CN110281662A - A kind of circuit board double printing process and system - Google Patents
A kind of circuit board double printing process and system Download PDFInfo
- Publication number
- CN110281662A CN110281662A CN201910586094.8A CN201910586094A CN110281662A CN 110281662 A CN110281662 A CN 110281662A CN 201910586094 A CN201910586094 A CN 201910586094A CN 110281662 A CN110281662 A CN 110281662A
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- Prior art keywords
- wiring board
- printing
- face
- conveying
- layer
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/60—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing on both faces of the printing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of circuit board double printing process and systems, and wherein method includes: that conveying circuit plate to the first printing mechanism carries out the printing processing of the first face；After printing completes the process in first face, the wiring board is conveyed to turnover mechanism；The wiring board is overturn by the turnover mechanism, keeps the second of the wiring board face-up；It conveys the wiring board to the second printing mechanism and carries out the printing processing of the second face；After printing completes the process in second face, the wiring board is exported.By continuous-flow type conveying circuit plate, sequentially progressive processing can effectively improve the efficiency of circuit board double printing.
Description
Technical field
The present invention relates to printing technique field more particularly to a kind of circuit board double printing processes.
Background technique
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic component, be the supporter of electronic component, be electronic component electrical connection carrier.Since it is using electronic seal
The production of brush art, therefore referred to as " print " wiring board.
With development in Hi-Tech, people need high, small in size, more than function the electronic product of performance, promote printed wiring board
Manufacture also to light, thin, short, small development, in a limited space in realize it is more multi-functional, wiring density becomes larger, aperture is smaller.Line
Therefore road plate also develops to printed on both sides from being printed on one side.
To circuit board double printing, there are mainly two types of modes at present: silk-screen is with spray printing.But traditional silk-screen the disadvantage is that: system
It is long to make the silk screen period, and debugging is difficult, worker operation is required it is high, it is seriously polluted, and need two-sided respective production silk screen, cost
It is high.
Traditional spray printing the disadvantage is that: the degree of automation is not high, and wiring board is directly placed spray printing platform by manipulator and carries out the
The mobile overturning of wiring board is changed position again later, is placed on spray printing platform followed by and is printed by one face spray printing, such effect
Rate is not only low, but also manipulator mounting cost is expensive, failure rate is also high, and efficiency is lower if using manual handling turnover panel.
Summary of the invention
The embodiment of the invention provides a kind of circuit board double printing processes, relative to traditional printed on both sides, production
Period is short and high degree of automation, the printing that can be automatically performed the first face and the second face of wiring board are processed, high production efficiency.
In view of this, first aspect of the embodiment of the present invention provides a kind of circuit board double printing process, comprising:
Conveying circuit plate to the first printing mechanism carries out the printing processing of the first face；
After printing completes the process in first face, the wiring board is conveyed to turnover mechanism；
The wiring board is overturn by the turnover mechanism, keeps the second of the wiring board face-up；
It conveys the wiring board to the second printing mechanism and carries out the printing processing of the second face；
After printing completes the process in second face, the wiring board is exported.
Further, the turnover mechanism includes layer rolling layer, and the conveying wiring board to turnover mechanism includes:
The wiring board is conveyed into the crack of the layer rolling layer.
Further, described to include: by the turnover mechanism overturning wiring board
The wiring board is clamping in the crack of the layer rolling layer；
The layer rolling layer is rotated, it is face-up with overturn the wiring board second；
The wiring board is unclamped, and the layer rolling layer rotation is driven to transmit the wiring board.
Further, described to include: in the crack of the layer rolling layer by the wiring board is clamping
It is by the clamping device that layer rolling layer two sides are arranged in that the wiring board is clamping in the layer rolling
In the crack of layer.
Further, the conveying circuit plate is processed to the first printing mechanism progress the first face printing includes:
The wiring board is conveyed to first printing mechanism by the first conveying mechanism；
Wherein, before first conveying mechanism conveys the wiring board to first printing mechanism, the method is also
Include:
First conveying mechanism carries out the first clappers to the wiring board and adjusts.
Further, the first conveying mechanism conveying wiring board to first printing mechanism includes:
The wiring board is risen or is dropped to the first plane by first conveying mechanism；
The wiring board is delivered to first printing mechanism by first plane by first conveying mechanism.
Further, the conveying wiring board is processed to the second printing mechanism progress the second face printing includes:
The wiring board is conveyed to second printing mechanism by second conveyor structure；
Wherein, before the second conveyor structure conveys the wiring board to second printing mechanism, the method is also
Include:
The second conveyor structure carries out the second clappers to the wiring board and adjusts.
Further, the second conveyor structure conveying wiring board to second printing mechanism includes:
The wiring board is risen or is dropped to the second plane by the second conveyor structure；
The wiring board is delivered to second printing mechanism by second plane by the second conveyor structure.
Second aspect of the embodiment of the present invention provides a kind of circuit board double print system, comprising:
First conveying mechanism, for conveying circuit plate to the first printing mechanism；
First printing mechanism, for carrying out the printing processing of the first face to the wiring board；
Turnover mechanism keeps the second of the wiring board face-up for overturning the wiring board；
Second conveyor structure, for conveying the wiring board to the second printing mechanism；
Second printing mechanism, for carrying out the printing processing of the second face to the wiring board.
Further, the turnover mechanism includes:
Layer rolling layer, second for overturning the wiring board are face-up；
Clamping device, for the wiring board is clamping in the crack of the layer rolling layer.
Further, first conveying mechanism includes:
First count panel assembly is adjusted for carrying out the first clappers to the wiring board.
Further, the second conveyor structure includes:
Second count panel assembly is adjusted for carrying out the second clappers to the wiring board.
Further, first conveying mechanism further include:
First lifting device, for rising or dropping to the first plane for the wiring board, so that first conveyer
The wiring board is delivered to first printing mechanism by first plane by structure.
Further, the second conveyor structure further include:
Second lifting device, for rising or dropping to the second plane for the wiring board, so that the second conveyor
The wiring board is delivered to second printing mechanism by second plane by structure.
As can be seen from the above technical solutions, the embodiment of the present invention has the advantage that
The printing processing of the first face is carried out by conveying circuit plate to the first printing mechanism, printing completes the process it in the first face
Afterwards, conveying circuit plate is to turnover mechanism；Again by turnover mechanism flipflop plate, keep the second of wiring board face-up, pipeline
Road plate to the second printing mechanism carries out the printing processing of the second face；After in the second face, printing is completed the process, output circuit board.Thus
It is found that by continuous-flow type conveying circuit plate, sequentially progressive processing in the embodiment of the present invention, therefore it is double to effectively improve wiring board
The efficiency of face printing.
Detailed description of the invention
Fig. 1 is one embodiment schematic diagram of circuit board double printing process in the embodiment of the present invention；
Fig. 2 is one embodiment schematic diagram of step S130 in the embodiment of the present invention；
Fig. 3 is one embodiment schematic diagram of step S132 in the embodiment of the present invention；
Fig. 4 is one embodiment schematic diagram of step S110 in the embodiment of the present invention；
Fig. 5 is another embodiment schematic diagram of step S110 in the embodiment of the present invention；
Fig. 6 is the step embodiment schematic diagram that the first printing mechanism carries out the printing processing of the first face in the embodiment of the present invention；
Fig. 7 is one embodiment schematic diagram of step S140 in the embodiment of the present invention；
Fig. 8 is another embodiment schematic diagram of step S140 in the embodiment of the present invention；
Fig. 9 is the step embodiment schematic diagram that the second printing mechanism carries out the printing processing of the second face in the embodiment of the present invention；
Figure 10 is one embodiment schematic diagram of step S120 in the embodiment of the present invention；
Figure 11 is another embodiment schematic diagram of step S120 in the embodiment of the present invention；
Figure 12 is one embodiment schematic diagram of step S150 in the embodiment of the present invention；
Figure 13 is one embodiment schematic diagram of circuit board double printing-flow in the embodiment of the present invention；
Figure 14 is one embodiment schematic diagram of circuit board double print system in the embodiment of the present invention；
Figure 15 is another embodiment schematic diagram of circuit board double print system in the embodiment of the present invention.
Specific embodiment
For a clearer understanding of the technical characteristics, objects and effects of the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical solution in the embodiment of the present invention is described in greater detail.Obviously, real as described below
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field skill
Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
In addition, term " first ", " second " are to be used to distinguish similar objects, without for describe specific sequence or
Precedence.
In the prior art, it is the two-sided spray printing printing for realizing wiring board, at least needs to use three manipulators: manipulator 1,
Manipulator 2 and manipulator 3.Wherein, manipulator 1 grabs on wiring board to the spray printing platform of the first jet printer；The crawl of manipulator 2 the
At the wiring board to panel turnover device that one jet printer spray printing is completed, wiring board is overturn into 180 degree by panel turnover device, then by manipulator 2
Crawl wiring board is sent to the spray printing platform of the second jet printer；The wiring board that manipulator 3 completes the second jet printer spray printing grabs
It send to windrow, completes the two-sided spray printing work of wiring board.But since the every subjob completion of manipulator needs to return initial bit
The work that could start next period is set, production efficiency is lower, and required cost is expensive, failure rate is again high.
For this purpose, being arranged in the embodiment of the present invention using the "-" type of continuous-flow type, first wiring board to be processed first is faced
On be delivered to the first printing mechanism, printed by the first face that the first printing mechanism completes wiring board, conveying circuit after completion
Plate is into turnover mechanism, up by turnover mechanism flipflop plate to second, and conveys the second face-up wiring board extremely
Second printing mechanism prints processing, the final output wiring board by the second face that second printing mechanism completes wiring board.This hair
Machine direction is unified continuous-flow type direction in bright embodiment, and sequentially progressive processing, thus without using manipulator can be effective
Improve the production efficiency of circuit board double printing in ground.
Though description is compared it should be understood that printing in the embodiment of the present invention for circuit board double spray printing in the prior art,
But it should not constitute the restriction to the embodiment of the present invention, and the embodiment of the present invention can be applied in addition to spray printing printing
In other printing processes.
Refering to Figure 1, the embodiment of the invention provides one embodiment of circuit board double printing process, comprising:
S110, conveying circuit plate to the first printing mechanism carry out the printing processing of the first face；
Wiring board first to be processed is delivered to the first printing mechanism up and carries out the printing processing of the first face.
S120, the first face printing complete the process after, conveying circuit plate to turnover mechanism；
The turnover mechanism may include layer rolling layer, the layer rolling layer be upper layer and lower layer structure, and this upper and lower two
The crack of certain altitude can be set between the layer rolling layer of layer.
After the first printing mechanism completes the first face printing processing of wiring board, by the way that wiring board is delivered to the bilayer
The step of conveying circuit plate to turnover mechanism is completed in the crack of rolling layer.
It should be understood that the crack height of the layer rolling layer is greater than the plate body thickness of wiring board, the layer rolling layer
It can be the double-deck idler wheel, be also possible to double-layer rolling shaft, specifically herein without limitation.
S130, pass through turnover mechanism flipflop plate, keep the second of wiring board face-up；
It, can be by the top and bottom of the wiring board after assist side is delivered in the crack of the layer rolling layer of turnover mechanism
It is clamped in the layer rolling layer.
The overturning for driving wiring board by rotating the layer rolling layer, by the second of the wiring board after 180 ° of overturning
Face is overturn to upward.
It should be noted that upward can be for relative to the first printing mechanism or the second printing described in the embodiment of the present invention
Mechanism carries out the direction of printing processing to wiring board.
S140, conveying circuit plate to the second printing mechanism carry out the printing processing of the second face；
Second face-up wiring board is transported to the second printing mechanism and carries out the printing processing of the second face.
S150, the second face printing complete the process after, output circuit board.
Second printing mechanism can export final be completed after completing to the second face printing processing of wiring board
The wiring board of printed on both sides.
In the embodiment of the present invention, by the turnover mechanism being arranged between the first printing mechanism and the second printing mechanism, by
The turnover mechanism receives the wiring board that the printing processing of the first face is completed to come from the conveying of the first printing mechanism, is turned over by 180 °
Turn the wiring board, the second face overturning to be processed of the wiring board upward, then by the wiring board is transported to the second printing mechanism
Complete the printing processing of the second face.By the processing method of continuous-flow type, without manipulator, it is thus possible to effectively improve route
The production efficiency of plate printed on both sides.
Specifically, as shown in Fig. 2, one embodiment of step S130 includes: in the embodiment of the present invention
It is S131, wiring board is clamping in the crack of the layer rolling layer of turnover mechanism；
Assist side is delivered to after the layer rolling layer of turnover mechanism, which can be clamping double by wiring board
In the crack of layer rolling layer, such as: it can be by the way that the gripping means grips of the layer rolling layer two sides wiring board be arranged in.
S132, rotary double-layer rolling layer, up with the second of flipflop plate；
Turnover mechanism can rotate the layer rolling layer, can be to rotate clockwise or rotate counterclockwise, rotate
After 180 ° upward by the second face overturning of the wiring board.
S133, wiring board is unclamped；
After turnover mechanism flipflop plate second is face-up, the wiring board is unclamped.It can be by shrinking the folder
Tight device, to loosen the extruding to wiring board.
S134, driving layer rolling layer rotation, transmission lines plate.
The upper layer and lower layer of layer rolling layer can be rotated by driving chain by driving in turnover mechanism, i.e., the double-deck rolling
The idler wheel or roller bearing that dynamic layer upper layer and lower layer are included can be transmitted chain drive rotation.
In one embodiment, turnover mechanism receive from the first printing mechanism convey come wiring board when, can drive
The lower layer's rotation for moving the layer rolling layer, the traveling of wiring board is kept with this.And assist side marches in layer rolling layer
Between position when, the driving to the layer rolling layer lower layer can be stopped, wiring board is stopped at into the middle position.And in tipper
After structure overturns wiring board, the upper layer of layer rolling layer is located relatively at the lower section of lower layer at this time, that is, is located under the wiring board
Side, the upper layer of the layer rolling layer can be driven, and transmission lines plate is into the second printing mechanism.
And as shown in figure 3, in a preferred embodiment, in one embodiment of above-mentioned steps S130, step
S132 includes:
S1321, the direction for determining turnover mechanism rotary double-layer rolling layer in a upper period；
If to rotate clockwise in S1322, a upper period, the rotary double-layer rolling layer counterclockwise in current period；
If S1323, a upper period are not to rotate clockwise, layer rolling layer was rotated clockwise in current period.
In the embodiment of the present invention, turnover mechanism successively alternating clockwise can rotate and rotate the layer rolling counterclockwise
Layer, if rotating the layer rolling layer counterclockwise in current period within a upper period to rotate clockwise.Conversely, on if
It is rotation counterclockwise in one period, then rotates clockwise the layer rolling layer in current period.
It should be noted that can pass through PLC (Programmable Logic in the embodiment of the present invention
Controller, programmable logic controller (PLC)) step executed in the embodiment of the present invention is controlled, it is including but not limited to above to implement
Step in example.
To reduce the data processing amount of PLC and simplifying the structure of equipment, two limits can be set in turnover mechanism and opened
It closes, is rotated clockwise with this determining the turnover mechanism or rotary double-layer rolling layer counterclockwise, specifically herein without limitation.
Two set limit switches are also possible to prevent turnover mechanism and overturn wiring board more than 180 °.
In the embodiment of the present invention, the first conveying mechanism can be equipped with before the first printing mechanism, to print to first
Mechanism conveying circuit plate.As shown in figure 4, one embodiment of step S110 includes:
S111, the first conveying mechanism receiving circuit plate；
In the process of continuous-flow type of the present invention, the first conveyer can be connected in the feed side of the first printing mechanism
Structure, first conveying mechanism can be used for for wiring board being sent to the first printing mechanism.
First conveying mechanism can receive and transmission lines plate, for example, can receive allocation mechanism constantly transfer to it is to be added
The wiring board of work.
S112, the first clappers adjusting is carried out to wiring board；
Before the first conveying mechanism transmission lines plate to the first printing mechanism, which can be to route
Plate carries out clappers adjusting, i.e., the first clappers are adjusted.It is to clap the wiring board conveyed just that it, which is acted on, guarantees the plate body one of wiring board
Axis is parallel with conveying direction.
Specifically, first conveying mechanism to wiring board carry out clappers adjust can be by be arranged inside first
Clappers device realization, such as: the first count panel assembly may include the lifting lever being arranged in the direction of advance of assist side, with
And the supporting rod of two avris is set；The lifting lever can rise the wiring board for blocking and conveying in first conveying mechanism,
And supporting rod is cooperated to hold together from both sides to centre folder, positive line plate is clapped with this, realizes that clappers are adjusted.
S113, conveying circuit plate to the first printing mechanism.
Wiring board after clapping just can be transported in the first printing mechanism by first conveying mechanism, in order to the first printing
Mechanism processes the printing of wiring board.
In a preferred embodiment, as shown in figure 5, another embodiment of step S110 includes:
S111, the first conveying mechanism receiving circuit plate；
S112, the first clappers adjusting is carried out to wiring board；
S114, wiring board is risen or is dropped to the first plane；
Wiring board can be risen or be dropped to the first plane by first conveying mechanism, which can be with the first printing
The processing plane of mechanism maintains an equal level.Such as: first conveying mechanism can be risen by the first lifting device of inside setting
Or step-down operation, the wiring board carried will be ask to be adjusted to the first plane to maintain an equal level with the processing plane of the first printing mechanism.
It can control the stroke that the first lifting device rises or declines in first conveying mechanism by limit switch.
S113, conveying circuit plate to the first printing mechanism.
In the embodiment of the present invention, it should be noted that step S113 can be with step S111 reversed order, the i.e. present invention in fact
Step S113 can also be first carried out by applying in example executes step S111 again, is specifically not repeated herein.It is conveyed in first conveying mechanism
The device of wiring board can be roller devices, be also possible to roller assembly, is specially the well known prior art, does not do herein superfluous
It states.
Further, as shown in fig. 6, in one embodiment of step S110, the first printing mechanism carries out the first face printing
The step of processing includes:
S115, first printing mechanism's conveying circuit plate to the first printing platform；
It may include having preset first printing platform in first printing mechanism, can be used for carrying out wiring board printing and add
Work.In above-mentioned embodiment illustrated in fig. 5, the first printing platform i.e. processing plane of the first printing mechanism, with the first conveying
First plane of mechanism conveying circuit plate maintains an equal level, it is ensured that the smooth transport of wiring board.
When the wiring board is transmitted to the first printing mechanism, which can continue transmission lines plate to default
The first printing platform.Such as: continue to transmit the wiring board by built-in belt conveyer, and the belt conveyer can
To rise, scratching for wiring board is avoided.
S116, wiring board is compressed；
It can be equipped with T-bar in four orientation of the first printing platform, wherein the T-type of the direction of travel setting of assist side
Bar can rise and block the wiring board, and the T-bar in the other three orientation can be close from three directions respectively and clamps this
Wiring board.
Later, the T-bar in aforementioned four orientation can decline four sides for tensing the wiring board, realize the four sides pressure of wiring board
Tightly, the plate bent plate that can successfully manage wiring board sticks up situation.
S117, the plate for measuring wiring board are high；
First printing mechanism can measure the plate height degree of wiring board, transmitting terminal and reception by laser-measured height device
End is separately positioned on the two sides of the first printing platform, can move simultaneously along the plate body direction of wiring board, measure the wiring board
Whether plate height degree is more than preset height.By filtering out underproof wiring board, the printing of the first printing mechanism can protect
Device is not damaged, such as the ink gun of protection jet printing technique.
The first face of S118, positioning line fault plate；
First printing mechanism can be used for positioning line fault plate by the way that positioning camera is arranged in the top of the first printing platform
Printing zone, in order to which the subsequent pattern to wiring board prints.
Preferably, which can be four CCD (Charge Coupled Device) cameras, with corresponding positioning
Whether the target everywhere on wiring board judges it in reasonable error range.It is understood that if target on the wiring board
To be multiple, then the CCD camera for being correspondingly arranged corresponding number is needed.
It should be noted that above-mentioned CCD camera can be equipped with horizontal mobile device and longitudinal moving device, this first
It moves in plane in parallel above printing platform, to be respectively moved to above the target of wiring board, positions on the wiring board
Target.
The first face of S119, printed wiring board.
After demarcating wiring board, which can be removable above the first printing platform by being arranged in
Printing equipment the printing processing of the first face is carried out to the first face-up wiring board.
For example, carrying out spray printing printing by the ink gun of mobile printing equipment in jet printing technique, and in the same of spray printing
Shi Qidong UV lamp (Ultra-Violet, ultraviolet light), irradiation solidify the ink of institute's spray printing, complete presswork.
In the embodiment of the present invention, if the plate height degree for measuring wiring board in step S117 is more than preset height, first print
Brush mechanism can not execute step S119.And it is possible to feed back unqualified signal to PLC by laser-measured height device, PLC control is indicated
It makes the second printing mechanism and does not execute and processing is printed to the second face of wiring board.Correspondingly, if the wiring board measured in step S117
Plate height degree be less than preset height, then the laser-measured height device can feed back qualifying signal to PLC, indicate PLC control the
Two printing mechanisms, which execute, prints processing to the second face of wiring board.
Please refer to shown in Fig. 7 to Fig. 9, be the printing processing for ensureing the second printing mechanism in the embodiment of the present invention, this
Second conveyor structure is can connect between two printing mechanisms and turnover mechanism, for passing through the second conveyor structure for wiring board
First printing mechanism is delivered to by turnover mechanism.
As shown in fig. 7, one embodiment of step S140 includes:
S141, second conveyor structure receiving circuit plate；
S142, the second clappers adjusting is carried out to wiring board；
S143, conveying circuit plate to the second printing mechanism.
In a preferred embodiment, as shown in figure 8, another embodiment of step S140 includes:
S141, second conveyor structure receiving circuit plate；
S142, the second clappers adjusting is carried out to wiring board；
S144, wiring board is risen or is dropped to the second plane；
S143, conveying circuit plate to the second printing mechanism.
Further, as shown in figure 9, in one embodiment of step S140, the second printing mechanism carries out the second face printing
The step of processing includes:
S145, second printing mechanism's conveying circuit plate to the second printing platform；
S146, wiring board is compressed；
S147, the plate for measuring wiring board are high；
The second face of S148, positioning line fault plate；
The second face of S149, printed wiring board.
In above embodiments, second conveyor structure can be with the first conveying mechanism mechanism with the same function, second
Printing mechanism can be with mechanism with the same function, the first printing mechanism, therefore Fig. 7 and embodiment illustrated in fig. 8 are not done superfluous
It states, embodiment illustrated in fig. 9 is not also repeated them here, referring specifically to earlier figures 4 to embodiment illustrated in fig. 6.
It should be noted that step S143 can also be with the mutual reversed order of step S141 in above-mentioned embodiment illustrated in fig. 8.
The second plane that wiring board is risen or declined by the second conveyor structure is also possible to realize by limit switch and the second printing
The second printing platform being arranged in mechanism maintains an equal level.The second conveyor structure initial plane can connect from the overturning plane of turnover mechanism
Wiring board is received, initial plane can be also realized by limit switch and overturns maintaining an equal level for plane.Overturning plane, that is, the turnover mechanism
Middle layer rolling layer overturning is preceding and overturns plane locating for rear board.
Also, in the embodiment of the present invention, when wiring board is delivered to the first printing mechanism, if the route that step S117 is measured
Plate plate height degree is more than preset height, then the first printing mechanism can not execute step S119, and can be in following process process
In, and when wiring board is transported to the second printing mechanism, which can not execute step S149, can be by
PLC is controlled, which can be separately positioned on the first printing mechanism and the second printing mechanism, is also possible to be integrated at one
PLC, specifically herein without limitation.
It will also be appreciated that for the wiring board with a item number, it can be to be processed at first piece in the embodiment of the present invention
Wiring board when being delivered to the first printing mechanism, first piece of wiring board is demarcated by the first printing mechanism, i.e., above-mentioned Fig. 6
Step S118 can be the first face of calibration wiring board in illustrated embodiment, then the step in the subsequent processing flow into plate
S118 only need to quickly be positioned according to the calibration position of first piece of wiring board.Positioning flow is not only so enormously simplified, also
Improve processing efficiency.
In an alternative embodiment, third output mechanism company can be set between the first printing mechanism and turnover mechanism
It connects, the wiring board that the printing of first the first face of printing mechanism completes the process is delivered to turnover mechanism by the third output mechanism
In.
As shown in Figure 10, one embodiment of step S120 includes:
S121, third conveying mechanism receiving circuit plate；
S122, third clappers adjusting is carried out to wiring board；
S123, conveying circuit plate to turnover mechanism.
Further, as shown in figure 11, another embodiment of step S120 includes:
S121, third conveying mechanism receiving circuit plate；
S122, third clappers adjusting is carried out to wiring board；
S124, by wiring board rise or under near overturning plane；
S123, conveying circuit plate to turnover mechanism.
It should be noted that the third conveying mechanism can be with second conveyor structure mechanism with the same function, because
This does not repeat them here Figure 10 and embodiment illustrated in fig. 11.And the initial plane of the third conveying mechanism can be with the first printing machine
First plane of structure maintains an equal level, from the first printing mechanism receiving circuit plate.
In an alternative embodiment, the connection of the 4th output mechanism can be set after the second printing mechanism, to incite somebody to action
The wiring board that the printing of the second face completes the process in second printing mechanism transfers out.
As shown in figure 12, one embodiment of step S150 includes:
S151, the 4th conveying mechanism receiving circuit plate；
S152, the 4th clappers adjusting is carried out to wiring board；
S153, output circuit board.
It should be noted that the 4th conveying mechanism can be with the first conveying mechanism mechanism with the same function, because
This does not repeat them here embodiment illustrated in fig. 12.And the initial plane of the 4th conveying mechanism can be with the of the second printing mechanism
Two planes maintain an equal level, from the second printing mechanism receiving circuit plate.
The wiring board that 4th conveying mechanism can complete the printed on both sides transported out from the second printing mechanism exports
Into discharging mechanism, which can be temporary storage machine.Also, the 4th conveying mechanism can also rise or fall, with right
Wiring board should be exported into discharging mechanism.
If should be understood that, the discharging mechanism is temporary storage machine, which can be under the control of PLC, in above-mentioned reality
Apply laser-measured height device in the step S117 of example measure wiring board plate height degree be more than preset height feed back unqualified signal it
Afterwards, which can correspond to sort underproof wiring board and store, specifically herein without limitation.
It please combines together refering to fig. 1 to Figure 12, in the embodiment shown in fig. 13, the embodiment of the invention provides wiring boards
One embodiment of printed on both sides process, comprising:
S100, allocation mechanism conveying circuit plate to the first conveying mechanism；
In the embodiment of the present invention, the initial end of continuous-flow type processing flow can be provided with allocation mechanism, in its material toggling slot
In can store multiple wiring boards to be processed in advance, which can be according to preset material toggling speed one by one by route
Plate is delivered to the first conveying mechanism.
And the first face of the as wiring board of one side upward of the wiring board of conveying is transferred to by the allocation mechanism.
S111, the first conveying mechanism receiving circuit plate；
S112, the first clappers adjusting is carried out to wiring board；
S114, wiring board is risen or is dropped to the first plane；
S113, conveying circuit plate to the first printing platform；
S115, first printing mechanism's conveying circuit plate to the first printing platform；
S116, wiring board is compressed；
S117, the plate for measuring wiring board are high；
The first face of S118, positioning line fault plate；
The first face of S119, printed wiring board；
S121, third conveying mechanism receiving circuit plate；
S122, third clappers adjusting is carried out to wiring board；
S124, by wiring board rise or under near overturning plane；
S123, conveying circuit plate to turnover mechanism；
It is S131, wiring board is clamping in the crack of the layer rolling layer of turnover mechanism；
S132, rotary double-layer rolling layer, up with the second of flipflop plate；
S133, wiring board is unclamped；
S134, driving layer rolling layer rotation, transmission lines plate；
S141, second conveyor structure receiving circuit plate；
S142, the second clappers adjusting is carried out to wiring board；
S144, wiring board is risen or is dropped to the second plane；
S143, conveying circuit plate to the second printing mechanism；
S145, second printing mechanism's conveying circuit plate to the second printing platform；
S146, wiring board is compressed；
S147, the plate for measuring wiring board are high；
The second face of S148, positioning line fault plate；
The second face of S149, printed wiring board；
S151, the 4th conveying mechanism receiving circuit plate；
S152, the 4th clappers adjusting is carried out to wiring board；
S153, output circuit board；
S160, discharging mechanism keep in wiring board.
In the embodiment of the present invention, wiring board first to be processed is delivered to the first conveying mechanism up by allocation mechanism,
Conveying circuit plate passes through first printing mechanism to the first printing mechanism after first conveying mechanism adjusts wiring board clappers
Printing processing is carried out to the first face of wiring board, the wiring board for completing the printing processing of the first face is clapped by third conveying mechanism later
Plate is adjusted, and the wiring board is sent in turnover mechanism.The turnover mechanism can be clamping in layer rolling layer by the wiring board
Crack among, by rotating the layer rolling layer, upward by the overturning of the second face of wiring board, then unclamp wiring board, drive
Layer rolling layer rotates transmission lines plate to second conveyor structure.The second conveyor structure has the final say to wiring board adjust again, defeated
Wiring board is sent to carry out the printing processing of the second face into the second printing mechanism, after completing second face printing processing, this second
Wiring board can be sent to the 4th conveying mechanism by printing mechanism, defeated after being adjusted by the 4th conveying mechanism to wiring board clappers
The wiring board is kept in into discharging mechanism out.More than, it is adjusted by the clappers layer by layer to wiring board, it is ensured that wiring board is defeated
Orientation during sending is constant always, completes continuous-flow type processing.And the first conveying mechanism therein, second conveyor structure, third
Conveying mechanism and the 4th conveying mechanism and liftable, may be implemented wiring board in the steady conveying of transmission process.Also, this is turned over
Rotation mechanism includes the clamping device of layer rolling layer and two sides, and structure is simple, can make the embodiment of the present invention without
Manipulator, the layer rolling layer can overturn and rotate, and may make the seamless transit of wiring board during transportation, significantly
Improve production efficiency.
It please refers to shown in Figure 14, the embodiment of the invention also provides one embodiment of circuit board double print system, packets
It includes:
First conveying mechanism 10, for conveying circuit plate to the first printing mechanism 20；
First printing mechanism 20, for carrying out the printing processing of the first face to wiring board；
Turnover mechanism 30 is used for flipflop plate, keeps the second of wiring board face-up；
Second conveyor structure 40, for conveying circuit plate to the second printing mechanism 50；
Second printing mechanism 50, for carrying out the printing processing of the second face to wiring board.
It should be noted that first conveying mechanism 10, the first printing mechanism 20, turnover mechanism 30, second conveyor structure
40 and second printing mechanism 50 can be sequentially connected, with constitute continuous-flow type "-" type arrangement.
Further, in one embodiment, which may include:
Layer rolling layer, second for flipflop plate are face-up；
Clamping device, for wiring board is clamping in the crack of layer rolling layer.
Further, in one embodiment, which may include:
First count panel assembly is adjusted for carrying out the first clappers to wiring board.
Further, in one embodiment, which may include:
Second count panel assembly is adjusted for carrying out the second clappers to wiring board.
Further, in one embodiment, which can also include:
First lifting device, for rising or dropping to the first plane wiring board, so that first conveying mechanism is by line
Road plate is delivered to the first printing mechanism by the first plane.
Further, in one embodiment, which can also include:
Second lifting device, for rising or dropping to the second plane wiring board, so that the second conveyor structure is by line
Road plate is delivered to the second printing mechanism by the second plane.
Optionally, as shown in figure 15, in one embodiment, circuit board double print system can also include: that third is defeated
Mechanism 60 is sent, for wiring board to be sent to turnover mechanism 30 by the first printing mechanism 20.
The third conveying mechanism 60 can connect between the first printing mechanism 20 and turnover mechanism 30, and the third is defeated
Send mechanism 60 can be with the function having the same of second conveyor structure 40, i.e. the third conveying mechanism 60 may include third clappers
Device and third lifting device.
Optionally, as shown in figure 15, in one embodiment, circuit board double print system can also include: the 4th defeated
Mechanism 70 is sent, is exported for transmitting wiring board by the second printing mechanism 50.
4th conveying mechanism 70 can connect after the second printing mechanism 20, and the 4th conveying mechanism 70 can be with
With the function having the same of the first conveying mechanism 10, i.e. the 4th conveying mechanism 70 may include the 4th clappers device and the 4th liter
Falling unit.
It has the final say and adjusts to wiring board by using first conveying mechanism 10 in the embodiment of the present invention, later conveying circuit plate
To the first printing mechanism 20, printing processing is carried out by first face of first printing mechanism 20 to wiring board.Pass through third again
60 pairs of the conveying mechanism wiring boards for completing the printing processing of the first face are had the final say and are adjusted, which is sent in turnover mechanism 30.
The turnover mechanism 30 can be clamping among the crack of layer rolling layer by the wiring board, will by rotating the layer rolling layer
The second face overturning of wiring board upward, then unclamps wiring board, and driving layer rolling layer rotates transmission lines plate to the second conveying
Mechanism 40.The second conveyor structure 40 has the final say to wiring board adjust again, and conveying circuit plate is carried out into the second printing mechanism 50
The printing processing of second face, after completing second face printing processing, which can be sent to wiring board
4th conveying mechanism 70 exports the wiring board after being adjusted by the 4th conveying mechanism 70 to wiring board clappers.More than, by right
The clappers layer by layer of wiring board are adjusted, it is ensured that the orientation of wiring board during transportation is constant always, completes continuous-flow type processing.
And the first conveying mechanism 10 therein, second conveyor structure 40, third conveying mechanism 60 and the 4th conveying mechanism 70 can on
It rises or declines, wiring board may be implemented in the steady conveying of transmission process.Also, the turnover mechanism 30 include layer rolling layer and
The clamping device of two sides, structure is simple, and the embodiment of the present invention can be made without manipulator, which can be with
Overturning and rotation, and may make the seamless transit of wiring board during transportation, substantially increase production efficiency.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (10)
1. a kind of circuit board double printing process characterized by comprising
Conveying circuit plate to the first printing mechanism carries out the printing processing of the first face；
After printing completes the process in first face, the wiring board is conveyed to turnover mechanism；
The wiring board is overturn by the turnover mechanism, keeps the second of the wiring board face-up；
It conveys the wiring board to the second printing mechanism and carries out the printing processing of the second face；
After printing completes the process in second face, the wiring board is exported.
2. double-sided printing process according to claim 1, which is characterized in that the turnover mechanism includes layer rolling layer,
The conveying wiring board to turnover mechanism includes:
The wiring board is conveyed into the crack of the layer rolling layer.
3. double-sided printing process according to claim 2, which is characterized in that described by described in turnover mechanism overturning
Wiring board includes:
The wiring board is clamping in the crack of the layer rolling layer；
The layer rolling layer is rotated, it is face-up with overturn the wiring board second；
The wiring board is unclamped, and the layer rolling layer rotation is driven to transmit the wiring board.
4. double-sided printing process according to claim 3, which is characterized in that described that the wiring board is clamping described double
Include: in the crack of layer rolling layer
It is by the way that the clamping devices of layer rolling layer two sides is arranged in that the wiring board is clamping in the layer rolling layer
In crack.
5. double-sided printing process according to claim 1, which is characterized in that the conveying circuit plate to the first printing mechanism
Carrying out the printing processing of the first face includes:
The wiring board is conveyed to first printing mechanism by the first conveying mechanism；
Wherein, before first conveying mechanism conveys the wiring board to first printing mechanism, the method also includes:
First conveying mechanism carries out the first clappers to the wiring board and adjusts.
6. double-sided printing process according to claim 5, which is characterized in that first conveying mechanism conveys the route
Plate to first printing mechanism includes:
The wiring board is risen or is dropped to the first plane by first conveying mechanism；
The wiring board is delivered to first printing mechanism by first plane by first conveying mechanism.
7. double-sided printing process according to claim 1, which is characterized in that the conveying wiring board to the second printing
Mechanism carries out the printing processing of the second face
The wiring board is conveyed to second printing mechanism by second conveyor structure；
Wherein, before the second conveyor structure conveys the wiring board to second printing mechanism, the method also includes:
The second conveyor structure carries out the second clappers to the wiring board and adjusts.
8. double-sided printing process according to claim 7, which is characterized in that the second conveyor structure conveys the route
Plate to second printing mechanism includes:
The wiring board is risen or is dropped to the second plane by the second conveyor structure；
The wiring board is delivered to second printing mechanism by second plane by the second conveyor structure.
9. a kind of circuit board double print system characterized by comprising
First conveying mechanism, for conveying circuit plate to the first printing mechanism；
First printing mechanism, for carrying out the printing processing of the first face to the wiring board；
Turnover mechanism keeps the second of the wiring board face-up for overturning the wiring board；
Second conveyor structure, for conveying the wiring board to the second printing mechanism；
Second printing mechanism, for carrying out the printing processing of the second face to the wiring board.
10. printed on both sides system according to claim 9, which is characterized in that the turnover mechanism includes:
Layer rolling layer, second for overturning the wiring board are face-up；
Clamping device, for the wiring board is clamping in the crack of the layer rolling layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910586094.8A CN110281662A (en) | 2019-07-01 | 2019-07-01 | A kind of circuit board double printing process and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910586094.8A CN110281662A (en) | 2019-07-01 | 2019-07-01 | A kind of circuit board double printing process and system |
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| CN110281662A true CN110281662A (en) | 2019-09-27 |
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| CN201910586094.8A Pending CN110281662A (en) | 2019-07-01 | 2019-07-01 | A kind of circuit board double printing process and system |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131352A (en) * | 2010-01-13 | 2011-07-20 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing printed circuit board (PCB) |
| CN203740671U (en) * | 2014-03-27 | 2014-07-30 | 宁波同道恒信环保科技有限公司 | Circuit board turnover mechanism for layering of circuit board |
| CN205997482U (en) * | 2016-08-26 | 2017-03-08 | 中山市金玛印刷机械有限公司 | A kind of PCB double-surface screen printing machine |
| CN106564312A (en) * | 2016-10-12 | 2017-04-19 | 江西景旺精密电路有限公司 | Double-faced character printing method for PCB |
| CN206384516U (en) * | 2016-09-14 | 2017-08-08 | 广东一鼎科技有限公司 | The plate turnover mechanism of sheet material pipeline |
| CN109130567A (en) * | 2018-06-20 | 2019-01-04 | 东莞三润田智能科技股份有限公司 | The online two-sided character spray printing method of pcb board |
-
2019
- 2019-07-01 CN CN201910586094.8A patent/CN110281662A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131352A (en) * | 2010-01-13 | 2011-07-20 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing printed circuit board (PCB) |
| CN203740671U (en) * | 2014-03-27 | 2014-07-30 | 宁波同道恒信环保科技有限公司 | Circuit board turnover mechanism for layering of circuit board |
| CN205997482U (en) * | 2016-08-26 | 2017-03-08 | 中山市金玛印刷机械有限公司 | A kind of PCB double-surface screen printing machine |
| CN206384516U (en) * | 2016-09-14 | 2017-08-08 | 广东一鼎科技有限公司 | The plate turnover mechanism of sheet material pipeline |
| CN106564312A (en) * | 2016-10-12 | 2017-04-19 | 江西景旺精密电路有限公司 | Double-faced character printing method for PCB |
| CN109130567A (en) * | 2018-06-20 | 2019-01-04 | 东莞三润田智能科技股份有限公司 | The online two-sided character spray printing method of pcb board |
Non-Patent Citations (2)
| Title |
|---|
| （日）本田早苗，（日）荒井实著: "《装卸机械设计》", 30 October 1982, 中国铁道出版社 * |
| 陆维强: "《轮转机组式凹版印刷机》", 30 April 2014, 印刷工业出版社 * |
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