CN110148671A - Organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively - Google Patents
Organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively Download PDFInfo
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- CN110148671A CN110148671A CN201910292615.9A CN201910292615A CN110148671A CN 110148671 A CN110148671 A CN 110148671A CN 201910292615 A CN201910292615 A CN 201910292615A CN 110148671 A CN110148671 A CN 110148671A
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 52
- 229920005989 resin Polymers 0.000 title claims abstract description 37
- 239000011347 resin Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 238000007711 solidification Methods 0.000 claims abstract description 36
- 230000008023 solidification Effects 0.000 claims abstract description 36
- 239000003292 glue Substances 0.000 claims abstract description 31
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000001301 oxygen Substances 0.000 claims abstract description 29
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 238000000016 photochemical curing Methods 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 6
- 230000005669 field effect Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 4
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- -1 quartzy Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- 230000008030 elimination Effects 0.000 claims 1
- 238000003379 elimination reaction Methods 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 9
- 230000004888 barrier function Effects 0.000 abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 7
- 238000012536 packaging technology Methods 0.000 abstract description 4
- 208000012260 Accidental injury Diseases 0.000 abstract description 2
- 208000033999 Device damage Diseases 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 208000014674 injury Diseases 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 20
- 230000006378 damage Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of organic electronic device encapsulation multilayer light-cured resins to cover packaging method comprehensively, specifically: it passes sample and enters in nitrogen glove box, film inertia UV solidifies protective glue on organic assembly.High water oxygen barrier UV solidification glue (high water oxygen barrier film) on glass or flexible cover plate of film covers the encapsulation coating that film is completed on sample in nitrogen glove box simultaneously, smooth pressing.Device is put into solidification under uv lamps and completes encapsulation and bonding.Compared with prior art, the invention has the following beneficial effects: packaging technologies and material in view of the protection to device, while encapsulation being rapidly completed as far as possible, reduces the risk of device damage.In encapsulation process, encapsulated layer can be covered on above device comprehensively, reduce etching, positioning printing and etc..This can protect device accidental injury, can also be improved film rate and reduce process costs.
Description
Technical field
The invention belongs to organic electronic devices to encapsulate studying technological domain, in particular to a kind of organic electronic device encapsulation is more
Layer light-cured resin covers packaging method comprehensively.
Background technique
Novel organic electronic device, organic light emission, organic electro-optic device, organic detectors and organic field-effect tube due to
The advantages that its own frivolous, energy saving and self-luminous, power generation, in display and solid-state lighting, the energy, detector, mobile phone is wearable
Field has broad application prospects.Its outstanding characteristic will affect the exploitation of next-generation display electronic product, be flexible electronic
The main force of display.
However according to long-term, a large amount of organic electronics studies have shown that the steam and oxygen gas component in air to Organic Electricity
Sub- device has fatal influence, and it is various that reason mainly has steam and oxygen molecule to have organic and other each nanometer thin film layers
Different reactions and influence, to there is very big harm to the integral device service life.If can be carried out to organic electro-optic device
The encapsulation of effect stops steam/oxygen to touch each organic function layer, so that it may greatly improve device lifetime.
As many novel encapsulation coating materials and direct combination encapsulating structure are invented and are used, organic electronic device
Packaging effect and performance obtained huge promotion, and existing high encapsulation, the organic electronic display screen of long-life is
It emerges.But organic electronic device packaging technology is complicated, with high costs, the disadvantages such as packaging efficiency is low cause the production capacity of organic assembly
Lowly, at high cost, the device is complicated changes, and especially to large area, the encapsulation of flexible device has great difficulty and challenge, such as
OLED large screen, organic field-effect tube, the encapsulation such as organic solar batteries.Additionally due to organic electronic device, especially flexible
Thickness of detector is very thin, and material and nanometer layer are very sensitive and fragile, and encapsulating structure and the improper of technique easily cause production
The damage and damage of product, cause the decline of yields.
The information disclosed in the background technology section is intended only to increase the understanding to general background of the invention, without answering
When being considered as recognizing or imply that the information constitutes the prior art already known to those of ordinary skill in the art in any form.
Summary of the invention
The purpose of the present invention is to provide a kind of organic electronic device encapsulation multilayer light-cured resins to cover encapsulation side comprehensively
The problems such as method, structure is complicated to overcome in current organic packages structure, and step is various, and at high cost and speed of production is slow.
To achieve the above object, the present invention provides a kind of organic electronic device encapsulation multilayer light-cured resins to cover comprehensively
Packaging method, comprising: S1 prepares organic electronic device or organic function layer in substrate；The inertia light of S2 coating on it is solid
Change the high-barrier photocurable layers on layer, and encapsulation cover plate；S3 will be coated with resin cover plate and be covered in the solidification glue of substrate,
Light repoussage encapsulates cover plate, and disposable UV irradiation solidification, wherein step S2 and S3 is carried out in inert gas environment.
Preferably, in above-mentioned technical proposal S1, substrate is selected from metal, quartzy, silica, glass, the hard materials such as silicon wafer,
It is also possible to the flexiplast of various high water oxygen barriers, polymer, resin material.
Preferably, in above-mentioned technical proposal S1, organic electronic device and organic function layer are selected from organic luminescent device
OLED, quantum luminescent device GLED, polymer light-emitting device PLED, small organic molecule, polymer, perovskite photoelectric device, light
Electric explorer and solar battery and organic, polymer field-effect tube.
Preferably, in above-mentioned technical proposal S2, inertia photocuring glue-line, material is selected from light-cured resin, light-solidifying poly
Close object.It is not damaged to organic electronic device, it is reactionless.
Preferably, in above-mentioned technical proposal S2, inertia photocuring glue-line can be scratched, sprinkling, roll- by spin coating
To-roll, the liquid films method such as printing are completed.
Preferably, in above-mentioned technical proposal S2, inertia photocuring glue-line, thickness can be from 0.1-10 microns.
Preferably, in above-mentioned technical proposal S2, encapsulation cover plate is selected from the metal that high water oxygen stops, glass, silicon wafer, oxidation
The fexible film that silicon, metal oxide and high water oxygen stop, one of substrate.
Preferably, in above-mentioned technical proposal S2, high-barrier photocurable layers can obstruct UV solidified resin selected from high water oxygen,
Polymer etc..
Preferably, in above-mentioned technical proposal S2, high-barrier photocurable layers, thickness can be from 1-50 microns.
Preferably, in above-mentioned technical proposal S3, resin cover plate will be coated with and be covered in the solidification glue of substrate, can be portion
Divide covering, can also be encapsulated with all standing.
Preferably, in above-mentioned technical proposal S3, light repoussage encapsulates cover plate, can be flat metal, silicon wafer, glass
Deng making gas in two kinds of solidification glues be discharged and eliminate gap.
Preferably, in above-mentioned technical proposal S3, disposable UV irradiation solidification, is that once irradiating is completed at the same time two layers of solidification glue
While solidify.
Preferably, in above-mentioned technical proposal S2, inertia photocuring glue-line and high-barrier cured layer can be monolayer immobilization tree
Rouge/glue, and be multilayer film layer.
Basic principle of the invention is that inertia protection solidification glue and high water oxygen obstruct packaging plastic separate type film, remerges exposure
UV light completes disposal solidifying and encapsulation.After completing encapsulation, sample, inertia packaging plastic, high water oxygen barrier packaging plastic and above
Encapsulation covering version complete seamless disposal solidifying adhesion.Due to the gradually plated film work of the multilayered structure of reduction in whole process
Skill, all using optic-solidified adhesive, coating process and material are relatively simple, and technique can significantly simplify.2 kinds of solidification glues can be with simultaneously
It is completed at the same time film, another rise merges, and package speed and condition are unified, greatly reduces process costs and improves production speed
Degree.In addition, we use, property exposure curing again after the covering of 2 kinds of solidification glues merges, two kinds of colloids for being before curing can be with
Interface efficiently combine wants to permeate, greatly reduce and occur defect in gradually encapsulation process, localized voids can not adhesion the case where.
It protects device from damage as first layer by inertia solidification glue, completes to be completed at the same time resistance after mixed two layers of solidification adhesive curing
The work of water blocking Oxygen permeation, and cover plate is encapsulated on device top in perfect adhesion.Other packaging plastic films and solidification process
It is all real to complete in an inert atmosphere, such as completed in the glove box of nitrogen, argon gas inert gas.This simple packaging technology
Reduce sample transmission step and time, equipment cost.Water and oxygen content should be less than 1 Ppm in glove box.In encapsulation process
The substrate of use is the flexible substrates that glass and high water oxygen stop, and organic electronic device is used to water oxygen and thermo-responsive organic small
Mulecular luminescence device (OLED).Top encapsulated layer is hindered using high water oxygen barrier UV solidified resin film in glass glass or high water oxygen
In the flexible substrates of gear, inertia protects optic-solidified adhesive film on organic assembly.It is covered on sample by upper encapsulated layer, once
UV solidification.
Specific encapsulating structure and encapsulation emphasis are as follows:
1. passing sample to enter in nitrogen glove box, film inertia UV solidifies protective glue on organic assembly.
2. the high water oxygen barrier UV solidification glue of film (high water oxygen resistance on glass or flexible cover plate in nitrogen glove box simultaneously
Diaphragm).
3. the encapsulation coating that film is completed is covered on sample, smooth pressing.
4. device, which is put solidification under uv lamps, completes encapsulation and bonding.
Compared with prior art, the guarantor to device is considered the invention has the following beneficial effects: packaging technology and material
Shield, while encapsulation being rapidly completed as far as possible, reduce the risk of device damage.In encapsulation process, encapsulated layer can be covered on comprehensively
Above device, reduce etching, positioning printing and etc..This can protect device accidental injury, can also be improved film speed
Rate and reduction process costs.
This programme can increase substantially the efficiency of encapsulation in existing encapsulating structure and reduce packaging cost, have following excellent
Point:
It A. will not damage device with the inertia cured layer of device contacts.
B. high-barrier cured layer has good water oxygen barriering efficiency.
C. multiple layers of cured glue can use quickly, and easy method completes film.
D. multiple layers of cured glue cannot destroy mutually.
E. the seamless adhesion of multiple layers of cured glue.
Simple 1, whole solidifications can be completed in 2 UV irradiations.
Detailed description of the invention:
The large area encapsulation scheme structure and flow diagram that Fig. 1 multilayer light-cured resin covers comprehensively.
In figure: glass or flexible substrate (high water oxygen barrier) 1, organic electronic device or functional layer 2, inertia UV solidification glue 3,
Top package board (glass, flexible substrate) 4, high water oxygen obstruct UV solidification glue 5.
Specific embodiment:
Specific embodiments of the present invention will be described in detail below, it is to be understood that protection scope of the present invention is not had
The limitation of body embodiment.
Unless otherwise explicitly stated, otherwise in entire disclosure and claims, term " includes " or its change
Changing such as "comprising" or " including " etc. will be understood to comprise stated element or component, and not exclude other
Element or other component parts.
According to the design and processes of invention, encapsulation scheme is very simple, practical, using following steps:
The first step, be ready to can glass or high-barrier flexible PET substrate, surface can be cleaned.And it is put into vacuum drying
Steam and oxygen of the case removal more than absorption.It is raw that glass or high-barrier flexible PET substrate are put into organic light-emitting diode equipment
Long and preparation OLED device.
Sample is passed to 20 degree by second step, and water, oxygen is less than in the nitrogen glove box of 1ppm.Pass through spin coating proceeding film
One layer of inertia UV solidified resin is about 1-2 microns thick.
Third step, while second step, the film 5 on the glass of encapsulation covering or high-barrier flexible PET cover plate
The thick inertia high-barrier packaging plastic of micron.
4th step, encapsulation coating are placed on sample, and with smooth glass, silicon wafer is pressed lightly on.This can make two kinds of UV
Glue perfection combines, and intermediate gas and removal gap is discharged.
5th step opens UV lamp and irradiates entire sample cure package coating, complete after 2-4 minutes on the basis of four steps
Device solidification.
1 packaging time of list compares (laboratory hand operation)
| Testing scheme | Packaging time | Sealed in unit | Encapsulating material |
| Metal oxide/UV solidification glue encapsulation scheme | 4-5 hours | CVD/ vacuum chamber, film applicator, UV lamp | Metal oxide, UV solidification glue. |
| Encapsulation scheme of the present invention | 10-15 minutes | Nitrogen glove box, film applicator, UV lamp | 2 kinds of UV solidification glues |
, it is much higher than UV solidification glue with cost the time required to metal oxide plated film as can be known from the above table.
Selection scheme as one preferred, substrate is selected from metal, quartzy, silica, glass, the hard materials such as silicon wafer,
It is also possible to the flexiplast of various high water oxygen barriers, polymer, resin material.
Selection scheme as one preferred, organic electronic device and organic function layer are selected from organic luminescent device
OLED, quantum luminescent device GLED, polymer light-emitting device PLED, small organic molecule, polymer, perovskite photoelectric device, light
Electric explorer and solar battery and organic, polymer field-effect tube.
Selection scheme as one preferred, inertia photocuring glue-line, material are selected from light-cured resin, light-solidifying poly
Close object.It is not damaged to organic electronic device, it is reactionless.
Selection scheme as one preferred, inertia photocuring glue-line can be scratched, sprinkling, roll- by spin coating
To-roll, the liquid films method such as printing are completed.
Selection scheme as one preferred, inertia photocuring glue-line, thickness can be from 0.1-10 microns.
Selection scheme as one preferred, encapsulation cover plate are selected from the metal that high water oxygen stops, glass, silicon wafer, oxidation
The fexible film that silicon, metal oxide and high water oxygen stop, one of substrate.
Selection scheme as one preferred, high-barrier photocurable layers can obstruct UV solidified resin selected from high water oxygen, gather
Close object etc..
Selection scheme as one preferred, high-barrier photocurable layers, thickness can be from 1-50 microns.
Selection scheme as one preferred will be coated with resin cover plate and be covered in the solidification glue of substrate, can be portion
Divide covering, can also be encapsulated with all standing.
Selection scheme as one preferred, light repoussage encapsulate cover plate, can be flat metal, silicon wafer, glass etc.,
The gas in two kinds of solidification glues is set to be discharged and eliminate gap.
Selection scheme as one preferred, disposable UV irradiation solidification, is that once irradiating is completed at the same time two layers of solidification glue
While solidify.
Selection scheme as one preferred, inertia photocuring glue-line and high-barrier cured layer can be monolayer immobilization tree
Rouge/glue, and be multilayer film layer.
The aforementioned description to specific exemplary embodiment of the invention is in order to illustrate and illustration purpose.These descriptions
It is not wishing to limit the invention to disclosed precise forms, and it will be apparent that according to the above instruction, can much be changed
And variation.The purpose of selecting and describing the exemplary embodiment is that explaining specific principle of the invention and its actually answering
With so that those skilled in the art can be realized and utilize a variety of different exemplary implementation schemes of the invention with
And various chooses and changes.The scope of the present invention is intended to be limited by claims and its equivalents.
Claims (13)
1. organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively characterized by comprising S1 preparation exists
Organic electronic device or organic function layer in substrate；In the inertia photocurable layers of S2 coating on it, and encapsulation cover plate
High-barrier photocurable layers；S3 will be coated with resin cover plate and be covered in the solidification glue of substrate, light repoussage encapsulation cover plate, and one
Secondary property UV irradiation solidification, wherein step S2 and S3 is carried out in inert gas environment.
2. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S1, substrate is selected from metal, quartzy, silica, glass, the hard materials such as silicon wafer, is also possible to various high water oxygens resistances
Every flexiplast, polymer, resin material.
3. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S1, organic electronic device and organic function layer are selected from organic luminescent device OLED, quantum luminescent device GLED,
Polymer light-emitting device PLED, small organic molecule, polymer, perovskite photoelectric device, photodetector and solar battery, with
And organic, polymer field-effect tube.
4. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S2, inertia photocuring glue-line, material is selected from light-cured resin, photo-curable polymer.
5. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S2, inertia photocuring glue-line can be scratched, sprinkling, roll-to-roll, the liquid films such as printing by spin coating
Method is completed.
6. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S2, inertia photocuring glue-line, thickness can be from 0.1-10 microns.
7. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S2, encapsulation cover plate is selected from the metal that high water oxygen stops, glass, silicon wafer, silica, metal oxide, Yi Jigao
The fexible film that water oxygen stops, one of substrate.
8. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S2, high-barrier photocurable layers can obstruct UV solidified resin, polymer etc. selected from high water oxygen.
9. organic electronic device encapsulation multilayer light-cured resin according to claim 1 covers packaging method, special comprehensively
Sign is, in S2, high-barrier photocurable layers, thickness can be from 1-50 microns.
10. organic electronic device encapsulation multilayer light-cured resin covers packaging method, feature according to claim 1 comprehensively
It is, in S3, resin cover plate will be coated with and be covered in the solidification glue of substrate, can be part covering, can also be sealed with all standing
Dress.
11. organic electronic device encapsulation multilayer light-cured resin covers packaging method, feature according to claim 1 comprehensively
It is, in S3, light repoussage encapsulates cover plate, can be flat metal, silicon wafer, glass etc. makes the gas in two kinds of solidification glues
Discharge and elimination gap.
12. organic electronic device encapsulation multilayer light-cured resin covers packaging method, feature according to claim 1 comprehensively
It is, in S3, disposable UV irradiation solidification, is solidification while once irradiating is completed at the same time two layers of solidification glue.
13. organic electronic device encapsulation multilayer light-cured resin covers packaging method, feature according to claim 1 comprehensively
It is, in S2, inertia photocuring glue-line and high-barrier cured layer can be monolayer immobilization resin/glue, and be multilayer film layers.
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| CN201910292615.9A CN110148671A (en) | 2019-04-12 | 2019-04-12 | Organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910292615.9A CN110148671A (en) | 2019-04-12 | 2019-04-12 | Organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676391A (en) * | 2019-09-27 | 2020-01-10 | 苏州威格尔纳米科技有限公司 | Packaging method of perovskite thin film battery pack |
| CN110838547A (en) * | 2019-11-08 | 2020-02-25 | 福仕保(江苏)新材料有限公司 | Vacuum sputtering mixed light-cured resin packaging process for organic electronic device |
| CN110838544A (en) * | 2019-11-08 | 2020-02-25 | 福仕保(江苏)新材料有限公司 | Integrated structure design and preparation process for preparing and packaging ultrathin flexible organic electronic device |
| CN111240131A (en) * | 2020-03-17 | 2020-06-05 | 中国科学院云南天文台 | Manufacturing method of transparent hemispherical cover and transparent hemispherical cover |
| WO2024097417A1 (en) * | 2022-11-04 | 2024-05-10 | Caelux Corporation | Encapsulated perovskite modules and solar cells containing the same |
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Application publication date: 20190820 |