CN109983153A - Equipment for non-contact transport of the carrier in depositing system, the system of the non-contact transport for carrier, for the carrier of the non-contact transport in depositing system and the method for the non-contact transport for carrier in depositing system - Google Patents
Equipment for non-contact transport of the carrier in depositing system, the system of the non-contact transport for carrier, for the carrier of the non-contact transport in depositing system and the method for the non-contact transport for carrier in depositing system Download PDFInfo
- Publication number
- CN109983153A CN109983153A CN201780042940.9A CN201780042940A CN109983153A CN 109983153 A CN109983153 A CN 109983153A CN 201780042940 A CN201780042940 A CN 201780042940A CN 109983153 A CN109983153 A CN 109983153A
- Authority
- CN
- China
- Prior art keywords
- carrier
- equipment
- depositing system
- transport
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Present disclosure provides a kind of equipment for being used for the non-contact transport of carrier (220) in depositing system.The equipment includes the driving structure (210) for the mobile vehicle (220) in transporting direction (1), and the position detecting device (215) at the driving structure (210).
Description
Technical field
The embodiment of present disclosure is related to the equipment of the non-contact transport for carrier in depositing system, for carrying
The system of the non-contact transport of body, for the non-contact transport in depositing system carrier and for carrier in depositing system
Non-contact transport method.The embodiment of present disclosure is in particular to used to be maintained at Organic Light Emitting Diode (OLED)
The electrostatic chuck (E sucker) of substrate used in the manufacture of device and/or mask.
Background technique
Technology for the layer deposition on substrate includes such as hot evaporation, physical vapour deposition (PVD) (PVD) and chemical gaseous phase
It deposits (CVD).Coated substrate can be used in several applications and in several technical fields.For example, coated
Substrate can be used in the field of Organic Light Emitting Diode (OLED) device.OLED can be used for manufacturing video screen, computer
Monitor, mobile phone, other hand-held devices etc., for showing information.The OLED device of such as OLED display can wrap
Include one or more layers organic material between two electrodes for being located at and being all deposited on substrate.
During processing, substrate can be supported on the carrier for being configured to keep substrate and optional mask.It can be with
Using magnetic force in the depositing system of such as vacuum deposition system non-contactly transport agent.For such as organic light emitting apparatus
For, the purity and uniformity for the organic layer being deposited on substrate should be high.In addition, being come using non-contact transport defeated
It send and is challenging with the carrier of transfer of support substrate and mask without sacrificing yield because of substrate breakage.
In view of above, overcome the problems, such as at least some for non-contact transport of the carrier in depositing system in this field
New equipment, for carrier non-contact transport system, for the carrier of the non-contact transport in depositing system and for carrying
The method of non-contact transport of the body in depositing system is beneficial.Present disclosure is intended in particular to offer can be heavy in such as vacuum
In the depositing system of product system effectively and the carrier that smoothly transports.
Summary of the invention
In view of above, a kind of equipment, a kind of for carrier of non-contact transport for carrier in depositing system is provided
The system of non-contact transport, a kind of carrier for the non-contact transport in depositing system and a kind of deposited for carrier
The method of non-contact transport in system.Other aspects, advantage and the feature of present disclosure are from claim, specification and attached
Figure is apparent.
According to the one side of present disclosure, a kind of setting for non-contact transport for carrier in depositing system is provided
It is standby.The equipment includes the position detection dress for the driving structure of mobile vehicle in transporting direction and at driving structure
It sets.
According to the other aspect of present disclosure, a kind of system of non-contact transport for carrier is provided.The system
Including the equipment and carrier according to the non-contact transport for carrier of present disclosure.
According to another aspect of the present disclosure, a kind of carrier for the non-contact transport in depositing system is provided.
The carrier includes being configured as magnetically interacting with the driving structure of depositing system with the mobile vehicle in transporting direction
Magnet structure and position detecting device.
According to the one side of present disclosure, a kind of side of non-contact transport for carrier in depositing system is provided
Method.The method includes using the position detecting device at driving structure or on carrier to generate position and the speed of instruction carrier
At least one signal of at least one of degree, and control based at least one described signal the one or more of depositing system
The active magnet unit of at least one of first active magnet unit.
According to another aspect of the present disclosure, a kind of setting for non-contact transport for carrier in depositing system is provided
It is standby.The equipment includes at least one guidance unit.At least one guidance unit includes active magnet unit and two or more
A range sensor.Active magnet unit is arranged between two or more range sensors.
Embodiment is also for the equipment for carrying out disclosed method and including for executing each the method
The environment division of aspect.In terms of these methods can by hardware component, by the computer of appropriate software programming, pass through described two
Any combination of person executes in any other way.In addition, according to the embodiment of the present disclosure also for being used for
The method for operating the equipment.Method for operating the equipment includes the method side for executing each function of equipment
Face.
Detailed description of the invention
Therefore, the mode of the features described above of present disclosure can be understood in detail, can be obtained by reference to embodiment
Obtain being discussed in greater detail for the above present disclosure summarized.Attached drawing is related to the embodiment of present disclosure and hereinafter
It is described.
Fig. 1 shows the schematic diagram of carrier and guide structure.
Fig. 2 shows according to embodiment described herein for the equipment of non-contact transport and the schematic diagram of carrier.
Fig. 3 is shown according to other embodiment described herein for the equipment of non-contact transport and the signal of carrier
Figure.
Fig. 4 A and Fig. 4 B are shown according to embodiment described herein for the equipment of non-contact transport and the signal of carrier
Figure.
Fig. 5 shows the schematic diagram of the system for processing substrate according to embodiment described herein.
Fig. 6 shows the schematic diagram of the system for processing substrate according to other embodiment described herein.
Fig. 7 is shown according to the method for non-contact transport of the carrier in depositing system of embodiment described herein
Flow chart.
Specific embodiment
With detailed reference to the various embodiments of present disclosure, illustrate that the one or more of embodiment is shown in attached drawing
Example.Interior in being described below for attached drawing, same reference numbers indicate same parts.Generally, it only describes to implement relative to independent
The difference of mode.Each example is to be provided in a manner of explaining present disclosure, and do not mean that the limit to present disclosure
System.In addition, the feature that the part as an embodiment is illustrated or described can be used in other embodiment or
It is used in combination with other embodiment, to generate another embodiment.Specification is intended to include these modifications and variations.
Carrier can be used, in the depositing system of such as vacuum deposition system to protect in the deposition chamber of depositing system
Hold and transport substrate and/or mask.For example, one or more material layers can sink while substrate is supported on carrier
Product is on substrate.For such as organic light emitting apparatus application for, be deposited on the organic layer on substrate high purity and
Even property may be beneficial.In addition, smooth transport of the carrier in depositing system is beneficial, for example, to reduce substrate breakage.
According to the embodiment of the present disclosure, it is filled using the position detection of such as encoder or resolver (resolver)
It sets to determine position and/or speed of the carrier in depositing system.In some instances, position detecting device can be set heavy
At the driving structure of the transport arrangement of product system.In other examples, position detecting device can be set at carrier with just
It is transported together with carrier.The position of carrier and/or speed can be used for selectively controlling transport arrangement, such as, for making carrier
The active magnet unit to suspend.The smooth transport of carrier may be implemented.
Fig. 1 shows the schematic diagram of carrier 100 and a part transport arrangement, and the transport arrangement is configured in transport
The non-contact transport of carrier 100, transporting direction 1 can be horizontally oriented in direction 1.
Transport arrangement includes guide structure 110, and guide structure 110 can be active guide structure.Guide structure 110 includes
Multiple guidance units 111, multiple guidance units 111 are arranged along transporting direction 1.Each guidance unit 111 includes (for example, electricity
Magnetic) actuator, such as active magnet unit 112, and it is configured to the controller 114 of control actuator, and be configured to measure
To the range sensor (not shown) in the gap of carrier 100.Guide structure 110 can be configured to non-contactly make to carry using magnetic force
Body 100 suspends.
When carrier 100 is toward or away from guidance unit 111, suspension accuracy and/or suspension stability may be by shadows
It rings.Particularly, when carrier 100 is toward or away from guidance unit 111, it is possible to create will lead to carrier 100 and accelerate or subtract suddenly
Sizable and/or pulse type (pulse-like) power of speed.The power may depend on the geometry of the component of guide structure 110
Arrangement and construction, and especially multiple guidance units 111 (for example, one or more electromagnetic actuators and it is one or more away from
From sensor) geometrical arrangements and construction.The power can lead to the undesired and unexpected movement of carrier 100, and very
It is contacted to the accidental mechanical that may cause between carrier 100 and guide structure 110.Carrier 100, substrate and/or guide structure 110
It is likely to be broken.Additionally, it is possible to generate particle, this can reduce the quality of deposition processes.
When carrier 100 suddenly disappears, such as when suddenly disappearing below the range sensor, it may occur however that in suspending power
On direction, the change of the power or power of the pulse type especially on the direction (for example, vertical direction 3) of the magnetic force provided by actuator
Change.This may cause the signal value at range sensor and executes with carrier at distance (or measurement) direction (such as vertical direction 3)
In far from range sensor the signal value fast moved it is identical.In other words, range sensor indicates gap enlargement.Signal changes
Become controller can be made consumingly to change actuator force so that " mobile " carrier 100 return to guide structure 110 and carrier 100 it
Between set distance.
In addition, can produce the force component along transporting direction 1 when carrier 100 is toward or away from guidance unit 111.
Force component even can the sufficiently strong further transport with holdback carrier 100.It can be originated from and make along the force component of transporting direction 1
Actuating before carrier and/or on back (for example, leading edge (leading edge) or rear (trailing edge))
The magnetic resistance of device.This carries out illustrative representations by the magnetic field line behind carrier 100 in Fig. 1.
Fig. 2 shows the setting for non-contact transport of the carrier 220 in depositing system according to embodiment described herein
Standby schematic diagram.
Equipment includes the driving structure 210 and position detecting device for the mobile vehicle 220 in transporting direction 1, such as,
Encoder apparatus 215.In one example, position detecting device is arranged at driving structure 210 and can be depositing system
Transport arrangement stationary part.In another example, carrier 220 includes position detecting device.Particularly, position detection fills
Setting may be mounted on carrier 220 to move together with carrier 220.Carrier 220 can have first end 201 and the second end
End 202.First end can be the leading edge of carrier 220, and second end can be the rear of carrier 220.
According to some embodiments that can be combined with other embodiment as described herein, position detecting device can be through matching
It sets to provide about the position of carrier and/or the information of speed.In some instances, position detecting device can be encoder or
Person's resolver.Term " position detecting device ", " encoder ", " encoder apparatus " and " solution used in the whole text in present disclosure
Parser " is understood as providing the meaning of the device of the location information about carrier, such as, the absolute position in depositing system
It sets, such as relative to the relative position of guide structure and/or the speed of carrier.In some embodiments, speed can be used
Or VELOCITY DISTRIBUTION (speed profile) and reference point (starting point of such as carrier) obtain the position of carrier, such as absolutely
Position and/or relative position.
In some implementations, one or more operating parameters of driving structure can be used to obtain example in position detecting device
Such as the additional information of position and/or speed in relation to carrier.One or more of operating parameters can include but is not limited to grasp
The rate of doing work such as flows through the electric current of the active magnet unit of one or more second of driving structure.
Carrier 220 is configurable for one or more chambers (such as vacuum chamber) by depositing system, especially
By at least one deposition region, non-contact transport is carried out along the transportation route of such as linear transportation route.Carrier 220 can be with
It is disposed for carrying out non-contact transport in the transporting direction 1 that can be horizontally oriented.
According to some embodiments that can be combined with other embodiment as described herein, depositing system may include being configured to
Transport for non-contact suspension and/or non-contact transport of the carrier 220 in depositing system is arranged.In some implementations, if
Standby, especially transport is arranged, is carried including the guide structure 230 for making carrier 220 suspend and for mobile in transporting direction 1
The driving structure 210 of body 220.
Guide structure 230 can have be configured to magnetically interact with the first magnet structure 222 of carrier 220 one
A or multiple first active magnet units 112.First magnet structure 222 may include being configured as and 230 magnetism of guide structure
The first magnet unit of one or more of ground interaction.In some implementations, one or more first magnet units can be
Passive magnet unit, such as permanent magnet unit and/or ferromagnetic part.
According to some embodiments that can be combined with other embodiment as described herein, carrier 220 includes the second magnet
Structure, the second magnet structure include being configured as magnetically interacting with driving structure 210 moving in transporting direction 1
One or more the second magnet unit (not shown) of carrier 220.In some implementations, one or more of second magnet lists
Member can be passive magnet unit, such as ferromagnet.Guide structure 230 and driving structure 210 can be arranged in the phase of carrier 220
At end or end section.Specifically, one or more first magnet units and one or more second magnet units can be with
It is arranged at the opposing end portions or end section of carrier 220.
Depositing system, especially transport arrangement, may include the guide structure 230 with multiple guidance units 111.Each
Guidance unit 111 may include actuator, the such as first active magnet unit 112, the unit control for being configured to control actuator
Device 114, and be optionally configured to sense or measure magnet structure (especially one or more the first magnet list of magnet structure
Member) and actuator between gap range sensor 118.Gap can be measured in the direction perpendicular to transporting direction 1, it is all
Such as vertical direction 3 or horizontal direction 2.Particularly, range sensor 118 can be arranged to towards one or more first magnet lists
Member, such as when carrier 220 is located at range sensor 118 towards one or more first magnet units, to sense or measure
Gap between one or more first magnet units and the first active magnet unit 112.
Cell controller 114 can be configured to the first active magnet unit 112 of control to be based on being mentioned by encoder apparatus 215
It the information of confession and the information provided by range sensor 118 is provided is mentioned to adjust by the first active magnet unit 112
The magnetic force of confession.Particularly, cell controller 114 can be configured to the first active magnet unit 112 of control, so that in carrier 220
While by transport by depositing system, one or more the distance between first magnet unit and active magnet unit 112 bases
It is constant in sheet.Although Fig. 2 illustratively illustrates each guidance unit 111 with cell controller, it should be appreciated that present disclosure
It is without being limited thereto, and cell controller can be assigned to two or more guidance units.For example, all guidance can be directed to
Unit provides individual unit controller.
According to some embodiments that can be combined with other embodiment as described herein, equipment include controller 240 (
Referred to as " system controller " or " master controller "), controller 240 is configured as control guide structure 230 and/or driving structure
210.Controller 240 can wirelessly or by wire be connected to driving structure 210, be especially connected to encoder apparatus 215.?
In some embodiments, controller 240 may be coupled to guide structure 230, such as be connected to guide structure via bus 242
230.Particularly, controller 240 may be coupled to each cell controller 114 of guidance unit 111.Controller 240 can match
It is set to the cell controller 114 of guidance unit 111 and provides control signal or instruction to control guide structure 230.Bus 242 can
To be that based on line or can be wireless.
In some implementations, controller 240 can be configured to input signal based on one or more and selectively control
One or more first active magnet units 112.For example, controller 240 can send control signals to cell controller 114
To control one or more first active magnet units 112.One or more input signals can by encoder apparatus 215 and/
Or one or more range sensors 118 provide.For example, encoder apparatus 215 can be configured to provide one or more inputs
The first input signal of at least one of signal.At least one described first input signal can indicate that carrier 220 is in deposition
At least one of position and speed in system.Additionally or alternatively, one or more range sensors 118 can be configured to
There is provided at least one of one or more input signals the second input signal.At least one second input signal can indicate one
Gap between a or multiple first active magnet units 112 and carrier 220.
According to some embodiments that can be combined with other embodiment as described herein, the unit control of guidance unit 111
What device 114 processed can be provided based on the location information provided by encoder apparatus 215 and being optionally based on by range sensor 118
Gap information is before the first active magnet unit 112 and/or range sensor 118 " leave " respective rail on carrier 220
Deactivate the first active magnet unit 112.Optionally or alternatively, the cell controller 114 of guidance unit 111 can be based on by encoding
Device device 215 provide location information and be optionally based on the gap information provided by range sensor 118 only first
Active magnet unit 112 and/or range sensor 118 are towards the first active magnet of enabling after the respective rail on carrier 220
Unit 112.In other words, the first active magnet unit 112 quilt before the active magnet unit 112 of carrier 220 " leaving " first
It deactivates.Equally, the active magnet unit 112 of first be deactivated is only in the magnet knot of the first active magnet unit 112 and carrier
It is enabled after structure overlapping.The enabling of one or more first active magnet units 112 and/or deactivate can be gradually,
Continuous or unexpected (abrupt).Selective enabling can be provided and/or deactivated, because encoder apparatus 215 provides pass
Information in position of the carrier 220 in transporting direction 1 in depositing system.
According to the one side of present disclosure, carrier includes encoder.In other words, encoder is not integrated in transport cloth
In the setting but part of carrier.Function is substantially same as above.Particularly, encoder can be configured to provide instruction load
At least one signal of at least one of the position and speed of body.At least one described signal can correspond to described above
At least one first input signal.According to some embodiments, carrier may include being configured as transmitting at least one signal
To the communication device of depositing system.For example, communication device can be configured to for example wirelessly or via cable by least one believe
Number it is transferred to controller 240.
Carrier 220, which may be configured to hold, (to be such as vacuum-treated) substrate used in period in processing substrate and/or covers
Mould (not shown).In some implementations, carrier 220 can be configured to both supporting substrate and mask.In other implementation, carry
Body 220 can be configured to support or substrate or mask.In this case, carrier 220 can be referred to as " substrate load
Body " and " mask carrier ".
Carrier 220 may include providing the support construction or main body 225 of support surface, and the support surface, which can be, is matched
It is set to the substantially flat surface of the back surface for contacting such as substrate.Particularly, substrate can have and back surface phase
Pair front surface (also referred to as " processing surface "), the sedimentary on the front surface during the processing of such as vacuum deposition process.The
One magnet structure 222 can be set at main body 225.
Used term " vacuum " can be understood as with the vacuum pressure less than such as 10 millibars present disclosure in the whole text
The meaning of the technology vacuum of power.Pressure in vacuum chamber can be 10-5Millibar and about 10-8Between millibar, specifically 10-5Millibar and 10-7Between millibar, more specifically about 10-6Millibar and about 10-7Between millibar.It can provide and be connected to vacuum chamber
Room is with one or more vacuum pumps of the generation vacuum in vacuum chamber, such as turbine pump and/or cryogenic pump (cryo-pump).
It can be electrostatic chuck (E sucker) according to the carrier 220 of present disclosure, the electrostatic chuck is provided for by base
Plate and/or mask are maintained at the electrostatic force at carrier 220.For example, carrier 220 includes electrode arrangement, the electrode arrangement is matched
The attraction for providing and acting at least one of substrate and mask is provided.Electrode arrangement can be embedded in main body 225, or
(such as placement) can be set in main body 225.According to some embodiment party that can be combined with other embodiment as described herein
Formula, main body 225 are dielectric bodies, such as dielectric plate.Dielectric body can be made of dielectric substance, preferably high
Thermal conductivity dielectric substance, such as pyrolytic boron nitride, aluminium nitride, silicon nitride, alumina or equivalent material, but can be by such as gathering
Imido material is made.In some embodiments, electrode arrangement includes being placed on dielectric plate and being covered with Bao electricity Jie
The multiple electrodes of matter layer, such as thin metal strip grid (grid of fine metal strips).
Electrode arrangement, especially multiple electrodes can be configured to provide attraction, such as adsorption capacity.Attraction can be
Substrate and/or mask are acted at specific relative distance between multiple electrodes (or support surface) and substrate and/or mask
On power.Attraction can be the electrostatic force provided by the voltage for being applied to multiple electrodes arrangement.
The attraction that substrate can be provided by carrier 220 is towards support surface (for example, in the side perpendicular to transporting direction
In) attract, carrier 220 can be E sucker.Attraction can be sufficiently strong to keep substrate, such as by frictional force vertical
Substrate is kept in position.Particularly, attraction can be configured to be fixed on substrate on substantially immovable support surface.
For example, can regard coefficient of friction in order to use frictional force that 0.5 millimeter of glass substrate is maintained at vertical position and use about 50
To the suction pressure of 100 Ns/square metre (pa).
According to some embodiments that can be combined with other embodiment as described herein, carrier 220 is configurable for
With generally vertical orientation holding or supporting substrate and/or mask.Particularly, carrier can be configured for vertically-oriented
In transported.As present disclosure in the whole text used in, especially when being related to substrate orientation, it should be understood that " generally vertical "
Allow to deviate vertical direction or orientation ± 20 ° or less, for example, deviateing ± 10 ° or less.For example, determining because having with vertical
It can produce more stable substrate position to the substrate support of certain deviation, it is possible to provide this deviation.In addition, when substrate to
When top rake, less particle reaches substrate surface.However, for example during the deposition process, substrate orientation is considered as substantially
Upper vertical, this is considered different from horizontal base plate orientation, and horizontal base plate orientation can be considered as ± 20 ° horizontal or less.
Term " vertical direction " or " vertically-oriented " are interpreted as being different from " horizontal direction " or " horizontal orientation ".Namely
It says, " vertical direction " or " vertically-oriented " is related to the generally vertical orientation of such as carrier and substrate, wherein the deviation in several years,
For example, being regarded as from stringent vertical direction or vertically-oriented up to 10 ° or even up to 15 ° of deviation " generally vertical
Direction " or " generally vertical orientation ".Vertical direction can be substantially parallel to gravity.
Embodiment described herein can be used for being evaporated on large area substrates, and the substrate is for example aobvious for OLED
Show that device manufactures.Specifically, providing according to the targeted substrate of the structures and methods of embodiment described herein is large-area substrates.
For example, large-area substrates or carrier can be GEN 4.5, correspond to the surface of about 0.67 square metre (0.73 meter × 0.92 meter)
Product；GEN 5 corresponds to the surface area of about 1.4 square metres (1.1 meters × 1.3 meters)；GEN 7.5 corresponds to about 4.29 square metres
The surface area of (1.95 meters × 2.2 meters)；GEN 8.5 corresponds to the surface area of about 5.7 square metres (2.2 meters × 2.5 meters)；Or very
To being GEN 10, correspond to the surface area of about 8.7 square metres (2.85 meters × 3.05 meters).It can be similarly effected even greater
Generation, such as GEN 11 and GET 12 and corresponding surface area.One that GEN generation can also be provided in OLED display manufacture is medium-sized
It is small.
According to some embodiments that can be combined with other embodiment as described herein, substrate thickness can be 0.1 milli
Rice is to 1.8 millimeters.Substrate thickness can be about 0.9 millimeter or smaller, such as 0.5 millimeter.Term as used herein " substrate "
It can specifically include generally inflexible substrate, such as chip, the slice or glass of the transparent crystal of sapphire etc.
Glass plate.However, present disclosure is without being limited thereto, and term " substrate " may include flexible base board, such as coiled material or foil.Term
" generally inflexible " is interpreted as being different from " flexible ".Specifically, generally inflexible substrate can have certain journey
The flexibility of degree, such as the glass plate with 0.9 millimeter or smaller, such as 0.5 millimeter or smaller thickness, wherein with flexible base board
It compares, the flexibility of generally inflexible substrate is small.
According to embodiment described herein, substrate can be made of any material for being suitable for material deposition.For example, substrate
It can be by selected from by glass (such as soda-lime glass, borosilicate glass etc.), metal, polymer, ceramics, composite material, carbon fiber
Material is tieed up, or the material of group composed by the combination for any other material or material that can be coated by deposition processes
Material is made.
Fig. 3 shows setting for non-contact transport of the carrier in depositing system according to another aspect of the present disclosure
Standby schematic diagram.
The equipment includes at least one guidance unit 311.For example, multiple guidance units can be along the fortune of carrier 320
Defeated direction 1 is arranged.At least one guidance unit 311 includes active magnet unit 312 and is configured to measure active magnet unit
Two or more range sensors 318 in the gap between 312 and carrier 320.Active magnet unit 312 be arranged in two or
Between more range sensors 318.Particularly, active magnet unit 312 and two or more range sensors 318 can be with
It is sequentially arranged along the transporting direction 1 of carrier 320.Two or more range sensors 318 can be substantially the same.
According to some embodiments, active magnet unit can be controlled based on the comparison of the measuring signal of two sensors
312.For example, if two or more range sensors 318 provide different signals, that is, if two or more distances
Sensor 318 indicates different gaps, then active magnet unit 312 can be deactivated.Additionally or alternatively, if two or
More range sensors 318 provide substantially the same signal, that is, if two or more range sensors 318 indicate
Substantially the same gap, then active magnet unit 312 can be enabled.In some implementations, when between the gap measured
When difference is equal to or less than predetermined threshold, it can determine that measured gap is substantially the same.When the difference between the gap measured is big
When predetermined threshold, it can determine that measured gap is different.According to some embodiments, if two or more away from
Different signals is provided from sensor 318, that is, if two or more range sensors 318 indicate different gaps,
The close active magnet unit 312 of carrier can be enabled.In some embodiments, the equipment may further include position
Set detection device, such as encoder or resolver.Active magnet unit can be based on the information provided by position detecting device
Other controller, make it possible to achieve smooth transport of the carrier in transporting direction.
Fig. 4 A and Fig. 4 B show the equipment 400 of the non-contact transport for carrier 410 according to embodiment described herein
Schematic diagram.The equipment and carrier 410 can be configured according to embodiment described herein.
Equipment 400 includes the transport arrangement with guide structure 470 and the carrier 410 according to present disclosure, guidance knot
Structure 470 includes one or more first active magnetic units 475.Equipment 400 may further include controller, the controller
It is configured as selectively controlling in one or more first active magnet units 475 based on the data for using encoder to obtain
At least one first active magnet unit.According to some embodiments as described herein, transport arrangement can be arranged in vacuum system
In the vacuum chamber of system.Vacuum chamber can be vacuum deposition chamber.However, present disclosure is not limited to vacuum system, and
Carrier as described herein and transport arrangement can be implemented in atmospheric environment.
Carrier 410 may include the magnet structure with one or more first magnet units, and one or more of the
One magnet unit is configured as magnetically interacting with the guide structure 470 of vacuum system, to provide for keeping carrier 410 outstanding
Floating magnetic suspension force.One or more first magnet units can be the first passive magnetic unit 450.Guide structure 470 can be
Extend in the transporting direction 1 of carrier 410, transporting direction 1 can be horizontally oriented.Guide structure 470 may include one or more
A first active magnetic unit 475.Carrier 410 can be moveable along guide structure 470.First passive magnetic unit
The first active magnetic of one or more unit 475 of 450 (such as items of ferromagnetic material) and guide structure 470 can be configured to mention
For the first magnetic suspension force for making carrier 410 suspend.The device for suspension is non-contact for providing as described herein
Power is so that the device that such as carrier 410 suspends.
Transport configuration can further comprise driving structure 480.Driving structure 480 may include multiple other magnet lists
Member, such as one or more second active magnetic units.Carrier 410 may include being configured as with driving structure 480 magnetically
The second magnet unit of one or more of interaction.Particularly, it is passive to can be second for one or more second magnet units
Magnet unit 460 (such as item of ferromagnetic material), with the second active magnetic of one or more unit 485 with driving structure 480
Interaction.
Fig. 4 B shows the side view of transport arrangement.In figure 4b, multiple one or more first active magnetic units are shown
475 active magnetic unit.Active magnetic unit provides the magnetic to interact with the first passive magnetic unit 450 of carrier 410
Power.For example, the first passive magnetic unit 450 can be the bar of ferromagnetic material.What bar can be carrier 410 is connected to support construction
412 a part.Support construction 412 can be provided by the main body of carrier 410.Bar or the first passive magnetic unit can also divide
It is not integrally formed with support construction 412, with supporting substrate 10.Carrier 410 may further include the second passive magnetic unit
460, such as other bar.The other bar may be coupled to carrier 410.Bar or the second passive magnetic unit can also be distinguished
It is integrally formed with support construction 412.
The concept of " active " magnet unit is different from using the term of " passive " magnet unit herein.Passive magnetic unit
It can refer to the magnetic element of tool, not by Active control or adjustment, by Active control during the operation arranged at least not in transport
Or adjustment.For example, the magnetic of passive magnetic unit (such as bar or other bar of carrier) generally passes through vacuum in carrier movement
Not by Active control during chamber or vacuum system.According to some embodiment party that can be combined with other embodiment as described herein
Formula, the controller for transporting arrangement are not configured to control passive magnetic unit.Passive magnetic unit can be adapted for generating magnetic field,
Such as static magnetic field.Passive magnetic unit can not be configurable for generating adjustable magnetic field.Passive magnetic unit can be with
It is the magnetic material of such as ferromagnetic material, permanent magnet or can have permanent magnetism.
According to embodiment described herein, one or more first active magnetic units 475 are in the first passive magnetic unit
Magnetic force is provided on 450, and therefore provides magnetic force on carrier 410.One or more first active magnetic units 475 make carrier
410 suspend.One or more second active magnetic units 485 can drive carrier 410 in vacuum chamber, such as along transport
Direction 1 drives carrier 410.One or more second active magnetic units 485 form driving structure, and the driving structure is used for
The first active magnetic of one or more unit 475 by being located at 410 top of carrier moves in transporting direction 1 while suspension
Carrier 410.One or more second active magnetic units 485 can interact with the second passive magnetic unit 460 with along
Transporting direction 1 provides power.For example, the second passive magnetic unit 460 may include the multiple permanent magnets arranged with alternately polarity.The
The gained magnetic field of two passive magnetic units 460 can interact with one or more second active magnetic units 485 outstanding
Mobile vehicle 410 while floating.
In order to make carrier 410 suspend and/or utilize one or more using one or more first active magnetic units 475
Second active magnetic unit 485 keeps carrier 410 mobile, can control active magnetic unit to provide adjustable magnetic field.It is adjustable
Whole magnetic field can be static or dynamic magnetic field.According to the embodiment that can be combined with other embodiment as described herein,
Active magnetic unit be configurable for generating magnetic field with provide along the vertical direction 3 (for example, for vertically-oriented carrier and
Speech) or horizontal direction 2 (for example, for carrier of horizontal orientation) extend magnetic suspension force.According to can with it is described herein another
The other embodiment of outer embodiment combination, active magnetic unit can be configured for what offer extended in transverse direction
Magnetic force.As described herein, active magnetic unit can be or include the element selected from the group being made of the following: electromagnetic installing
It sets；Solenoid；Coil；Superconducting magnet；Or any combination of said elements.
Embodiment described herein is related to non-contact suspension, transport and/or the alignment of carrier, substrate and/or mask.This public affairs
It opens content and is related to carrier, may include one or more elements in the group being made of the following: the carrier of supporting substrate；
Carrier without substrate；Substrate；Or the substrate by supports support.Present disclosure in the whole text used in term " non-contact " can be with
The weight for being interpreted as such as carrier and substrate is not the meaning for being kept by Mechanical Contact or mechanical force but being kept by magnetic force.Tool
Body, using magnetic force rather than carrier is maintained at suspension or quick condition by mechanical force.For example, transport arrangement as described herein can
With the mechanical device of the weight of no support carrier, such as mechanical tracks.In some implementations, in vacuum system carrier it is outstanding
It, can absolutely not Mechanical Contact between carrier and the rest part of equipment during floating and for example mobile.
According to the embodiment of the present disclosure, it just suspends or suspends and refer to the state of object, wherein object is in no machine
It is floated in the case where tool contact or support.In addition, mobile object, which refers to, provides driving force (such as in the direction different from suspending power
In power), wherein object is moved to another different position from a position.For example, the object of such as carrier can suspend,
I.e. by resisting the power of gravity, and can be moved in the direction different from the direction for being parallel to gravity while suspending.
According to the non-contact suspension of the carrier of embodiment described herein and transport be it is beneficial, be carrier transport or
During alignment, particle will not be generated due to the Mechanical Contact between carrier and the part (such as mechanical tracks) of transport arrangement.
Therefore, embodiment as described herein provides the improved purity and uniformity for the layer being deposited on substrate, especially because working as
It is minimized using particle generation when non-contact suspension, transport and/or alignment.Furthermore it is possible to provide carrier without impact
(shock-less) and smoothly it transports, and can for example reduce or even glass be avoided to rupture.
Fig. 5 shows the system 500 for processing substrate according to embodiment described herein.Can be vacuum system is
System 500 can be configured for the one or more layers for depositing such as organic material using such as mask 20 on the substrate 10.
System 500 includes such as deposition chambers of vacuum chamber 502,520 and of carrier according to embodiment described herein
It is configured in the transport arrangement 510 of transport agent 520 in deposition chambers.In some implementations, system 500 is included in heavy
One or more material deposition sources 580 in product chamber.Carrier 520 can be configured to the lodgment in such as vacuum deposition process
Substrate 10 is kept during reason.System 500 can be configured for for example for manufacturing the evaporation of the organic material of OLED device.?
In another example, system 500 can be configured for CVD or PVD, and such as sputter deposits.
In some implementations, one or more material deposition sources 580 can be evaporation source, especially for sinking on substrate
One or more organic materials are accumulated to form the evaporation source of the layer of OLED device.For the branch support group for example during layer deposition processes
The carrier 520 of plate 10 can be transported in deposition chambers along transportation route (such as linear transportation route) and by deposit cavity
Room, and especially by deposition region.
Material can from one or more material deposition sources 580 in the direction of the launch towards where substrate to be coated 10
Deposition region transmitting.For example, one or more material deposition sources 580 can provide the line source with multiple openings and/or nozzle,
The multiple opening and/or nozzle are arranged at least one line along the length of one or more material deposition sources 580.Material
It can be sprayed by multiple openings and/or nozzle.
As indicated in figure 5, other chamber can be set adjacent to vacuum chamber 502.Vacuum chamber 502 can pass through
Valve and adjacent chamber with valve casing 504 and valve cell 506 separate.In carrier 520 (there is substrate 10 on carrier 520) such as arrow
After insertion vacuum chamber 502 shown in head, valve cell 506 can be closed.It can be true individually to control by generation technology vacuum
Atmosphere in plenum chamber 502, for example, passing through the vacuum pump for being connected to vacuum chamber 502.
According to some embodiments, carrier 520 and substrate 10 are static or dynamic during the deposition of deposition materials.
According to some embodiments as described herein, Dynamic deposition processing can be provided, such as manufacturing OLED device.
In some implementations, system 500 may include the one or more transportation routes for extending through vacuum chamber 502.
Carrier 520 can be configured for being transported along one or more transportation routes, for example, heavy by one or more materials
Product source 580.Although a transportation route is illustratively indicated with arrow in Fig. 5, it is to be understood that, present disclosure is unlimited
In this and two or more transportation routes can be provided.For example, at least two transportation routes can be substantially parallel to each other
Ground arrangement is for transporting corresponding carrier.One or more material deposition sources 580 can be arranged between two transportation routes.
Fig. 6 is shown is for handling and (being such as vacuum-treated) substrate 10 according to other embodiment as described herein
The schematic diagram of system 600.
System 600 includes two or more processing regions and arranges 660 according to the transport of present disclosure, transport arrangement
660 are configurable for by supporting substrate 10 and optionally the carrier 601 of mask being supported to transport two or more in order
Processing region.For example, transport arrangement 660 can be configured for passing through two or more along 1 transport agent 601 of transporting direction
A processing region is for carrying out processing substrate.In other words, substrate 10 is transported using identical carrier pass through multiple processing
Region.Particularly, in the processing area between the substrate of processing substrate and processing subsequent processing region, substrate 10 is not from carrier
601 remove, that is, for two or more substrate processing process, substrate is rested on identical carrier.According to some embodiment party
Formula, carrier 601 can be configured according to embodiment described herein.Optionally or alternatively, transport arrangement 660 can be such as ginseng
It examines and is configured like that described in such as Fig. 4 A and Fig. 4 B.
Such as graphical representation of exemplary in Fig. 6, two or more processing regions may include that the first deposition region 608 and second is heavy
Product region 612.It is alternatively possible to provide transport zone 610 between the first deposition region 608 and the second deposition region 612.It can
To provide multiple regions in a vacuum chamber, such as two or more processing regions and transport zone.Alternatively, can be
Multiple regions are provided in the different vacuum chambers being connected to each other.For example, each vacuum chamber can provide a region.Specifically
Ground, the first vacuum chamber can provide the first deposition region 608, and the second vacuum chamber can provide transport zone 610, and third
Vacuum chamber can provide the second deposition region 612.In some implementations, the first vacuum chamber and third vacuum chamber can be referred to as
" deposition chambers ".Second vacuum chamber can be referred to as " processing chamber housing ".It shown areas adjacent can mention in the example of fig. 6
For other vacuum chamber or region.
Vacuum chamber or region can be separated by valve and adjacent area with valve casing 604 and valve cell 605.It is carrying
After in (there is substrate 10 on the carrier 601) insertion of the body 601 such as region of the second deposition region 612, valve cell can be closed
605.The atmosphere that can be individually controlled by generation technology vacuum in region, for example, by being connected to the true of the region
Sky pump and/or by being inserted into one or more processing gas, for example, in the first deposition region 608 and/or the second deposition region
In 612.The transportation route of such as linear transportation route can be provided, to transport carrier 601 (there is substrate 10 on carrier 601)
It is input into region, is transported by region and is transported out region.Transportation route can at least partly extend through two or more
A processing region, such as the first deposition region 608 and the second deposition region 612, and alternately through transport zone 610.
System 600 may include transport zone 610.In some embodiments, transport zone 610 can be omitted.Transfer
Region 610 can be provided by the combination of rotary module, interconnecting module or above-mentioned module.Fig. 6 illustrates rotary module and interconnecting module
Combination.In rotary module, one or more carriers that track arranged and be arranged in track arrangement can surround rotary shaft
Rotation, the rotary shaft such as vertical rotary shaft.For example, one or more carriers can be transferred to from the left side of system 600 and be
The right side of system 600, or it is transferred to from the right side of system 600 left side of system 600.Interconnecting module may include cross track, with
One or more carriers are shifted in different directions (for example, direction perpendicular to one another) by interconnecting module.
In such as deposition region of the first deposition region 608 and the second deposition region 612, one or more can be provided
Sedimentary origin.For example, the first sedimentary origin 630 can be provided in the first deposition region 608.It can be in the second deposition region 612
Second sedimentary origin 650 is provided.One or more sedimentary origins can be evaporation source, and the evaporation source is configured in substrate 10
The one or more organic layers of upper deposition are to form the organic layer stack structure (stack) for OLED device.
Fig. 7 is shown to be connect according to the non-of carrier in the depositing system of such as vacuum system that be used for of embodiment described herein
Touch the flow chart of the method 700 of transport.Method 700 can use according to the carrier of present disclosure, equipment and system.
Method 700 includes generating at least one of the position and speed of instruction carrier using encoder in block 710
At least one signal, and one or more the of depositing system is controlled based at least one described signal in block 720
The active magnet unit of at least one of one active magnet unit.One or more first active magnet units may include in quilt
It is configured in the guide structure for making carrier suspend.In some implementations, method 700 can be based on the position letter provided by encoder
Breath is to determine position of the end of such as carrier in depositing system.
According to some embodiments, method 700 further comprises measuring one or more using such as range sensor
Gap between first active magnet unit and carrier, and control based on the gap measured one or more the of depositing system
The active magnet unit of at least one of one active magnet unit.
Can at least one of signal based on code device signal and from range sensor selectively controlled
Source magnet unit, to provide the steady movement of carrier.In one embodiment, it can change to flow through according to code device signal and draw
The electric current of the active magnet unit of at least one of guide structure.For example, for the active magnet unit of carrier " leaving ", electric current
It can suddenly or continuously be reduced to zero.In addition, electric current can for the active magnet unit of carrier " close " or " entrance "
To increase to setting value suddenly or continuously from zero.
According to embodiment described herein, computer program, software, computer software product and interrelated can be used
Controller come the method that carries out the contactless transport for carrier in depositing system, the controller can have CPU,
Memory, user interface, the bus for outputting and inputting device and being communicated with the corresponding component of carrier, equipment and/or system
System.Bus system can be based on line or can be wireless.
According to the embodiment of the present disclosure, determined using encoder position of the carrier in depositing system and/or
Speed.In some instances, encoder can be set at the driving structure of the transport arrangement of depositing system.In other example
In, encoder can be set on carrier to transport together with carrier.Selectivity is carried out in the position and/or speed that carrier can be used
Ground control transport arrangement, such as active magnet unit for making carrier suspend.The smooth transport of carrier may be implemented.
Although, can be in the base region for not departing from present disclosure described previously for the embodiment of present disclosure
In the case where design other and other embodiments of present disclosure, and scope of the present disclosure wanted by following right
Book is asked to determine.
Claims (15)
1. a kind of equipment of the non-contact transport for carrier in depositing system, comprising:
Driving structure for moving the carrier in transporting direction；With
Position detecting device at the driving structure.
2. equipment as described in claim 1, wherein the position detecting device is encoder or resolver.
3. equipment as claimed in claim 1 or 2 further comprises the guide structure for making the carrier suspend, described to draw
Guide structure has the one or more first for being configured as magnetically interacting with the first magnet structure of the carrier active
Magnet unit.
4. equipment as claimed in claim 3 further comprises controller, the controller is configured as based on one or more
Input signal selectively controls the one or more of first active magnet units, wherein the encoder is configured as mentioning
For the first input signal of at least one of one or more of input signals.
5. equipment as claimed in claim 4, wherein at least one described first input signal indicate the carrier position and
At least one of speed.
It further comprise one or more range sensors 6. equipment the invention according to any one of claims 2 to 5, described one
A or multiple range sensors are configured as measuring between the one or more of first active magnet units and the carrier
Gap.
7. equipment as claimed in claim 6, wherein one or more of range sensors be configured to supply it is one
Or the second input signal of at least one of multiple input signals, wherein at least one second input signal instruction described one
The gap a or between multiple first active magnet units and the carrier.
8. the equipment as described in any one of claims 1 to 7, wherein the driving structure includes being configured as and the carrier
The active magnet unit of one or more second that magnetically interacts of the second magnet structure.
9. a kind of system of the non-contact transport for carrier, comprising:
Such as equipment described in any item of the claim 1 to 8；With
The carrier.
10. a kind of carrier for the non-contact transport in depositing system, comprising:
Magnet structure is configured as magnetically interacting with the driving structure of the depositing system to move in transporting direction
The carrier；With
Position detecting device.
11. carrier as claimed in claim 10, wherein the position detecting device is configured to supply the instruction carrier
At least one signal of at least one of position and speed.
12. carrier as claimed in claim 11, further comprise be configured as at least one described signal being transferred to it is described
The communication device of depositing system.
13. the carrier as described in any one of claim 10 to 12, wherein the carrier is configured as in vertically-oriented or water
Calm down and is transported in the depositing system in.
14. a kind of method of the non-contact transport for carrier in depositing system, which comprises
The position and speed for indicating the carrier is generated using position detecting device at driving structure or on the carrier
At least one of at least one signal；With
It is controlled based at least one described signal in the active magnet unit of one or more first of the depositing system extremely
A few active magnet unit.
15. method as claimed in claim 14, further comprises:
Measure the gap between the one or more of first active magnet units and the carrier；With
It is controlled based on the gap measured in the one or more of first active magnet units of the depositing system
At least one active magnet unit.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/077644 WO2019081045A1 (en) | 2017-10-27 | 2017-10-27 | Apparatus for contactless transportation of a carrier in a deposition system, system for contactless transportation of a carrier, carrier for contactless transportation in a deposition system, and method for contactless transportation of a carrier in a deposition system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109983153A true CN109983153A (en) | 2019-07-05 |
Family
ID=60186309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780042940.9A Pending CN109983153A (en) | 2017-10-27 | 2017-10-27 | Equipment for non-contact transport of the carrier in depositing system, the system of the non-contact transport for carrier, for the carrier of the non-contact transport in depositing system and the method for the non-contact transport for carrier in depositing system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2020500257A (en) |
| KR (1) | KR20190058443A (en) |
| CN (1) | CN109983153A (en) |
| WO (1) | WO2019081045A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670028A (en) * | 2019-11-12 | 2020-01-10 | 谢曲坚 | Equipment for evaporating dysprosium on surface of magnetic material |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416123A (en) * | 2019-07-05 | 2019-11-05 | 深超光电（深圳）有限公司 | Adsorbent equipment and preparation method thereof and transfer system |
| KR102228145B1 (en) | 2019-08-07 | 2021-03-17 | 세메스 주식회사 | Apparatus for transporting carrier and system for controlling the apparatus |
| DE102020130209A1 (en) * | 2020-11-16 | 2022-05-19 | Applied Materials, Inc. | Vacuum processing system, support structure and method for transporting a substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545462A (en) * | 2012-07-10 | 2014-01-29 | 三星显示有限公司 | Organic layer deposition apparatus, organic light emitting display device and manufacturing method thereof |
| JP2016530709A (en) * | 2013-07-17 | 2016-09-29 | メカトロニクス・アクチェンゲゼルシャフトＭｅｃａｔｒｏｎｉｘ ＡＧ | Positioning device for moving a substrate |
| CN105993068A (en) * | 2014-11-27 | 2016-10-05 | Ulvac韩国股份有限公司 | Substrate transfer apparatus |
| JP2017507870A (en) * | 2014-03-19 | 2017-03-23 | メカトロニクス・アクチェンゲゼルシャフトＭｅｃａｔｒｏｎｉｘ ＡＧ | Conveying device for moving and / or positioning an object |
| JP2017514446A (en) * | 2014-04-25 | 2017-06-01 | メカトロニクス・アクチェンゲゼルシャフトＭｅｃａｔｒｏｎｉｘ ＡＧ | Device for holding, positioning and / or moving objects |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101386685B1 (en) * | 2012-04-20 | 2014-04-24 | 세메스 주식회사 | Apparatus for processing substrate |
-
2017
- 2017-10-27 KR KR1020197000067A patent/KR20190058443A/en not_active Application Discontinuation
- 2017-10-27 JP JP2018566408A patent/JP2020500257A/en active Pending
- 2017-10-27 WO PCT/EP2017/077644 patent/WO2019081045A1/en active Application Filing
- 2017-10-27 CN CN201780042940.9A patent/CN109983153A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545462A (en) * | 2012-07-10 | 2014-01-29 | 三星显示有限公司 | Organic layer deposition apparatus, organic light emitting display device and manufacturing method thereof |
| JP2016530709A (en) * | 2013-07-17 | 2016-09-29 | メカトロニクス・アクチェンゲゼルシャフトＭｅｃａｔｒｏｎｉｘ ＡＧ | Positioning device for moving a substrate |
| JP2017507870A (en) * | 2014-03-19 | 2017-03-23 | メカトロニクス・アクチェンゲゼルシャフトＭｅｃａｔｒｏｎｉｘ ＡＧ | Conveying device for moving and / or positioning an object |
| JP2017514446A (en) * | 2014-04-25 | 2017-06-01 | メカトロニクス・アクチェンゲゼルシャフトＭｅｃａｔｒｏｎｉｘ ＡＧ | Device for holding, positioning and / or moving objects |
| CN105993068A (en) * | 2014-11-27 | 2016-10-05 | Ulvac韩国股份有限公司 | Substrate transfer apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670028A (en) * | 2019-11-12 | 2020-01-10 | 谢曲坚 | Equipment for evaporating dysprosium on surface of magnetic material |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190058443A (en) | 2019-05-29 |
| WO2019081045A1 (en) | 2019-05-02 |
| JP2020500257A (en) | 2020-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109983153A (en) | Equipment for non-contact transport of the carrier in depositing system, the system of the non-contact transport for carrier, for the carrier of the non-contact transport in depositing system and the method for the non-contact transport for carrier in depositing system | |
| US11377310B2 (en) | Magnetic levitation system, base of a magnetic levitation system, vacuum system, and method of contactlessly holding and moving a carrier in a vacuum chamber | |
| TW201923943A (en) | Method and apparatus for determining alignment of a carrier levitation system | |
| JP6440740B2 (en) | Device for holding, positioning and / or moving objects | |
| TW202001274A (en) | Distance sensor for measuring a distance to a ferromagnetic element, magnetical levitation system and method for measuring a distance to a ferromagnetic element | |
| TW201932393A (en) | Carrier for contactless transportation in a deposition system, apparatus for contactless transportation of a carrier, and method for contactless transportation of a carrier in a deposition system | |
| TWI670789B (en) | Carrier for use in a vacuum system, system for vacuum processing, and method for vacuum processing of a substrate | |
| CN109983152B (en) | System for contactless transport vehicles, and method for contactless transport vehicles in a deposition system | |
| KR20210104134A (en) | Magnetic levitation system, carrier for magnetic levitation system, vacuum system, and method of transporting carrier | |
| CN112218971A (en) | Magnetic levitation system for transporting a carrier, carrier for a magnetic levitation system, processing system for vertical processing of substrates and method for transporting a carrier | |
| US20240204697A1 (en) | Apparatus and method for contactless transportation of a carrier | |
| CN113678238A (en) | Magnetic levitation system and method for measuring the distance between at least one electromagnetic actuator and a ferromagnetic element | |
| KR20220021455A (en) | How to levitate a magnetic levitation system and carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190705 |
|
| WD01 | Invention patent application deemed withdrawn after publication |