondary shunt network line and the main shunt network line;
arranging a power plug-in hole and a power shielding hole around the power hole;
correspondingly arranging a load pad and a load isolating ring at the position of the load hole, and correspondingly arranging a power supply pad and a power supply isolating ring at the position of the power supply hole;
and welding the load bonding pad and the power supply bonding pad through cables, and testing the cables to obtain a passive intermodulation value.
Further, the step of determining the secondary offload network line in the calibration network graph specifically includes:
and identifying a main shunt network line in the calibration network graph, and determining a secondary shunt network line close to the main shunt network line.
Further, the main shunt network line is a network line with the longest length in the calibration network pattern.
Furthermore, the hole pitch of the plurality of grounding holes is between 1.5 and 2.0mm, the distance between each grounding hole and the secondary shunt network line is between 1.0 and 1.5mm, and the aperture of each grounding hole is between 0.2 and 1.0 mm.
Furthermore, the aperture of the load hole is between 0.2 mm and 1.0mm, and the aperture of the power supply hole is between 0.8mm and 1.5 mm.
Furthermore, the aperture of the power plug-in hole is between 0.8mm and 1.5mm, and the aperture of the power shielding hole is between 0.2 mm and 0.8 mm.
Further, the diameter of the load bonding pad is between 1.0mm and 2.0 mm.
Further, the load isolation ring surrounds the load pad in a circle and is close to the load pad, and the width of the load isolation ring is between 0.5 mm and 0.8 mm.
Furthermore, the diameter of the power supply bonding pad is between 0.5 mm and 0.8 mm.
Further, the power isolation ring surrounds the power pad for one circle and is close to the power pad, and the width of the power isolation ring is between 0.5 mm and 0.8 mm.
The invention has the beneficial effects that:
aiming at different calibration network graphs, the invention automatically adds the secondary shunt network line to the board edge test strip by identifying the calibration network graphs and sets the grounding hole and the load hole according to a certain rule so as to realize dynamic monitoring of passive intermodulation. Moreover, the design of the board edge test strips is adopted, so that the pattern is small, the space of the jointed boards is saved, and the utilization rate of the jointed boards is improved; meanwhile, only the passive intermodulation value of the board edge test strip needs to be detected, so that the actual production unit cannot be scrapped, and the scrapping cost is saved.
Drawings
Fig. 1 is a schematic flow chart diagram of an embodiment of a method of dynamically monitoring passive intermodulation in the present invention;
FIG. 2 is a schematic diagram of the structure of the calibration network pattern according to the present invention;
fig. 3 is a schematic structural diagram of a secondary shunt network line according to the present invention.
In the figure, 1, a main shunt network line; 2. a secondary shunt network line; 21. a secondary shunt network line; 3. the width of the coupling seam; 4. a ground hole; 5. a load port; 6. a power supply hole; 7. a power plug-in hole; 8. and a power shielding hole.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Example one
The embodiment provides a method for dynamically monitoring passive intermodulation, as shown in fig. 1, including the following steps:
s1, determining a secondary shunt network line in a calibration network graph;
s2, copying the secondary shunt network line to a board edge test strip area;
s3, arranging a plurality of grounding holes around the secondary shunt network line;
s4, arranging a load hole at one end, close to the coupling slit width, of the secondary shunt network line, and arranging a power supply hole at the other end, far away from the coupling slit width, of the secondary shunt network line, wherein the coupling slit width is a slit between the secondary shunt network line and the main shunt network line;
s5, arranging power plug-in holes and power shielding holes around the power holes;
s6, correspondingly arranging a load pad and a load isolating ring at the load hole, and correspondingly arranging a power pad and a power isolating ring at the power hole;
and S7, welding a load bonding pad and a power supply bonding pad through cables, and obtaining a passive intermodulation value by utilizing cable testing.
In this embodiment, the step S1 of determining that calibrating the sub-offload network line in the network pattern specifically includes: identifying a primary offload network line in the calibration network graph, and determining a secondary offload network line that is close to the primary offload network line.
In this embodiment, the main shunt network line is the network line with the longest length in the calibration network pattern.
Fig. 2 is a schematic structural diagram of a calibration network pattern in the present invention, in which 1 is a main shunt network line, 2 is a sub-shunt network line, and 3 is a coupling gap width, i.e., a gap between the main shunt network line 1 and the sub-shunt network line 2. Fig. 3 is a schematic structural diagram of a secondary shunt network line according to the present invention. The above steps S1 to S7 are described with reference to fig. 2 and 3:
step S1: determining a secondary shunt network line in the calibration network graph. Specifically, software is used to screen line attributes, and a network line with the longest length in the calibration network graph is further screened and calibrated, that is, the main shunt network line 1. After identifying the primary offload network line 1, a secondary offload network line 2 close to the primary offload network line 1 is determined. Referring to fig. 2, in the present embodiment, there are 16 sub-tapping network lines.
Step S2: and copying the secondary shunt network line to the test strip area at the edge of the plate. Specifically, each of the sub-shunting network lines 2 is sequentially copied to the board edge test strip area beside the calibration network pattern for testing.
Step S3: and a plurality of grounding holes are arranged around the secondary shunt network line. Specifically, referring to fig. 3, taking the secondary shunt network line 21 in fig. 2 as an example, after the secondary shunt network line 21 is copied to the board edge test strip area, a plurality of grounding holes 4 are disposed around the secondary shunt network line 21. Preferably, the hole pitch between the plurality of grounding holes 4 is between 1.5 and 2.0mm, the distance between each grounding hole 4 and the secondary shunt network line 21 is between 1.0 and 1.5mm, and the aperture of each grounding hole 4 is between 0.2 and 1.0 mm.
Step S4: a load hole 5 is arranged at one end of the secondary shunt network wire 21 close to the coupling slit width 3, and referring to fig. 2, it can be seen that the end close to the coupling slit width 3 is the lower end of the secondary shunt network wire 21 in fig. 3; the other end of the secondary shunt network wire 21 far from the coupling slit width 3 is provided with a power supply hole 6, and referring to fig. 2, it can be seen that the other end far from the coupling slit width 3 is the upper end of the secondary shunt network wire 21 in fig. 3. Preferably, the aperture of the load hole 5 is between 0.2 and 1.0mm, and the aperture of the power supply hole 6 is between 0.8 and 1.5 mm.
Step S5: and a power plug hole and a power shielding hole are arranged around the power hole. Specifically, a power plug hole 7 and a power shielding hole 8 are provided around the power supply hole 6. Referring to fig. 3, three power card holes 7 and four power shielding holes 8 are provided. Preferably, the aperture of each power plug-in hole 7 is between 0.8 and 1.5mm, and the aperture of each power shielding hole 8 is between 0.2 and 0.8 mm.
Step S6: and a load bonding pad and a load isolating ring are correspondingly arranged at the load hole, and a power supply bonding pad and a power supply isolating ring are correspondingly arranged at the power supply hole. Specifically, a load pad (not shown in the figure) and a load isolation ring (not shown in the figure) are correspondingly arranged at the position of the top layer pattern load hole 5, wherein the load isolation ring surrounds the load pad for one circle and is next to the load pad, preferably, the diameter of the load pad is between 1.0-2.0 mm, and the width of the load isolation ring is between 0.5-0.8 mm; the power supply pad (not shown in the figure) and the power supply isolating ring (not shown in the figure) are correspondingly arranged at the position of the bottom layer pattern power supply hole 6, wherein the power supply isolating ring surrounds the power supply pad for a circle and is close to the power supply pad, the diameter of the power supply pad is between 0.5 and 0.8mm, and the width of the power supply isolating ring is between 0.5 and 0.8 mm.
Step S7: and welding a load bonding pad and a power supply bonding pad through a cable, and obtaining a passive intermodulation value by utilizing cable testing. Specifically, a load pad and a power supply pad are welded through cables respectively, one end of each cable is connected with load equipment, the other end of each cable is connected with a passive intermodulation instrument, a load hole and a power supply hole in the PCB are formed in the middle of each cable, and the passive intermodulation value of the PCB is obtained through testing of the passive intermodulation instruments, the cables and the load equipment.
On one hand, the invention automatically identifies the calibration graph network aiming at different calibration network graphs, automatically adds a secondary shunt network line to a panel edge test strip (PIM-Coppon), sets a grounding hole and a loading hole according to a certain rule, realizes dynamic monitoring passive intermodulation, and has wide application range and strong compatibility; on the other hand, the passive intermodulation value of the actual graph can be better reflected, and the practicability is strong; on the other hand, welding is needed to be adopted for passive intermodulation testing, welded units cannot be delivered to customers, the design of the plate edge test strips is adopted, the pattern is small, the space of the jointed boards is saved, the utilization rate of the jointed boards is improved, meanwhile, only the passive intermodulation value of the plate edge test strips needs to be detected, actual production units cannot be scrapped, and scrapping cost is saved.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A method of dynamically monitoring passive intermodulation, comprising the steps of:
determining a secondary shunt network line in the calibration network graph;
copying the secondary shunt network line to a board edge test strip area;
a plurality of grounding holes are arranged around the secondary shunt network line;
a load hole is arranged at one end of the secondary shunt network line close to the coupling slit width, a power supply hole is arranged at the other end of the secondary shunt network line far away from the coupling slit width, and the coupling slit width is a slit between the secondary shunt network line and the main shunt network line;
arranging a power plug-in hole and a power shielding hole around the power hole;
correspondingly arranging a load pad and a load isolating ring at the position of the load hole, and correspondingly arranging a power supply pad and a power supply isolating ring at the position of the power supply hole;
welding the load bonding pad and the power supply bonding pad through a cable, and testing by using the cable to obtain a passive intermodulation value;
wherein the calibration network pattern comprises the primary shunt network line and the secondary shunt network line; the main shunt network line is the network line with the longest length in the calibration network graph; the step of determining the secondary shunt network line in the calibration network graph specifically includes: and identifying a main shunt network line in the calibration network graph, and determining a secondary shunt network line close to the main shunt network line.
2. The method of claim 1, wherein a hole pitch of a plurality of ground holes is between 1.5mm and 2.0mm, a distance between each ground hole and the secondary shunt network line is between 1.0mm and 1.5mm, and a hole diameter of each ground hole is between 0.2 mm and 1.0 mm.
3. The method of claim 1, wherein the aperture of the load hole is 0.2-1.0 mm, and the aperture of the power hole is 0.8-1.5 mm.
4. The method of claim 1, wherein the aperture of the power plug-in hole is between 0.8mm and 1.5mm, and the aperture of the power shielding hole is between 0.2 mm and 0.8 mm.
5. The method of claim 1, wherein the diameter of the load pad is between 1.0mm and 2.0 mm.
6. A method for dynamically monitoring passive intermodulation as claimed in claim 1, wherein the load isolation ring surrounds and is immediately adjacent to the load pad, and the width of the load isolation ring is between 0.5 mm and 0.8 mm.
7. The method of claim 1, wherein the diameter of the power pad is between 0.5 mm and 0.8 mm.
8. The method of claim 1, wherein the power isolation ring surrounds the power pad and is adjacent to the power pad, and the width of the power isolation ring is between 0.5 mm and 0.8 mm.
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| CN201910613519.XA CN110470970B (en) | 2019-07-09 | 2019-07-09 | Method for dynamically monitoring passive intermodulation |
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| CN201910613519.XA CN110470970B (en) | 2019-07-09 | 2019-07-09 | Method for dynamically monitoring passive intermodulation |
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| CN110470970A CN110470970A (en) | 2019-11-19 |
| CN110470970B true CN110470970B (en) | 2021-09-21 |
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| CN111289808B (en) * | 2020-02-25 | 2022-09-13 | 广州兴森快捷电路科技有限公司 | Method for dynamically monitoring amplitude and phase deviation |
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| CN108886190A (en) * | 2016-02-05 | 2018-11-23 | 斯宾纳有限公司 | Filter construction for PIM measurement |
| CN208272136U (en) * | 2018-05-28 | 2018-12-21 | 广东通宇通讯股份有限公司 | A kind of feeding network of extensive mimo antenna |
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- 2019-07-09 CN CN201910613519.XA patent/CN110470970B/en active Active
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|---|---|---|---|---|
| CN104133098A (en) * | 2013-05-03 | 2014-11-05 | 英飞凌科技股份有限公司 | Integration of current measurement in wiring structure of an electronic circuit |
| US9977068B1 (en) * | 2015-07-22 | 2018-05-22 | Anritsu Company | Frequency multiplexer for use with instruments for measuring passive intermodulation (PIM) |
| US9863987B2 (en) * | 2015-11-03 | 2018-01-09 | Commscope Italy S.R.L. | Apparatus and methods for dynamic passive intermodulation distortion testing |
| CN108886190A (en) * | 2016-02-05 | 2018-11-23 | 斯宾纳有限公司 | Filter construction for PIM measurement |
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