CN110128581B - 一种微带贴片天线的灌封工艺 - Google Patents
一种微带贴片天线的灌封工艺 Download PDFInfo
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Abstract
本发明公开了一种毫米波应答天线微带贴片的灌封工艺,属于应答天线封装领域。包括以下步骤:A以苯乙烯和含氟单体为原料,采用分散聚合法制备出含氟聚苯乙烯微球;B将步骤A得到的含氟聚苯乙烯微球继续进行发泡得一次发泡含氟聚苯乙烯微球;C将微带贴片放入模具中,将一次发泡含氟聚苯乙烯微球放入微带贴片与模具的间隙中后锁紧模具进行灌封。本发明通过采用含氟聚苯乙烯为灌封材料,不仅解决了发泡材料对微带贴片的附着力问题,而且由于含氟聚苯乙烯介电常数低,介电损耗低,发泡均匀性好等优点,还解决了毫米波天线微带贴片灌封封装介质插损大,透过率低等电性能问题。
Description
技术领域
本发明属于天线封装领域,具体涉及一种微带贴片天线的灌封工艺。
背景技术
微带贴片天线具有体积小、重量轻、剖面薄、易共形等诸多优点,在无线通信、远程遥感、航空航天等领域的应用十分广泛。
天线为提高产品的抗振动能力和防水性能,绝大多数均采用了在底板(或支架、腔体)、外罩、印制板的空隙空间填充灌封材料的结构方式,由于天线信号传输的需要,对外罩材料和灌封材料的选用均有比较特殊的要求。
目前常用的灌封材料为硬质聚氨酯发泡材料,这种材料具有介电常数小、密度小、不溶于水等特性,但是遇高温容易二次反应膨胀,从而导致天线鼓包、变形。
聚苯乙烯泡沫是以聚苯乙烯树脂为主体,加入发泡剂等添加剂制成。它具有闭孔结构,吸水性小,有优良的抗水性;密度小;机械强度好,缓冲性能优异;加工性好,易于模塑成型;温度适应性强,结构均匀。但是其对微带贴片没有附着力,不适合作为微带贴片天线的灌封材料。
发明内容
为了解决上述技术问题,本发明提供了一种微带贴片天线的灌封工艺,包括以下步骤:
A以苯乙烯和含氟单体为原料,采用分散聚合法制备出含氟聚苯乙烯微球;
B将步骤A得到的含氟聚苯乙烯微球发泡得一次发泡含氟聚苯乙烯微球;
C将微带贴片放入模具中,将一次发泡含氟聚苯乙烯微球放入微带贴片与模具的间隙中后锁紧模具进行灌封。
其中,上述的灌封工艺,步骤A满足以下至少一项:
所述苯乙烯与含氟单体质量比为18:2~6;
所述含氟单体为甲基丙烯酸十二氟庚酯;
所述制备温度为60~100℃;
所述制备时间为10~20h;
所述步骤A还包括催化剂、分散剂和溶剂。
其中,上述的灌封工艺,步骤A中,所述催化剂为偶氮二异丁腈;所述分散剂为聚乙烯吡咯烷酮;所述溶剂为乙醇和水的混合溶液,其中乙醇和水的体积比为1.5:1。
其中,上述的灌封工艺,步骤A中,所述催化剂的用量为原料用量的0.5~2.5wt%;所述分散剂的用量为原料用量的2~5.5wt%;所述溶剂与原料的体积重量比为8~10mL:1g。
其中,上述的灌封工艺,步骤B中,所述发泡的温度为80±5℃;所述发泡的时间为3~5min。
其中,上述的灌封工艺,所述一次发泡含氟聚苯乙烯微球的粒径为2000±100μm。
其中,上述的灌封工艺,步骤C中,所述灌封的温度为100~125℃。
其中,上述的灌封工艺,步骤C中,所述灌封的时间为40~60min。
其中,上述的灌封工艺,步骤C中,所述灌封的压力为35~90KPa。
本发明的有益效果:
本发明通过采用含氟聚苯乙烯为灌封材料,不仅解决了发泡材料对微带贴片的附着力问题,而且由于含氟聚苯乙烯介电常数低,介电损耗低,发泡均匀性好等优点,还解决了毫米波天线微带贴片灌封封装介质插损大,透过率低等电性能问题。
显然,根据本发明的上述内容,按照本领域的普通技术知识和惯用手段,在不脱离本发明上述基本技术思想前提下,还可以做出其它多种形式的修改、替换或变更。
以下通过实施例形式的具体实施方式,对本发明的上述内容再作进一步的详细说明。但不应将此理解为本发明上述主题的范围仅限于以下的实施例。凡基于本发明上述内容所实现的技术均属于本发明的范围。
附图说明
图1为灌封模具和灌封得到的微带片的示意图
图2为实施例1制备得到的一次发泡含氟聚苯乙烯微球。
图3为灌封模具。
图4为含氟聚苯乙烯灌封后得到微带贴片。
具体实施方式
灌封模具和灌封得到的微带片的示意图见图1。
实施例1
含氟聚苯乙烯的制备:在装有机械搅拌器、冷凝管和N2进出口装置的250mL三口瓶中,加入0.8g聚乙烯吡咯烷酮、108mL无水乙醇和72mL去离子水,搅拌均匀后置于温度为100℃的水浴中,然后加入18g苯乙烯单体,2g甲基丙烯酸十二氟庚酯和0.1g偶氮二异丁腈的混合液,搅拌(200r/min)反应12h,冷却后终止反应,除去未反应的单体和分散剂,最终得到白色粉末状的含氟聚苯乙烯微球。
一次发泡:将步骤1制备得到的含氟聚苯乙烯微球在80℃下进行发泡3min后得一次发泡含氟聚苯乙烯微球,粒径为2000±100μm,见图2。
灌封:将微带贴片放入模具中,将一次发泡含氟聚苯乙烯微球放入微带贴片与模具(见图3)的间隙中后锁紧模具,将模具置于压力为80KPa,110℃下灌封60min后即可,灌封后得微带贴片见图4。
实施例2
含氟聚苯乙烯的制备:在装有机械搅拌器、冷凝管和N2进出口装置的250mL三口瓶中,加入0.4g聚乙烯吡咯烷酮、108mL无水乙醇和72mL去离子水,搅拌均匀后置于温度为80℃的水浴中,然后加入18g苯乙烯单体,2g甲基丙烯酸十二氟庚酯和0.2g偶氮二异丁腈的混合液,搅拌(200r/min)反应10h,冷却后终止反应,除去未反应的单体和分散剂,最终得到白色粉末状的含氟聚苯乙烯微球。
一次发泡:将步骤1制备得到的含氟聚苯乙烯微球在80℃下进行发泡5min后得一次发泡含氟聚苯乙烯微球,粒径为2000±100μm。
灌封:将微带贴片放入模具中,将一次发泡含氟聚苯乙烯微球放入微带贴片与模具(见图2)的间隙中后锁紧模具,将模具置于压力为50KPa,100℃下灌封40min后即可。
Claims (9)
1.一种微带贴片天线的灌封工艺,其特征在于,包括以下步骤:
A以苯乙烯和甲基丙烯酸十二氟庚酯为原料,采用分散聚合法制备出含氟聚苯乙烯微球;
B将步骤A得到的含氟聚苯乙烯微球发泡得一次发泡含氟聚苯乙烯微球;
C将微带贴片放入模具中,将一次发泡含氟聚苯乙烯微球放入微带贴片与模具的间隙中后锁紧模具进行灌封;
步骤A中,所述苯乙烯与含氟单体质量比为18:2~6。
2.根据权利要求1所述的灌封工艺,其特征在于,步骤A满足以下至少一项:
所述制备温度为60~100℃;
所述制备时间为10~20h;
所述步骤A还包括催化剂、分散剂和溶剂。
3.根据权利要求2所述的灌封工艺,其特征在于,步骤A中,所述催化剂为偶氮二异丁腈;所述分散剂为聚乙烯吡咯烷酮;所述溶剂为乙醇和水的混合溶液,其中乙醇和水的体积比为1.5:1。
4.根据权利要求3所述的灌封工艺,其特征在于,步骤A中,所述催化剂的用量为原料用量的0.5~2.5wt%;所述分散剂的用量为原料用量的2~5.5wt%;所述溶剂与原料的体积重量比为8~10mL:1g。
5.根据权利要求1~4任一项所述的灌封工艺,其特征在于,步骤B中,所述发泡的温度为80±5℃;所述发泡的时间为3~5min。
6.根据权利要求5所述的灌封工艺,其特征在于,所述一次发泡含氟聚苯乙烯微球的粒径为2000±100μm。
7.根据权利要求1~4、6中的任一项所述的灌封工艺,其特征在于,步骤C中,所述灌封的温度为100~125℃。
8.根据权利要求7所述的灌封工艺,其特征在于,步骤C中,所述灌封的时间为40~60min。
9.根据权利要求8所述的灌封工艺,其特征在于,步骤C中,所述灌封的压力为35~90KPa。
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TW495528B (en) * | 1997-01-20 | 2002-07-21 | Sekisui Plastics | Expandable thermoplastic resin beads and expanded molded articles manufactured therefrom |
CN1478120A (zh) * | 2000-12-04 | 2004-02-25 | ���Ŵ�ѧ | 可发泡性聚合物组合物的泡沫多孔颗粒 |
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