CN110303269A - For the Sn-Cu-Ti solder of low temperature brazing diamond and application - Google Patents
For the Sn-Cu-Ti solder of low temperature brazing diamond and application Download PDFInfo
- Publication number
- CN110303269A CN110303269A CN201910590660.2A CN201910590660A CN110303269A CN 110303269 A CN110303269 A CN 110303269A CN 201910590660 A CN201910590660 A CN 201910590660A CN 110303269 A CN110303269 A CN 110303269A
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- Prior art keywords
- diamond
- solder
- low temperature
- grams
- brazing
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses for the Sn-Cu-Ti solder of low temperature brazing diamond and application, it can be realized the low-temperature welding of diamond, the graphitization of diamond is avoided from mechanism, reduces the thermal damage of diamond in welding process, reduces the loss for the temperature-sensitive matrix mechanical property connecting with diamond.
Description
Technical field
The invention belongs to technical field of soldering materials, and in particular to the Sn-Cu-Ti alloy for low temperature brazing diamond welds
Material and application.
Background technique
Diamond intensity is high, and hardness is big, is the maximum substance of hardness found in nature.Because of the object of diamond brilliance
Rationality energy, this plays diamond abrasive grain tool in the grinding of the hard brittle materials such as stone material, ceramics, hard alloy to focus on
The effect wanted.Currently, preparing by the diamond tool of bonding agent of metal, the connection of diamond and tool base mainly passes through electricity
Plating, the means such as sintering and soldering are realized.Compared to single layer electroplating technology, the millgrain tool diamond abrasive grain of method for brazing preparation with
There is chemical bonding in solder matrix interface, have higher bonding strength, more peel；Compared to traditional multi-layer sintering technique,
The exposure degree of diamond abrasive grain can be improved 70%~80% by method for brazing, greatly improve the appearance bits ability and cutting effect of tool
Rate.
The problem of preparation process of soldering diamond is primarily present is that diamond abrasive grain will appear fragmentation after being brazed
The phenomenon that, and diamond abrasive grain tool is in use, and abrasive grain is easy to appear breakage phenomenon, and abrasive grain heel and toe wear is tight
Weight.Mechanical property and dimensional accuracy for the temperature-sensitive matrix of diamond abrasive grain tool also have and can have damage, such as scroll saw, soldering
After complete compared with original steel wire, loss in mechanical strength is serious.This allows for method for brazing and is difficult to prepare fine granularity, high-precision Buddha's warrior attendant
Lapicide's tool.Current soldering preparation process can generate biggish thermal damage to diamond abrasive grain and tool base, limit to pricker
Welding method prepares the scope of application of diamond abrasive grain tool.The consolidated diamond millgrain tool prepared with method for brazing, is currently in and cries
The good difficult situation that do not draw well, is mainly used in the roughing occasion such as sawing, corase grinding of material, and fine-grained soldering diamond
The application of tool is then more rare.The fine granularity that is often applied in Precision Machining, non-steel matrix consolidated diamond tool are such as
Diamond repairs disk device, mill, scroll saw etc., still relies primarily on electroplating technology.
Diamond is a kind of face-centered cubic crystal structure, and on the one hand this stable structure has diamond very high hard
On the other hand degree makes diamond have extremely strong chemical inertness again, the temperature that this allows for welding diamond is generally relatively high.
In addition, diamond is a kind of metastable material again, 700 DEG C in vacuum, normal pressure, will occur the quick graphitization phase of diamond
Become.In the diamond brazing research of existing difference solder hierarchy, Ni-Cr base (brazing temperature: 950~1160 DEG C), Cu-Sn base
(brazing temperature: 880~1150 DEG C), Ag-Cu base (brazing temperature: 740~970 DEG C) solder are widely used in the weldering of diamond
It connects, the characteristics of these solder hierarchies is Gao Yuan, high-melting-point.Solder Gao Yuan, dystectic essential point make the welding temperature of diamond
Degree is high.When using Ni-Cr base, Cu-Sn base, Ag-Cu base solder welding diamond, different journeys can all occur in diamond
The chemical erosion and thermal shock of degree.Existing solder hierarchy is originally welded for ceramic material, and welding temperature is all higher than
The quick graphited temperature (700 DEG C) of diamond vacuum normal pressure.The improper use of high-temperature solder, inevitably results in diamond abrasive grain
Thermal damage and graphitization phase transformation.High temperature brazing causes diamond abrasive grain tool thermal damage to be limitation brazed diamond tool performance
With the basic reason of application range.
Summary of the invention
The present invention overcomes the prior art to reduce brazing process to the thermal damage of diamond abrasive grain and its tool base
Shortcoming is provided for the Sn-Cu-Ti solder of low temperature brazing diamond and application, can be in 700 DEG C of following implemented
The low-temperature welding of diamond avoids the graphitization of diamond from mechanism, greatly reduces the thermal damage in welding process.
The technical solution adopted by the present invention to solve the technical problems is: the Sn-Cu-Ti for low temperature brazing diamond is closed
Gold solder is made of following element by weight: 0.71~50 part of Cu, 0.25~6 part of Ti, and 0~20 part of Ag, Ga 0~0.5
Part, 0~0.5 part of Ce, surplus is Sn and inevitable impurity., Ti active high characteristic low using Sn fusing point, Lai Shixian exist
Interfacial reaction occurs for diamond and solder under cryogenic conditions, thus realize that diamond is connect with solder low temperature brazing,
Reduce brazing process thermal damage；Kamash alloy is effectively increased with Sn-Cu (Ag) intermetallic compound is formed by addition Cu, Ag
Mechanical strength；Increase the antioxygenic property of solder by addition active element Ga.
In a preferred embodiment of the present invention, it is made of by weight following element: 0.71~50 part of Cu, Ti 0.5~
3.5 parts, 0~20 part of Ag, 0~0.5 part of Ga, 0~0.5 part of Ce, surplus is Sn and inevitable impurity.
In a preferred embodiment of the present invention, it is made of by weight following element: 0.71~20 part of Cu, Ti 0.5~6
Part, 0~20 part of Ag, 0~0.5 part of Ga, 0~0.5 part of Ce, surplus is Sn and inevitable impurity.
In a preferred embodiment of the present invention, the solder is smelted into liquid by each component metal together in smelting furnace
State mixture, then misting cooling powder forms under inert ambient environment.
In a preferred embodiment of the present invention, the solder be it is powdered, having a size of 10~50 microns.
In a preferred embodiment of the present invention, the fusing point of the solder is at 227~650 DEG C.
The present invention also provides application of the above-mentioned solder in low temperature brazing diamond, the low temperature is 550~750
℃。
In a preferred embodiment of the present invention, by the brazing filler metal alloy in vacuum tube furnace, 10-4~10-3Pa's is true
Diamond particles are welded under the conditions of reciprocal of duty cycle, 550~650 DEG C of temperature.
The technical program compared with the background art, it has the following advantages:
Brazing filler metal alloy according to the present invention for low temperature brazing diamond, can not only be in 700 DEG C of following implemented Buddha's warrior attendants
The low-temperature welding of stone avoids the graphitization of diamond from mechanism, greatly reduces the thermal damage in welding process, and reduction connects therewith
(450 DEG C of heating are down in the heating of 0.3 950 DEG C of mm dia steel wire, and tensile property is promoted for the loss of the temperature-sensitive matrix mechanical property connect
Nearly 60%), and brazing cost can be effectively reduced, diamond brazing is enable to be widely applied in more areas.
Detailed description of the invention
Fig. 1 is the three-dimensional appearance figure of 550 DEG C of brazing filler metal alloy soldering diamonds of embodiment 1.
Fig. 2 is the scanning electron microscope (SEM) photograph of the combination interface of 550 DEG C of brazing filler metal alloy soldering diamonds of embodiment 1.
Specific embodiment
Embodiment 1
920 grams of Sn, 50 grams of Cu, 30 grams of Ti are weighed respectively, are smelted into liquefied mixture together in smelting furnace, then
Powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by brazing alloy of the invention, wherein Sn,
The weight percent content of Cu, Ti are respectively 92%, 5%, 3%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 550 DEG C of welding diamond particles, such as Fig. 1 in)
Described in~2, brazing filler metal alloy and diamond particles form good connection.
Embodiment 2
987.4 grams of Sn, 7.1 grams of Cu, 2.5 grams of Ti, 3 grams of Ag are weighed respectively, are smelted into liquid together in smelting furnace
Mixture, then powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by soldering of the invention
Alloy, wherein the weight percent content of Sn, Cu, Ti, Ag are respectively 98.74%, 0.71%, 0.25%, 0.3%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 550 DEG C of welding diamond particles, solder in)
Alloy and diamond particles form good connection.
Embodiment 3
893.5 grams of Sn, 100 grams of Cu, 5 grams of Ti, 1.5 grams of Ga are weighed respectively, are smelted into liquid together in smelting furnace
Mixture, then powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by soldering of the invention
Alloy, wherein the weight percent content of Sn, Cu, Ti, Ga are respectively 89.35%, 10%, 0.5%, 0.15%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 650 DEG C of welding diamond particles, solder in)
Alloy and diamond particles form good connection.
Embodiment 4
763.5 grams of Sn, 200 grams of Cu, 35 grams of Ti, 1.5 grams of Ce are weighed respectively, are smelted into liquid together in smelting furnace
Mixture, then powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by soldering of the invention
Alloy, wherein the weight percent content of Sn, Cu, Ti, Ce are respectively 76.35%, 20%, 3.5%, 0.15%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 650 DEG C of welding diamond particles, solder in)
Alloy and diamond particles form good connection.
Embodiment 5
928.4 grams of Sn, 7.1 grams of Cu, 60 grams of Ti, 3 grams of Ag, 1.5 grams of Ga are weighed respectively, are melted together in smelting furnace
It is smelt liquefied mixture, then powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by this hair
Bright brazing alloy, wherein the weight percent content of Sn, Cu, Ti, Ag, Ga be respectively 92.84%, 0.71%, 6%,
0.3%, 0.15%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 600 DEG C of welding diamond particles, solder in)
Alloy and diamond particles form good connection.
Embodiment 6
928.4 grams of Sn, 7.1 grams of Cu, 60 grams of Ti, 3 grams of Ag, 1.5 grams of Ce are weighed respectively, are melted together in smelting furnace
It is smelt liquefied mixture, then powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by this hair
Bright brazing alloy, wherein the weight percent content of Sn, Cu, Ti, Ag, Ce be respectively 92.84%, 0.71%, 6%,
0.3%, 0.15%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 600 DEG C of welding diamond particles, solder in)
Alloy and diamond particles form good connection.
Embodiment 7
667 grams of Sn, 300 grams of Cu, 30 grams of Ti, 1.5 grams of Ga, 1.5 grams of Ce are weighed respectively, are melted together in smelting furnace
It is smelt liquefied mixture, then powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by this hair
Bright brazing alloy, wherein the weight percent content of Sn, Cu, Ti, Ag, Ce be respectively 66.7%, 30%, 0.25%, 3%,
0.15%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 650 DEG C of welding diamond particles, solder in)
Alloy and diamond particles form good connection.
Embodiment 8
567 grams of Sn, 400 grams of Cu, 30 grams of Ti, 1.5 grams of Ga, 1.5 grams of Ce are weighed respectively, are melted together in smelting furnace
It is smelt liquefied mixture, then powdered alloy mixture is made in misting cooling under inert ambient environment, can be prepared by this hair
Bright brazing alloy, wherein the weight percent content of Sn, Cu, Ti, Ag, Ce be respectively 56.7%, 40%, 0.25%, 3%,
0.15%.
With the brazing filler metal alloy obtained in vacuum tube furnace (5.0 × 10-4Pa 700 DEG C of welding diamond particles, solder in)
Alloy and diamond particles form good connection.
The above is only the preferred embodiment of the present invention, the range implemented of the present invention that therefore, it cannot be limited according to, i.e., according to
Equivalent changes and modifications made by the invention patent range and description, should still be within the scope of the present invention.
Claims (8)
1. being used for the Sn-Cu-Ti solder of low temperature brazing diamond, which is characterized in that be made of by weight following element:
0.71~50 part of Cu, 0.25~6 part of Ti, 0~20 part of Ag, 0~0.5 part of Ga, 0~0.5 part of Ce, surplus is Sn and can not
The impurity avoided.
2. the Sn-Cu-Ti solder according to claim 1 for low temperature brazing diamond, which is characterized in that by weight
Amount part is made of following element: 0.71~50 part of Cu, 0.5~3.5 part of Ti, and 0~20 part of Ag, 0~0.5 part of Ga, Ce 0~
0.5 part, surplus is Sn and inevitable impurity.
3. the Sn-Cu-Ti solder according to claim 1 for low temperature brazing diamond, which is characterized in that by weight
Amount part is made of following element: 0.71~20 part of Cu, 0.5~6 part of Ti, and 0~20 part of Ag, 0~0.5 part of Ga, Ce 0~0.5
Part, surplus is Sn and inevitable impurity.
4. the Sn-Cu-Ti solder according to claim 1 for low temperature brazing diamond, it is characterised in that: described
Solder is smelted into liquefied mixture by each component metal together in smelting furnace, then spraying cold under inert ambient environment
But at being prepared.
5. the Sn-Cu-Ti solder according to claim 1 for low temperature brazing diamond, it is characterised in that: described
Solder be it is powdered, having a size of 10~50 microns.
6. the Sn-Cu-Ti solder according to claim 1 for low temperature brazing diamond, it is characterised in that: described
The fusing point of solder is at 227~650 DEG C.
7. the Sn-Cu-Ti solder as described in any one of claims 1 to 6 for low temperature brazing diamond is in low temperature pricker
Weld the application in diamond, it is characterised in that: the low temperature is 550~750 DEG C.
8. application according to claim 7, it is characterised in that: by the brazing filler metal alloy in vacuum tube furnace, 10-4~
10-3Diamond particles are welded under the conditions of the vacuum degree of Pa, 550~650 DEG C of temperature.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910590660.2A CN110303269A (en) | 2019-07-02 | 2019-07-02 | For the Sn-Cu-Ti solder of low temperature brazing diamond and application |
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|---|---|---|---|
| CN201910590660.2A CN110303269A (en) | 2019-07-02 | 2019-07-02 | For the Sn-Cu-Ti solder of low temperature brazing diamond and application |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222676A (en) * | 2020-08-24 | 2021-01-15 | 西安交通大学 | Micro-nano powder modified active brazing filler metal and preparation method thereof |
| CN112548396A (en) * | 2020-12-02 | 2021-03-26 | 安徽工业大学 | Cu-based alloy brazing filler metal containing Ga, preparation method of brazing filler metal and brazing method |
| CN115213507A (en) * | 2022-06-29 | 2022-10-21 | 潜江市江汉钻具有限公司 | Vacuum brazing method for cobalt-based diamond composite spherical teeth |
| CN116038178A (en) * | 2023-02-27 | 2023-05-02 | 中国机械总院集团宁波智能机床研究院有限公司 | Brazing filler metal for superhard cutter and preparation method and application thereof |
| CN117086505A (en) * | 2023-09-11 | 2023-11-21 | 浙江亚通新材料股份有限公司 | Diamond brazing filler metal and preparation method and application thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222676A (en) * | 2020-08-24 | 2021-01-15 | 西安交通大学 | Micro-nano powder modified active brazing filler metal and preparation method thereof |
| CN112222676B (en) * | 2020-08-24 | 2022-02-22 | 西安交通大学 | Micro-nano powder modified active brazing filler metal and preparation method thereof |
| CN112548396A (en) * | 2020-12-02 | 2021-03-26 | 安徽工业大学 | Cu-based alloy brazing filler metal containing Ga, preparation method of brazing filler metal and brazing method |
| CN115213507A (en) * | 2022-06-29 | 2022-10-21 | 潜江市江汉钻具有限公司 | Vacuum brazing method for cobalt-based diamond composite spherical teeth |
| CN115213507B (en) * | 2022-06-29 | 2024-04-16 | 潜江市江汉钻具有限公司 | Vacuum brazing method for cobalt-based diamond composite buttons |
| CN116038178A (en) * | 2023-02-27 | 2023-05-02 | 中国机械总院集团宁波智能机床研究院有限公司 | Brazing filler metal for superhard cutter and preparation method and application thereof |
| CN117086505A (en) * | 2023-09-11 | 2023-11-21 | 浙江亚通新材料股份有限公司 | Diamond brazing filler metal and preparation method and application thereof |
| CN117086505B (en) * | 2023-09-11 | 2024-02-13 | 浙江亚通新材料股份有限公司 | Diamond brazing filler metal and preparation method and application thereof |
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