CN109158795A - A kind of low-temperature solder alloy powder and preparation method thereof - Google Patents
A kind of low-temperature solder alloy powder and preparation method thereof Download PDFInfo
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- CN109158795A CN109158795A CN201811189672.6A CN201811189672A CN109158795A CN 109158795 A CN109158795 A CN 109158795A CN 201811189672 A CN201811189672 A CN 201811189672A CN 109158795 A CN109158795 A CN 109158795A
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- alloy powder
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 208
- 239000000956 alloy Substances 0.000 title claims abstract description 208
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 131
- 239000000843 powder Substances 0.000 title claims abstract description 118
- 238000002360 preparation method Methods 0.000 title claims description 50
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 67
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 56
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 29
- 229910052718 tin Inorganic materials 0.000 claims description 148
- 238000010792 warming Methods 0.000 claims description 125
- 238000002844 melting Methods 0.000 claims description 88
- 230000008018 melting Effects 0.000 claims description 88
- 238000013019 agitation Methods 0.000 claims description 86
- 230000006698 induction Effects 0.000 claims description 86
- 229910052802 copper Inorganic materials 0.000 claims description 64
- 229910052709 silver Inorganic materials 0.000 claims description 32
- 229910052782 aluminium Inorganic materials 0.000 claims description 30
- 229910052684 Cerium Inorganic materials 0.000 claims description 28
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 28
- 229910052733 gallium Inorganic materials 0.000 claims description 27
- 229910052738 indium Inorganic materials 0.000 claims description 27
- 229910052726 zirconium Inorganic materials 0.000 claims description 27
- 239000000155 melt Substances 0.000 claims description 26
- 229910052749 magnesium Inorganic materials 0.000 claims description 24
- 238000005266 casting Methods 0.000 claims description 20
- 229910020708 Co—Pd Inorganic materials 0.000 claims description 17
- 229910001096 P alloy Inorganic materials 0.000 claims description 16
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 16
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 16
- 229910009038 Sn—P Inorganic materials 0.000 claims description 16
- 238000005275 alloying Methods 0.000 claims description 16
- 239000011261 inert gas Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 16
- BSPSZRDIBCCYNN-UHFFFAOYSA-N phosphanylidynetin Chemical compound [Sn]#P BSPSZRDIBCCYNN-UHFFFAOYSA-N 0.000 claims description 16
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 6
- 150000002910 rare earth metals Chemical class 0.000 claims description 6
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 229910052712 strontium Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 229910052792 caesium Inorganic materials 0.000 claims description 2
- 229910052730 francium Inorganic materials 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052762 osmium Inorganic materials 0.000 claims description 2
- 229910052705 radium Inorganic materials 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- 229910052701 rubidium Inorganic materials 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910052706 scandium Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 64
- 239000010949 copper Substances 0.000 description 61
- 239000011777 magnesium Substances 0.000 description 28
- 235000013339 cereals Nutrition 0.000 description 25
- 238000005507 spraying Methods 0.000 description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 16
- 238000012360 testing method Methods 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 210000004243 sweat Anatomy 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910017435 S2 In Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910019319 Sn—Cu—Zn Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000009690 centrifugal atomisation Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- DNYWZCXLKNTFFI-UHFFFAOYSA-N uranium Chemical compound [U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U] DNYWZCXLKNTFFI-UHFFFAOYSA-N 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The present invention provides a kind of low-temperature solder alloy powder, which is characterized in that according to percent by weight, include following components: Ag 3-3.5%, P 0.02-1%, RE 0.02-1%, Co 1-1.5%, Pd 2-3%, Bi 40-60%, remaining is Sn.
Description
Technical field
The invention belongs to alloy field, more specifically a kind of low-temperature solder alloy powder and preparation method thereof.
Background technique
With the needs of production and living, tin alloy is made extensively because of its excellent bonding strength and good processing performance
With.Solder is one of main application of tin alloy, and the annual consumption in the whole world is the solder of basic system with tin alloy more than 60000 tons
Alloy.
Tin can with lithium, sodium, potassium, copper, silver, the gold of group i in the periodic table of elements, with the beryllium of the IIth race, magnesium, calcium, strontium, barium,
Zinc, cadmium, mercury, aluminium, gallium, indium, thallium, ytterbium, lanthanum, uranium with the IIIth race, silicon, germanium, lead, titanium, zirconium, hafnium with the IVth race, with group V
Phosphorus, arsenic, antimony, bismuth, vanadium, niobium, selenium, tellurium, chromium with the VIth race, with the manganese of the VIIth race and iron, cobalt, nickel, rhodium, palladium, the platinum of the VIIIth race
Etc. forming binary and multicomponent alloy and intermetallic compound.
For presently commercially available tin alloy powder there is welding temperature height, corrosion resistance is poor, easily big by atmospheric oxidn and brittleness
Problem, therefore, this field urgently develop a kind of low-temperature solder alloy powder that can be solved these problems simultaneously.
Summary of the invention
To solve the above-mentioned problems, the first aspect of the present invention provides a kind of low-temperature solder alloy powder, according to weight hundred
Score meter includes following components: Ag 3-3.5%, P 0.02-1%, RE 0.02-1%, Co 1-1.5%, Pd 2-3%, Bi
40-60%, remaining is Sn.
As a kind of perferred technical scheme, the solder alloy powder also includes other groups according to percent by weight
Point, it is specific as follows:
Mg 0.05-0.15%, Al 0.05-0.15%, Cu 0.8-1.2%, Zr 0.5-0.8% and In 0.3-
0.4%.
As a kind of perferred technical scheme, the average grain diameter of the low-temperature solder alloy powder is 5-70 microns.
As a kind of perferred technical scheme, the RE group is divided into one or more combinations in rare earth metal.
As a kind of perferred technical scheme, the RE group is divided into Dy, Ga, Ce, one or more combinations in Pr.
As a kind of perferred technical scheme, the weight ratio of the Co and Pd is 1:2.
As a kind of perferred technical scheme, the weight ratio of the Mg and Al is 1:1.
To solve the above-mentioned problems, the second aspect of the present invention provides a kind of preparation method of low-temperature solder alloy powder,
It is characterized in that, comprising the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 700-900 DEG C, melts and magnetic agitation is to equal
It is even, it stands, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
It is warming up to 360-400 DEG C, from P is added in hopper into molten bath, magnetic agitation is quiet to uniform after tin phosphorus alloy liquid alloying
It sets, is air-cooled, obtaining Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 500-800 DEG C, melt and magnetic agitation extremely
Uniformly, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: being added Sn, Co and Pd in vacuum frequency induction melting furnace, is warming up to 1400-1500 DEG C, melts simultaneously magnetic agitation
To uniform, stand, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, being proportionally added into purity is
99.99% Sn and other components, is warming up to 500-850 DEG C, melts and magnetic agitation is to uniform, stand, ingot casting, sky of coming out of the stove
It is cold；It is warming up to 170-185 DEG C, water-spraying control to room temperature；It is warming up to 70-85 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
As a kind of perferred technical scheme, the weight ratio of the Sn in the step S1 and Ag is 95:5, the step S2
In Sn and the weight ratio of P be 95:5, the weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, Sn in the step S4,
The weight ratio of Co and Pd is 94:2:4.
As a kind of perferred technical scheme, a kind of low-temperature solder alloy powder, also comprising one of following component
Or multiple combinations:
K、Na、K、Ca、Sc、Ti、V、Mn、Fe、Ni、Ga、Ge、Rb、Sr、Y、Nb、Mo、Tc、Ru、Rh、Co、Sb、Cs、Ba、
Hf、Ta、W、Re、Os、Ir、Pt、Au、Pb、Fr、Ra、Rd、Sg、Bh、Hs、Ds、Rg。
The beneficial effects of the present invention are:
The present inventor during research and development, be found surprisingly that combine Cu and Zn and rare earth metal by amount appropriate and
Using method appropriate, it is not only able to effectively enhance the inoxidizability of solder alloy powder, while intensity and resistance to can be significantly increased
Corrosivity；
The present inventor is added to Pd and Co in tin alloy, significantly improves the big problem of tin alloy brittleness, it may be possible to because
Tin is able to suppress for Pd and Co and is changed into orthorhombic system during heating, while can enhance wetability and impact resistance
Energy；
The present inventor adds Bi and Zn in tin alloy, crystal grain refinement is helped, to enhance the stability of tin alloy.
Specific embodiment
Unless otherwise indicated, from context cues or belong to the convention of the prior art, otherwise number all in the application
It is all based on weight with percentage, and test and characterizing method used is all synchronous with the submission date of the application.If existing
There is defining for the concrete term disclosed in technology inconsistent with any definition provided herein, then with provided herein
Subject to term definition.
It is further clear, complete that the technical characteristic work in technical solution is provided to the present invention With reference to embodiment
Description, not to the limitation of its protection scope.
Word " preferred ", " preferably ", " preferred " in the present invention etc. refer to, can provide certain in some cases
The embodiment of the present invention of a little beneficial effects.However, other embodiments may also under identical circumstances or in the case of other
It is preferred.In addition, not implying that other embodiments are unavailable to the statement of one or more preferred embodiments, it is not yet
It is intended to exclude other embodiments except the scope of the present invention.In the present invention, used metal is pure metal.
To solve the above-mentioned problems, the first aspect of the present invention provides a kind of low-temperature solder alloy powder.
In some embodiments, the low-temperature solder alloy powder includes following components according to percent by weight:
Ag 3-3.5%, P 0.02-1%, RE 0.02-1%, Co 1-1.5%, Pd 2-3%, Bi 40-60%, remaining is Sn；
Ag represents silver metal, and P represents white phosphorus powder, and RE represents the combination of a kind of rare earth metal or several rare earth metals, Co generation
Table metal Co, is analogized backward with this.
In a preferred embodiment, the low-temperature solder alloy powder, according to percent by weight, comprising with the following group
Point: Ag 3.1-3.4%, P 0.12-0.8%, RE 0.45-0.55%, Co 1.1-1.4%, Pd 2.2-2.8%, Bi 45-
55%, remaining is Sn；
In further preferred embodiment, the low-temperature solder alloy powder, according to percent by weight, comprising with
Lower component: Ag 3.2-3.3%, P 0.32-0.6%, RE 0.48-0.52%, Co 1.2-1.3%, Pd 2.4-2.6%, Bi
48-52%, remaining is Sn；
In embodiment still more preferably, the low-temperature solder alloy powder includes according to percent by weight
Following components: Ag 3.25%, P 0.45%, RE 50%, Co 1.25%, Pd 2.5%, Bi 50%, remaining is Sn；
In some embodiments, the low-temperature solder alloy powder also includes in parts by weight other components, tool
Body is as follows:
Mg 0.05-0.15%, Al 0.05-0.15%, Cu 0.8-1.2%, Zr 0.5-0.8% and In 0.3-
0.4%.
In a preferred embodiment, the low-temperature solder alloy powder also includes in parts by weight other components,
It is specific as follows:
Mg 0.07-0.13%, Al 0.07-0.13%, Cu 0.9-1.1%, Zr 0.6-35% and In 0.32-
0.38%.
In further preferred embodiment, the low-temperature solder alloy powder also includes in parts by weight other
Component, specific as follows:
Mg 0.09-0.11%, Al 0.09-0.11%, Cu 0.9-1.0%, Zr 0.63-0.67% and In 0.34-
0.36%.
In embodiment still more preferably, the low-temperature solder alloy powder also includes in parts by weight it
His component, specific as follows:
Mg 0.1%, Al 0.1%, Cu 0.95%, Zr 0.65% and In 0.35%.
In some embodiments, the average grain diameter of the low-temperature solder alloy powder is 5-70 microns；Preferably implementing
In mode, the average grain diameter of the low-temperature solder alloy powder is 20-45 microns；It is described in further preferred embodiment
The average grain diameter of low-temperature solder alloy powder is 35 microns.
After alloy melting, ultrasonic atomizatio e.g. is used using this field conventional means for the control of partial size in the application
Or high-speed centrifugal atomization device is atomized, and is sieved according to required particle diameter distribution, it is required suitable to obtain
The solder alloy powder of size.
In some embodiments, the RE group is divided into one or more combinations in rare earth metal；In preferred embodiment party
In formula, the RE group is divided into Dy, Ga, Ce, one or more combinations in Pr；In further preferred embodiment, the RE
Group is divided into Ga, one or more combinations in Ce, Pr；In embodiment still more preferably, the RE group is divided into Ga and Ce
It is combined by 1:1.
In some preferred embodiments, the weight ratio of the Co and Pd is 1:2.
In some preferred embodiments, the weight ratio of the Mg and Al is 1:1.
To solve the above-mentioned problems, the second aspect of the present invention provides a kind of preparation method of low-temperature solder alloy powder.
In some embodiments, the preparation method of the low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 700-900 DEG C, melts and magnetic agitation is to equal
It is even, it stands, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
It is warming up to 360-400 DEG C, from P is added in hopper into molten bath, magnetic agitation is quiet to uniform after tin phosphorus alloy liquid alloying
It sets, is air-cooled, obtaining Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 500-800 DEG C, melt and magnetic agitation extremely
Uniformly, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: being added Sn, Co and Pd in vacuum frequency induction melting furnace, is warming up to 1400-1500 DEG C, melts simultaneously magnetic agitation
To uniform, stand, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, being proportionally added into purity is
99.99% Sn and other components, is warming up to 500-850 DEG C, melts and magnetic agitation is to uniform, stand, ingot casting, sky of coming out of the stove
It is cold；It is warming up to 170-185 DEG C, water-spraying control to room temperature；It is warming up to 70-85 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
In some preferred embodiments, the preparation method of the low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 720-850 DEG C, melts and magnetic agitation is to equal
It is even, it stands, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
It is warming up to 370-390 DEG C, from P is added in hopper into molten bath, magnetic agitation is quiet to uniform after tin phosphorus alloy liquid alloying
It sets, is air-cooled, obtaining Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 550-750 DEG C, melt and magnetic agitation extremely
Uniformly, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: being added Sn, Co and Pd in vacuum frequency induction melting furnace, is warming up to 1410-1450 DEG C, melts simultaneously magnetic agitation
To uniform, stand, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, being proportionally added into purity is
99.99% Sn and other components, is warming up to 530-820 DEG C, melts and magnetic agitation is to uniform, stand, ingot casting, sky of coming out of the stove
It is cold；It is warming up to 175-180 DEG C, water-spraying control to room temperature；It is warming up to 70-85 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
In further preferred embodiment, the preparation method of the low-temperature solder alloy powder is comprised the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment
Embodiment 1
The first aspect of embodiment 1 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising such as the following group
Point: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%,
Cu 0.95%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder alloy
Average grain diameter is 35 microns.
The second aspect of embodiment 1 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 2
The first aspect of embodiment 2 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising such as the following group
Point: Ag 3%, P 0.02%, RE 40%, Co 1%, Pd 2%, Bi 40%, Mg 0.05%, Al 0.05%, Cu
0.8%, Zr 0.5%, In 0.3%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain of solder alloy
Diameter is 35 microns.
The second aspect of embodiment 2 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 3
The first aspect of embodiment 3 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising such as the following group
Point: Ag 3.5%, P 1%, RE 1%, Co 1.5%, Pd 3%, Bi 60%, Mg 0.15%, Al 0.15%, Cu
1.2%, Zr 0.8%, In 0.4%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain of solder alloy
Diameter is 35 microns.
The second aspect of embodiment 3 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 4
The first aspect of embodiment 4 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising such as the following group
Point: Ag 3.1%, P 0.12%, RE 0.22%, Co 1.1%, Pd 2.2%, Bi 48%, Mg 0.07%, Al 0.07%,
Cu 0.9%, Zr 0.6%, In 0.32%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder alloy is put down
Equal partial size is 35 microns.
The second aspect of embodiment 4 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 5
The first aspect of embodiment 5 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising such as the following group
Point: Ag 3.4%, P 0.8%, RE 0.8%, Co 1.4%, Pd 2.8%, Bi 52%, Mg 0.13%, Al 0.13%, Cu
1.1%, Zr 35%, In 0.38%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain of solder alloy
Diameter is 35 microns.
The second aspect of embodiment 5 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 6
The first aspect of embodiment 6 provides a kind of low-temperature solder alloy powder, according to percent by weight, Ag3.25%, P
0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr
0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 1.3
Micron.
The second aspect of embodiment 6 provides a kind of preparation method of low-temperature solder alloy powder, preparation method and embodiment 1
It is identical.
Embodiment 7
The first aspect of embodiment 7 provides a kind of low-temperature solder alloy powder, according to percent by weight, Ag 3.25%,
P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr
0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.
The second aspect of embodiment 7 provides a kind of preparation method of low-temperature solder alloy powder, preparation method and embodiment 1
It is identical.
Embodiment 8
The first aspect of embodiment 8 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising such as the following group
Point: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%,
Cu 0.95%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Dy.The average grain diameter of solder alloy is 35
Micron.
The second aspect of embodiment 8 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 9
The first aspect of embodiment 9 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising such as the following group
Point: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%,
Cu 0.95%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Eu.The average grain diameter of solder alloy is 35
Micron.
Embodiment 10
The second aspect of embodiment 10 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
The first aspect of embodiment 10 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu
0.95%, Zr 0.65%, In 0.35%, remaining is Sn.The average grain diameter of solder alloy is 35 microns.
The second aspect of embodiment 10 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn and Cu being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, is air-cooled, obtaining Sn-Cu-Zn intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn and Cu is 90:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 11
The first aspect of embodiment 11 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al
0.2%, Cu 0.95%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder
The average grain diameter of alloy is 35 microns.
The second aspect of embodiment 11 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 12
The first aspect of embodiment 12 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Cu 0.95%, Zr
0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35
Micron.
The second aspect of embodiment 12 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 13
The first aspect of embodiment 13 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al
0.1%, Cu 4.7%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder
The average grain diameter of alloy is 35 microns.
The second aspect of embodiment 13 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 14
The first aspect of embodiment 14 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al
0.1%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder alloy is averaged
Partial size is 35 microns.
The second aspect of embodiment 14 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, is air-cooled, obtaining SnRE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn and RE is 90:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 15
The first aspect of embodiment 15 provides a kind of low-temperature solder alloy powder, according to percent by weight, in addition to Ag,
Other components are same as Example 1.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35 microns.
The second aspect of embodiment 15 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 98:2, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 16
The first aspect of embodiment 16 provides a kind of low-temperature solder alloy powder, according to percent by weight, in addition to p,
Remaining component is same as Example 1.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35 microns.
The second aspect of embodiment 16 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 98:2,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 17
The first aspect of embodiment 17 provides a kind of low-temperature solder alloy powder, according to percent by weight, removes RE component
Except, remaining component is identical as embodiment 17.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is
35 microns.
The second aspect of embodiment 17 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 18
The first aspect of embodiment 18 provides a kind of low-temperature solder alloy powder, according to percent by weight, removes Co and Pd
Except, remaining component is same as Example 1.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35
Micron.
The second aspect of embodiment 18 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 97:1:1 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 19
The first aspect of embodiment 19 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu
0.95%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder alloy is put down
Equal partial size is 35 microns.
The second aspect of embodiment 19 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S2: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S3: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S4: the intermediate alloy of step S1-S3 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and P in the step S1 are 95:5, and the weight ratio of Sn, Cu and RE are 90 in the step S2:
The weight ratio of Sn, Co and Pd are 94:2:4 in 3:3, the step S3.
Embodiment 20
The first aspect of embodiment 20 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu
0.95%, Zr 0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder alloy is put down
Equal partial size is 35 microns.
The second aspect of embodiment 20 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S3: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S4: the intermediate alloy of step S1-S3 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn, Cu and RE are 90 in the step S2:
The weight ratio of Sn, Co and Pd are 94:2:4 in 3:3, the step S3.
Embodiment 21
The first aspect of embodiment 21 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Zr
0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35
Micron.
The second aspect of embodiment 21 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S4: the intermediate alloy of step S1-S3 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Co and Pd are 94:2:4 in the step S3.
Embodiment 22
The first aspect of embodiment 22 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, RE 0.55%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr
0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35
Micron.
The second aspect of embodiment 22 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: the intermediate alloy of step S1-S3 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3.
Embodiment 23
The first aspect of embodiment 23 provides a kind of low-temperature solder alloy powder, according to percent by weight, component and reality
It is identical to apply example 1.The average grain diameter of solder alloy is 35 microns.
The second aspect of embodiment 23 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
Each metal is added in vacuum frequency induction melting furnace, is warming up to 650 DEG C, melts and magnetic agitation is to uniform, stand,
Ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control to room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy
Powder.
Embodiment 24
The first aspect of embodiment 24 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr
0.65%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35
Micron.
The second aspect of embodiment 24 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S2: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S3: the intermediate alloy of step S1-S2 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S1, and the weight ratio of Sn, Co and Pd are in the step S2
94:2:4。
Embodiment 25
The first aspect of embodiment 25 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Mg 0.1%, Al 0.1%, Cu
0.95%, Zr 0.65%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35
Micron.
The second aspect of embodiment 25 provides a kind of preparation method of low-temperature solder alloy powder, specific preparation method and reality
It is identical to apply example 1.
Embodiment 26
The first aspect of embodiment 26 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al
0.1%, Cu 0.95%, In 0.35%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.Solder alloy is averaged
Partial size is 35 microns.
The second aspect of embodiment 26 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 780 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: being added Sn and P in vacuum frequency induction melting furnace and be filled with inert gas into furnace to form molten bath in crucible,
380 DEG C are warming up to, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 600 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1420 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 is added in vacuum frequency induction melting furnace, is proportionally added into Sn and other groups
Point, be warming up to 650 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control is extremely
Room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
The weight ratio of Sn and Ag in the step S1 are 95:5, and the weight ratio of Sn and P in the step S2 are 95:5,
The weight ratio of Sn, Cu and RE are 90:3:3 in the step S3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
Embodiment 27
The first aspect of embodiment 27 provides a kind of low-temperature solder alloy powder, according to percent by weight, comprising as follows
Component: Ag 3.25%, remaining is Sn.Wherein RE group is divided into Ga and Ce is combined by 1:1.The average grain diameter of solder alloy is 35 micro-
Rice.
The second aspect of embodiment 27 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:
It is proportionally added into each metal in vacuum frequency induction melting furnace, is warming up to 650 DEG C, melts and magnetic agitation is to equal
It is even, stand, ingot casting, come out of the stove it is air-cooled；177 DEG C are warming up to, water-spraying control to room temperature；It is warming up to 78 DEG C again, is air-cooled to room temperature, prepares
Tin alloy powder.
Performance evaluation test
It will mix, be made by weight 100:12 with scaling powder according to the preparation-obtained solder alloy powder of embodiment 1-27
Solder composition, used scaling powder are bought from Suzhou Ze Xi Electronic Science and Technology Co., Ltd..
1) viscosity stability is tested
In viscosity stability test, saved at 25 DEG C of room temperature, the viscosity number of detection in every 5 days, with initial viscosity phase
It when being less than 10Pas than, viscosity number rising value, is denoted as normal, when viscosity rising value reaches 13-1610Pas, is denoted as rotten, glues
When angle value rising value reaches 29-32Pas, it is denoted as and scraps.
Welding quality can show that the test of quality of welding spot can be tested using soldered ball to test by quality of welding spot.
It is divided into 4 grades according to the concentration class of weldering pearl, grade 1 requires absolutely not tin sweat(ing), only one big tin ball；The requirement of grade 2
Not more than 3 tin sweat(ing)s around big ball, and tin sweat(ing) size less with 75 microns；Playing ball around for grade 3 can have extra 3 tin sweat(ing)s
But does not assemble and do not constitute ring-type, and tin sweat(ing) size is not more than 75 microns；Class 4 in addition to there is the outer also many tin sweat(ing)s of big spherical shape,
And form desultory ring-type.Grade 1 and grade 2 be it is excellent, grade 3 is to pass, and class 4 is to fail.
The test of 1 viscosity stability of table
| Sample ID | 5 days | 15 days | 30 days | Soldered ball test |
| Sample 1 | Normally | Normally | Normally | 1 grade |
| Sample 2 | Normally | Normally | Normally | 2 grades |
| Sample 3 | Normally | Normally | Normally | 2 grades |
| Sample 4 | Normally | Normally | Normally | 1 grade |
| Sample 5 | Normally | Normally | Normally | 1 grade |
2) tin cream state verification
Sample 1,2 and 3 is subjected to tin cream state verification, upper sample is uniformly put on copper sample board, controls three samples
All indexs are all the same, observe tin cream state.
2 tin cream state of table
| 1h | 2h | 3h | 4h | 5h | 6h | 7h | 8h | |
| Sample 1 | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry |
| Sample 2 | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry |
| Sample 3 | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry |
| Sample 4 | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry |
| Sample 5 | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry | It is not dry |
3) wetability is tested
The wetability of solder(ing) paste is tested using scolding tin diffusion method, and the method is based on JISZ31978.3.1.1.
50mm × 50mm × 0.5mm copper sheet 15 is chosen, is cleaned, is made with isopropanol after being ground with sand paper
It is sufficiently dry.It puts it into the drying box that temperature is 160 DEG C and carries out oxidation processes, obtain copper oxide testing piece；
Accurate weighing 0.330 ± 0.003g solder(ing) paste is imprinted in the copper sheet prepared with 0.2mm Stainless Molding Board at circle
Centre, each sample take 5 testing pieces, testing piece are placed on 265 ± 2 DEG C of scolding tin rooved face and keep 30s, and level takes out examination
Piece is cooled to room temperature, washes flux residue with isopropanol；
With the height after amesdial measurement lead-free solder melting diffusion, the rate of spread is calculated by formula 3:
SR: diffusivity, unit are percentage (%)；
H: the height of solder after extension, unit are millimeter (mm), H=H1-H0, H1: scolding tin height+copper sheet height, H0: copper
Piece height；
Test: being considered as with solder diameter when ball by D, and unit is millimeter (mm), D=1.24V1/3；
V: the test volume of disk solder, unit are cubic millimeter (mm3)
The arithmetic mean of instantaneous value of one group of (5) testing piece rate of spread is the rate of spread of the solder, and the results are shown in Table 2:
The test of 3 solder(ing) paste scalability of table
4) impact flexibility, tensile strength and elongation at break test
4 impact flexibility of table, tensile strength and elongation at break test
It may be noted that the foregoing is merely the preferable specific embodiments of the present invention, but protection scope of the present invention is not
Be confined to this, anyone skilled in the art in the technical scope disclosed by the present invention, the variation that can readily occur in or
Replacement, should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with the protection of claim
Subject to range.
Claims (10)
1. a kind of low-temperature solder alloy powder, which is characterized in that it include following components: Ag 3-3.5% according to percent by weight,
P 0.02-1%, RE 0.02-1%, Co 1-1.5%, Pd 2-3%, Bi 40-60%, remaining is Sn.
2. solder alloy powder described in claim 1, which is characterized in that also include other components, tool according to percent by weight
Body is as follows:
Mg 0.05-0.15%, Al 0.05-0.15%, Cu 0.8-1.2%, Zr 0.5-0.8% and In 0.3-0.4%.
3. solder alloy powder described in claim 1, which is characterized in that the average grain diameter of the low-temperature solder alloy powder is 5-70
Micron.
4. solder alloy powder described in claim 1, which is characterized in that the RE group is divided into rare earth metal one or more groups
It closes.
5. solder alloy powder as claimed in claim 4, which is characterized in that the RE group is divided into Dy, Ga, Ce, one kind or more in Pr
Kind combination.
6. solder alloy powder as claimed in claim 2, which is characterized in that the weight ratio of the Mg and Al is 1:1.
7. a kind of preparation method of solder alloy powder described in any one of claims 1-6, which is characterized in that include following step
It is rapid:
S1: Sn and Ag being added in vacuum frequency induction melting furnace, is warming up to 700-900 DEG C, melts and magnetic agitation is to uniform, quiet
It sets, it is air-cooled, obtain Sn-Ag intermediate alloy；
S2: Sn and P is added in vacuum frequency induction melting furnace and is filled with inert gas into furnace to form molten bath in crucible, heats up
To 360-400 DEG C, from P is added in hopper into molten bath, magnetic agitation is stood, is empty to uniform after tin phosphorus alloy liquid alloying
It is cold, obtain Sn-P intermediate alloy；
S3: Sn, Cu and RE being added in vacuum frequency induction melting furnace, is warming up to 500-800 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Cu-RE intermediate alloy；
S4: Sn, Co and Pd being added in vacuum frequency induction melting furnace, is warming up to 1400-1500 DEG C, melt and magnetic agitation is to equal
It is even, it stands, is air-cooled, obtaining Sn-Co-Pd intermediate alloy；
S5: the intermediate alloy of step S1-S4 being added in vacuum frequency induction melting furnace, is proportionally added into Sn and other components,
Be warming up to 500-850 DEG C, melt and magnetic agitation is to uniform, stand, ingot casting, come out of the stove it is air-cooled；It is warming up to 170-185 DEG C, water spray
It is cooled to room temperature；It is warming up to 70-85 DEG C again, is air-cooled to room temperature, prepares tin alloy powder.
8. the preparation method of solder alloy powder as claimed in claim 7, which is characterized in that the weight of Sn and Ag in the step S1
For amount than being 95:5, the weight ratio of Sn and P in the step S2 are 95:5.
9. the preparation method of solder alloy powder as claimed in claim 7, which is characterized in that Sn, Cu and RE in the step S3
Weight ratio is 90:3:3, and the weight ratio of Sn, Co and Pd are 94:2:4 in the step S4.
10. solder alloy powder described in claim 1, which is characterized in that also comprising one of following component or multiple combinations:
Na、K、Ca、Sc、Ti、V、Mn、Fe、Ni、Ga、Ge、Rb、Sr、Y、Nb、Mo、Tc、Ru、Rh、Co、Sb、Cs、Ba、Hf、Ta、
W、Re、Os、Ir、Pt、Au、Pb、Fr、Ra、Rd、Sg、Bh、Hs、Ds、Rg。
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| CN115430949B (en) * | 2022-10-09 | 2024-04-05 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered eutectic high-toughness low-Wen Xibi-series solder and preparation method thereof |
| CN116100187A (en) * | 2022-12-16 | 2023-05-12 | 无锡市斯威克科技有限公司 | Low-melting-point ternary alloy solder, ultralow-temperature solder strip, and preparation methods and applications thereof |
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Denomination of invention: A low-temperature solder alloy powder and its preparation method Granted publication date: 20210806 Pledgee: Bank of China Limited Suzhou Xiangcheng sub branch Pledgor: EUNOW ELECTRONIC TECHNOLOGY Co.,Ltd. (SUZHOU) Registration number: Y2024980029145 |
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