WO2023246438A1 - Adhesive dispensing method for lamp beads in led lamp panel, and led display screen - Google Patents

Adhesive dispensing method for lamp beads in led lamp panel, and led display screen Download PDF

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Publication number
WO2023246438A1
WO2023246438A1 PCT/CN2023/097118 CN2023097118W WO2023246438A1 WO 2023246438 A1 WO2023246438 A1 WO 2023246438A1 CN 2023097118 W CN2023097118 W CN 2023097118W WO 2023246438 A1 WO2023246438 A1 WO 2023246438A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
led lamp
lamp beads
dispensing
led
Prior art date
Application number
PCT/CN2023/097118
Other languages
French (fr)
Chinese (zh)
Inventor
蓝荣南
吴春光
Original Assignee
西安青松光电技术有限公司
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Publication date
Application filed by 西安青松光电技术有限公司 filed Critical 西安青松光电技术有限公司
Publication of WO2023246438A1 publication Critical patent/WO2023246438A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • This application relates to display screen design technology, for example, to a dispensing method of lamp beads in an LED lamp panel and an LED display screen.
  • the LED display screen is a flat-panel display used to display various information such as text, images, and videos.
  • the LED display screen includes a substrate, a plurality of different devices and a plurality of LED lamp beads. Each device is located on the first side of the substrate, and each LED lamp bead is located on the second side of the substrate opposite to the first side. LED lamp beads adjacent to the edge of the substrate are easy to fall off the substrate (also called lamp drop). In the production process, transportation process, and LED screen installation process, lights may fall out. Glue can be dispensed between two adjacent LED lamp beads to fix the LED lamp beads, thereby increasing the thrust of the LED lamp beads and avoiding the color difference of the LED display caused by falling lamps and colloid.
  • This application provides a glue dispensing method for lamp beads in an LED lamp panel and an LED display screen, which can reduce the color difference of the LED display screen caused by colloid, saving time and cost.
  • this application provides a method for dispensing lamp beads in an LED lamp panel.
  • the LED lamp panel includes a circuit board and a plurality of LED lamp beads arranged on the circuit board.
  • the method for dispensing lamp beads in an LED lamp panel includes :
  • each glue dispensing area is adjacent to the edge of the circuit board, and each glue dispensing area has at least one glue point;
  • the application provides a dispensing method for lamp beads in an LED lamp panel.
  • the dispensing process is performed on the circuit board to form multiple spaced dispensing areas, including:
  • Each dispensing area is surrounded by at least three circles from the outside to the inside.
  • the application provides a dispensing method for lamp beads in an LED lamp panel.
  • the dispensing process is performed on the circuit board to form multiple spaced dispensing areas, including:
  • Glue dispensing is performed on the circuit board to form multiple spaced glue dispensing areas, and the number of glue dots in each dispensing area is greater than or equal to one and less than or equal to four.
  • this application provides a dispensing method for lamp beads in an LED lamp panel.
  • the LED lamp beads corresponding to the dispensing area include a lamp body and a plurality of pins.
  • the pins are located on the bottom surface of the lamp body.
  • the bottom surface of the lamp body also has a recessed part and two convex parts, the recessed part is located between the two convex parts, and the recessed part and the convex part are located in the area surrounded by each pin;
  • SMD installation of LED lamp beads on the circuit board includes:
  • Paste LED lamp beads on the circuit board in the form of an array in which each raised portion of the LED lamp beads corresponding to the glue dispensing area corresponds to at least one glue dot, and the pins correspond to the solder paste.
  • the application provides a dispensing method for lamp beads in an LED lamp panel.
  • the dispensing process is performed on the circuit board to form multiple spaced dispensing areas, including:
  • the dispensing equipment is used to dispens glue on the circuit board to form multiple spaced dispensing areas.
  • this application provides a dispensing method for lamp beads in an LED lamp panel, and fixing the circuit board includes:
  • the method for dispensing lamp beads in an LED lamp panel provided by this application also includes: before dispensing the glue on the circuit board:
  • this application provides a dispensing method for lamp beads in an LED lamp panel.
  • SMD mounting of LED lamp beads on the circuit board includes:
  • embodiments of the present application also provide an LED display screen, including an LED display screen body and an LED light panel disposed on the LED display screen body.
  • the LED light panel includes a circuit board and a plurality of LEDs located on the circuit board. Lamp beads, wherein the LED lamp beads are fixed on the circuit board through the glue dispensing method of the lamp beads in the LED lamp panel provided in the first aspect.
  • the LED lamp beads are TOP-type LED lamp beads.
  • the dispensing method of lamp beads in the LED lamp panel and the LED display screen provided by this application are set up in parts prone to lamp failure. Glue dots and solder paste are used to fix the LED lamp beads, and solder paste is used to fix the LED lamp beads in the parts where the lamp is less likely to fall off.
  • the LED lamp beads adjacent to the edge of the circuit board are fixed on the circuit board through glue dots and solder paste in the dispensing area, and the remaining LED lamp beads are fixed on the circuit board through solder paste, without the need for all LED lamps.
  • the beads are all set with glue points, which saves time and cost and improves efficiency.
  • the LED lamp beads can block the glue points and prevent the glue points from leaking out of the LED lamp beads. In this way, when observing the LED light panel from the side of the LED lamp beads, it is difficult to observe the glue points. Therefore, , can reduce the color difference of LED display caused by colloid.
  • Figure 1 is a flow chart of a dispensing method for lamp beads in an LED lamp panel provided by an embodiment of the present application
  • Figure 2 is a schematic structural diagram of an LED light panel
  • Figure 3 is a structural diagram of printing solder paste on a circuit board in the dispensing method of lamp beads in an LED lamp board provided by the embodiment of the present application;
  • Figure 4 is a structural diagram of the circuit board after dispensing treatment in the dispensing method of lamp beads in the LED lamp board provided by the embodiment of the present application;
  • Figure 5 is a structural diagram after pasting LED lamp beads on the circuit board in the dispensing method of lamp beads in the LED lamp panel provided by the embodiment of the present application;
  • Figure 6 is a schematic structural diagram of an LED lamp bead
  • Figure 7 is a cross-sectional view of the A-A section in Figure 6;
  • Fig. 8 is a cross-sectional view of the B-B section in Fig. 6 .
  • connection should be understood in a broad sense.
  • it can be a fixed connection or an intermediate connection.
  • the medium is indirectly connected, which can be the internal connection between two components or the interaction between two components.
  • the LED display screen is a flat-panel display used to display various information such as text, images, and videos.
  • LED display screen integrates microelectronics technology, computer technology, and information processing. It has the advantages of bright color, wide dynamic range, high brightness, long life, stable and reliable operation, etc. LED display screen is widely used in commercial media, cultural performance market, sports Venues, information dissemination, news releases, securities trading, etc. can meet the needs of different environments.
  • LED Light Emitting Diode
  • Ga gallium
  • As arsenic
  • P phosphorus
  • N nitrogen
  • In indium
  • the made diode can radiate visible light when electrons and holes recombine, so it can be used to make light-emitting diodes. in circuits and instruments as an indicator light, or to form a text or digital display.
  • Gallium arsenide phosphorus diodes emit red light
  • gallium phosphide diodes emit green light
  • silicon carbide diodes emit yellow light
  • indium gallium nitrogen diodes emit blue light.
  • the LED display screen includes a light board, which has an LED surface and a Printed Circuit Board (PCB) surface.
  • the circuit board surface includes a substrate and devices (such as chips, resistor-capacitor components, connectors, etc.) arranged on the first surface of the substrate.
  • the above-mentioned devices are fixed on the substrate using a reflow soldering process.
  • the second side of the substrate opposite to the first side has a plurality of LED lamp beads, and a reflow soldering process is used to fix the LED lamp beads on the second side of the substrate.
  • the second surface covered with LED lamp beads can be called the LED surface, and the distance between the LED lamp beads and the edge of the PCB is less than or equal to 0.2mm.
  • the size of the LED lamp bead is also relatively small, usually between 1mm ⁇ 1mm and 2mm ⁇ 2mm.
  • the thrust of the LED lamp bead (thrust force refers to the force required to push the LED lamp bead off the PCB) is usually about 15N. , that is, 1.5 kilograms of force. Because the LED lamp beads have small thrust and are very close to the edge of the PCB, the LED lamp beads are easy to fall off the PCB (also called lamp drop). In the production process, transportation process, and LED screen installation process, lights may fall out.
  • the LED lamp beads have been reflow soldered to form an LED lamp board.
  • Glue is dispensed between two adjacent LED lamp beads to fix the LED lamp beads, thereby increasing the thrust of the LED lamp beads and preventing the lamp from falling off.
  • Due to the presence of colloid in the glued area there will be a color difference between the glued area and the non-glued area.
  • the dispensing colloid needs to be preheated to a preset temperature.
  • the dispensing amount is set according to the distance between the LED lamp beads.
  • a heating table is used to bake the LED light panel.
  • the baking causes the colloid to solidify.
  • the LED lamp beads are fixed on the PCB.
  • glue dispensing is performed on the entire LED light panel, which increases costs and wastes time.
  • this application provides a glue dispensing method for lamp beads in an LED lamp panel and an LED display screen, which can reduce the color difference of the LED display screen caused by the colloid while saving time and cost.
  • Figure 1 is a flow chart of a dispensing method of lamp beads in an LED lamp panel provided by an embodiment of the present application
  • Figure 2 is a schematic structural diagram of an LED light panel
  • Figure 3 is a diagram of the dispensing method of lamp beads in an LED lamp panel provided by an embodiment of the present application. Structural diagram of printing solder paste on a circuit board using the glue method.
  • the dispensing method of lamp beads in LED light panels provided by this application includes:
  • the LED lamp board includes a circuit board 100 and a plurality of LED lamp beads 300 arranged on the circuit board 100.
  • the circuit board 100 is electrically connected to each LED lamp bead 300.
  • the LED lamp beads 300 can be arranged in an array on the circuit board 100, for example, a rectangular array or other arrangements commonly used in the art. For convenience of description, the LED lamp beads are used below.
  • the lamp beads 300 are arranged on the circuit board 100 in the form of a rectangular array for illustration.
  • the circuit board 100 is fixed on the workbench of the reflow soldering machine, and the circuit board 100 is fixed by a clamp on the workbench to prevent the circuit board 100 from moving on the workbench.
  • the solder paste 200 is a soldering material.
  • the solder paste 200 is a paste-like mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc.
  • Solder paste 200 is mainly used for soldering electronic components.
  • the quantity of the solder paste 200 is set according to the number of LED lamp beads 300 to be installed on the circuit board 100, the position of the LED lamp beads 300, and the number of pins 310 of the LED lamp beads 300. , as long as the LED lamp beads 300 can be firmly welded to the circuit board 100. For example, if the LED lamp bead 300 has four pins 310, one solder paste 200 is provided for each pin 310.
  • each glue dispensing area is adjacent to an edge of the circuit board 100, and each glue dispensing area has at least one glue point 400.
  • FIG 4 is a structural diagram of a circuit board after dispensing treatment in the dispensing method of lamp beads in an LED lamp board provided by an embodiment of the present application.
  • the LED lamp beads 300 adjacent to the edge of the circuit board 100 are easy to fall from the circuit board 100, and the remaining LED lamp beads 300 are not easy to fall. . Therefore, after the solder paste 200 is placed corresponding to the LED lamp bead 300 adjacent to the edge of the circuit board 100, the present application sets glue dots 400 at the edge of the circuit board 100, where the glue dots 400 and the solder paste 200 are located on the edge of the circuit board 100. On the same surface, the glue points 400 are located in the area surrounded by the solder pastes 200 corresponding to the same LED lamp bead 300. The LED lamp beads 300 are fixed together by the solder paste 200 and the glue points 400.
  • S103 SMD-mount the LED lamp beads 300 on the circuit board 100.
  • the dispensing area corresponds to the bottom of the LED lamp beads 300 adjacent to the edge of the circuit board 100.
  • Each LED lamp bead 300 is in contact with the solder paste. 200 corresponds.
  • Figure 5 is a structural diagram after pasting LED lamp beads on the circuit board in the dispensing method of lamp beads in the LED lamp panel provided by the embodiment of the present application.
  • the circuit board 100 can be placed on a placement machine, and the LED lamp beads 300 can be mounted on the circuit board 100 of the placement machine.
  • the side of the circuit board 100 with the solder paste 200 is attached to the LED lamp board.
  • the LED lamp beads 300 represented by the solid lines in Figure 5 correspond to the solder paste 200
  • the LED lamp beads 300 represented by the dotted lines correspond to the glue dots 400 and the solder paste 200.
  • the LED lamp beads 300 cover the glue points 400 in the glue dispensing area.
  • the LED lamp beads 300 can block the glue points 400 and prevent the glue points 400 from leaking out of the LED lamp beads 300. In this way, the LED lamp board can be observed from the side of the LED lamp beads 300.
  • the glue dots 400 are difficult to observe, thereby reducing the color difference of the LED display screen caused by the glue.
  • the circuit board 100 with the LED lamp beads 300 is placed in a reflow soldering machine.
  • the heating circuit in the reflow soldering machine heats air or nitrogen to a preset temperature and then blows it toward the circuit board with the LED lamp beads 300 . 100, to melt the glue dots 400 and the solder paste 200, thereby bonding the LED lamp beads 300 to the circuit board 100.
  • the LED lamp beads 300 adjacent to the edge of the circuit board 100 are fixed on the circuit board 100 through the glue dots 400 and solder paste 200 in the dispensing area, and the remaining LED lamp beads 300 are fixed on the circuit board 100 through the solder paste 200 .
  • the method for dispensing lamp beads in an LED lamp board is to set glue dots 400 and solder paste 200 to fix the LED lamp beads 300 in the parts where the lamps are prone to drop out, and to fix the LED lamps by setting solder paste 200 in the parts where the lamps are less likely to drop out. beads 300.
  • the LED lamp beads 300 adjacent to the edge of the circuit board 100 are fixed on the circuit board 100 through the glue dots 400 and solder paste 200 in the dispensing area, and the remaining LED lamp beads 300 are fixed on the circuit board through the solder paste 200 On the board 100, there is no need to set glue points on all LED lamp beads, which saves time and cost and improves efficiency.
  • the LED lamp beads 300 can block the glue points 400 and prevent the glue points 400 from leaking out of the LED lamp beads 300. In this way, it is difficult to observe the LED lamp board from the side of the LED lamp beads 300. 400 glue dots were observed, thus the color difference of the LED display screen caused by the colloid can be reduced.
  • the fallen lights are all concentrated near the edge of the circuit board 100 , because the LED lamp beads 300 at the edge of the circuit board 100 will be knocked off by external force from the side of the circuit board 100 . Even if the middle position of the circuit board 100 is impacted, it is from the front of the circuit board 100 or from the front of the circuit board 100 at an oblique angle. The impact at this time cannot cause the LED lamp bead 300 to fall. However, after the outermost ring of LED lamp beads 300 is stressed, it may squeeze the adjacent ring of LED lamp beads 300 to the outermost ring of LED lamp beads 300 . Therefore, in some embodiments, performing a dispensing process on the circuit board 100 to form a plurality of spaced dispensing areas includes:
  • a dispensing process is performed on the circuit board 100 to form a plurality of spaced dispensing areas.
  • Each dispensing area is surrounded by at least three circles from the outside to the inside. That is to say, at least three circles of LED lamp beads 300 on the circuit board 100 from the outside to the inside of the circuit board 100 have glue dots 400 at their bottoms, thereby preventing the lamp from falling off on the LED lamp board.
  • the number of glue dots 400 in each glue dispensing area is greater than or equal to one and less than or equal to four.
  • the stability of the LED lamp bead 300 on the circuit board 100 is improved.
  • the number of glue dots 400 in each glue dispensing area is greater than or equal to two and less than or equal to four. Because when the glue point 400 is higher than the solder paste 200, a glue point 400 is set, the LED lamp bead 300 first contacts the glue point 400, and the LED lamp bead 300 is supported by a glue point 400, and the LED lamp bead 300 will be skewed. , therefore, two, three or four glue points 400 corresponding to the LED lamp beads 300 are set to prevent the LED lamp beads 300 from being skewed. Due to the size limitation of the LED lamp bead 300, in one embodiment, two glue points 400 corresponding to the LED lamp bead 300 are provided.
  • FIG. 6 is a schematic structural diagram of an LED lamp bead
  • Figure 7 is a cross-sectional view of the A-A section in Figure 6
  • Figure 8 is a cross-sectional view of the B-B section in Figure 6.
  • the LED lamp beads 300 corresponding to the dispensing area and the remaining LED lamp beads 300 can all be TOP type LED lamp beads 300.
  • the TOP type LED lamp beads 300 can include a lamp body 320 and a plurality of The pin 310 is located on the bottom surface of the lamp body 320.
  • the bottom surface of the lamp body 320 also has a recessed portion 330 and two protruding portions 340.
  • the recessed portion 330 is located between the two protruding portions 340.
  • the raised portion 340 is located in the area surrounded by each pin 310 .
  • the recessed portion 330 is a feed port for molding the LED lamp bead 300. Since the feed port has burrs, the center of the bottom of the LED lamp bead 300 is usually designed to be a concave circle.
  • the glue dot 400 may correspond to the recessed portion 330 , that is, the glue dot 400 is provided in the middle of the bottom of the LED lamp bead 300 .
  • Glue dots 400 can also be provided at the position of the protruding portion 340. Compared with the corresponding glue dots 400 provided at the recessed portion 330, the amount of glue used for the glue dots 400 corresponding to the protruding portion 340 is smaller.
  • patch mounting the LED lamp beads 300 on the circuit board 100 includes:
  • LED lamp beads 300 are mounted on the circuit board 100 in an array, wherein each raised portion 340 in the LED lamp beads 300 corresponding to the glue dispensing area corresponds to at least one glue dot 400, and the pins 310 correspond to the solder paste 200.
  • the application provides a dispensing method for lamp beads in an LED lamp panel.
  • the dispensing process is performed on the circuit board 100 to form multiple spaced dispensing areas, including:
  • the glue dispensing equipment is used to perform glue dispensing processing on the circuit board 100 to form multiple spaced glue dispensing areas. Therefore, the operation is convenient and the glue dispensing position is accurately positioned.
  • the dispensing equipment may include components such as a frame, a transmission structure, a controller, a servo positioning system, an optical positioning system, a dispensing machine, an air compressor, etc.
  • the frame is fixed on the installation surface (such as the ground),
  • the transmission structure, servo positioning system, optical positioning system, dispensing machine and air compressor are all electrically connected to the controller.
  • the servo positioning system includes a servo motor and a transmission mechanism.
  • the dispensing machine is fixed on the transmission mechanism.
  • the servo motor drives the dispensing machine to move through the transmission mechanism.
  • the transmission structure sends the circuit board 100 to a predetermined position.
  • the optical positioning system uses a camera to image the pads on the circuit board 100 and transmits it to the controller.
  • the controller analyzes the image and controls the optical positioning system to perform optical positioning to determine According to the coordinates of the glue spots 400 required on the circuit board 100, the servo motor drives the dispensing machine to move through the transmission mechanism according to the coordinates of the glue spots 400 to dispense glue on the circuit board 100.
  • the air compressor is used to provide gas to the glue barrel of the dispensing machine so that the colloid in the glue barrel flows out for dispensing.
  • the dispensing method for lamp beads in an LED lamp panel provided by this application also includes: before performing the dispensing process on the circuit board 100:
  • An embodiment of the present application also provides an LED display screen, which includes an LED display screen body and an LED light panel disposed on the LED display screen body.
  • the LED light panel includes a circuit board 100 and a plurality of LEDs located on the circuit board 100 Lamp bead 300, wherein the LED lamp bead 300 is fixed on the circuit board 100 through the glue dispensing method of the lamp bead in the LED lamp board provided in the above embodiment.
  • the LED light panel in the LED display screen of this application is formed by the above-mentioned dispensing method of lamp beads in the LED light panel.
  • the LED light panel production line in the related technology can be directly used and a dispensing equipment can be added.
  • the high temperature in the reflow soldering process can be used to solidify the LED lamp beads 300, without the need for separate heating stages and other equipment like the dispensing process in related technologies.
  • this application adopts local dispensing method to avoid dispensing glue on the entire circuit board.
  • the number of LED lamp beads 300 that need to be dispensed is small, the amount of glue used is small, the production efficiency is high, and materials are saved.
  • the glue dots 400 of this application are at the bottom of the LED lamp bead 300. Since the distance between the bottom of the LED lamp bead 300 and the circuit board 100 is small, very thin glue dots 400 can cause the LED lamp bead 300 and the circuit board 100 to bond. Compared with the side dispensing of the LED lamp bead 300 in the related art, material can be greatly saved and the stability of the LED lamp bead 300 can be significantly increased. Setting multiple glue points 400 at the bottom of an LED lamp bead 300 can optimize the patch effect and improve the stability of the LED lamp bead 300 . Moreover, the LED lamp bead 300 can block the glue dots 400, and the glue dots 400 cannot be seen from the side of the LED lamp bead 300, so that the color difference of the LED display screen will not be caused by the reflection of the glue dots 400 and other factors.
  • the LED display screen body may include a frame, a controller and other components that implement the functions of the LED display screen, which will not be described in detail here.
  • the LED lamp beads 300 are TOP-type LED lamp beads 300 .
  • the structure of the TOP-type LED lamp bead 300 has been described in the above embodiment, and will not be described again here.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Provided in the present application are an adhesive dispensing method for lamp beads in an LED lamp panel, and an LED display screen. The adhesive dispensing method for lamp beads in an LED lamp panel comprises: fixing a circuit board, and printing a solder paste onto the circuit board; performing an adhesive dispensing treatment on the circuit board, so as to form a plurality of spaced adhesive dispensing areas; performing surface mounting on LED lamp beads on the circuit board; and performing reflow soldering on the circuit board provided with the LED lamp beads, fixing, onto the circuit board and by means of adhesive points and the solder paste in the adhesive dispensing areas, LED lamp beads adjacent to edges of the circuit board, and fixing the remaining LED lamp beads onto the circuit board by means of the solder paste. By means of the adhesive dispensing method for lamp beads in an LED lamp panel, and the LED display screen provided in the present application, the color difference of the LED display screen caused by an adhesive can be reduced, the time is saved on, and the cost is reduced.

Description

LED灯板中灯珠的点胶方法及LED显示屏Dispensing method of lamp beads in LED lamp panel and LED display screen
本申请要求于2022年06月21日提交国家知识产权局、申请号为202210702980.4、发明名称为“LED灯板中灯珠的点胶方法及LED显示屏”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application requires the priority of the Chinese patent application submitted to the State Intellectual Property Office on June 21, 2022, with the application number 202210702980.4 and the invention name "Dispensing method of lamp beads in LED lamp panels and LED display screen", all of which The contents are incorporated into this application by reference.
技术领域Technical field
本申请涉及显示屏设计技术，例如涉及一种LED灯板中灯珠的点胶方法及LED显示屏。This application relates to display screen design technology, for example, to a dispensing method of lamp beads in an LED lamp panel and an LED display screen.
背景技术Background technique
LED显示屏是一种平板显示器，用来显示文字、图像、视频等各种信息。The LED display screen is a flat-panel display used to display various information such as text, images, and videos.
LED显示屏包括基板、多个不同的器件和多个LED灯珠，各器件位于基板的第一面，各LED灯珠位于基板的与第一面相对的第二面。与基板的板边相邻的LED灯珠容易从基板上掉落(也可称为掉灯)。在生产环节，运输环节，LED屏安装环节，都存在掉灯的情况。可以在相邻的两个LED灯珠之间进行点胶，以固定LED灯珠，从而增加LED灯珠的推力，避免掉灯和胶体引起的LED显示屏的色差。The LED display screen includes a substrate, a plurality of different devices and a plurality of LED lamp beads. Each device is located on the first side of the substrate, and each LED lamp bead is located on the second side of the substrate opposite to the first side. LED lamp beads adjacent to the edge of the substrate are easy to fall off the substrate (also called lamp drop). In the production process, transportation process, and LED screen installation process, lights may fall out. Glue can be dispensed between two adjacent LED lamp beads to fix the LED lamp beads, thereby increasing the thrust of the LED lamp beads and avoiding the color difference of the LED display caused by falling lamps and colloid.
但是，上述固定LED灯珠的方式增加成本，且较为费时。However, the above method of fixing LED lamp beads increases costs and is time-consuming.
发明内容Contents of the invention
本申请提供一种LED灯板中灯珠的点胶方法及LED显示屏，可以减小胶体引起的LED显示屏色差，省时且节约成本。This application provides a glue dispensing method for lamp beads in an LED lamp panel and an LED display screen, which can reduce the color difference of the LED display screen caused by colloid, saving time and cost.
第一方面，本申请提供一种LED灯板中灯珠的点胶方法，LED灯板包括电路板和设置在电路板上的多个LED灯珠，LED灯板中灯珠的点胶方法包括：In a first aspect, this application provides a method for dispensing lamp beads in an LED lamp panel. The LED lamp panel includes a circuit board and a plurality of LED lamp beads arranged on the circuit board. The method for dispensing lamp beads in an LED lamp panel includes :
固定电路板，在电路板上印刷锡膏；Fix the circuit board and print solder paste on the circuit board;
在电路板上进行点胶处理，形成多个间隔的点胶区，其中，各点胶区与电路板的边缘相邻，每个点胶区内具有至少一个胶点；Perform glue dispensing processing on the circuit board to form multiple spaced glue dispensing areas, wherein each glue dispensing area is adjacent to the edge of the circuit board, and each glue dispensing area has at least one glue point;
在电路板上对LED灯珠进行贴片安装，其中，点胶区和与电路板的边缘相邻的LED灯珠的底部一一对应，各LED灯珠与锡膏对应；SMD-mount the LED lamp beads on the circuit board, where the dispensing area corresponds to the bottom of the LED lamp beads adjacent to the edge of the circuit board, and each LED lamp bead corresponds to the solder paste;
将具有LED灯珠的电路板进行回流焊，与电路板的边缘相邻的LED灯珠通过点胶区内的胶点和锡膏固定在电路板上，其余LED灯珠通过锡膏固定在电路板上。Reflow the circuit board with LED lamp beads. The LED lamp beads adjacent to the edge of the circuit board are fixed on the circuit board through glue dots and solder paste in the dispensing area. The remaining LED lamp beads are fixed on the circuit through solder paste. on the board.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，在电路板上进行点胶处理，形成多个间隔的点胶区包括： In a possible implementation, the application provides a dispensing method for lamp beads in an LED lamp panel. The dispensing process is performed on the circuit board to form multiple spaced dispensing areas, including:
在电路板上进行点胶处理，形成多个间隔的点胶区，各点胶区有外至内依次围成至少三圈。Carry out glue dispensing processing on the circuit board to form multiple spaced glue dispensing areas. Each dispensing area is surrounded by at least three circles from the outside to the inside.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，在电路板上进行点胶处理，形成多个间隔的点胶区包括：In a possible implementation, the application provides a dispensing method for lamp beads in an LED lamp panel. The dispensing process is performed on the circuit board to form multiple spaced dispensing areas, including:
在电路板上进行点胶处理，形成多个间隔的点胶区，且每个点胶区内的胶点的数量大于或等于一个且小于或等于四个。Glue dispensing is performed on the circuit board to form multiple spaced glue dispensing areas, and the number of glue dots in each dispensing area is greater than or equal to one and less than or equal to four.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，与点胶区对应的LED灯珠包括灯体和多个引脚，引脚位于灯体的底面，灯体的底面还具有凹陷部和两个凸起部，凹陷部位于两个凸起部之间，凹陷部和凸起部位于各引脚围成的区域内；In a possible implementation, this application provides a dispensing method for lamp beads in an LED lamp panel. The LED lamp beads corresponding to the dispensing area include a lamp body and a plurality of pins. The pins are located on the bottom surface of the lamp body. The bottom surface of the lamp body also has a recessed part and two convex parts, the recessed part is located between the two convex parts, and the recessed part and the convex part are located in the area surrounded by each pin;
在电路板上对LED灯珠进行贴片安装包括：SMD installation of LED lamp beads on the circuit board includes:
在电路板上呈阵列形式贴LED灯珠，其中，与点胶区对应的LED灯珠中每个凸起部对应至少一个胶点，引脚与锡膏对应。Paste LED lamp beads on the circuit board in the form of an array, in which each raised portion of the LED lamp beads corresponding to the glue dispensing area corresponds to at least one glue dot, and the pins correspond to the solder paste.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，在电路板上进行点胶处理，形成多个间隔的点胶区包括：In a possible implementation, the application provides a dispensing method for lamp beads in an LED lamp panel. The dispensing process is performed on the circuit board to form multiple spaced dispensing areas, including:
通过点胶设备在电路板上进行点胶处理，形成多个间隔的点胶区。The dispensing equipment is used to dispens glue on the circuit board to form multiple spaced dispensing areas.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，固定电路板包括：In a possible implementation, this application provides a dispensing method for lamp beads in an LED lamp panel, and fixing the circuit board includes:
将电路板固定在回流焊机的工作台上，通过工作台上的夹具固定电路板。Fix the circuit board on the workbench of the reflow soldering machine and fix the circuit board through the clamps on the workbench.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，在电路板上进行点胶处理之前还包括：In a possible implementation, the method for dispensing lamp beads in an LED lamp panel provided by this application also includes: before dispensing the glue on the circuit board:
在工作台上调整电路板的平面度，以使电路板的平面度小于或等于0.3％。Adjust the flatness of the circuit board on the workbench so that the flatness of the circuit board is less than or equal to 0.3%.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，在电路板上对LED灯珠进行贴片安装包括：In a possible implementation manner, this application provides a dispensing method for lamp beads in an LED lamp panel. SMD mounting of LED lamp beads on the circuit board includes:
将电路板放在贴片机上，在电路板上对LED灯珠进行贴片安装。Place the circuit board on the placement machine and mount the LED lamp beads on the circuit board.
第二方面，本申请实施例还提供了一种LED显示屏，包括LED显示屏本体和设置在LED显示屏本体上的LED灯板，LED灯板包括电路板和位于电路板上的多个LED灯珠，其中，LED灯珠通过上述第一方面提供的LED灯板中灯珠的点胶方法固定在电路板上。In a second aspect, embodiments of the present application also provide an LED display screen, including an LED display screen body and an LED light panel disposed on the LED display screen body. The LED light panel includes a circuit board and a plurality of LEDs located on the circuit board. Lamp beads, wherein the LED lamp beads are fixed on the circuit board through the glue dispensing method of the lamp beads in the LED lamp panel provided in the first aspect.
在一种可能的实现方式中，本申请实施例的LED显示屏，LED灯珠为TOP型LED灯珠。In a possible implementation manner, in the LED display screen of the embodiment of the present application, the LED lamp beads are TOP-type LED lamp beads.
本申请提供的LED灯板中灯珠的点胶方法及LED显示屏，在易发生掉灯的部分设置 胶点和锡膏固定LED灯珠，在不易发生掉灯的部分设置锡膏固定LED灯珠。换而言之，与电路板的边缘相邻的LED灯珠通过点胶区内的胶点和锡膏固定在电路板上，其余LED灯珠通过锡膏固定在电路板上，无需所有LED灯珠均设置胶点，这样，节省时间和节约成本，提供了效率。且通过LED灯珠覆盖点胶区内的胶点，LED灯珠可以遮挡胶点，避免胶点漏出LED灯珠，这样，在LED灯珠侧观测LED灯板，难以观测到胶点，由此，可以减小胶体引起的LED显示屏色差。The dispensing method of lamp beads in the LED lamp panel and the LED display screen provided by this application are set up in parts prone to lamp failure. Glue dots and solder paste are used to fix the LED lamp beads, and solder paste is used to fix the LED lamp beads in the parts where the lamp is less likely to fall off. In other words, the LED lamp beads adjacent to the edge of the circuit board are fixed on the circuit board through glue dots and solder paste in the dispensing area, and the remaining LED lamp beads are fixed on the circuit board through solder paste, without the need for all LED lamps. The beads are all set with glue points, which saves time and cost and improves efficiency. And by covering the glue points in the dispensing area with LED lamp beads, the LED lamp beads can block the glue points and prevent the glue points from leaking out of the LED lamp beads. In this way, when observing the LED light panel from the side of the LED lamp beads, it is difficult to observe the glue points. Therefore, , can reduce the color difference of LED display caused by colloid.
附图说明Description of the drawings
为了更清楚地说明本申请实施例或相关技术中的技术方案，下面将对实施例或相关技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly explain the technical solutions in the embodiments of the present application or related technologies, a brief introduction will be made below to the drawings that need to be used in the description of the embodiments or related technologies. Obviously, the drawings in the following description are of the present invention. For some embodiments of the application, those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts.
图1为本申请实施例提供的LED灯板中灯珠的点胶方法的流程图；Figure 1 is a flow chart of a dispensing method for lamp beads in an LED lamp panel provided by an embodiment of the present application;
图2为LED灯板的结构示意图；Figure 2 is a schematic structural diagram of an LED light panel;
图3为本申请实施例提供的LED灯板中灯珠的点胶方法中在电路板上印刷锡膏的结构图；Figure 3 is a structural diagram of printing solder paste on a circuit board in the dispensing method of lamp beads in an LED lamp board provided by the embodiment of the present application;
图4为本申请实施例提供的LED灯板中灯珠的点胶方法中点胶处理后的电路板的结构图；Figure 4 is a structural diagram of the circuit board after dispensing treatment in the dispensing method of lamp beads in the LED lamp board provided by the embodiment of the present application;
图5为本申请实施例提供的LED灯板中灯珠的点胶方法中在电路板上贴LED灯珠后的结构图；Figure 5 is a structural diagram after pasting LED lamp beads on the circuit board in the dispensing method of lamp beads in the LED lamp panel provided by the embodiment of the present application;
图6为LED灯珠的结构示意图；Figure 6 is a schematic structural diagram of an LED lamp bead;
图7为图6中A-A剖面的剖视图；Figure 7 is a cross-sectional view of the A-A section in Figure 6;
图8为图6中B-B剖面的剖视图。Fig. 8 is a cross-sectional view of the B-B section in Fig. 6 .
附图标记说明：Explanation of reference symbols:
100-电路板；100-circuit board;
200-锡膏；200-Solder paste;
300-LED灯珠；300-LED lamp beads;
310-引脚；310-pin;
320-灯体；320-Lamp body;
330-凹陷部；330 - depression;
340-凸起部； 340-bulge;
400-胶点。400-glue dots.
具体实施方式Detailed ways
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or an intermediate connection. The medium is indirectly connected, which can be the internal connection between two components or the interaction between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
在本申请的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或者位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或者暗示所指的装置或者元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or component referred to must have a specific orientation. Constructed and operated in a specific orientation and therefore should not be construed as limiting this application.
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。The terms "first", "second" and "third" (if present) in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific sequence or sequence. Sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the application described herein can, for example, be practiced in sequences other than those illustrated or described herein.
此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、***、产品或维护工具不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或维护工具固有的其它步骤或单元。Furthermore, the terms "include" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or maintenance tool that encompasses a series of steps or units and need not be limited to those explicitly listed. may include other steps or elements not expressly listed or inherent to such processes, methods, products or maintenance tools.
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of this application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
LED显示屏是一种平板显示器，用来显示文字、图像、视频等各种信息。LED显示屏集微电子技术、计算机技术、信息处理于一体，具有色彩鲜艳、动态范围广、亮度高、寿命长、工作稳定可靠等优点，LED显示屏广泛应用于商业传媒、文化演出市场、体育场馆、信息传播、新闻发布、证券交易等，可以满足不同环境的需要。The LED display screen is a flat-panel display used to display various information such as text, images, and videos. LED display screen integrates microelectronics technology, computer technology, and information processing. It has the advantages of bright color, wide dynamic range, high brightness, long life, stable and reliable operation, etc. LED display screen is widely used in commercial media, cultural performance market, sports Venues, information dissemination, news releases, securities trading, etc. can meet the needs of different environments.
发光二极管(Light Emitting Diode，LED)，它是一种通过控制半导体发光二极管的显示方式，由镓(Ga)与砷(As)、磷(P)、氮(N)、铟(In)的化合物制成的二极管，当电子与空穴复合时能辐射出可见光，因而可以用来制成发光二极管。在电路及仪器 中作为指示灯，或者组成文字或数字显示。磷砷化镓二极管发红光，磷化镓二极管发绿光，碳化硅二极管发黄光，铟镓氮二极管发蓝光。Light Emitting Diode (LED), which is a display method that controls semiconductor light-emitting diodes, is composed of compounds of gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), and indium (In). The made diode can radiate visible light when electrons and holes recombine, so it can be used to make light-emitting diodes. in circuits and instruments as an indicator light, or to form a text or digital display. Gallium arsenide phosphorus diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and indium gallium nitrogen diodes emit blue light.
LED显示屏包括灯板，灯板具有LED面和电路板(Printed Circuit Board，PCB)面。电路板面包括基板和设置在基板的第一面上的器件(例如芯片、阻容件和接插件等)，上述器件采用回流焊工艺固定在基板上。基板的与第一面相对的第二面具有多个LED灯珠，采用的回流焊工艺，将LED灯珠固定在基板的第二面。其中，布满LED灯珠的第二面可以称为LED面，LED灯珠距离PCB的板边的距离小于或等于0.2mm。而LED灯珠的尺寸也比较小，通常为1mm×1mm到2mm×2mm之间，LED灯珠的推力(推力是指把LED灯珠从PCB上推掉需要的力)，推力通常为15N左右，即1.5公斤的力。LED灯珠由于推力小，而且距离PCB的板边非常近，LED灯珠容易从PCB上掉落(也可称为掉灯)。在生产环节，运输环节，LED屏安装环节，都存在掉灯的情况。The LED display screen includes a light board, which has an LED surface and a Printed Circuit Board (PCB) surface. The circuit board surface includes a substrate and devices (such as chips, resistor-capacitor components, connectors, etc.) arranged on the first surface of the substrate. The above-mentioned devices are fixed on the substrate using a reflow soldering process. The second side of the substrate opposite to the first side has a plurality of LED lamp beads, and a reflow soldering process is used to fix the LED lamp beads on the second side of the substrate. Among them, the second surface covered with LED lamp beads can be called the LED surface, and the distance between the LED lamp beads and the edge of the PCB is less than or equal to 0.2mm. The size of the LED lamp bead is also relatively small, usually between 1mm×1mm and 2mm×2mm. The thrust of the LED lamp bead (thrust force refers to the force required to push the LED lamp bead off the PCB) is usually about 15N. , that is, 1.5 kilograms of force. Because the LED lamp beads have small thrust and are very close to the edge of the PCB, the LED lamp beads are easy to fall off the PCB (also called lamp drop). In the production process, transportation process, and LED screen installation process, lights may fall out.
相关技术中，LED灯珠已经完成回流焊，形成一个LED灯板，在相邻的两个LED灯珠之间进行点胶，以固定LED灯珠，从而增加LED灯珠的推力，避免掉灯。由于点胶区域存在胶体，和不点胶的区域会形成色差。为了避免色差等影响显示效果，因此需要对于整个LED面的全部LED灯珠之间进行点胶固定，以避免色差。In the related technology, the LED lamp beads have been reflow soldered to form an LED lamp board. Glue is dispensed between two adjacent LED lamp beads to fix the LED lamp beads, thereby increasing the thrust of the LED lamp beads and preventing the lamp from falling off. . Due to the presence of colloid in the glued area, there will be a color difference between the glued area and the non-glued area. In order to avoid chromatic aberration and other effects on the display effect, it is necessary to glue and fix all the LED lamp beads on the entire LED surface to avoid chromatic aberration.
但是，实际出现掉灯的区域集中在LED灯板的四边，容易受到磕碰的位置。LED灯板中间区域不会出现掉灯的情况。点胶的胶体需要预热到预设温度，依据LED灯珠之间的间距，设置点胶量，并且点胶完成后，采用加热台，对LED灯板进行烘烤，烘烤使得胶体固化，从而将LED灯珠固定在PCB上。相关技术中对整个LED灯板进行点胶处理，增加成本，浪费时间。However, the actual areas where lights fall out are concentrated on the four sides of the LED light panel, where they are easily bumped. There will be no lights falling off in the middle area of the LED light panel. The dispensing colloid needs to be preheated to a preset temperature. The dispensing amount is set according to the distance between the LED lamp beads. After the dispensing is completed, a heating table is used to bake the LED light panel. The baking causes the colloid to solidify. Thereby the LED lamp beads are fixed on the PCB. In related technologies, glue dispensing is performed on the entire LED light panel, which increases costs and wastes time.
基于此，本申请提供了一种LED灯板中灯珠的点胶方法及LED显示屏，可以减小胶体引起的LED显示屏色差的同时，省时且节约成本。Based on this, this application provides a glue dispensing method for lamp beads in an LED lamp panel and an LED display screen, which can reduce the color difference of the LED display screen caused by the colloid while saving time and cost.
下面，结合附图和具体实施例对本申请进行说明。Below, the present application will be described with reference to the drawings and specific embodiments.
图1为本申请实施例提供的LED灯板中灯珠的点胶方法的流程图；图2为LED灯板的结构示意图；图3为本申请实施例提供的LED灯板中灯珠的点胶方法中在电路板上印刷锡膏的结构图。参见图1至图3所示，本申请提供的LED灯板中灯珠的点胶方法包括：Figure 1 is a flow chart of a dispensing method of lamp beads in an LED lamp panel provided by an embodiment of the present application; Figure 2 is a schematic structural diagram of an LED light panel; Figure 3 is a diagram of the dispensing method of lamp beads in an LED lamp panel provided by an embodiment of the present application. Structural diagram of printing solder paste on a circuit board using the glue method. Referring to Figures 1 to 3, the dispensing method of lamp beads in LED light panels provided by this application includes:
S101、固定电路板100，在电路板100上印刷锡膏200。S101. Fix the circuit board 100 and print the solder paste 200 on the circuit board 100.
可以理解的是，LED灯板包括电路板100和设置在电路板100上的多个LED灯珠300，电路板100与各LED灯珠300电连接。LED灯珠300在电路板100上的可以以阵列的形式排布，例如，矩形阵列或者其他本领域惯用的排列方式，为了便于描述，以下以LED 灯珠300以矩形阵列的形式排布在电路板100上进行说明。It can be understood that the LED lamp board includes a circuit board 100 and a plurality of LED lamp beads 300 arranged on the circuit board 100. The circuit board 100 is electrically connected to each LED lamp bead 300. The LED lamp beads 300 can be arranged in an array on the circuit board 100, for example, a rectangular array or other arrangements commonly used in the art. For convenience of description, the LED lamp beads are used below. The lamp beads 300 are arranged on the circuit board 100 in the form of a rectangular array for illustration.
在一实施例中，将电路板100固定在回流焊机的工作台上，通过工作台上的夹具固定电路板100，以防止电路板100在工作台上移动。In one embodiment, the circuit board 100 is fixed on the workbench of the reflow soldering machine, and the circuit board 100 is fixed by a clamp on the workbench to prevent the circuit board 100 from moving on the workbench.
锡膏200是一种焊接材料，锡膏200由焊锡粉、助焊剂以及其它的表面活性剂、触变剂等加以混合，形成的膏状混合物。锡膏200主要用于电子元器件的焊接。在电路板100印刷锡膏200时，锡膏200的数量根据电路板100上需要设置的LED灯珠300的数量、LED灯珠300的位置、以及LED灯珠300的引脚310的数量进行设置，只要保证LED灯珠300能稳固焊接在电路板100上即可。示例性的，若LED灯珠300具有四个引脚310，相应的每个引脚310对应设置一个锡膏200。The solder paste 200 is a soldering material. The solder paste 200 is a paste-like mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc. Solder paste 200 is mainly used for soldering electronic components. When the solder paste 200 is printed on the circuit board 100, the quantity of the solder paste 200 is set according to the number of LED lamp beads 300 to be installed on the circuit board 100, the position of the LED lamp beads 300, and the number of pins 310 of the LED lamp beads 300. , as long as the LED lamp beads 300 can be firmly welded to the circuit board 100. For example, if the LED lamp bead 300 has four pins 310, one solder paste 200 is provided for each pin 310.
S102、在电路板100上进行点胶处理，形成多个间隔的点胶区，其中，各点胶区与电路板100的边缘相邻，每个点胶区内具有至少一个胶点400。S102. Perform a glue dispensing process on the circuit board 100 to form multiple spaced glue dispensing areas, where each glue dispensing area is adjacent to an edge of the circuit board 100, and each glue dispensing area has at least one glue point 400.
图4为本申请实施例提供的LED灯板中灯珠的点胶方法中点胶处理后的电路板的结构图。参见图4所示，由于在生产环节，运输环节，LED屏安装环节，与电路板100边缘相邻的LED灯珠300容易从电路板100上掉落，其余部分的LED灯珠300不易掉落。因此，与电路板100边缘相邻的LED灯珠300对应设置锡膏200后，本申请在与电路板100边缘的位置上设置胶点400，其中胶点400和锡膏200位于电路板100的同一表面，且胶点400位于与同一LED灯珠300对应的各锡膏200围成的区域内，通过锡膏200和胶点400共同固定LED灯珠300。Figure 4 is a structural diagram of a circuit board after dispensing treatment in the dispensing method of lamp beads in an LED lamp board provided by an embodiment of the present application. As shown in Figure 4, due to the production process, transportation process, and LED screen installation process, the LED lamp beads 300 adjacent to the edge of the circuit board 100 are easy to fall from the circuit board 100, and the remaining LED lamp beads 300 are not easy to fall. . Therefore, after the solder paste 200 is placed corresponding to the LED lamp bead 300 adjacent to the edge of the circuit board 100, the present application sets glue dots 400 at the edge of the circuit board 100, where the glue dots 400 and the solder paste 200 are located on the edge of the circuit board 100. On the same surface, the glue points 400 are located in the area surrounded by the solder pastes 200 corresponding to the same LED lamp bead 300. The LED lamp beads 300 are fixed together by the solder paste 200 and the glue points 400.
S103、在电路板100上对LED灯珠300进行贴片安装，其中，点胶区和与电路板100的边缘相邻的LED灯珠300的底部一一对应，各LED灯珠300与锡膏200对应。S103. SMD-mount the LED lamp beads 300 on the circuit board 100. The dispensing area corresponds to the bottom of the LED lamp beads 300 adjacent to the edge of the circuit board 100. Each LED lamp bead 300 is in contact with the solder paste. 200 corresponds.
图5为本申请实施例提供的LED灯板中灯珠的点胶方法中在电路板上贴LED灯珠后的结构图。参见图5所示，在一实施例中，可以将电路板100放在贴片机上，通过在贴片机电路板100上对LED灯珠300进行贴片安装。Figure 5 is a structural diagram after pasting LED lamp beads on the circuit board in the dispensing method of lamp beads in the LED lamp panel provided by the embodiment of the present application. Referring to FIG. 5 , in one embodiment, the circuit board 100 can be placed on a placement machine, and the LED lamp beads 300 can be mounted on the circuit board 100 of the placement machine.
其中，在电路板100上具有锡膏200的一面贴LED灯板，图5中实线表示的LED灯珠300对应锡膏200，虚线表示的LED灯珠300对应胶点400和锡膏200。本申请通过LED灯珠300覆盖点胶区内的胶点400，LED灯珠300可以遮挡胶点400，避免胶点400漏出LED灯珠300，这样，在LED灯珠300侧观测LED灯板，难以观测到胶点400，由此，可以减小胶体引起的LED显示屏色差。Among them, the side of the circuit board 100 with the solder paste 200 is attached to the LED lamp board. The LED lamp beads 300 represented by the solid lines in Figure 5 correspond to the solder paste 200, and the LED lamp beads 300 represented by the dotted lines correspond to the glue dots 400 and the solder paste 200. In this application, the LED lamp beads 300 cover the glue points 400 in the glue dispensing area. The LED lamp beads 300 can block the glue points 400 and prevent the glue points 400 from leaking out of the LED lamp beads 300. In this way, the LED lamp board can be observed from the side of the LED lamp beads 300. The glue dots 400 are difficult to observe, thereby reducing the color difference of the LED display screen caused by the glue.
S104、将具有LED灯珠300的电路板100进行回流焊，与电路板100的边缘相邻的LED灯珠300通过点胶区内的胶点400和锡膏200固定在电路板100上，其余LED灯珠 300通过锡膏200固定在电路板100上。S104. Reflow the circuit board 100 with the LED lamp beads 300. The LED lamp beads 300 adjacent to the edge of the circuit board 100 are fixed on the circuit board 100 through the glue dots 400 and solder paste 200 in the glue dispensing area. LED lamp beads 300 is fixed on the circuit board 100 through solder paste 200 .
在一实施例中，将具有LED灯珠300的电路板100在回流焊机中，回流焊机中的加热电路将空气或者氮气加热到预设的温度后吹向具有LED灯珠300的电路板100，以融化胶点400和锡膏200，从而使LED灯珠300的电路板100粘接。这样，与电路板100的边缘相邻的LED灯珠300通过点胶区内的胶点400和锡膏200固定在电路板100上，其余LED灯珠300通过锡膏200固定在电路板100上。In one embodiment, the circuit board 100 with the LED lamp beads 300 is placed in a reflow soldering machine. The heating circuit in the reflow soldering machine heats air or nitrogen to a preset temperature and then blows it toward the circuit board with the LED lamp beads 300 . 100, to melt the glue dots 400 and the solder paste 200, thereby bonding the LED lamp beads 300 to the circuit board 100. In this way, the LED lamp beads 300 adjacent to the edge of the circuit board 100 are fixed on the circuit board 100 through the glue dots 400 and solder paste 200 in the dispensing area, and the remaining LED lamp beads 300 are fixed on the circuit board 100 through the solder paste 200 .
本申请提供的LED灯板中灯珠的点胶方法，在易发生掉灯的部分设置胶点400和锡膏200固定LED灯珠300，在不易发生掉灯的部分设置锡膏200固定LED灯珠300。换而言之，与电路板100的边缘相邻的LED灯珠300通过点胶区内的胶点400和锡膏200固定在电路板100上，其余LED灯珠300通过锡膏200固定在电路板100上，无需所有LED灯珠均设置胶点，这样，节省时间和节约成本，提供了效率。且通过LED灯珠300覆盖点胶区内的胶点400，LED灯珠300可以遮挡胶点400，避免胶点400漏出LED灯珠300，这样，在LED灯珠300侧观测LED灯板，难以观测到胶点400，由此，可以减小胶体引起的LED显示屏色差。The method for dispensing lamp beads in an LED lamp board provided by this application is to set glue dots 400 and solder paste 200 to fix the LED lamp beads 300 in the parts where the lamps are prone to drop out, and to fix the LED lamps by setting solder paste 200 in the parts where the lamps are less likely to drop out. beads 300. In other words, the LED lamp beads 300 adjacent to the edge of the circuit board 100 are fixed on the circuit board 100 through the glue dots 400 and solder paste 200 in the dispensing area, and the remaining LED lamp beads 300 are fixed on the circuit board through the solder paste 200 On the board 100, there is no need to set glue points on all LED lamp beads, which saves time and cost and improves efficiency. And by covering the glue points 400 in the glue dispensing area with the LED lamp beads 300, the LED lamp beads 300 can block the glue points 400 and prevent the glue points 400 from leaking out of the LED lamp beads 300. In this way, it is difficult to observe the LED lamp board from the side of the LED lamp beads 300. 400 glue dots were observed, thus the color difference of the LED display screen caused by the colloid can be reduced.
掉灯全部集中在靠近电路板100边缘的位置，因为电路板100的边缘位置的LED灯珠300会受到从电路板100的侧面的外力撞击，才会被磕碰掉。而电路板100的中间位置，即使受到撞击，也是从电路板100的正面或者电路板100的正面带倾斜角度的撞击，此时的撞击不能使得LED灯珠300掉落。但是，最外圈的LED灯珠300受力之后，可能会挤压到与最外圈的LED灯珠300相邻圈的LED灯珠300。因此，在一些实施例中，在电路板100上进行点胶处理，形成多个间隔的点胶区包括：The fallen lights are all concentrated near the edge of the circuit board 100 , because the LED lamp beads 300 at the edge of the circuit board 100 will be knocked off by external force from the side of the circuit board 100 . Even if the middle position of the circuit board 100 is impacted, it is from the front of the circuit board 100 or from the front of the circuit board 100 at an oblique angle. The impact at this time cannot cause the LED lamp bead 300 to fall. However, after the outermost ring of LED lamp beads 300 is stressed, it may squeeze the adjacent ring of LED lamp beads 300 to the outermost ring of LED lamp beads 300 . Therefore, in some embodiments, performing a dispensing process on the circuit board 100 to form a plurality of spaced dispensing areas includes:
在电路板100上进行点胶处理，形成多个间隔的点胶区，各点胶区有外至内依次围成至少三圈。也就是说，电路板100上由电路板100的外侧至内侧的至少三圈LED灯珠300底部均具有胶点400，由此，避免LED灯板上出现掉灯现象。A dispensing process is performed on the circuit board 100 to form a plurality of spaced dispensing areas. Each dispensing area is surrounded by at least three circles from the outside to the inside. That is to say, at least three circles of LED lamp beads 300 on the circuit board 100 from the outside to the inside of the circuit board 100 have glue dots 400 at their bottoms, thereby preventing the lamp from falling off on the LED lamp board.
在本申请中，每个点胶区内的胶点400的数量大于或等于一个且小于或等于四个。由此，提高LED灯珠300在电路板100上的稳固性。在一实施例中，每个点胶区内的胶点400的数量大于或等于两个且小于或等于四个。由于在在胶点400高于锡膏200时，设置一个胶点400，LED灯珠300先接触到胶点400，通过一个胶点400支撑LED灯珠300，会出现LED灯珠300歪斜的情况，因此，将与LED灯珠300对应的胶点400设置两个、三个或者四个，以避免LED灯珠300歪斜。由于LED灯珠300尺寸的限制，在一实施例中，与LED灯珠300对应的胶点400设置两个。 In this application, the number of glue dots 400 in each glue dispensing area is greater than or equal to one and less than or equal to four. Thus, the stability of the LED lamp bead 300 on the circuit board 100 is improved. In one embodiment, the number of glue dots 400 in each glue dispensing area is greater than or equal to two and less than or equal to four. Because when the glue point 400 is higher than the solder paste 200, a glue point 400 is set, the LED lamp bead 300 first contacts the glue point 400, and the LED lamp bead 300 is supported by a glue point 400, and the LED lamp bead 300 will be skewed. , therefore, two, three or four glue points 400 corresponding to the LED lamp beads 300 are set to prevent the LED lamp beads 300 from being skewed. Due to the size limitation of the LED lamp bead 300, in one embodiment, two glue points 400 corresponding to the LED lamp bead 300 are provided.
图6为LED灯珠的结构示意图；图7为图6中A-A剖面的剖视图；图8为图6中B-B剖面的剖视图。参见图6至图8所示，与点胶区对应的LED灯珠300和其余的LED灯珠300可以均为TOP型LED灯珠300，TOP型LED灯珠300可以包括灯体320和多个引脚310，引脚310位于灯体320的底面，灯体320的底面还具有凹陷部330和两个凸起部340，凹陷部330位于两个凸起部340之间，凹陷部330和凸起部340位于各引脚310围成的区域内。Figure 6 is a schematic structural diagram of an LED lamp bead; Figure 7 is a cross-sectional view of the A-A section in Figure 6; Figure 8 is a cross-sectional view of the B-B section in Figure 6. Referring to Figures 6 to 8, the LED lamp beads 300 corresponding to the dispensing area and the remaining LED lamp beads 300 can all be TOP type LED lamp beads 300. The TOP type LED lamp beads 300 can include a lamp body 320 and a plurality of The pin 310 is located on the bottom surface of the lamp body 320. The bottom surface of the lamp body 320 also has a recessed portion 330 and two protruding portions 340. The recessed portion 330 is located between the two protruding portions 340. The recessed portion 330 and the protruding portions 340. The raised portion 340 is located in the area surrounded by each pin 310 .
其中，凹陷部330为LED灯珠300成型的进料口，由于进料口会有毛刺，因此LED灯珠300的底部的中心通常设计成内凹的圆形。胶点400可以与凹陷部330对应，即在LED灯珠300的底部中间设置胶点400。也可以在凸起部340的位置设置胶点400，相对于在凹陷部330对应设置胶点400，凸起部340对应的胶点400用胶量较少。Among them, the recessed portion 330 is a feed port for molding the LED lamp bead 300. Since the feed port has burrs, the center of the bottom of the LED lamp bead 300 is usually designed to be a concave circle. The glue dot 400 may correspond to the recessed portion 330 , that is, the glue dot 400 is provided in the middle of the bottom of the LED lamp bead 300 . Glue dots 400 can also be provided at the position of the protruding portion 340. Compared with the corresponding glue dots 400 provided at the recessed portion 330, the amount of glue used for the glue dots 400 corresponding to the protruding portion 340 is smaller.
因此，在一些实施例中，在电路板100上对LED灯珠300进行贴片安装包括：Therefore, in some embodiments, patch mounting the LED lamp beads 300 on the circuit board 100 includes:
在电路板100上呈阵列形式贴LED灯珠300，其中，与点胶区对应的LED灯珠300中每个凸起部340对应至少一个胶点400，引脚310与锡膏200对应。LED lamp beads 300 are mounted on the circuit board 100 in an array, wherein each raised portion 340 in the LED lamp beads 300 corresponding to the glue dispensing area corresponds to at least one glue dot 400, and the pins 310 correspond to the solder paste 200.
本申请提供的LED灯板中灯珠的点胶方法，在电路板100上进行点胶处理，形成多个间隔的点胶区包括：The application provides a dispensing method for lamp beads in an LED lamp panel. The dispensing process is performed on the circuit board 100 to form multiple spaced dispensing areas, including:
通过点胶设备在电路板100上进行点胶处理，形成多个间隔的点胶区，由此，操作方便，且点胶位置定位准确。The glue dispensing equipment is used to perform glue dispensing processing on the circuit board 100 to form multiple spaced glue dispensing areas. Therefore, the operation is convenient and the glue dispensing position is accurately positioned.
在一实施例中，点胶设备可以包括机架、传送结构、控制器、伺服定位***、光学定位***、点胶机和空压机等部件，机架固定在安装面(例如地面)上，传动结构、伺服定位***、光学定位***、点胶机和空压机均与控制器电连接。伺服定位***包括伺服电机和传动机构，点胶机固定在传动机构上，伺服电机通过传动机构驱动点胶机移动。传动结构将电路板100送到预定位置，光学定位***采用摄像机对电路板100上的焊盘等进行成像，从而传输至控制器，控制器通过分析图像，控制光学定位***进行光学定位，从而确定电路板100上需要的胶点400的坐标，伺服电机根据胶点400的坐标通过传动机构驱动点胶机移动，以在电路板100上进行点胶。其中，空压机用于给点胶机的胶筒提供气体，以使胶筒内的胶体流出，从而进行点胶。In one embodiment, the dispensing equipment may include components such as a frame, a transmission structure, a controller, a servo positioning system, an optical positioning system, a dispensing machine, an air compressor, etc. The frame is fixed on the installation surface (such as the ground), The transmission structure, servo positioning system, optical positioning system, dispensing machine and air compressor are all electrically connected to the controller. The servo positioning system includes a servo motor and a transmission mechanism. The dispensing machine is fixed on the transmission mechanism. The servo motor drives the dispensing machine to move through the transmission mechanism. The transmission structure sends the circuit board 100 to a predetermined position. The optical positioning system uses a camera to image the pads on the circuit board 100 and transmits it to the controller. The controller analyzes the image and controls the optical positioning system to perform optical positioning to determine According to the coordinates of the glue spots 400 required on the circuit board 100, the servo motor drives the dispensing machine to move through the transmission mechanism according to the coordinates of the glue spots 400 to dispense glue on the circuit board 100. Among them, the air compressor is used to provide gas to the glue barrel of the dispensing machine so that the colloid in the glue barrel flows out for dispensing.
在一种可能的实现方式中，本申请提供的LED灯板中灯珠的点胶方法，在电路板100上进行点胶处理之前还包括：In a possible implementation, the dispensing method for lamp beads in an LED lamp panel provided by this application also includes: before performing the dispensing process on the circuit board 100:
在工作台上调整电路板100的平面度，以使电路板100的平面度小于或等于0.3％。电路板100的平面度越小，点胶机的喷嘴可以贴近电路板100面进行点胶，点胶效果较好。 Adjust the flatness of the circuit board 100 on the workbench so that the flatness of the circuit board 100 is less than or equal to 0.3%. The smaller the flatness of the circuit board 100, the nozzle of the dispensing machine can be close to the surface of the circuit board 100 for dispensing glue, and the dispensing effect is better.
本申请实施例还提供了一种LED显示屏，包括LED显示屏本体和设置在所述LED显示屏本体上的LED灯板，LED灯板包括电路板100和位于电路板100上的多个LED灯珠300，其中，LED灯珠300通过上述实施例提供的LED灯板中灯珠的点胶方法固定在电路板100上。An embodiment of the present application also provides an LED display screen, which includes an LED display screen body and an LED light panel disposed on the LED display screen body. The LED light panel includes a circuit board 100 and a plurality of LEDs located on the circuit board 100 Lamp bead 300, wherein the LED lamp bead 300 is fixed on the circuit board 100 through the glue dispensing method of the lamp bead in the LED lamp board provided in the above embodiment.
其中，的LED灯板中灯珠的点胶方法在上述实施例中进行了详细说明，此处不再一一赘述。Among them, the dispensing method of the lamp beads in the LED lamp panel was described in detail in the above embodiments, and will not be described again here.
本申请LED显示屏中的LED灯板，采用上述LED灯板中灯珠的点胶方法形成，可以直接用相关技术中的LED灯板的生产线，增加一台点胶设备即可。可以采用回流焊工艺中的高温使得LED灯珠300发生固化，而不需要像相关技术中点胶工艺需要单独加热台等设备。The LED light panel in the LED display screen of this application is formed by the above-mentioned dispensing method of lamp beads in the LED light panel. The LED light panel production line in the related technology can be directly used and a dispensing equipment can be added. The high temperature in the reflow soldering process can be used to solidify the LED lamp beads 300, without the need for separate heating stages and other equipment like the dispensing process in related technologies.
并且，本申请采用局部点胶的方式，避免整个电路板100点胶，需要点胶的LED灯珠300的数量少，用胶量少，生产效率高，节省材料。Moreover, this application adopts local dispensing method to avoid dispensing glue on the entire circuit board. The number of LED lamp beads 300 that need to be dispensed is small, the amount of glue used is small, the production efficiency is high, and materials are saved.
本申请的胶点400在LED灯珠300的底部，由于LED灯珠300的底部和电路板100距离小，很薄的胶点400就可以使得LED灯珠300和电路板100发生粘结。相对于相关技术中的LED灯珠300的侧面点胶，既可以大幅度节省材料，也可以显著增加LED灯珠300的稳固性。在一个LED灯珠300的底部设置多个胶点400，可以优化贴片效果，提高LED灯珠300的稳固性。并且，LED灯珠300可以挡住胶点400，从LED灯珠300侧看不到胶点400，从而不会因为胶点400的反光等因素导致LED显示屏的色差。The glue dots 400 of this application are at the bottom of the LED lamp bead 300. Since the distance between the bottom of the LED lamp bead 300 and the circuit board 100 is small, very thin glue dots 400 can cause the LED lamp bead 300 and the circuit board 100 to bond. Compared with the side dispensing of the LED lamp bead 300 in the related art, material can be greatly saved and the stability of the LED lamp bead 300 can be significantly increased. Setting multiple glue points 400 at the bottom of an LED lamp bead 300 can optimize the patch effect and improve the stability of the LED lamp bead 300 . Moreover, the LED lamp bead 300 can block the glue dots 400, and the glue dots 400 cannot be seen from the side of the LED lamp bead 300, so that the color difference of the LED display screen will not be caused by the reflection of the glue dots 400 and other factors.
可以理解的是，LED显示屏本体可以包括架体、控制器等实现LED显示屏功能的其他部件，此处不再一一赘述。It can be understood that the LED display screen body may include a frame, a controller and other components that implement the functions of the LED display screen, which will not be described in detail here.
参见图6至图8所示，在一种可能的实现方式中，本申请实施例的LED显示屏，LED灯珠300为TOP型LED灯珠300。其中，TOP型LED灯珠300的结构在上述实施例中进行了说明，此处不再一一赘述。Referring to FIGS. 6 to 8 , in one possible implementation manner, in the LED display screen of the embodiment of the present application, the LED lamp beads 300 are TOP-type LED lamp beads 300 . Among them, the structure of the TOP-type LED lamp bead 300 has been described in the above embodiment, and will not be described again here.
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。 Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or substitutions do not deviate from the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present application. scope.

Claims (10)

  1. 一种LED灯板中灯珠的点胶方法，其中，LED灯板包括电路板和设置在所述电路板上的多个LED灯珠，所述LED灯板中灯珠的点胶方法包括：A method of dispensing glue for lamp beads in an LED lamp panel, wherein the LED lamp panel includes a circuit board and a plurality of LED lamp beads arranged on the circuit board. The method of dispensing glue for lamp beads in the LED lamp panel includes:
    固定所述电路板，在所述电路板上印刷锡膏；Fix the circuit board and print solder paste on the circuit board;
    在所述电路板上进行点胶处理，形成多个间隔的点胶区，其中，各所述点胶区与所述电路板的边缘相邻，每个所述点胶区内具有至少一个胶点；A glue dispensing process is performed on the circuit board to form a plurality of spaced glue dispensing areas, wherein each glue dispensing area is adjacent to an edge of the circuit board, and each glue dispensing area has at least one glue dispensing area. point;
    在所述电路板上对所述LED灯珠进行贴片安装，其中，所述点胶区和与所述电路板的边缘相邻的所述LED灯珠的底部一一对应，各所述LED灯珠与所述锡膏对应；The LED lamp beads are patch-mounted on the circuit board, wherein the dispensing area corresponds to the bottom of the LED lamp beads adjacent to the edge of the circuit board, and each LED The lamp beads correspond to the solder paste;
    将具有所述LED灯珠的所述电路板进行回流焊，与所述电路板的边缘相邻的所述LED灯珠通过所述点胶区内的胶点和所述锡膏固定在所述电路板上，其余所述LED灯珠通过所述锡膏固定在所述电路板上。The circuit board with the LED lamp beads is reflowed, and the LED lamp beads adjacent to the edge of the circuit board are fixed on the On the circuit board, the remaining LED lamp beads are fixed on the circuit board through the solder paste.
  2. 根据权利要求1所述的LED灯板中灯珠的点胶方法，其中，所述在所述电路板上进行点胶处理，形成多个间隔的点胶区包括：The dispensing method for lamp beads in an LED lamp panel according to claim 1, wherein the dispensing process on the circuit board to form a plurality of spaced dispensing areas includes:
    在所述电路板上进行点胶处理，形成多个间隔的点胶区，各所述点胶区有外至内依次围成至少三圈。A glue dispensing process is performed on the circuit board to form a plurality of spaced glue dispensing areas. Each of the glue dispensing areas is surrounded by at least three circles from the outside to the inside.
  3. 根据权利要求1所述的LED灯板中灯珠的点胶方法，其中，所述在所述电路板上进行点胶处理，形成多个间隔的点胶区包括：The dispensing method for lamp beads in an LED lamp panel according to claim 1, wherein the dispensing process on the circuit board to form a plurality of spaced dispensing areas includes:
    在所述电路板上进行点胶处理，形成多个间隔的点胶区，且每个所述点胶区内的所述胶点的数量大于或等于一个且小于或等于四个。A glue dispensing process is performed on the circuit board to form a plurality of spaced glue dispensing areas, and the number of glue dots in each glue dispensing area is greater than or equal to one and less than or equal to four.
  4. 根据权利要求3所述的LED灯板中灯珠的点胶方法，其中，与所述点胶区对应的所述LED灯珠包括灯体和多个引脚，所述引脚位于所述灯体的底面，所述灯体的底面还具有凹陷部和两个凸起部，所述凹陷部位于两个所述凸起部之间，所述凹陷部和所述凸起部位于各所述引脚围成的区域内；The dispensing method for lamp beads in an LED lamp panel according to claim 3, wherein the LED lamp beads corresponding to the dispensing area include a lamp body and a plurality of pins, and the pins are located on the lamp The bottom surface of the lamp body also has a recessed portion and two protruding portions. The recessed portion is located between the two protruding portions. The recessed portion and the protruding portion are located on each of the two protruding portions. Within the area surrounded by pins;
    所述在所述电路板上对所述LED灯珠进行贴片安装包括：The patch mounting of the LED lamp beads on the circuit board includes:
    在所述电路板上呈阵列形式贴所述LED灯珠，其中，与所述点胶区对应的所述LED灯珠中每个所述凸起部对应至少一个所述胶点，所述引脚与所述锡膏对应。The LED lamp beads are mounted in an array on the circuit board, wherein each raised portion of the LED lamp beads corresponding to the glue dispensing area corresponds to at least one glue point, and the lead The feet correspond to the solder paste.
  5. 根据权利要求1至4任一项所述的LED灯板中灯珠的点胶方法，其中，所述在所述电路板上进行点胶处理，形成多个间隔的点胶区包括：The dispensing method for lamp beads in an LED lamp panel according to any one of claims 1 to 4, wherein the dispensing process on the circuit board to form a plurality of spaced dispensing areas includes:
    通过点胶设备在所述电路板上进行点胶处理，形成多个间隔的点胶区。A dispensing equipment is used to perform dispensing processing on the circuit board to form multiple spaced dispensing areas.
  6. 根据权利要求1至4任一项所述的LED灯板中灯珠的点胶方法，其中，所述固定 所述电路板包括：The dispensing method of lamp beads in an LED lamp panel according to any one of claims 1 to 4, wherein the fixing The circuit board includes:
    将所述电路板固定在回流焊机的工作台上，通过所述工作台上的夹具固定所述电路板。The circuit board is fixed on the workbench of the reflow soldering machine, and the circuit board is fixed by the clamp on the workbench.
  7. 根据权利要求6所述的LED灯板中灯珠的点胶方法，其中，所述在所述电路板上进行点胶处理之前还包括：The dispensing method for lamp beads in an LED lamp panel according to claim 6, wherein the dispensing process before performing the dispensing process on the circuit board further includes:
    在所述工作台上调整所述电路板的平面度，以使所述电路板的平面度小于或等于0.3％。Adjust the flatness of the circuit board on the workbench so that the flatness of the circuit board is less than or equal to 0.3%.
  8. 根据权利要求1至4任一项所述的LED灯板中灯珠的点胶方法，其中，所述在所述电路板上对所述LED灯珠进行贴片安装包括：The dispensing method of lamp beads in an LED lamp panel according to any one of claims 1 to 4, wherein the patch mounting of the LED lamp beads on the circuit board includes:
    将所述电路板放在贴片机上，在所述电路板上对所述LED灯珠进行贴片安装。Place the circuit board on the placement machine, and mount the LED lamp beads on the circuit board.
  9. 一种LED显示屏，其中，包括LED显示屏本体和设置在所述LED显示屏本体上的LED灯板，所述LED灯板包括电路板和位于所述电路板上的多个LED灯珠，其中，所述LED灯珠通过权利要求1至8任一项所述的LED灯板中灯珠的点胶方法固定在所述电路板上。An LED display screen, which includes an LED display screen body and an LED light panel arranged on the LED display screen body. The LED light panel includes a circuit board and a plurality of LED lamp beads located on the circuit board. Wherein, the LED lamp beads are fixed on the circuit board through the dispensing method of lamp beads in the LED lamp panel according to any one of claims 1 to 8.
  10. 根据权利要求9所述的LED显示屏，其中，所述LED灯珠为TOP型LED灯珠。 The LED display screen according to claim 9, wherein the LED lamp beads are TOP type LED lamp beads.
PCT/CN2023/097118 2022-06-21 2023-05-30 Adhesive dispensing method for lamp beads in led lamp panel, and led display screen WO2023246438A1 (en)

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CN110010017A (en) * 2019-04-12 2019-07-12 湖南新亚胜光电股份有限公司 A kind of LED light board fabrication method and product that external force resistance is hit
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