CN110305445A - A kind of black-colored resin composition, prepreg and laminate - Google Patents

A kind of black-colored resin composition, prepreg and laminate Download PDF

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Publication number
CN110305445A
CN110305445A CN201910404866.1A CN201910404866A CN110305445A CN 110305445 A CN110305445 A CN 110305445A CN 201910404866 A CN201910404866 A CN 201910404866A CN 110305445 A CN110305445 A CN 110305445A
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China
Prior art keywords
black
epoxy resin
resin composition
colored resin
type
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Withdrawn
Application number
CN201910404866.1A
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Chinese (zh)
Inventor
竺孟晓
沈宗华
彭康
盛佳炯
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Hangzhou Hua Zheng Xin Materials Co Ltd
New Materials Co Ltd Zhejiang China Is
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Hangzhou Hua Zheng Xin Materials Co Ltd
New Materials Co Ltd Zhejiang China Is
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Application filed by Hangzhou Hua Zheng Xin Materials Co Ltd, New Materials Co Ltd Zhejiang China Is filed Critical Hangzhou Hua Zheng Xin Materials Co Ltd
Priority to CN201910404866.1A priority Critical patent/CN110305445A/en
Publication of CN110305445A publication Critical patent/CN110305445A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B32B2315/085—Glass fiber cloth or fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide

Abstract

The invention belongs to printed wiring board resin material fields, and in particular to a kind of black-colored resin composition, prepreg and laminate.Wherein, black-colored resin composition includes in parts by weight following component: 100 parts of epoxy resin；0.001~60 part of curing agent；0.001~5 part of curing accelerator；10~100 parts of filler；0.001~50 part of modified black additive；0.001~50 part of additive.Resin combination of the invention improves the difficult of resin system by modified black additive and disperses, and prepreg and the disadvantage that laminate Shading intensity is weak and adsorbing powder dust is big have good processability.

Description

A kind of black-colored resin composition, prepreg and laminate
Technical field
The invention belongs to printed wiring board resin material fields, and in particular to a kind of black-colored resin composition, prepreg And laminate.
Background technique
In recent years, with the rapid hair of PCB industry, the market demand of high performance copper clad laminate increasingly increases, and is pursuing material It is also right while the heat resistance of material and high Tg are to meet the application of all kinds of high-end products now such as multi-layer board, HDI, LED light source Required by the light-proofness and color of its baseplate material also have, and the shading performance and application field of black plate are generally higher than other Color.Therefore, black copper-clad plate has become a big research direction of PCB industry.
Conventional black plate, it is basic to use carbon black and black filler (for example, the patent text of Publication No. CN101851390A Offer), or other black additives (for example, patent document of Publication No. CN102190865A) are used, reach dye black It is required that.It is well known that general carbon black and black filler basis are all graphite, conductivity is big, and grain diameter is big, is easy Powder is adsorbed, causes to be difficult to disperse even to cause agglomeration in impregnation mixed process, increases product in the fabrication process Duration and difficulty, and the insulation performance of the laminate after pressing is poor, is easy to produce micro- short or even direct conduction phenomenon, seriously Limit its application on high-end product.
Summary of the invention
Based in place of deficiencies of the prior art, the present invention provides a kind of black-colored resin composition, using the tree The prepreg of oil/fat composition preparation and the laminate prepared using the prepreg.
In order to achieve the above object of the invention, the invention adopts the following technical scheme:
A kind of black-colored resin composition includes in parts by weight following component:
Preferably, the epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol S type ring Oxygen resin, bisphenol A-type novolac epoxy resin, phenol aldehyde modified epoxy resin, isocyanate modified epoxy resin, DCPD modified epoxy Resin, polyfunctional group modified epoxy, alicyclic based epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene The combination of one or more of ring-like epoxy resin.
Preferably, the curing agent is o-cresol type phenolic resin, linear phenolic resin, bisphenol A-type phenolic aldehyde tree Rouge, phenol type phenolic resin, aromatic amine curing agent, carboxylic amine curing agent, alicyclic ring amine curing agent, polynary amine curing agent, The combination of one or more of aromatic acid anhydride curing agents, fatty acid anhydride curing agent, halogenation anhydride curing agent.
Preferably, the curing accelerator be 2-ethyl-4-methylimidazole, 2- ethyl imidazol(e), 2- phenylimidazole, 2-methylimidazole, 1 benzyl 2 methyl imidazole, undecyl imidazole, triethanolamine, dimethylaniline, in organic metal salt One or more of combinations.
Preferably, the black-colored resin composition further includes fire retardant, and fire retardant is halogenated flame retardant, be can be selected from One of chlorine-containing flame retardant, brominated flame-retardant, deca-BDE, decabromodiphenylethane, brominated epoxy resin, tetrabromobisphenol A Or several combination.
Preferably, the filler is crystalline sillica, fused silica, preparing spherical SiO 2, silicic acid Calcium, silicon carbide, calcium carbonate, aluminium oxide, aluminium hydroxide, aluminium nitride, boron nitride, titanium dioxide, barium titanate, barium sulfate, talcum powder, The combination of one or more of polytetrafluoroethylene (PTFE).
Preferably, the modified black additive be phenyl amines black additive, metal complex black additive, The combination of one or more of insulation carbon black, acid black, cationic sulphur BK, three nitrogen additives.
Preferably, the additive is one of coupling agent, dispersing agent, toughener, defoaming agent, solvent or several The combination of kind.
The present invention also provides a kind of prepreg, including reinforcing material and by impregnation it is dry after be attached on reinforcing material such as Black-colored resin composition described in any one of upper scheme.
The present invention also provides a kind of laminate, the laminate includes pre- described in metal foil and one layer or more scheme as above Leaching material.
Compared with prior art, the present invention beneficial effect is:
(1) resin combination of the invention improves the difficult of resin system by modified black additive and disperses, prepreg With the disadvantage that laminate Shading intensity is weak and adsorbing powder dust is big, there is good processability；
(2) heat resistance is good after prepreg of the invention solidification, and Tg high, electric property is excellent, excellent fireproof performance, resistance to suction Aqueous good, blackness is high, and colour consistency is good, and light-proofness is good.
(3) laminate excellent combination property of the invention, heat resistance is good, Tg high, and insulating properties is excellent, and flame retardant property is excellent Different, water absorption resistance is good, and blackness is high, and colour consistency is good, light-proofness is good, has excellent toughness and PCB processing performance is excellent, It is highly suitable for high blackness, high Tg and the multilayer printed circuit for requiring excellent insulation performance.
Specific embodiment
It in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below will be to the embodiment of the present invention Technical solution carries out clear, complete description.Obviously, described embodiment is a part of the embodiments of the present invention, rather than Whole embodiments.Based on described the embodiment of the present invention, those of ordinary skill in the art are without creative work Under the premise of every other embodiment obtained, belong to protection scope of the present invention.
Unless otherwise defined, technical term or scientific term used in the disclosure are should be in fields of the present invention The ordinary meaning for thering is the personage of general technical ability to be understood.
Part raw material used in embodiment:
Epoxy resin 1: bisphenol A type epoxy resin；
Epoxy resin 2: alicyclic based epoxy resin；
Epoxy resin 3: isocyanate modified epoxy resin；
Curing agent 1: o-cresol type phenolic resin；
Curing agent 2: alicyclic ring amine curing agent；
Curing accelerator: 2-ethyl-4-methylimidazole；
Filler 1: crystalline sillica；
Filler 2: titanium dioxide；
Coupling agent: silane coupling agent；
Modified black additive 1: nigrosine；
Modified black additive 2: acid black；
Black additive 3: insulation carbon black.
Embodiment 1:
One, black-colored resin composition is prepared
By weight, 1,15 part of 45 parts of epoxy resin, 2,10 parts of epoxy resin, 3,0 parts of epoxy resin, 1,8 part of curing agent is taken 2,0.05 parts of curing accelerators of curing agent, 0.5 part of 1,0 part of modified black additive, 2,0 parts of modified black additive black addition 3,0.2 parts of silane coupling agents of agent, 15 parts of fillers, 1,20 part of filler 2, are dissolved with organic solvent, are stirred evenly, and adjust resin combination The solid content of object is 60wt%, and black resin is made and combines liquid.
Two, prepreg is prepared
By above-mentioned black resin combination liquid dipping or it is full and uniform be coated on reinforcing material on, reinforcing material such as E type glass Glass cloth, and toasted in 150 DEG C of baking ovens and prepreg is made.
Three, copper-clad laminate is prepared
It takes prepreg six obtained above to be superimposed together, respectively puts a copper foil (1OZ) up and down, be placed in vacuum hotpressing machine Middle compacting obtains copper-clad laminate.Wherein, specific pressing process are as follows: it is small that 1 is pressed under 2MPa pressure, at a temperature of 180 DEG C When.
The preparation method of the black-colored resin composition of embodiment 2~3 and comparative example 4~7, prepreg and copper-clad laminate With embodiment 1, concrete component ratio is shown in Table 1.
Table 1
The performance of copper-clad laminate made from each embodiment and comparative example is detected, specific Testing index and inspection Mark is quasi- as follows:
(1) gel time, test method is according to IPC-TM-650 2.3.18；
(2) High Pot, test method keep 30s using 1000V according to IPC-TM-650 2.5.7；
(3) peel strength, test method is according to IPC-TM-650 2.4.9；
(4) glass transition temperature (Tg), test method differential scanning calorimetry (DSC)；
(5) thermally stratified layer time (T288), test method use thermomechanical analysis (TMA)；
(6) flammability is measured according to U.S. UL94 vertical combustion；
(7) blackness, light transmittance, according to plastic cement light transmission and the examination criteria of whiteness.
Concrete outcome is shown in Table 2.
Table 2
From table 2 it can be seen that embodiment 1,2 is that the obtained prepreg of the present invention has good insulating properties and excellent High Pot performance, copper-clad laminate excellent combination property obtained, copper-clad laminate heat resistance is good, Tg high, absolutely Edge is excellent, excellent fireproof performance, and water absorption resistance is good, and blackness is high, and colour consistency is good, light-proofness is good, has excellent toughness And PCB processing performance is excellent, is highly suitable for the high Tg of high blackness and requires the multilayer printed circuit of excellent insulation performance.And And resin combination of the invention, the difficult of resin system is improved by modified black additive and is dispersed, prepreg and laminate The disadvantage that Shading intensity is weak and adsorbing powder dust is big has good processability；Heat resistance after prepreg solidification of the invention Good, Tg high, electric property is excellent, excellent fireproof performance, and water absorption resistance is good, and blackness is high, and colour consistency is good, and light-proofness is good.
In above-described embodiment and its alternative, epoxy resin 1, epoxy resin 2, epoxy resin 3 are contained by the embodiment 1 Except, it can also be in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, bisphenol A-type phenolic aldehyde ring The modified ring of oxygen resin, phenol aldehyde modified epoxy resin, isocyanate modified epoxy resin, DCPD modified epoxy, polyfunctional group It is oxygen, alicyclic based epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, any in naphthalene nucleus type epoxy resin Selection, and is not limited to three kinds of epoxy resin, for example, a kind of, two kinds, three kinds, the group of four kinds or even above-mentioned whole epoxy resin It closes.
It, can be with except curing agent 1, curing agent 2 are contained by the embodiment 1 in above-described embodiment and its alternative In o-cresol type phenolic resin, linear phenolic resin, bisphenol A type phenolic resin, phenol type phenolic resin, aromatic amine solidification Agent, carboxylic amine curing agent, alicyclic ring amine curing agent, polynary amine curing agent, aromatic acid anhydride curing agents, fatty acid anhydride solidification It is arbitrarily selected in agent, halogenation anhydride curing agent, and is not limited to two kinds of curing agent, can also be a kind of, two kinds, three kinds, four kinds, very To the combination of above-mentioned whole curing agent.
It can also be 2- second except curing accelerator is contained by the embodiment 1 in above-described embodiment and its alternative Base -4-methylimidazole, 2- ethyl imidazol(e), 2- phenylimidazole, 2-methylimidazole, 1 benzyl 2 methyl imidazole, undecyl miaow One of azoles, triethanolamine, dimethylaniline, organic metal salt or a variety of combinations.
In above-described embodiment and its alternative, black-colored resin composition can also add fire retardant, and fire retardant is halogen Flame retardant can be selected from chlorine-containing flame retardant, brominated flame-retardant, deca-BDE, decabromodiphenylethane, brominated epoxy resin, four One of bromine bisphenol-A or a variety of combinations.
In above-described embodiment and its alternative, except filler 1 and filler 2 are contained by the embodiment 1, it can also tie Crystal form silica, fused silica, preparing spherical SiO 2, calcium silicates, silicon carbide, calcium carbonate, aluminium oxide, aluminium hydroxide, Aluminium nitride boron nitride, titanium dioxide, barium titanate, barium sulfate, talcum powder, arbitrarily selects in polytetrafluoroethylene (PTFE), and is not limited to two kinds Filler can also be a kind of, two kinds, three kinds, the combination of four kinds or even above-mentioned whole fillers.
In above-described embodiment and its alternative, modified black additive 1 and modified black additive 2 are in embodiment 1 It, can also be in phenyl amines black additive, metal complex black additive, insulation carbon black, acid black, cation except contained Arbitrarily selected in sulphur BK, three nitrogen additives, and be not limited to two kinds of modified black additives, can also for it is a kind of, two kinds, three kinds, The combination of four kinds or even above-mentioned whole modified black additive.
It can also include coupling except additive is contained by the embodiment 1 in above-described embodiment and its alternative One of agent, dispersing agent, toughener, defoaming agent, solvent or a variety of combinations.
The method of the present invention that the above embodiments are only used to help understand and its core concept.It should be pointed out that for For those skilled in the art, without departing from the principle of the present invention, if can also be carried out to the present invention Dry improvement and modification, these improvement and modification are also fallen into the claims in the present invention protection scope.

Claims (10)

1. a kind of black-colored resin composition, which is characterized in that include following component in parts by weight:
2. a kind of black-colored resin composition according to claim 1, which is characterized in that the epoxy resin is bisphenol A-type Epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, bisphenol A-type novolac epoxy resin, phenol aldehyde modified asphalt mixtures modified by epoxy resin Rouge, isocyanate modified epoxy resin, DCPD modified epoxy, polyfunctional group modified epoxy, alicyclic based epoxy resin, connection The combination of one or more of benzene-type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene nucleus type epoxy resin.
3. a kind of black-colored resin composition according to claim 1, which is characterized in that the curing agent is o-cresol type phenol Urea formaldehyde, linear phenolic resin, bisphenol A type phenolic resin, phenol type phenolic resin, aromatic amine curing agent, carboxylic amine-type cure Agent, alicyclic ring amine curing agent, polynary amine curing agent, aromatic acid anhydride curing agents, fatty acid anhydride curing agent, halogenation anhydride-cured The combination of one or more of agent.
4. a kind of black-colored resin composition according to claim 1, which is characterized in that the curing accelerator is 2- second Base -4-methylimidazole, 2- ethyl imidazol(e), 2- phenylimidazole, 2-methylimidazole, 1 benzyl 2 methyl imidazole, undecyl miaow The combination of one or more of azoles, triethanolamine, dimethylaniline, organic metal salt.
5. a kind of black-colored resin composition according to claim 1, which is characterized in that the black-colored resin composition also wraps Fire retardant is included, fire retardant is halogenated flame retardant, can be selected from chlorine-containing flame retardant, brominated flame-retardant, deca-BDE, decabrominated dipheny second The combination of one or more of alkane, brominated epoxy resin, tetrabromobisphenol A.
6. a kind of black-colored resin composition according to claim 1, which is characterized in that the filler is crystal type titanium dioxide Silicon, fused silica, preparing spherical SiO 2, calcium silicates, silicon carbide, calcium carbonate, aluminium oxide, aluminium hydroxide, aluminium nitride, nitridation The combination of one or more of boron, titanium dioxide, barium titanate, barium sulfate, talcum powder, polytetrafluoroethylene (PTFE).
7. a kind of black-colored resin composition according to claim 1, which is characterized in that the modified black additive is benzene Amine black additive, metal complex black additive, insulation carbon black, acid black, cationic sulphur BK, one in three nitrogen additives Kind or several combinations.
8. a kind of black-colored resin composition according to claim 1, which is characterized in that the additive is coupling agent, divides The combination of one or more of powder, toughener, defoaming agent, solvent.
9. a kind of prepreg, which is characterized in that including reinforcing material and by being attached on reinforcing material after impregnation drying as weighed Benefit requires the described in any item black-colored resin compositions of 1-8.
10. a kind of laminate, which is characterized in that the laminate includes that metal foil and one layer or more are as claimed in claim 9 Prepreg.
CN201910404866.1A 2019-05-16 2019-05-16 A kind of black-colored resin composition, prepreg and laminate Withdrawn CN110305445A (en)

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CN111057270A (en) * 2019-12-04 2020-04-24 广东盈骅新材料科技有限公司 Modified carbon black and preparation method thereof, resin composition and copper-clad plate
CN111138636A (en) * 2019-12-31 2020-05-12 浙江华正新材料股份有限公司 Resin composition, prepreg and laminated board
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CN111923562A (en) * 2020-08-10 2020-11-13 三鑫笑为电子材料(苏州)有限公司 Laminating process of white epoxy glass fiber cloth laminated board
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CN111534056A (en) * 2020-04-15 2020-08-14 浙江华正新材料股份有限公司 Resin composition, prepreg and laminated board thereof
CN111899954A (en) * 2020-07-28 2020-11-06 江苏科化新材料科技有限公司 Thermosetting epoxy resin composition for packaging inductor and preparation method thereof
CN111923562A (en) * 2020-08-10 2020-11-13 三鑫笑为电子材料(苏州)有限公司 Laminating process of white epoxy glass fiber cloth laminated board
CN113808779A (en) * 2021-11-17 2021-12-17 西安宏星电子浆料科技股份有限公司 Low-temperature curing insulating medium slurry for chip resistor
CN113808779B (en) * 2021-11-17 2022-03-01 西安宏星电子浆料科技股份有限公司 Low-temperature curing insulating medium slurry for chip resistor

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Application publication date: 20191008