CN110190033A - 一种电子产品用芯片固定装置 - Google Patents
一种电子产品用芯片固定装置 Download PDFInfo
- Publication number
- CN110190033A CN110190033A CN201910337044.6A CN201910337044A CN110190033A CN 110190033 A CN110190033 A CN 110190033A CN 201910337044 A CN201910337044 A CN 201910337044A CN 110190033 A CN110190033 A CN 110190033A
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- electronic products
- fixture apparatus
- chip fixture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910337044.6A CN110190033B (zh) | 2019-04-25 | 2019-04-25 | 一种电子产品用芯片固定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910337044.6A CN110190033B (zh) | 2019-04-25 | 2019-04-25 | 一种电子产品用芯片固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110190033A true CN110190033A (zh) | 2019-08-30 |
CN110190033B CN110190033B (zh) | 2021-05-25 |
Family
ID=67714880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910337044.6A Active CN110190033B (zh) | 2019-04-25 | 2019-04-25 | 一种电子产品用芯片固定装置 |
Country Status (1)
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CN (1) | CN110190033B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113109357A (zh) * | 2021-04-09 | 2021-07-13 | 徐州盛科半导体科技有限公司 | 一种可拆卸的半导体分析装置 |
WO2022105306A1 (zh) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技(上海)有限公司 | 一种新型散热装置 |
CN116631950A (zh) * | 2023-07-20 | 2023-08-22 | 弘润半导体(苏州)有限公司 | 一种半导体芯片封装盒 |
CN117594455A (zh) * | 2024-01-19 | 2024-02-23 | 凯瑞电子(诸城)有限公司 | 一种微电子芯片外壳无干涉安装装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1257209A (zh) * | 1998-11-17 | 2000-06-21 | 埃皮技术公司 | 小间距接触装置 |
CN1848549A (zh) * | 2005-03-10 | 2006-10-18 | 安普泰科电子有限公司 | Ic封装件、ic插座以及ic插座组件 |
CN208235051U (zh) * | 2018-04-27 | 2018-12-14 | 江苏菲拉凯恋新材料科技股份有限公司 | 一种纱线可回收装置 |
CN208622704U (zh) * | 2018-07-17 | 2019-03-19 | 江西意科斯光电科技有限公司 | 一种集成电路芯片封装结构 |
-
2019
- 2019-04-25 CN CN201910337044.6A patent/CN110190033B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1257209A (zh) * | 1998-11-17 | 2000-06-21 | 埃皮技术公司 | 小间距接触装置 |
CN1848549A (zh) * | 2005-03-10 | 2006-10-18 | 安普泰科电子有限公司 | Ic封装件、ic插座以及ic插座组件 |
CN208235051U (zh) * | 2018-04-27 | 2018-12-14 | 江苏菲拉凯恋新材料科技股份有限公司 | 一种纱线可回收装置 |
CN208622704U (zh) * | 2018-07-17 | 2019-03-19 | 江西意科斯光电科技有限公司 | 一种集成电路芯片封装结构 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022105306A1 (zh) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技(上海)有限公司 | 一种新型散热装置 |
CN113109357A (zh) * | 2021-04-09 | 2021-07-13 | 徐州盛科半导体科技有限公司 | 一种可拆卸的半导体分析装置 |
CN116631950A (zh) * | 2023-07-20 | 2023-08-22 | 弘润半导体(苏州)有限公司 | 一种半导体芯片封装盒 |
CN116631950B (zh) * | 2023-07-20 | 2023-10-17 | 弘润半导体(苏州)有限公司 | 一种半导体芯片封装盒 |
CN117594455A (zh) * | 2024-01-19 | 2024-02-23 | 凯瑞电子(诸城)有限公司 | 一种微电子芯片外壳无干涉安装装置 |
CN117594455B (zh) * | 2024-01-19 | 2024-04-16 | 凯瑞电子(诸城)有限公司 | 一种微电子芯片外壳无干涉安装装置 |
Also Published As
Publication number | Publication date |
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CN110190033B (zh) | 2021-05-25 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20210510 Address after: 101500 room 106-566, building 2, courtyard 8, Xingsheng South Road, Miyun District, Beijing Applicant after: VACCINE AND HEALTH INSTITUTE Address before: 416000 No.61, Xihu Township, Longshan County, Xiangxi Tujia and Miao Autonomous Prefecture, Hunan Province Applicant before: Huang Jinping |
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TR01 | Transfer of patent right |
Effective date of registration: 20221118 Address after: 311200 room 602, 6th floor, building 1, No.111, Hongxing Road, economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Zhongyi (Hangzhou) Pharmaceutical Technology Co.,Ltd. Address before: 101500 room 106-566, building 2, courtyard 8, Xingsheng South Road, Miyun District, Beijing Patentee before: VACCINE AND HEALTH INSTITUTE |
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TR01 | Transfer of patent right |