CN101521996A - Copper foil of a plated circuit, surface treating method and electroplating apparatus for producing the copper foil - Google Patents
Copper foil of a plated circuit, surface treating method and electroplating apparatus for producing the copper foil Download PDFInfo
- Publication number
- CN101521996A CN101521996A CN200910004673A CN200910004673A CN101521996A CN 101521996 A CN101521996 A CN 101521996A CN 200910004673 A CN200910004673 A CN 200910004673A CN 200910004673 A CN200910004673 A CN 200910004673A CN 101521996 A CN101521996 A CN 101521996A
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- China
- Prior art keywords
- copper foil
- printed circuit
- plating
- molybdenum
- copper
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/12—Electroforming by electrophoresis
- C25D1/14—Electroforming by electrophoresis of inorganic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention relates to a copper foil of a plated circuit, surface treating method and electroplating apparatus for producing the copper foil, wherein the surface treating method comprises: forming copper coated warty layer; and forming blocking layer on the copper coated warty layer by electroplating molybdenum (Mo) or molybdenum (Mo) alloy. The invention may prevent stripping between copper foil and resin film, join improve acid-resistance, corrosion resistance and etching performance.
Description
Technical field
The present invention relates to a kind of surface treatment that is used for the Copper Foil of printed circuit, particularly, relate to a kind of Copper Foil that is used for printed circuit that in flexible print circuit etc., uses, the thermal endurance and the acid resistance of this Copper Foil improve by surface treatment, also relate to a kind of surface treatment method and the electroplating device that is used to make this Copper Foil of Copper Foil.
Background technology
Copper Foil is the primary element that is used in the printed circuit of electronic building brick, forms electrolytic copper foil (electrolytic copper foil) by the electrolysis plating, and this electrolytic copper foil is carried out surface treatment improving peel strength, thereby makes described Copper Foil.
Form electrolytic copper foil by general electrolysis depositing process.Electrolytic copper foil has lower light face (side) (being shiny surface) of surface roughness and the higher matsurface (being dull face (dull side)) of surface roughness.
In reprocessing (post-process), on Copper Foil, form Cu plating knurl (Cu-nodule) and barrier layer by surface treatment.Thereby Copper Foil has physics and the chemical characteristic that is suitable for printed circuit.
As shown in Figure 1, in reprocessing, during by first copper plating tank 10, second copper plating tank 11, nickel electroplating bath 12 and chromium electroplating bath 13, Copper Foil 1 is carried out surface treatment by electroplating in Copper Foil 1 order.Copper Foil 1 imports in each electroplating bath by a plurality of deflector rolls 14, and is wrapped on the winding roller 15.The deflector roll 14 that is arranged on each electroplating bath is connected with the electrode of polarity corresponding to the polarity of the respective electrical plating bath that is used to electroplate.First copper plating tank 10 accommodates and be used for producing the electroplate liquid that Cu plates the core (core) of knurl on the matsurface of Copper Foil.Second copper plating tank 11 accommodates and is used to make Cu to plate the electroplate liquid of the core growth of knurl.
As shown in Figure 2, on the matsurface of Copper Foil 1, form copper plating wart layer (Cu nodule layer) 2.On copper plating wart layer 2, form barrier layer 3.Barrier layer 3 comprises the electrodeposited coating of being made by nickel (Ni) or chromium (Cr).Barrier layer 3 provides thermal endurance, acid resistance and oxidative resistance.Though do not illustrate, applying silane coupler (silane coupling agent) on the barrier layer 3 to improve Copper Foil and will be bonded to caking property between the resin molding of this Copper Foil.
Yet conventional reprocessing is restricted improving on caking property, thermal endurance and the acid resistance, particularly is being used for that resin molding is bonded to the thermal endurance that the high-temperature heat treatment performance of Copper Foil is gone on business.Therefore, between Copper Foil and resin molding, can peel off (peel-off), cause etching (etchablity) not good.
Summary of the invention
The invention is intended to address the above problem.Therefore, the purpose of this invention is to provide a kind of Copper Foil that is used for printed circuit, improve thermal endurance and acid resistance by component to the metallic element on barrier layer, thereby have adhesiveness and excellent etching, the electroplating device that the present invention also aims to provide the surface treatment method of this Copper Foil and be used to make this Copper Foil to the resin molding excellence.
For the surface treatment method of the Copper Foil of realizing purpose of the present invention, the invention discloses being used for printed circuit, it provides the barrier layer of containing molybdenum (Mo) element.
That is, the surface treatment method that is used for the Copper Foil of printed circuit according to the present invention comprises: (a) form copper plating wart layer on the surface of Copper Foil; (b) on copper plating wart layer, form the barrier layer by electroplating molybdenum (Mo) or molybdenum (Mo) alloy.
Preferably, the plating amount of molybdenum (Mo) is between 0.5mg/m
2～100mg/m
2Between.
In step (b), further use zinc (Zn) or zinc (Zn) alloy plating copper plating wart layer, to form the barrier layer.
Preferably, the plating amount of zinc (Zn) is for being equal to or less than 20mg/m
2
In step (b), further use chromium (Cr) or chromium (Cr) alloy plating copper plating wart layer, to form the barrier layer.
Preferably, in step (b) afterwards, surface treatment method further comprises with silane coupler and applies the barrier layer.
According to another aspect of the present invention, a kind of Copper Foil that is used for printed circuit comprises unprocessed Copper Foil; The copper plating wart layer that on unprocessed copper foil surface, forms; The barrier layer that forms on copper plating wart layer, the electrodeposited coating of being made by molybdenum (Mo) or molybdenum (Mo) alloy is contained on described barrier layer.
In the barrier layer, the plating amount of molybdenum (Mo) is preferably between 0.5mg/m
2～100mg/m
2Between.
The barrier layer can further comprise the electrodeposited coating of being made by zinc (Zn) or zinc (Zn) alloy.
In the barrier layer, the plating amount of zinc (Zn) preferably is equal to or less than 20mg/m
2
The barrier layer can further comprise the electrodeposited coating of being made by chromium (Cr) or chromium (Cr) alloy.
The Copper Foil that is used for printed circuit can further be included in the silane coupler that forms on the barrier layer.
According to another aspect of the present invention, a kind of electroplating device that is used for the Copper Foil of printed circuit is used to handle copper foil surface, and this electroplating device comprises: first copper plating tank is used to hold to produce the electroplate liquid that copper plates the core of knurl on the surface of Copper Foil; Second copper plating tank is used to hold the electroplate liquid that the core that can make copper plating knurl is grown on copper foil surface; With the molybdenum electroplating bath, be used to hold the employed electroplate liquid of described copper plating knurl with molybdenum (Mo) or the described Copper Foil of molybdenum (Mo) alloy plating.
The electroplating device that is used for the Copper Foil of printed circuit can further comprise the zinc electroplating bath, is used to hold the employed electroplate liquid of described copper plating knurl with zinc (Zn) or the described Copper Foil of zinc (Zn) alloy plating.
The electroplating device that is used for the Copper Foil of printed circuit can further comprise the chromium electroplating bath, is used to hold the employed electroplate liquid of described copper plating knurl with chromium (Cr) or the described Copper Foil of chromium (Cr) alloy plating.
The present invention can avoid peeling off between Copper Foil and the resin molding, and improves acid resistance, corrosion resistance and etching.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described more all sidedly in embodiment, still, the explanation of this paper just is used to the preferred examples that illustrates, is not to be used to limit the scope of the invention.
Fig. 1 is the structure chart that the conventional electroplating device of making the Copper Foil that is used for printed circuit is described.
Fig. 2 is that explanation is by the profile of the primary structure of the surface-treated Copper Foil that is used for printed circuit of the electroplating device of Fig. 1.
Fig. 3 is the flow chart that the surface treatment method of the Copper Foil that is used for printed circuit according to the preferred embodiment of the invention is described.
Fig. 4 illustrates the structure chart of making the electroplating device of the Copper Foil that is used for printed circuit according to the preferred embodiment of the invention.
Fig. 5 illustrates according to the preferred embodiment of the invention by the primary structure profile of the surface-treated Copper Foil that is used for printed circuit of electroplating device.
Fig. 6 is the form of peel strength of the Copper Foil that is used for printed circuit of expression example of the present invention and comparative example.
Embodiment
Below, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.Be understood that before this, employed term should not be construed as the implication that is confined on common and the dictionary in specification and the appended claims, but, explain based on implication and notion corresponding to technical solution of the present invention according to the inventor can suitably define term in order to describe best principle.So only for being used for illustrational preferred embodiment, is not break away from the spirit and scope of the present invention in order to limit the scope of the invention, therefore to it should be understood that other equivalent that above example is made and revise in this explanation that provides.
As shown in Figure 3, according to the surface treatment method of the Copper Foil that is used for printed circuit, form Copper Foil (S100) by the electrolysis plating.By matsurface, on Copper Foil, form a plurality of plating knurl structures (S110) with the copper electro copper foil.By electroplating molybdenum (Mo) component (component), on copper plating knurl structure, form the barrier layer, to improve physics and chemical characteristic (S120).
Fig. 4 is a structural representation of making the electroplating device of the Copper Foil that is used for printed circuit.According to a preferred embodiment of the invention, this electroplating device is carried out surface treatment method.
With reference to figure 4, the electroplating device that is used for the Copper Foil of printed circuit comprises first copper plating tank 100 and second copper plating tank 101 that is used for forming Cu plating knurl structure on Copper Foil, and the molybdenum electroplating bath 102 that is used for forming the barrier layer on Cu plating knurl structure.
First copper plating tank 100 accommodates and be used for producing the electroplate liquid that Cu plates the core of knurl on the matsurface of Copper Foil.Second copper plating tank 101 accommodates and is used to make Cu to plate the electroplate liquid of the core growth of knurl.
Molybdenum electroplating bath 102 accommodates the electroplate liquid that comprises molybdenum (Mo) or molybdenum (Mo) alloy compositions, and it has excellent thermal endurance, acid resistance and corrosion resistance.Molybdenum (Mo) exists with ionic condition in electroplate liquid, and it obtains by electrolysis, plates on the knurl to Cu with the form electro-deposition of metal or alloy then.
For physics and the chemical characteristic that provides by molybdenum (Mo) component is provided, electroplating device can further comprise zinc electroplating bath 103 and chromium electroplating bath 104, wherein zinc electroplating bath 103 accommodates the electroplate liquid that comprises zinc (Zn) or zinc (Zn) alloy compositions, and chromium electroplating bath 104 accommodates the electroplate liquid that comprises chromium (Cr) or chromium (Cr) alloy compositions.
The electroplate liquid that is held in the molybdenum electroplating bath 102 can comprise the molybdenum (Mo) of 20g/l.Simultaneously, under the situation of using molybdenum (Mo)-nickel (Ni) alloy, the electroplate liquid that is held in the molybdenum electroplating bath 102 can comprise the molybdenum (Mo) of 15g/l and the nickel (Ni) of 30g/l.Here, the pH of preferred electroplate liquid remains on 12, and the temperature of electroplate liquid remains on 25 ℃.
During by first copper plating tank 100, second copper plating tank 101, molybdenum electroplating bath 102, zinc electroplating bath 103 and chromium electroplating bath 104, Copper Foil 200 is carried out surface treatment in Copper Foil 200 order by electroplating.Here, Copper Foil 200 imports in each electroplating bath by a plurality of deflector rolls 105, and is wrapped on the winding roller 106.The deflector roll 105 that is arranged on each electroplating bath is connected with such electrode: the polarity of this electrode is corresponding to the polarity of the respective electrical plating bath that is used to electroplate.
Fig. 5 illustrates according to the preferred embodiment of the invention by the primary structure profile of the surface-treated Copper Foil that is used for printed circuit of electroplating device.
As shown in Figure 5, on the matsurface of Copper Foil 200, form Cu plating wart layer 201.On Cu plating wart layer 201, form the barrier layer 202 that comprises molybdenum (Mo), zinc (Zn) and chromium (Cr) component.
Be plated in molybdenum (Mo) component on the Cu plating wart layer 201 and improved thermal endurance to increase with the caking property of resin molding (for example FR (fire retardant)-4) and to have improved acid resistance and corrosion resistance.In barrier layer 202, the plating amount of molybdenum (Mo) is preferably between 0.5mg/m
2With 100mg/m
2Between.Under the situation of electroplating molybdenum (Mo) alloy, 0.1～2 times of plating amount of molybdenum (Mo) is preferably measured in the plating of in addition element of molybdenum (Mo) (for example transition metal, as nickel (Ni)).
Zinc (Zn) and chromium (Cr) component have been improved the thermal endurance and the acid resistance on barrier layer 202.Here, the plating amount of preferred zinc (Zn) is for being equal to or less than 20mg/m
2
On the barrier layer, apply the silane coupler (not shown), to improve Copper Foil and will be bonded to caking property between the resin molding of this Copper Foil.Here, silane preferably epoxies or amine.
Fig. 6 is the form of peel strength of the Copper Foil that is used for printed circuit of expression example of the present invention and comparative example.
In Fig. 6, embodiment according to the present invention 1 is all electroplated 10mg/m on the thick Copper Foil of the thick Copper Foil of 12 μ m and 18 μ m
2Molybdenum (Mo) and 10mg/m
2Zinc (Zn), to form the barrier layer.Bonding FR (fire retardant)-4 resin is as resin molding.180 ℃ carry out 48 hours heat treatment after, measure the peel strength of each Copper Foil.
Embodiment according to the present invention 2 is all electroplated 5mg/m on the thick Copper Foil of the thick Copper Foil of 12 μ m and 18 μ m
2Nickel (Ni), 10mg/m
2Molybdenum (Mo) and 10mg/m
2Zinc (Zn), to form the barrier layer.Bonding FR (fire retardant)-4 resin is as resin molding.180 ℃ carry out 48 hours heat treatment after, measure the peel strength of each Copper Foil.
Simultaneously, according to comparative example, nickel (Ni) is electroplated on the thick Copper Foil of the thick Copper Foil of 12 μ m and 18 μ m, to form the barrier layer as key component.Use FR (fire retardant)-4 resin, to form resin molding.After 48 hours, measure the peel strength of Copper Foil 180 ℃ of heat treatments.
Table by Fig. 6 can be found: the present invention has improved the peel strength characteristic after the heat treatment.
So, the present invention has formed the barrier layer that comprises molybdenum (Mo) or molybdenum (Mo) alloy on the Cu of Copper Foil plating wart layer, and with the high-temperature heat treatment Copper Foil to improve thermal endurance.Therefore, the present invention can avoid peeling off between Copper Foil and the resin molding, and improves acid resistance, corrosion resistance and etching.
Hereinbefore, with reference to the accompanying drawings the preferred embodiment of the invention is had been described in detail.But, be appreciated that detailed explanation and concrete example when the explanation preferred embodiment of the present invention, only are in order to illustrate.Because by these detailed explanations, various changes within the scope of the present invention and modification are conspicuous to those skilled in the art.
Claims (17)
1. surface treatment method that is used for the Copper Foil of printed circuit, this method comprises the steps:
(a) on the surface of Copper Foil, form copper plating wart layer; With
(b) by electroplating molybdenum or molybdenum alloy, on described copper plating wart layer, form the barrier layer.
2. the surface treatment method that is used for the Copper Foil of printed circuit according to claim 1,
Wherein the plating amount of molybdenum is between 0.5mg/m
2With 100mg/m
2Between.
3. the surface treatment method that is used for the Copper Foil of printed circuit according to claim 1,
Wherein, in step (b), to described copper plating further electrogalvanizing of wart layer or kirsite, to form described barrier layer.
4. the surface treatment method that is used for the Copper Foil of printed circuit according to claim 3,
Wherein the plating amount of zinc is equal to or less than 20mg/m
2
5. the surface treatment method that is used for the Copper Foil of printed circuit according to claim 1,
Wherein, in step (b), to described copper plating further electrodeposited chromium of wart layer or evanohm, to form described barrier layer.
6. the surface treatment method that is used for the Copper Foil of printed circuit according to claim 1 in step (b) afterwards, further comprises:
Apply described barrier layer with silane coupler.
7. the surface treatment method that is used for the Copper Foil of printed circuit according to claim 1,
Wherein the electroplate liquid that uses in step (b) comprises the molybdenum that exists with ionic condition.
8. Copper Foil that is used for printed circuit comprises:
Unprocessed Copper Foil;
Copper plating wart layer is formed on the surface of described Copper Foil; With
The barrier layer is formed on the described copper plating wart layer and comprises the electrodeposited coating of being made by molybdenum or molybdenum alloy.
9. the Copper Foil that is used for printed circuit according to claim 8,
Wherein the plating amount of molybdenum is between 0.5mg/m
2With 100mg/m
2Between.
10. the Copper Foil that is used for printed circuit according to claim 8,
Wherein said barrier layer further comprises the electrodeposited coating of being made by zinc or kirsite.
11. the Copper Foil that is used for printed circuit according to claim 10,
Wherein the plating amount of zinc is equal to or less than 20mg/m
2
12. the Copper Foil that is used for printed circuit according to claim 8,
Wherein said barrier layer further comprises the electrodeposited coating of being made by chromium or evanohm.
13. the Copper Foil that is used for printed circuit according to claim 8 further comprises:
Silane coupler is formed on the described barrier layer.
14. the Copper Foil that is used for printed circuit according to claim 8,
Wherein said unprocessed Copper Foil is with polyimide film.
15. an electroplating device that is used for the Copper Foil of printed circuit, described electroplating device are used for the surface of Copper Foil is handled, it comprises:
First copper plating tank is used to hold to produce the electroplate liquid that copper plates the core of knurl on the surface of Copper Foil;
Second copper plating tank is used to hold the electroplate liquid that the core that can make described copper plating knurl is grown on the surface of described Copper Foil; With
The molybdenum electroplating bath is used to hold the employed electroplate liquid of described copper plating knurl of electroplating described Copper Foil with molybdenum or molybdenum alloy.
16. the electroplating device that is used for the Copper Foil of printed circuit according to claim 15 further comprises:
The zinc electroplating bath is used to hold the employed electroplate liquid of described copper plating knurl with zinc or the described Copper Foil of Zinc alloy electroplating.
17. the electroplating device that is used for the Copper Foil of printed circuit according to claim 15 further comprises:
The chromium electroplating bath is used to hold the employed electroplate liquid of described copper plating knurl of electroplating described Copper Foil with chromium or evanohm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080018153 | 2008-02-28 | ||
| KR1020080018153A KR100974373B1 (en) | 2008-02-28 | 2008-02-28 | Surface treatment method of copper foil for printed circuit, copper foil and electroplater thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101521996A true CN101521996A (en) | 2009-09-02 |
Family
ID=41082295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910004673A Pending CN101521996A (en) | 2008-02-28 | 2009-03-02 | Copper foil of a plated circuit, surface treating method and electroplating apparatus for producing the copper foil |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009206514A (en) |
| KR (1) | KR100974373B1 (en) |
| CN (1) | CN101521996A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103732798A (en) * | 2011-06-14 | 2014-04-16 | 大日本印刷株式会社 | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6111017B2 (en) * | 2012-02-03 | 2017-04-05 | Ｊｘ金属株式会社 | Copper foil for printed wiring board, laminate using the same, printed wiring board, and electronic component |
| KR20140034695A (en) * | 2012-09-12 | 2014-03-20 | 주식회사 두산 | Metal foil for radiating heat, method of preparing the same, and metal-clad laminate for radiating heat and multi-layer printed circuit board |
| KR102370441B1 (en) * | 2014-11-21 | 2022-03-03 | 에스케이넥실리스 주식회사 | Ito metal laminate having excellent adhesion and etching performance and method for forming electrode |
| KR102377288B1 (en) * | 2014-11-21 | 2022-03-21 | 에스케이넥실리스 주식회사 | Ito metal laminate having excellent adhesion and etching performance and method for forming electrode |
| KR102377293B1 (en) * | 2014-11-21 | 2022-03-21 | 에스케이넥실리스 주식회사 | Ito metal laminate having excellent adhesion and etching performance and method for forming electrode |
| KR102370449B1 (en) * | 2014-11-21 | 2022-03-03 | 에스케이넥실리스 주식회사 | Ito metal laminate having excellent adhesion and etching performance and method for forming electrode |
| JP6533089B2 (en) * | 2015-04-21 | 2019-06-19 | 京セラ株式会社 | Wiring board |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07832B2 (en) * | 1987-01-23 | 1995-01-11 | 日本電解株式会社 | Copper foil for printed circuit and manufacturing method thereof |
| JPS63186888A (en) * | 1987-01-30 | 1988-08-02 | Meiko Denshi Kogyo Kk | Production of copper foil |
| JP2631061B2 (en) * | 1992-06-25 | 1997-07-16 | 日本電解株式会社 | Copper foil for printed circuit and method of manufacturing the same |
| KR100404005B1 (en) * | 2001-05-03 | 2003-11-03 | 닛폰 덴카이 가부시키가이샤 | Roughening-treated copper foil and production of the same |
| JP2003201597A (en) * | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | Copper foil, production method therefor and electromagnetic wave shield body obtained by using the copper foil |
| US7749611B2 (en) * | 2002-12-05 | 2010-07-06 | Gbc Metals, L.L.C. | Peel strength enhancement of copper laminates |
| KR100560672B1 (en) * | 2003-08-30 | 2006-03-14 | 엘에스전선 주식회사 | surface treated copper foil and the preparation method thereof |
| JP4833556B2 (en) * | 2004-02-06 | 2011-12-07 | 古河電気工業株式会社 | Surface treated copper foil |
| JP2005340634A (en) * | 2004-05-28 | 2005-12-08 | Hitachi Cable Ltd | Copper foil for printed wiring board, and its production process |
| JP2005340633A (en) * | 2004-05-28 | 2005-12-08 | Hitachi Cable Ltd | Copper foil for printed wiring board and its production process |
| JP2005353918A (en) * | 2004-06-11 | 2005-12-22 | Hitachi Cable Ltd | Copper foil for printed-wiring board and manufacturing method thereof |
| KR100654737B1 (en) * | 2004-07-16 | 2006-12-08 | 일진소재산업주식회사 | Method of manufacturing Surface-treated Copper Foil for PCB having fine-circuit pattern and Surface-treated Copper Foil thereof |
| JP4626390B2 (en) * | 2005-05-16 | 2011-02-09 | 日立電線株式会社 | Copper foil for printed wiring boards in consideration of environmental protection |
-
2008
- 2008-02-28 KR KR1020080018153A patent/KR100974373B1/en active IP Right Grant
-
2009
- 2009-02-24 JP JP2009040973A patent/JP2009206514A/en active Pending
- 2009-03-02 CN CN200910004673A patent/CN101521996A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103732798A (en) * | 2011-06-14 | 2014-04-16 | 大日本印刷株式会社 | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
| CN103732798B (en) * | 2011-06-14 | 2016-07-06 | 大日本印刷株式会社 | The manufacture method of conductive substrate and collector plate used for solar batteries for forming the wiring pattern of collector plate used for solar batteries |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090092919A (en) | 2009-09-02 |
| JP2009206514A (en) | 2009-09-10 |
| KR100974373B1 (en) | 2010-08-05 |
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