CN105280839A - Package structure of flexible OLED (Organic Light Emitting Diode) device - Google Patents
Package structure of flexible OLED (Organic Light Emitting Diode) device Download PDFInfo
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- CN105280839A CN105280839A CN201510700071.7A CN201510700071A CN105280839A CN 105280839 A CN105280839 A CN 105280839A CN 201510700071 A CN201510700071 A CN 201510700071A CN 105280839 A CN105280839 A CN 105280839A
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- oled
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
Abstract
The invention discloses a package structure of a flexible OLED (Organic Light Emitting Diode) device, and belongs to the field of organic light-emitting diodes. The package structure of the flexible OLED is composed of a flexible conductive substrate, a functional organic electronic layer, a completely covered water oxygen package layer and a flexible cap film, wherein the complete water oxygen package layer is a process of completely covering and packaging the whole OLED in a liquid-state through the adoption of one or more package resin glues and sealants, and an efficient water and oxygen permeation shield is built.
Description
Technical field
The present invention relates to Organic Light Emitting Diode field, refer more particularly to a kind of flexible device encapsulating structure.
Background technology
Flexible OLED (OrganicLightEmittingDiodes, Organic Light Emitting Diode) is because himself is frivolous, and softness cuts the advantages such as self-luminous, has broad application prospects in display and solid-state illumination field.Its outstanding characteristic by the impact concept of new equipment of future generation and the exploitation of new product, such as, dresses some subset and intelligent display technology.Flexible OLED has sandwich construction, and it is by flexible transparent conductive film, functional organic electronic OLED unit, and packaging film, uses UV or hot curing single/multiple layer encapsulated layer thus is bonded together.For OLED, steam and oxygen infiltrate through OLED hydraulic performance decline that device is and the main cause that the life-span significantly reduces, and providing the barrier of water and Oxygen permeation is the key improving equipment life.Compared with glass substrate, flexible base, board has higher vapor transmission rate (WVTR).Therefore, select transparent conductive oxide (TCO) substrate and the emulsion sheet of a low WVTR, and encapsulation technology is vital to raising flexible OLED devices stability and life-span.The encapsulation technology of traditional OLED is all adopt packaging plastic or adhesive at device substrate and the tectal boundary of encapsulation, and not covering above device, is a kind of local method for packing.But be inappropriate for flexible flexible OLED devices.As shown in Figure 1, if border or local method for packing, when device bend, because centre exists space, substrate and emulsion sheet discontinuity can be caused, and OLED may be damaged or cause packaging plastic to break and produce defect, cause steam and oxygen to damage device.
Summary of the invention
The present invention, in order to solve the problem in flexible OLED devices, proposes a kind of novel encapsulated technology.The present invention proposes to use individual layer, and double-deck even multilayer inertia solwution method covers the method for packing of OLED comprehensively, specifically provides technical scheme as follows.
First, above OLED, cover ground floor inertia encapsulated layer, its dress layer material will have insulation, good heat transfer, without chemical corrosivity, has lower water oxygen permeability, thickness is between tens nanometers are to tens microns, and the material layer rate of curving is close to OLED material simultaneously.The second layer uses High-efficient Water and oxygen barrier encapsulated layer (low water oxygen permeability), covers above whole ground floor.This layer material mainly focus on reducing water and oxygen through and the good rate of curving, thickness can from hundreds of nanometer to hundreds of micron.Finally, then cover uppermost emulsion sheet, solidify and complete encapsulation.
This encapsulation technology overcomes the shortcoming of original conventional packaging techniques: as shown in Figure 2, whole encapsulated device uniform force when bending, can not damage OLED structure and organic/metal level, also can not because of bending generation discontinuity, cause border to be come unglued, device is damaged.Secondly, be cover encapsulation due to what adopt for OLED comprehensively, the problem causing whole component failure when a certain breakage of device can not be there is.The lifting improving device resistance and service condition is all had very important significance.This technology is also applicable for the OLED of glass substrate, greatly can improve survival and the working life of device.
In addition, encapsulated layer material can be easy to adopt large area, low cost, manageable solution film-forming technology, such as spin coating with smearing, spraying, blade coating, the method for infiltration.
If in order to improve packaging effect further and reduce water and OTR oxygen transmission rate, can again superpose multilayer encapsulation layer.Because the first inert blanket protects device layer, succeeding layer can adopt material and the glue of high packaging efficiency.
Accompanying drawing explanation
Fig. 1 is the flexible OLED devices warp architecture schematic diagram of conventional package.
Fig. 2 is the flexible OLED devices warp architecture schematic diagram that the present invention encapsulates.
Fig. 3 is encapsulating structure schematic diagram of the present invention.
Wherein, 1 is the film containing flexible and transparent conductive layer, and 2 is OLED, and 3 is packaging plastic, and 4 is encapsulating film, and 5 is the encapsulated layer of the first complete covering, and 6 is the encapsulated layer of the second complete covering, and 7 is packaging film.
Embodiment
In the present invention, encapsulation flexible substrate and top case chip adopt high performance flexible BF-PET film in the world, have 10
-6g/m
2the ultralow steam OTR oxygen transmission rate of/day.In film-substrate, the argon plasma that can pass through or UV ozone treatment with improve surface or deposition one deck inorganic/metal nano layer, then deposit uses one deck 130nm tin indium oxide (ITO) prepared by preparation technology in low temperature.As shown in Figure 3.This ITO flexible base, board has the thin layer electrode of 25 ± 5 Ω/ surface resistances, and is provided in the high-transmission rate of visible light wave range, and this is better than the ITO flexible membrane of most of business.In addition, ito film can realize patterning by using photoetching process or covering deposition.OLED by vacuum evaporation and solution technique on the ito layer, is prepared into complete OLED.
Subsequently, this OLED faces up and uses identical BF-PET film sealant or packaging plastic to cover encapsulation comprehensively.Novel concepts of the present invention be overall flexibility encapsulation, it is formed as the combination of the layer of the insulating polymer/ITO on the TCO substrate of the high-quality of flexible organic electric device.First inertia encapsulated layer (UV cured resin, DeloLP655) and the second encapsulated layer (UV cured resin DELOLP686) all adopt face covering device, and face method for packing is also for the life-span of the low equipment that effectively raises the cost.Another novelty is use maximum materials to be based on polymer and organic material for the present invention, and be therefore provided with following advantage, such as lightweight, cost is low, is easy to produce and flexible.Whole preparation and packaging technology temperature are less than 120C, and this is beneficial to plastic film and functional layer.Whole encapsulation process completes (water, oxygen " 1ppm ") at pure nitrogen gas glove box.
In the present invention, we have proposed two kinds of new encapsulation processs is flexible organic opto-electronic device.
Embodiment 1:
One, on flexible OLED devices, utilize spin coating one deck inertia encapsulated layer (UV cured resin, DeloLP655, electrical insulating property, better heat conductivity), cover OLED layer, about 100 microns comprehensively.
Two, subsequently the case chip reduced is covered above packaging plastic, gently press substrate, make whole package area even.
Three, again by whole substrate at roughing vacuum chamber, vacuumize, to remove in device area and sealant residual gas and bubble.
Four, after packaging passes nitrogen glove box back, hyperbar can evenly press on flexible sample.The even packaging adhesive film of further formation.
Five, sample is imported into UV illumination room again, within room temperature illumination 2-4 minute, realize the solidification of packaging plastic.Reach final packaging effect.
Embodiment 2:
In the face encapsulation technology of the enterprising one-step optimization of the encapsulating structure of embodiment 1.Different encapsulating materials can be adopted to obtain different packaging effects.In embodiment 1, the full characterization of encapsulated layer all requires harsher, and mainly inertia and high leakproofness are difficult to take into account simultaneously.Major part high-performance package material can damage OLED, cannot adopt.And the method is on packaging film coating and solidification first ring epoxy layer or protective layer (sealing of isolated water steam and oxygen), add the second epoxy encapsulation layer.It is coated on first ring oxygen layer, does not realize contacting with OLED function element layer.Which solves the problem adopting the packaging plastic face of more high leakproofness to encapsulate, thus intercept the infiltration of steam and oxygen to greatest extent, reach best OLED packaging effect.
One, on flexible OLED devices, utilize spin coating one deck inertia encapsulated layer (UV cured resin, DeloLP655, electrical insulating property, better heat conductivity), cover OLED layer, about 10-100 micron comprehensively.
Two, sample is imported into UV illumination room, within room temperature illumination 2-4 minute, realize the solidification of packaging plastic.Reach optimum packaging effect.Or on flexible OLED devices, utilize heat deposition or ALD method to deposit one deck Al2O3, LiF layer (electrical insulating property, better heat conductivity), cover OLED layer, about 100-200 nanometer comprehensively.
Three, the sample completing the first covering sealing is imported into glove box, spin coating or covering one deck high-performance utilize spin coating one deck high-performance package layer (UV cured resin again, DeloLP686, low water oxygen permeability) subsequently the case chip reduced is covered above packaging plastic, light pressure substrate, makes whole package area even.
Four, again by whole substrate at roughing vacuum chamber, draw load to remove the residual gas and bubble that retain in device area and sealant.
Five, packaging passes nitrogen glove box back, and hyperbar can evenly press on flexible sample.The even packaging adhesive film of further formation.
Six, sample is imported into UV illumination room again, within room temperature illumination 2-4 minute, realize the solidification of packaging plastic.Reach final packaging effect.
Measure:
The flexible OLED work encapsulated and the mensuration of storage life, and comparing of carrying out with those standard samples on the glass substrate.Wherein storage life completes measurement in accelerated test chamber remaining in 60 DEG C and 90% relative humidity humidity chamber.In order to check the luminance and efficiency of OLED, sample is taken out from humidity chamber, and measure corresponding feature.Then sample is sent back in humidity chamber, until measure next time.For the measurement of working life, the device after OLED encapsulation is fixed on the fixture of a customization, is carried out the measurement of luminous intensity under fixed current input by continuous brightness supervisory control system.Test result is as shown in table 1.
Table 1 shows the OLED lifetime results of different encapsulation, and compares with the life-span of device on the glass substrate respectively.
| OLED (glass) | The border encapsulation half-life | The face encapsulation half-life |
| Service life | > 1300 hours | > 2000 hours |
| Storage life | > 438 days | > 600 days |
| OLED (flexibility) | The border encapsulation half-life | The border encapsulation half-life |
| Service life | > 200 hours | > 1200 hours |
| Storage life | > 80 days | > 300 days |
As can be seen from the above results, the encapsulation technology that we propose, the device lifetime of glass OLED and flexible OLED is all far away higher than traditional boundary and local packaging effect.Wherein two kinds of life-spans of flexible OLED are the magnitudes reaching the glass substrate OLED matched in excellence or beauty.
Claims (12)
1. a solwution method encapsulating structure for flexible OLED devices, is characterized in that, comprising: at least one flexible low water oxygen permeability flexible substrates, a flexible and transparent conductive layer; Be positioned at the OLED on conductive layer; One or more flexible water oxygen encapsulated layer; Cover the low water oxygen permeability packaging film on described encapsulated layer.
2. the encapsulating structure of flexible OLED devices according to claim 1, it is characterized in that, the ground floor flexible package layer covered in OLED does not have device or seldom damages, in the preparation of transparency electrode subsequently, contingent infringement and the surface modification to primer can be prevented.
3. the encapsulating structure of flexible OLED devices according to claim 1, is characterized in that, flexible package layer prepared by described one or more solwution method, at room temperature can be prepared by solwution method.
4. the encapsulating structure of flexible OLED devices according to claim 1, it is characterized in that, described flexible water oxygen encapsulated layer is selected from insulating polymer/organic substance, the material of transparent insulating, comprise the epoxy resin of ultraviolet light or hot curing, or the combination of other transparent insulation materials.
5. the encapsulating structure of the flexible OLED devices according to claim 1 or 4, is characterized in that, light transmittance and the thickness of described flexible water oxygen encapsulated layer can adjust.
6. the encapsulating structure of flexible OLED devices according to claim 2, is characterized in that, the overlayable organic functions function of flexible package layer can be not limited to OLED, can be OPD, OTFT and OPV organic function layer.
7. the encapsulating structure of flexible OLED devices according to claim 1, is characterized in that, comprehensively described flexible water oxygen encapsulated layer encapsulated layer covers in OLED, and encapsulated layer has characteristic that is soft and low water vapor permeable rate.
8. the encapsulating structure of flexible OLED devices according to claim 1, is characterized in that, the individual layer of described flexible water oxygen encapsulated layer and multilayer can by suitable physics or chemical solution masking legal system standby, comprise hot steaming method, spin coating, spraying, smears, soak, print, rolltoroll etc.
9. the encapsulating structure of flexible OLED devices according to claim 4, is characterized in that, described epoxy resin can by suitable warm, and the combination of light or additive method is cured.
10. the encapsulating structure of flexible OLED devices according to claim 1, is characterized in that, described OLED be in a vacuum or condition of nitrogen gas to remove aqueous vapor and oxygen and to complete encapsulation.
The encapsulating structure of 11. flexible OLED devices according to claim 1, is characterized in that, described OLED comprises:
Flexible and transparent or opaque conductive film flexibly;
Inorganic and/or the organic function layer of multilayer prepared by the transparent conductive film of flexible low water oxygen permeability;
Solwution method prepares individual layer or layer flexible low polymer, the water oxygen barrier layers such as resin;
The low water oxygen permeability packaging film of topmost.
The encapsulating structure of 12. flexible OLED devices according to claim 11, is characterized in that, described packaging film and flexible transparent conductive film are plastic film or the sheet of the transparent covering penetration barrier layer being applicable to OLED, and water vapor permeable rate is less than 10-4g/m
2/ day.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510700071.7A CN105280839A (en) | 2015-10-26 | 2015-10-26 | Package structure of flexible OLED (Organic Light Emitting Diode) device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510700071.7A CN105280839A (en) | 2015-10-26 | 2015-10-26 | Package structure of flexible OLED (Organic Light Emitting Diode) device |
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| CN105280839A true CN105280839A (en) | 2016-01-27 |
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| CN201510700071.7A Pending CN105280839A (en) | 2015-10-26 | 2015-10-26 | Package structure of flexible OLED (Organic Light Emitting Diode) device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107329303A (en) * | 2017-06-30 | 2017-11-07 | 联想(北京)有限公司 | A kind of preparation method of display screen, electronic equipment and display screen |
| WO2018000553A1 (en) * | 2016-06-27 | 2018-01-04 | 武汉华星光电技术有限公司 | Oled encapsulation structure |
| CN110061153A (en) * | 2019-04-12 | 2019-07-26 | 南京福仕保新材料有限公司 | The packaging method of organic electronic device multi-layered infrared photo-thermal curing encapsulation coating |
| CN110148671A (en) * | 2019-04-12 | 2019-08-20 | 南京福仕保新材料有限公司 | Organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively |
| CN113471395A (en) * | 2021-06-04 | 2021-10-01 | 西南大学 | Waterproof packaging method for flexible photoelectric device |
| US11322723B2 (en) | 2018-04-09 | 2022-05-03 | Boe Technology Group Co., Ltd. | Packaging structure including water-absorbing layer, display component and display device |
-
2015
- 2015-10-26 CN CN201510700071.7A patent/CN105280839A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000553A1 (en) * | 2016-06-27 | 2018-01-04 | 武汉华星光电技术有限公司 | Oled encapsulation structure |
| CN107329303A (en) * | 2017-06-30 | 2017-11-07 | 联想(北京)有限公司 | A kind of preparation method of display screen, electronic equipment and display screen |
| US11322723B2 (en) | 2018-04-09 | 2022-05-03 | Boe Technology Group Co., Ltd. | Packaging structure including water-absorbing layer, display component and display device |
| CN110061153A (en) * | 2019-04-12 | 2019-07-26 | 南京福仕保新材料有限公司 | The packaging method of organic electronic device multi-layered infrared photo-thermal curing encapsulation coating |
| CN110148671A (en) * | 2019-04-12 | 2019-08-20 | 南京福仕保新材料有限公司 | Organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively |
| CN113471395A (en) * | 2021-06-04 | 2021-10-01 | 西南大学 | Waterproof packaging method for flexible photoelectric device |
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Application publication date: 20160127 |