CN110021534B - 一种避免假性瑕疵的晶圆流片表面平整度检测装置 - Google Patents
一种避免假性瑕疵的晶圆流片表面平整度检测装置 Download PDFInfo
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- CN110021534B CN110021534B CN201910165714.0A CN201910165714A CN110021534B CN 110021534 B CN110021534 B CN 110021534B CN 201910165714 A CN201910165714 A CN 201910165714A CN 110021534 B CN110021534 B CN 110021534B
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- 238000001514 detection method Methods 0.000 title claims abstract description 19
- 238000012360 testing method Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims description 24
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 230000007547 defect Effects 0.000 claims description 12
- 230000002950 deficient Effects 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 51
- 238000010586 diagram Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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Application Number | Priority Date | Filing Date | Title |
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CN201910165714.0A CN110021534B (zh) | 2019-03-06 | 2019-03-06 | 一种避免假性瑕疵的晶圆流片表面平整度检测装置 |
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CN201910165714.0A CN110021534B (zh) | 2019-03-06 | 2019-03-06 | 一种避免假性瑕疵的晶圆流片表面平整度检测装置 |
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CN110021534A CN110021534A (zh) | 2019-07-16 |
CN110021534B true CN110021534B (zh) | 2021-05-18 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114167335B (zh) * | 2020-09-10 | 2022-10-18 | 长鑫存储技术有限公司 | 新增检测工具的合格检验方法和检验*** |
CN113035750B (zh) * | 2021-03-02 | 2024-03-22 | 深圳鹏瑞智能科技股份有限公司 | 一种自动上下料的晶圆瑕疵测量装置及其使用方法 |
CN112893183B (zh) * | 2021-03-02 | 2023-03-28 | 深圳鹏瑞智能科技有限公司 | 一种异常数据提醒的在线连续式晶圆瑕疵测量方法 |
Family Cites Families (6)
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JP2007003459A (ja) * | 2005-06-27 | 2007-01-11 | Tokyo Seimitsu Co Ltd | 画像欠陥検査装置、外観検査装置及び画像欠陥検査方法 |
US7371590B2 (en) * | 2005-11-21 | 2008-05-13 | General Electric Company | Integrated inspection system and defect correction method |
JP4597155B2 (ja) * | 2007-03-12 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | データ処理装置、およびデータ処理方法 |
US9063097B2 (en) * | 2011-02-11 | 2015-06-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Systems and methods eliminating false defect detections |
JP2016072335A (ja) * | 2014-09-29 | 2016-05-09 | 株式会社Screenホールディングス | プロセス監視装置およびプロセス監視方法 |
CN109029335A (zh) * | 2018-09-12 | 2018-12-18 | 江苏英锐半导体有限公司 | 一种晶圆流片表面平整度检测装置 |
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