CN110010017A - A kind of LED light board fabrication method and product that external force resistance is hit - Google Patents
A kind of LED light board fabrication method and product that external force resistance is hit Download PDFInfo
- Publication number
- CN110010017A CN110010017A CN201910293302.5A CN201910293302A CN110010017A CN 110010017 A CN110010017 A CN 110010017A CN 201910293302 A CN201910293302 A CN 201910293302A CN 110010017 A CN110010017 A CN 110010017A
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- China
- Prior art keywords
- lamp bead
- circuit board
- pads
- fixed glue
- lamp
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A kind of LED light board fabrication method that external force resistance is hit, the LED lamp panel is included circuit board and is welded in several lamp beads of the circuit board surface with surface mount manner, each lamp bead is equipped with multiple pins, the circuit board corresponds to the pin equipped with multiple pads, comprising: coats tin cream in the board pads；Fixed glue is laid on at least part of circuit board or lamp bead, the fixed glue is the fixed glue of high temperature resistant；The lamp bead is attached on the circuit board；The circuit board for posting lamp bead feeding reflow oven is welded, makes the fixed glue by heat cure, the tin cream melting forms solder joint after cooling down again and is fixedly connected with the circuit board with the lamp bead.The present invention also provides the LED lamp panels that a kind of external force resistance is hit.The LED light board fabrication method and product that external force resistance provided by the invention is hit, accomplish the preparatory fixation of circuit board and lamp bead before welding, and lamp bead can be made to resist external force collision after welding, and the probability for hitting lamp failure is effectively reduced.
Description
Technical field
The present invention relates to field of display technology, the LED light board fabrication method hit more particularly to a kind of external force resistance and production
Product.
Background technique
Traditional light-emitting diode display, lamp plate 2 are easy to be detached from LED lamp bead pin 21 from pcb board 1 after by external force, custom
Claim desoldering.It may be that pin 21 is directly detached from from tin cream 3, it is also possible to which tin cream 3 is detached from (such as Fig. 1) from pcb board 1.As long as de-
It welds, this lamp just fails, and needs repairing.
This external force is very universal.In mounted LED lamp plate, disassembly, during carrying etc., it is easy to encounter LED lamp bead,
As lamp bead spacing is smaller and smaller, the lamp bead density of LED lamp panel is higher and higher, and this probability for hitting lamp is also higher and higher, influences
The use of client.
The LED lamp panel of small spacing develops into trend, but since lamp bead pin area is small, traditional weld strength becomes
Lower and lower, the probability for hitting lamp failure is higher and higher.
The narration of front is to provide general background information, might not constitute the prior art.
Summary of the invention
The purpose of the present invention is to provide LED light board fabrication methods and product that a kind of external force resistance is hit, can reduce and hit lamp
The probability of failure.
The present invention provides the LED light board fabrication method that a kind of external force resistance is hit, and the LED lamp panel includes circuit board and with table
Face mounting means is welded in several lamp beads of the circuit board surface, and each lamp bead is equipped with multiple pins, and the circuit board is corresponding
The pin is equipped with multiple pads, comprising: coats tin cream in the board pads；In at least part of circuit board or
Fixed glue is laid in lamp bead, the fixed glue is the fixed glue of high temperature resistant；The lamp bead is attached on the circuit board；It will post
The circuit board of the lamp bead is sent into reflow oven and is welded, and makes the fixed glue by heat cure, and the tin cream melting is cold again
But solder joint is formed afterwards to be fixedly connected with the circuit board with the lamp bead.
Further, when laying fixed glue, the fixed adhesive plaster is set to the circuit board, installation position is corresponding every
All pad area defined of one lamp bead.
Further, the installation position are as follows: if there are two pads for the corresponding lamp bead tool of the circuit board, lay position
Setting is region between described two pads；If there are three pads for the corresponding lamp bead tool of the circuit board, and described three are welded
Disk is located at three Angle Positions of a quadrangle, then installation position is the center of the quadrangle；If the circuit board pair
Answering a lamp bead tool, there are four pads, then installation position is the region between four pads；If the circuit board corresponding one
A lamp bead has more than four pads, and the pad forms multiple quadrangles, then installation position has multiple, is located at each
The center of the quadrangle.
Further, when laying fixed glue, all fixed adhesive plasters are disposably set to by the circuit using coating apparatus
Plate.
Further, when laying fixed glue, the fixed adhesive plaster is set to the lamp bead bottom, installation position is each
All pin area defined of lamp bead.
Further, the installation position are as follows: if there are two pins for lamp bead tool, installation position is described two draws
Region between foot；If there are three pins for the lamp bead tool, and three pins are located at three Angle Positions of a quadrangle,
Then installation position is the center of the quadrangle；If there are four pins for the lamp bead tool, installation position is described four
Region between pin；If the lamp bead has more than four pins, and the pin forms multiple quadrangles, then lays position
It is equipped with multiple, is located at the center of each quadrangle.
Further, when laying fixed glue, from top view, the fixed glue is rounded, and the center of circle is located at its week
The center of weld all around disk area defined, diameter are less than the distance between two pads around it, the corresponding fixed glue of each lamp bead
Area is greater than the 5% of the lamp bead bottom area.
Further, when laying fixed glue, the viscosity before the fixed adhesive curing is
150000-400000mpa.s, it is i.e. curable less than 3 minutes at 150 DEG C, and be resistant to 250 degree of high temperature 60 seconds with
On.
Further, it when laying fixed glue, is only laid in the peripheral position of the circuit board or is welded in the circuit
In the lamp bead of plate peripheral position.
The LED lamp panel that a kind of external force resistance is hit, including circuit board and the circuit board table is welded in surface mount manner
Several lamp beads in face, each lamp bead are equipped with multiple pins, and the circuit board corresponds to the pin equipped with multiple pads, the circuit
It is laid with fixed glue between plate and lamp bead, the fixed glue is the fixed glue of high temperature resistant, to fix the electricity after before welding
Road plate and lamp bead.
Further, the installation position of the fixed glue each lamp bead of correspondence all pad area defined, if
There are two pads for the corresponding lamp bead tool of the circuit board, then installation position is the region between described two pads；If described
There are three pads for the corresponding lamp bead tool of circuit board, and three pads are located at three Angle Positions of a quadrangle, then cloth
If position is the center of the quadrangle；If there are four pad, installation positions for the corresponding lamp bead tool of the circuit board
It is the region between four pads；If the corresponding lamp bead of the circuit board has more than four pads, and the weldering
Disk forms multiple quadrangles, then installation position has multiple, is located at the center of each quadrangle.
Further, the fixed glue is only laid in the peripheral position of the circuit board.
Further, from top view, the fixed glue is rounded, and the center of circle is located at the area that pad is surrounded around it
The center in domain, diameter are less than the distance between two pads around it, and the corresponding fixed glue surface product of each lamp bead is greater than the lamp bead
The 5% of bottom area.
Further, the viscosity before the fixed adhesive curing is 150000-400000mpa.s, less than 3 points at 150 DEG C
Clock, that is, curable, and it is resistant to 250 degree high temperature 60 seconds or more.
The LED light board fabrication method and product that external force resistance provided by the invention is hit, by at least part of electricity
The fixed glue of high temperature resistant is laid on road plate or lamp bead, to fix the circuit board and lamp bead after before welding, thus before welding
The preparatory fixation for accomplishing circuit board and lamp bead can make lamp bead resist external force collision after welding, the probability for hitting lamp failure is effectively reduced.
Detailed description of the invention
Fig. 1 is the failure factors schematic diagram of existing LED light board fabrication method.
Fig. 2 is the flow diagram for the LED light board fabrication method that external force resistance of the embodiment of the present invention is hit.
Fig. 3 is the schematic diagram of each steps flow chart of manufacturing method shown in Fig. 2.
Fig. 4 is to fix schematic diagram of the glue with respect to the first situation of the installation position of pad in manufacturing method shown in Fig. 2.
Fig. 5 is to fix schematic diagram of the glue with respect to the installation position second situation of pad in manufacturing method shown in Fig. 2.
Fig. 6 is to fix schematic diagram of the glue with respect to the third situation of the installation position of pad in manufacturing method shown in Fig. 2.
Fig. 7 is to fix schematic diagram of the glue with respect to the 4th kind of situation of installation position of pad in manufacturing method shown in Fig. 2.
Fig. 8 is to fix schematic diagram of the glue with respect to the 5th kind of situation of installation position of pad in manufacturing method shown in Fig. 2.
Fig. 9 is the schematic diagram that the installation position of glue opposing circuit board entirety is fixed in manufacturing method shown in Fig. 2.
Figure 10 is the structural schematic diagram for the LED lamp panel that external force resistance of the embodiment of the present invention is hit.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
Fig. 2 to Fig. 9 show the LED light board fabrication method of the present embodiment external force resistance shock.In the present embodiment, LED lamp panel
Several lamp beads 2 on 1 surface of circuit board are welded in including circuit board 1 and in a manner of surface installation (SMT).Each lamp bead 2 is equipped with more
A pin 21,1 corresponding pin 21 of circuit board are equipped with multiple pads 11.
As shown in Figure 2 and Figure 3, the LED light board fabrication method of the present embodiment external force resistance shock includes:
S1, tin cream 3 is coated in board pads 11；
S2, fixed glue 4 is laid at least part of circuit board 1 or lamp bead 2, and (Fig. 3 is shown to be laid admittedly on circuit boards
Determine glue), fixed glue 4 is the fixed glue of high temperature resistant；Laying mode can be dispensing or other similar techniques；
S3, lamp bead 2 is attached on circuit board 1；
S4, the circuit board 1 for posting lamp bead 2 feeding reflow oven is welded, fixed glue 4 is melted again by heat cure, tin cream 3
Solder joint 30 is formed after cooling to be fixedly connected with circuit board 1 with lamp bead 2.
Wherein, the sequence of step S1 and S2 does not limit, and can first carry out step S1 and carry out step S2 again, can also first be walked
Rapid S2 carries out step S1 again.Fig. 3 show first progress step S1 and carries out step S2 again.
In the present embodiment, the quick-setting epoxy adhesive of energy after fixed glue selection is heated, viscosity before curing are
150000-400000mpa.s, it is i.e. curable less than 3 minutes at 150 DEG C, and be resistant to 250 degree high temperature 60 seconds or more, with can be
Solidify in SMT welding process, and will not be damaged because of high temperature after solidifying.
In step s 2, when laying fixed glue 4, fixed glue 4 can be laid in circuit board 1, installation position can be in correspondence
11 area defined of all pads of each lamp bead.Specifically, if the corresponding lamp bead 2 of circuit board 1 has, there are two pads
11, then installation position is the region (such as Fig. 4) between two pads 11；If there are three pads for a corresponding lamp bead 2 tool of circuit board 1
11, and three pads 11 are located at three Angle Positions of a quadrangle, then installation position is the center of quadrangle (as schemed
5)；If a corresponding lamp bead 2 tool of circuit board 1, there are four pad 11, installation position is that the region between four pads 11 (is such as schemed
6)；If the corresponding lamp bead 2 of circuit board 1 has more than four pads 11, and pad 11 forms multiple quadrangles, then lays position
It is equipped with multiple, being located at the center of each quadrangle, (such as Fig. 7 and Fig. 8 respectively indicate corresponding 6 pads and 9 of lamp bead
The situation of a pad).When laying fixed glue 4, coating apparatus can be used, all fixed glue 4 is disposably laid in circuit board 1,
It can be obviously improved coating efficiency in this way.
In step s 2, when laying fixed glue, fixed adhesive plaster is also set to lamp bead bottom, installation position is in each lamp bead
All pin area defined.Specifically, if lamp bead has, there are two pins, and installation position is between two pins
Region；If there are three pins for lamp bead tool, and three pins are located at three Angle Positions of a quadrangle, then installation position is four sides
The center of shape；If there are four pins for lamp bead tool, installation position is the region between four pins；If there are four lamp bead tools
Above pin, and pin forms multiple quadrangles, then installation position has multiple, is located at the center of each quadrangle.
Because the above-mentioned position being laid in lamp bead is corresponding with the position being laid on circuit board, so in addition schematic diagram is not provided,
It is appreciated that according to above-mentioned Fig. 4 to Fig. 7.
In step s 2, when laying fixed glue, the size of fixed glue and position need strict control, from top view
It sees, fixed glue is rounded, and the center of circle is located at the center of pad area defined around it.Area cannot be too big, and diameter is answered small
The distance between two pads around it cross pad to avoid fixed Jiao Gai, influence the welding effect of circuit board 1 Yu lamp bead 2；But
Can not be too small, the corresponding fixed glue surface product of each lamp bead is greater than the 5% of the lamp bead bottom area, to guarantee that its fixes effect
Fruit.
In step s 2, as shown in figure 9, generally speaking with regard to circuit board, when laying fixed glue 4, can only be laid in circuit
Plate 1 peripheral position (Fig. 9 be only set to circuit board 1 outermost one circle, in other embodiments, can also only be set to it is outermost two circle or its
Its multi-turn, but first lap is generally set to between the 4th circle) or be welded in the lamp bead 2 of the above-mentioned peripheral position of circuit board 1,
Reinforcement fixation is carried out to the peripheral position for being most susceptible to external force collision in this way, can be saved on the basis of guaranteeing fixed effect at
Originally, process is reduced.Certainly, in other embodiments, circuit board whole region can also be set to namely all lamp beads is laid
Fixed glue is fixed, and more can guarantee the effect that external force resistance is hit.
As shown in Figure 10, the LED lamp panel that the present embodiment external force resistance is hit is included circuit board 1 and is welded with surface mount manner
Several lamp beads 2 in 1 surface of circuit board, each lamp bead 2 are equipped with multiple pins 21, and 1 corresponding pin 21 of circuit board is equipped with multiple welderings
Disk 11, the solder joint 30 that pin 21 is formed after being cooled down again with pad 11 by the melting of tin cream 3 are connect, cloth between circuit board 1 and lamp bead 2
Equipped with fixed glue 4.Fixed glue 4 is the fixed glue of high temperature resistant, to rear fixing circuit board 1 and lamp bead 2 before welding.
In the present embodiment, the installation position of the opposite pad 11 of fixed glue 4 is enclosed in all pads 11 of each lamp bead of correspondence
At region.It can refer to Fig. 4 to Fig. 8, specifically, there are two pad, installation positions if the corresponding lamp bead of circuit board has
It is the region between two pads；If there are three pads for the corresponding lamp bead tool of circuit board, and three pads are located at four sides
Three Angle Positions of shape, then installation position is the center of quadrangle；If the corresponding lamp bead of circuit board has there are four pad,
Then installation position is the region between four pads；If the corresponding lamp bead of circuit board has more than four pads, and pad
Multiple quadrangles are formed, then installation position has multiple, is located at the center of each quadrangle.
In the present embodiment, installation position of the fixed glue 4 in circuit board on the whole can refer to Fig. 9, and fixed glue 4 is only laid in
The peripheral position of circuit board 1.Certainly, in other embodiments, can also be set to circuit board whole region namely all lamp beads into
Row is laid fixed glue and is fixed, and more can guarantee the effect that external force resistance is hit.
Compared with prior art, LED light board fabrication method and product that external force resistance provided in this embodiment is hit, by
The fixed glue of high temperature resistant is laid at least part of circuit board or lamp bead, with rear fixing circuit board and lamp bead before welding, so that
The preparatory fixation for accomplishing circuit board and lamp bead before welding can make lamp bead resist external force collision, to dramatically increase LED after welding
Adhesive force of the lamp bead on pcb board, make LED lamp bead by external force after, it is not easy to desoldering；LED display is greatly reduced to pacify
Dress uses the dead lamp rate during a.
Herein, term " on ", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outside", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal" is to be based on the orientation or positional relationship shown in the drawings, merely to expression skill
The clear and description of art scheme is convenient, therefore is not considered as limiting the invention.
Herein, the terms "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, are removed
It comprising those of listed element, but also may include other elements that are not explicitly listed.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. the LED light board fabrication method that a kind of external force resistance is hit, the LED lamp panel are included circuit board and are welded with surface mount manner
Several lamp beads of the circuit board surface are connected to, each lamp bead is equipped with multiple pins, and the circuit board corresponds to the pin and is equipped with
Multiple pads characterized by comprising coat tin cream in the board pads；In at least part of circuit board or
Fixed glue is laid in lamp bead, the fixed glue is the fixed glue of high temperature resistant；The lamp bead is attached on the circuit board；It will post
The circuit board of the lamp bead is sent into reflow oven and is welded, and makes the fixed glue by heat cure, and the tin cream melting is cold again
But solder joint is formed afterwards to be fixedly connected with the circuit board with the lamp bead.
2. manufacturing method as described in claim 1, which is characterized in that when laying fixed glue, the fixed adhesive plaster is set to
The circuit board, all pad area defined of the installation position in each lamp bead of correspondence, the installation position are as follows: if described
There are two pads for the corresponding lamp bead tool of circuit board, then installation position is the region between described two pads；If the circuit
There are three pads for the corresponding lamp bead tool of plate, and three pads are located at three Angle Positions of a quadrangle, then lay position
Set be the quadrangle center；If there are four pads for the corresponding lamp bead tool of the circuit board, installation position is institute
State the region between four pads；If the corresponding lamp bead of the circuit board has more than four pads, and the pad shape
At multiple quadrangles, then installation position has multiple, is located at the center of each quadrangle.
3. manufacturing method as claimed in claim 2, which is characterized in that disposable using coating apparatus when laying fixed glue
All fixed adhesive plasters are set to the circuit board.
4. manufacturing method as described in claim 1, which is characterized in that when laying fixed glue, the fixed adhesive plaster is set to
The lamp bead bottom, all pin area defined of the installation position in each lamp bead, the installation position are as follows: if the lamp
There are two pins for pearl tool, then installation position is the region between described two pins；If the lamp bead has, there are three pins, and institute
Three Angle Positions that three pins are located at a quadrangle are stated, then installation position is the center of the quadrangle；If described
There are four pins for lamp bead tool, then installation position is the region between four pins；If the lamp bead has more than four
Pin, and the pin forms multiple quadrangles, then installation position has multiple, is located at the centre bit of each quadrangle
It sets.
5. manufacturing method as described in claim 1, which is characterized in that described solid from top view when laying fixed glue
Determine that glue is rounded, the center of circle is located at the center of pad area defined around it, and diameter is less than around it between two pads
Distance, the corresponding fixed glue surface product of each lamp bead are greater than the 5% of the lamp bead bottom area.
6. manufacturing method as described in claim 1, which is characterized in that when laying fixed glue, before the fixed adhesive curing
Viscosity is 150000-400000mpa.s, i.e. curable less than 3 minutes at 150 DEG C, and is resistant to 250 degree high temperature 60 seconds or more.
7. manufacturing method as described in claim 1, which is characterized in that when laying fixed glue, be only laid in the circuit board
Peripheral position or be welded in the lamp bead of the circuit board peripheral position.
8. the LED lamp panel that a kind of external force resistance is hit, which is characterized in that be welded in including circuit board and with surface mount manner described
Several lamp beads of circuit board surface, each lamp bead are equipped with multiple pins, and the circuit board corresponds to the pin and is equipped with multiple pads,
It is laid with fixed glue between the circuit board and lamp bead, the fixed glue is the fixed glue of high temperature resistant, to solid after before welding
The fixed circuit board and lamp bead.
9. LED lamp panel as claimed in claim 8, which is characterized in that from top view, the fixed glue is rounded, circle
The heart is located at the center of pad area defined around it, and diameter is less than the distance between two pads, each lamp bead pair around it
The fixation glue surface product answered is greater than the 5% of the lamp bead bottom area.
10. LED lamp panel as claimed in claim 8, which is characterized in that the viscosity before the fixed adhesive curing is 150000-
400000mpa.s, it is i.e. curable less than 3 minutes at 150 DEG C, and it is resistant to 250 degree high temperature 60 seconds or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910293302.5A CN110010017A (en) | 2019-04-12 | 2019-04-12 | A kind of LED light board fabrication method and product that external force resistance is hit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910293302.5A CN110010017A (en) | 2019-04-12 | 2019-04-12 | A kind of LED light board fabrication method and product that external force resistance is hit |
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| Publication Number | Publication Date |
|---|---|
| CN110010017A true CN110010017A (en) | 2019-07-12 |
Family
ID=67171378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910293302.5A Pending CN110010017A (en) | 2019-04-12 | 2019-04-12 | A kind of LED light board fabrication method and product that external force resistance is hit |
Country Status (1)
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| CN (1) | CN110010017A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110390890A (en) * | 2019-08-01 | 2019-10-29 | 深圳市恒利普智能显示有限公司 | The production method of lamp bar and lamp bar |
| CN111010805A (en) * | 2019-12-20 | 2020-04-14 | 深圳市南极光电子科技股份有限公司 | LED lamp bead fixing method, LED lamp strip and mobile terminal |
| CN111192946A (en) * | 2020-01-10 | 2020-05-22 | 深圳市隆利科技股份有限公司 | LED dispensing method |
| CN111192948A (en) * | 2020-01-10 | 2020-05-22 | 深圳市隆利科技股份有限公司 | LED dispensing method |
| WO2023246438A1 (en) * | 2022-06-21 | 2023-12-28 | 西安青松光电技术有限公司 | Adhesive dispensing method for lamp beads in led lamp panel, and led display screen |
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| CN110390890A (en) * | 2019-08-01 | 2019-10-29 | 深圳市恒利普智能显示有限公司 | The production method of lamp bar and lamp bar |
| CN111010805A (en) * | 2019-12-20 | 2020-04-14 | 深圳市南极光电子科技股份有限公司 | LED lamp bead fixing method, LED lamp strip and mobile terminal |
| CN111010805B (en) * | 2019-12-20 | 2022-01-11 | 深圳市南极光电子科技股份有限公司 | LED lamp bead fixing method, LED lamp strip and mobile terminal |
| CN111192946A (en) * | 2020-01-10 | 2020-05-22 | 深圳市隆利科技股份有限公司 | LED dispensing method |
| CN111192948A (en) * | 2020-01-10 | 2020-05-22 | 深圳市隆利科技股份有限公司 | LED dispensing method |
| WO2023246438A1 (en) * | 2022-06-21 | 2023-12-28 | 西安青松光电技术有限公司 | Adhesive dispensing method for lamp beads in led lamp panel, and led display screen |
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