CN107470795B - Active solder and its welding application method for SiC ceramic low temperature brazing - Google Patents
Active solder and its welding application method for SiC ceramic low temperature brazing Download PDFInfo
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- CN107470795B CN107470795B CN201710715363.7A CN201710715363A CN107470795B CN 107470795 B CN107470795 B CN 107470795B CN 201710715363 A CN201710715363 A CN 201710715363A CN 107470795 B CN107470795 B CN 107470795B
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- brazing filler
- filler metal
- temperature brazing
- sic ceramic
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The present invention relates to the active solders and its welding application method for SiC ceramic low temperature brazing, it is wherein sequentially overlapped and is constituted by one layer of part B low-temperature brazing filler metal, one layer of part A low-temperature brazing filler metal, one layer of part B low-temperature brazing filler metal for the active solder of SiC ceramic low temperature brazing, each layer low-temperature brazing filler metal volume is equal.Active solder for SiC ceramic low temperature brazing welds application method: by layer overlay nano-silver thread uniform on the joint face of SiC ceramic when welding, then part A low-temperature brazing filler metal and part B low-temperature brazing filler metal are placed sequentially among two joint faces of SiC ceramic according to the sequence of BAB, apply 0.2 ~ 2MPa simultaneously, it is heated to 50 ~ 90 DEG C, 10min is kept the temperature after brazing filler metal melts, it is cooling, complete the low temperature brazing connection of SiC ceramic.Brazing filler metal fusing point of the invention is low (≤40 DEG C), realizes in 50 ~ 90 DEG C of connections to SiC ceramic, can be effectively reduced the residualinternal stress of soldered fitting.
Description
Technical field
The present invention relates to the low-temperature brazing filler metals for being suitable for SiC ceramic, and in particular to the active pricker for SiC ceramic low temperature brazing
Material and its welding application method.
Background technique
SiC ceramic due to stable chemical performance, thermal coefficient is high, thermal expansion coefficient is small, density is small, wear-resisting property is good, hard
Degree is big, high mechanical strength, it is resistant to chemical etching the features such as, be widely used in the fields such as petroleum, chemical industry, steel, atomic energy.System
The sintering technology of standby SiC ceramic material has also tended to be mature, but the big component yield rate of complexity of SiC ceramic is still very low, therefore
Industrially usually using the method welded the SiC ceramic of small size and form big component.Wherein necessarily involve SiC pottery
The welding of porcelain and SiC ceramic and SiC ceramic and metal material, and it is liquid metal that SiC ceramic, which welds two faced hang-ups,
Solder combines problem and SiC ceramic/metal interface residual stress problems to the wetting of SiC ceramic.
Influencing the essential problem that connect with metal material of SiC ceramic is that can SiC ceramic be soaked by liquid metal, and shape
At metallurgical bonding.From the point of view of current welding method, soldering is to realize that SiC ceramic material connects one of most potential technology,
And it is extensively studied.It generally requires higher temperature condition just and liquid solder wetting combination good to SiC ceramic can be achieved,
And it requires to complete in vacuum or inert protective atmosphere.It can solve the problem there are three types of thinking at present: first is that in solder
Active element, which is added, promotes SiC in conjunction with liquid metal.For SiC ceramic, Ti, Ta, Cr etc. can be used as active element.
Second is that may make brazing filler metal alloy to SiC by the way that certain elements (such as Si, Ni, Cu, Fe, Co, Ag etc.) are added in brazing filler metal alloy
Angle of wetting become smaller, good wetting combination can be generated to SiC.Third is that replacing vacuum environment, welding to press using external energy
Power, high-temperature heating and chemical reagent etc. are brazed.Above-mentioned several method can be very good to realize SiC ceramic and metal material
Wetting combines, but SiC ceramic and the residual stress problems of metal interface still not can solve.
Because the physical and chemical performance of SiC ceramic and metal material, lattice structure, difference of linear expansion are all very big,
It will have a direct impact on SiC ceramic/metal dissimilar welding joint stress state after the completion of welding, and be formed about remnants in joint interface
Stress.Welding temperature more high residual stress is bigger, such as welds at low temperature, residual stress also can accordingly reduce.Now mature
Low temperature business solder is based on Sn base solder, such as the nearly eutectic solder of Sn-Bi eutectic solder, Sn-Bi and Sn-In series solder melt
Below 180 DEG C of point, but these Sn base solders are again relatively poor with SiC ceramic wetability, are hardly formed metallurgical bonding.
Summary of the invention
It is this low for SiC ceramic it is an object of the present invention to provide the active solder for SiC ceramic low temperature brazing
The residual stress problems due to caused by high temperature when the active solder of temperature soldering is for solving SiC ceramic connection；Of the invention is another
A purpose is to provide this active solder for SiC ceramic low temperature brazing and welds application method.
The technical solution adopted by the present invention to solve the technical problems is: this activity for SiC ceramic low temperature brazing
Solder is sequentially overlapped and is constituted by one layer of part B low-temperature brazing filler metal, one layer of part A low-temperature brazing filler metal, one layer of part B low-temperature brazing filler metal, each layer
Low-temperature brazing filler metal volume is equal；
Part A low-temperature brazing filler metal preparation method is completed according to the following steps:
One, by mass percentage by 10 ~ 30 μm of granularity of 15% ~ 30% fine silver powder and 30 ~ 80 μm of granularity of 3% ~ 8% pure titanium valve
Mixing, obtains mixed metal powder.
Two, the mixed metal powder that Ceramic Balls abrading-ball and step 1 obtain is fitted into ball grinder, pours argon gas after vacuumizing,
Then ball milling is carried out, Ball-milling Time is 6 ~ for 24 hours, revolving speed is 250 ~ 350r/min, and ratio of grinding media to material is 6 ~ 15:1；
Three, 56% ~ 83% liquid pure metal gallium is heated to 120 ~ 200 DEG C by mass percentage, then obtains step 2
Metal powder be slowly uniformly sprinkled into, and stir make metal powder sufficiently and liquid mixing, heat preservation 10 ~ 20min after, be cooled to room
Temperature, liquid alloy are solidified as solid alloy；
Four, by solid alloy that step 3 obtains by wire cutting method by brazing filler metal alloy block be cut into width be 10 ~ 30mm,
With a thickness of the alloy strip of 2 ~ 3mm, part A low-temperature brazing filler metal is obtained；
Part B low-temperature brazing filler metal preparation method is completed according to the following steps:
(1), by mass percentage by 20 ~ 50 μm of granularity of 10% ~ 30% copper powder and 20 ~ 80 μm of granularity of 0.1% ~ 10% nickel
Powder and 1% ~ 5% nano-silver thread uniformly mix, and obtain metal powder；
(2), the metal powder that Ceramic Balls abrading-ball and step (1) obtain is fitted into ball grinder, pours argon after vacuumizing
Gas then carries out ball milling, and Ball-milling Time is 0.5 ~ 2h, and revolving speed is 50 ~ 300r/min, and ratio of grinding media to material is 5 ~ 10:1；
(3), 45% ~ 78% liquid pure metal indium is heated to 160 ~ 200 DEG C by mass percentage, then by step (2)
Obtained metal powder is slowly uniformly sprinkled into, and stirring makes metal powder sufficiently and liquid mixing, after 5 ~ 15min of heat preservation, is cooled to
Room temperature, liquid alloy are solidified as solid alloy；
(4), by solid alloy that step (3) obtains by wire cutting method by brazing filler metal alloy block be cut into width be 10 ~
30mm, with a thickness of 2 ~ 3mm alloy strip to get part B low-temperature brazing filler metal.
The above-mentioned active solder for SiC ceramic low temperature brazing welds application method:
By layer overlay nano-silver thread uniform on the joint face of SiC ceramic when welding, then part A low-temperature brazing filler metal and B
Part low-temperature brazing filler metal is placed sequentially among two joint faces of SiC ceramic according to the sequence of BAB, while applying 0.2 ~ 2MPa, is added
Heat keeps the temperature 10min, then furnace cooling to 50 ~ 90 DEG C after brazing filler metal melts, completes the low temperature brazing connection of SiC ceramic.
The invention has the following advantages:
One, brazing filler metal fusing point of the invention is low (≤40 DEG C), realizes and makes pottery under low-down temperature (50 ~ 90 DEG C) to SiC
The connection of porcelain, therefore the residualinternal stress of soldered fitting can be effectively reduced；Low-temperature brazing filler metal and SiC ceramic of the invention soaks
Property is good.Welding SiC ceramic is carried out using low-temperature brazing filler metal of the invention, welding temperature can significantly reduce, SiC ceramic and metal material
Between residual stress can significantly reduce.
Two, solder of the invention overcomes SiC ceramic welding point and carries out high-temperature soldering and bring using high-temp solder
Stress problem forms a kind of simple and easy connection type.
Three, SiC ceramic welding point interface generates brittleness gold when the preparation method of solder of the present invention solves high temperature brazing
Interface embrittlement issue caused by compound between category.
Four, process equipment needed for the preparation method of solder of the present invention is simple to operation, easily realization low-temperature brazing filler metal high-volume
Preparation.
Five, part A solder and part B solder of the present invention can generate solid-state gallium-indium alloy after coming into full contact with, and intensity is high, matter
It measures, meets requirement, a kind of solder, which is used alone, then can not achieve this function.
Six, SiC ceramic can be effectively improved in conjunction with the wetting of low-temperature brazing filler metal containing nano-silver thread in part B solder of the present invention
Ability.
Detailed description of the invention
Fig. 1 is the assembling schematic diagram that soldering SiC ceramic is carried out using low-temperature brazing filler metal of the present invention.
In figure: 1, part A low-temperature brazing filler metal 2, part B low-temperature brazing filler metal 3, SiC ceramic 4, nano-silver thread.
Specific embodiment
The present invention will be further described below with reference to the drawings:
This active solder for SiC ceramic low temperature brazing is by one layer of part B low-temperature brazing filler metal, 2, one layers of part A low temperature pricker
1, one layer of part B low-temperature brazing filler metal 2 of material is sequentially overlapped composition, and each layer low-temperature brazing filler metal volume is equal；
Part A low-temperature brazing filler metal preparation method is completed according to the following steps:
One, by mass percentage by 10 ~ 30 μm of granularity of 15% ~ 30% fine silver powder and 30 ~ 80 μm of granularity of 3% ~ 8% pure titanium valve
Mixing, obtains mixed metal powder.
Two, the mixed metal powder that Ceramic Balls abrading-ball and step 1 obtain is fitted into ball grinder, pours argon gas after vacuumizing,
Then ball milling is carried out, Ball-milling Time is 6 ~ for 24 hours, revolving speed is 250 ~ 350r/min, and ratio of grinding media to material is 6 ~ 15:1；
Three, 56% ~ 83% liquid pure metal gallium is heated to 120 ~ 200 DEG C by mass percentage, then obtains step 2
Metal powder be slowly uniformly sprinkled into, and stir make metal powder sufficiently and liquid mixing, heat preservation 10 ~ 20min after, be cooled to room
Temperature, liquid alloy are solidified as solid alloy；
Four, by solid alloy that step 3 obtains by wire cutting method by brazing filler metal alloy block be cut into width be 10 ~ 30mm,
With a thickness of 2 ~ 3mm alloy strip to get part A low-temperature brazing filler metal；
Part B low-temperature brazing filler metal preparation method is completed according to the following steps:
(1), by mass percentage by 20 ~ 50 μm of granularity of 10% ~ 30% copper powder and 20 ~ 80 μm of granularity of 0.1% ~ 10% nickel
Powder and 1% ~ 5% nano-silver thread uniformly mix, and obtain metal powder；
(2), the metal powder that Ceramic Balls abrading-ball and step (1) obtain is fitted into ball grinder, pours argon after vacuumizing
Gas then carries out ball milling, and Ball-milling Time is 0.5 ~ 2h, and revolving speed is 50 ~ 300r/min, and ratio of grinding media to material is 5 ~ 10:1；
(3), 45% ~ 78% liquid pure metal indium is heated to 160 ~ 200 DEG C by mass percentage, then by step (2)
Obtained metal powder is slowly uniformly sprinkled into, and stirring makes metal powder sufficiently and liquid mixing, after 5 ~ 15min of heat preservation, is cooled to
Room temperature, liquid alloy are solidified as solid alloy；
(4), by solid alloy that step (3) obtains by wire cutting method by brazing filler metal alloy block be cut into width be 10 ~
30mm, with a thickness of 2 ~ 3mm alloy strip to get part B low-temperature brazing filler metal.
The above-mentioned active solder for SiC ceramic low temperature brazing welds application method:
By layer overlay nano-silver thread 4 uniform on the joint face of SiC ceramic 3 when welding, then part A low-temperature brazing filler metal 1
It is placed sequentially among 3 two joint faces of SiC ceramic with part B low-temperature brazing filler metal 2 according to the sequence of BAB, while application 0.2 ~
2MPa is heated to 50 ~ 90 DEG C, 10min is kept the temperature after brazing filler metal melts, then furnace cooling, completes the low temperature brazing of SiC ceramic 3
Connection.
Claims (2)
1. a kind of active solder for SiC ceramic low temperature brazing, it is characterised in that: this for SiC ceramic low temperature brazing
Active solder by one layer of part B low-temperature brazing filler metal (2), one layer of part A low-temperature brazing filler metal (1), one layer of part B low-temperature brazing filler metal (2) successively
Superposition is constituted, and each layer low-temperature brazing filler metal volume is equal；
Part A low-temperature brazing filler metal preparation method is completed according to the following steps:
One, by mass percentage that 10 ~ 30 μm of granularity of 15% ~ 30% fine silver powder and 30 ~ 80 μm of granularity of 3% ~ 8% pure titanium valve is mixed
It closes, obtains mixed metal powder；
Two, the mixed metal powder that Ceramic Balls abrading-ball and step 1 obtain is fitted into ball grinder, argon gas is poured after vacuumizing, then
Carry out ball milling, Ball-milling Time be 6 ~ for 24 hours, revolving speed be 250 ~ 350r/min, ratio of grinding media to material be 6 ~ 15:1；
Three, 56% ~ 83% liquid pure metal gallium is heated to 120 ~ 200 DEG C by mass percentage, the gold for then obtaining step 2
Belong to powder to be slowly uniformly sprinkled into, and stirring makes metal powder sufficiently and liquid mixing, after 10 ~ 20min of heat preservation, is cooled to room temperature, liquid
State alloy graining is solid alloy；
Four, brazing filler metal alloy block is cut into width by wire cutting method by the solid alloy that step 3 obtains is 10 ~ 30mm, thickness
For the alloy strip of 2 ~ 3mm, part A low-temperature brazing filler metal is obtained；
Part B low-temperature brazing filler metal preparation method is completed according to the following steps:
(1), by mass percentage by 20 ~ 50 μm of granularity of 10% ~ 30% copper powder and 20 ~ 80 μm of granularity of 0.1% ~ 10% nickel powder with
And 1% ~ 5% nano-silver thread uniformly mixes, and obtains metal powder；
(2), the metal powder that Ceramic Balls abrading-ball and step (1) obtain is fitted into ball grinder, pours argon gas after vacuumizing, connects
Carry out ball milling, Ball-milling Time be 0.5 ~ 2h, revolving speed be 50 ~ 300r/min, ratio of grinding media to material be 5 ~ 10:1；
(3), 45% ~ 78% liquid pure metal indium is heated to 160 ~ 200 DEG C by mass percentage, then obtains step (2)
Metal powder be slowly uniformly sprinkled into, and stir make metal powder sufficiently and liquid mixing, heat preservation 5 ~ 15min after, be cooled to room temperature,
Liquid alloy is solidified as solid alloy；
(4), by solid alloy that step (3) obtains by wire cutting method by brazing filler metal alloy block be cut into width be 10 ~ 30mm,
With a thickness of 2 ~ 3mm alloy strip to get part B low-temperature brazing filler metal.
2. a kind of active solder described in claim 1 for SiC ceramic low temperature brazing welds application method, feature exists
In: by layer overlay nano-silver thread (4) uniform on the joint face of SiC ceramic (3) when welding, then part A low-temperature brazing filler metal (1)
It is placed sequentially among (3) two joint faces of SiC ceramic with part B low-temperature brazing filler metal (2) according to the sequence of BAB, while applying 0.2
~ 2MPa is heated to 50 ~ 90 DEG C, 10min is kept the temperature after brazing filler metal melts, then furnace cooling, completes the low temperature pricker of SiC ceramic (3)
Weldering connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710715363.7A CN107470795B (en) | 2017-08-20 | 2017-08-20 | Active solder and its welding application method for SiC ceramic low temperature brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710715363.7A CN107470795B (en) | 2017-08-20 | 2017-08-20 | Active solder and its welding application method for SiC ceramic low temperature brazing |
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| CN107470795A CN107470795A (en) | 2017-12-15 |
| CN107470795B true CN107470795B (en) | 2019-10-25 |
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| CN108774476A (en) * | 2018-06-29 | 2018-11-09 | 北京梦之墨科技有限公司 | A kind of bonding agent and its application method of metal material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02179387A (en) * | 1988-12-29 | 1990-07-12 | Tokuriki Honten Co Ltd | Low melting point ag solder |
| CN1686662A (en) * | 2005-04-29 | 2005-10-26 | 华南理工大学 | Self soldering solder used for brazing connecting PTC ceramic and aluminium alloy |
| CN101323062A (en) * | 2008-07-16 | 2008-12-17 | 太仓市南仓金属材料有限公司 | Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof |
| CN103722304A (en) * | 2014-01-09 | 2014-04-16 | 北京航空航天大学 | Material used for aluminum alloy interface low-temperature diffusion bonding in field of interface heat transfer enhancement |
| CN104411450A (en) * | 2013-01-18 | 2015-03-11 | 优美科股份公司及两合公司 | Alloys |
| CN105458547A (en) * | 2015-12-28 | 2016-04-06 | 西安交通大学 | Active brazing filler metal suitable for cast aluminum-based composite material reinforced through high-volume-fraction SiC and preparation method of active brazing filler metal |
-
2017
- 2017-08-20 CN CN201710715363.7A patent/CN107470795B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02179387A (en) * | 1988-12-29 | 1990-07-12 | Tokuriki Honten Co Ltd | Low melting point ag solder |
| CN1686662A (en) * | 2005-04-29 | 2005-10-26 | 华南理工大学 | Self soldering solder used for brazing connecting PTC ceramic and aluminium alloy |
| CN101323062A (en) * | 2008-07-16 | 2008-12-17 | 太仓市南仓金属材料有限公司 | Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof |
| CN104411450A (en) * | 2013-01-18 | 2015-03-11 | 优美科股份公司及两合公司 | Alloys |
| CN103722304A (en) * | 2014-01-09 | 2014-04-16 | 北京航空航天大学 | Material used for aluminum alloy interface low-temperature diffusion bonding in field of interface heat transfer enhancement |
| CN105458547A (en) * | 2015-12-28 | 2016-04-06 | 西安交通大学 | Active brazing filler metal suitable for cast aluminum-based composite material reinforced through high-volume-fraction SiC and preparation method of active brazing filler metal |
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