CN109981958A - The production method of camera module, terminal device and camera module - Google Patents
The production method of camera module, terminal device and camera module Download PDFInfo
- Publication number
- CN109981958A CN109981958A CN201910335910.8A CN201910335910A CN109981958A CN 109981958 A CN109981958 A CN 109981958A CN 201910335910 A CN201910335910 A CN 201910335910A CN 109981958 A CN109981958 A CN 109981958A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- camera module
- metal support
- knockout
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention discloses a kind of camera module comprising: circuit board, the circuit board offer area of knockout；Metal support, the metal support are connected with the circuit board, and at least partly described metal support is oppositely arranged with the area of knockout；Image sensor chip, described image sensing chip are arranged on the position opposite with the area of knockout of the metal support, described image sensing chip and the circuit board electrical connection.Invention additionally discloses a kind of production method of camera module and terminal devices.Above scheme can solve current camera module production method and be easier to the problem for causing camera module shooting quality poor.
Description
Technical field
The present invention relates to technical field of communication equipment more particularly to a kind of camera modules, terminal device and camera mould
The production method of group.
Background technique
Shooting function is the basic function of terminal device, and shooting function is completed by the camera module of terminal device.It takes the photograph
As head mould group generally includes circuit board, image sensor chip and some subsidiary components (such as resistance, capacitor etc.), circuit board
Be adhesively fixed on circuit boards by glue-line, subsidiary components usually pass through SMT (Surface Mount Technology,
Surface mounting technology) process Installation is on circuit boards.
Camera module is higher to the planarity requirements of circuit board, while circuit board also being required to install image sensing core
Higher flatness is still kept after piece and subsidiary components, and then is able to maintain higher image quality.
But the production method of above-mentioned camera module have the defects that it is more, subsidiary components pass through SMT technique groups
During dress, circuit board meeting expanded by heating causes the flatness of plate face to decline, especially in the lesser feelings of the thickness of circuit board
Under condition, the plate face flatness decline of circuit board is more very, it is obvious that the shooting quality that this will lead to camera module is poor.
Summary of the invention
The present invention discloses a kind of camera module, is easier to cause to image with the camera module production method for solving current
The poor problem of head mould group shooting quality.
To solve the above-mentioned problems, the present invention adopts the following technical solutions:
A kind of camera module, comprising:
Circuit board, the circuit board offer area of knockout；
Metal support, the metal support are connected with the circuit board, at least partly described metal support and institute
Area of knockout is stated to be oppositely arranged；
The opposite with the area of knockout of the metal support is arranged in image sensor chip, described image sensing chip
Position on, described image sensing chip and the circuit board electrical connection.
A kind of terminal device, including camera module described above.
A kind of production method of camera module characterized by comprising
Area of knockout is offered in circuit board；
Metal support is fixed on the circuit board, so that at least partly described metal support is hollowed out with described
Region is oppositely arranged；
Image sensor chip is arranged on the position opposite with the area of knockout of the metal support；
It is electrically connected described image sensing chip and the circuit board.
The technical solution adopted by the present invention can reach it is following the utility model has the advantages that
Camera module disclosed by the invention improves the structure of camera module in the prior art, in circuit
Area of knockout is opened up on plate, metal support is arranged on circuit boards, and provides installation foundation, image for image sensor chip
Sensing chip is mounted on the position opposite with area of knockout of metal support, image sensor chip and circuit board electrical connection,
So as to ensure that image sensor chip can work.For by board support image sensor chip, metal support
Portion has higher intensity, is affected by temperature smaller, therefore exists and deforms lesser advantage, therefore can preferably ensure to install
The flatness of the base surface of image sensor chip achievees the purpose that the shooting quality for improving camera module.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes a part of the invention, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the perspective view of the explosion of camera module disclosed by the embodiments of the present invention；
Fig. 2 is the partial structure diagram of encapsulation module disclosed by the embodiments of the present invention；
Fig. 3 is the flow diagram of the production method of camera module disclosed by the embodiments of the present invention.
Description of symbols:
100- circuit board, 110- area of knockout, 120- pad,
200- metal support, 210- flat support portion, 220- interconnecting piece,
300- image sensor chip,
400- camera lens, 500- protective film, 600- bracket, 700- flexible circuit board, 800- electric connector, 900- infrared filtering
Piece.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
Below in conjunction with attached drawing, technical solution disclosed in each embodiment that the present invention will be described in detail.
Fig. 1-Fig. 3 is please referred to, the embodiment of the present invention discloses a kind of camera module, and disclosed camera module includes electricity
Road plate 100, metal support 200 and image sensor chip 300.
Circuit board 100 is the basic component of camera module, and circuit board 100 is the other components of camera module
(such as resistance, capacitor etc.) provides installation foundation, and at the same time, circuit board 100 is (such as being schemed with electric components for camera module
As sensing chip 300) power supply is provided.In the embodiment of the present invention, circuit board 100 offers area of knockout 110, area of knockout 110
It can be slot, or aperture.
Image sensor chip 300 is the core component of camera module, and image sensor chip 300 can incude optical signal and turn
It is changed to electric signal, and then is capable of forming image information.
Metal support 200 is made of metal material, and metal support 200 is that image sensor chip 300 provides installation base
Plinth, in the embodiment of the present invention, metal support 200 is connected with circuit board 100, specifically, metal support 200 can be fixed on
On circuit board 100.At least partly metal support 200 is oppositely arranged with area of knockout 110, and the setting of image sensor chip 300 exists
On the position opposite with area of knockout 110 of metal support 200, image sensor chip 300 is electrically connected with circuit board 100, into
And can be realized between image sensor chip 300 and circuit board 100 for be electrically connected and signal connect.
Camera module disclosed by the embodiments of the present invention improves the structure of camera module in the prior art,
Area of knockout 110 is opened up on circuit board 100, metal support 200 is arranged on circuit board 100, and is image sensing core
Piece 300 provides installation foundation, and image sensor chip 300 is mounted on the position opposite with area of knockout 110 of metal support 200
On, image sensor chip 300 is electrically connected with circuit board 100, so as to ensure that image sensor chip 300 can work.It compares
In by circuit board 100 support image sensor chip 300 for, metal support 200 have higher intensity, be affected by temperature compared with
It is small, therefore exist and deform lesser advantage, therefore can preferably ensure to install the plane of the base surface of image sensor chip 300
Degree achievees the purpose that the shooting quality for improving camera module.Metal has good thermal diffusivity simultaneously, can provide preferably
Temperature control.
In addition, can preferably be realized to image sensor chip due to the intensity with higher of metal support 200
300 support can reduce the plate thickness of circuit board 100 in such cases, as the thickness of circuit board 100 reduces, can reduce
The stack height of camera module finally can provide more spaces for the assembling of terminal device.
Moreover, the higher-strength of metal support 200, can preferably resist foreign impacts, figure can be effectively supported
As sensing chip 300, and then the deformation that image sensor chip 300 generates in falling process is avoided, can preferably protect image
Sensing chip reaches and avoids terminal device from falling being easier to the case where causing camera module to be damaged.
The surface of metal support 200 has good flatness, can reach 15 μm under normal conditions, and circuit board
100 can reach 40 μm, it is obvious that support image sensor chip 300 to be undoubtedly capable of providing preferably using metal support 200
Surface smoothness.
At the same time, for circuit board 100 directly supports image sensor chip 300, metal support 200 has
Good heat dissipation performance can quickly remove the heat generated in the camera module course of work, it is seen then that the embodiment of the present invention
Disclosed camera module undoubtedly has stronger heat-sinking capability.
Referring again to Fig. 1, it is generally the case that camera module further includes bracket 600 and camera lens 400, and camera lens 400 is installed
On bracket 600, bracket 600 is fixed on circuit board 100, and image sensor chip 300 is found a view through camera lens 400.Preferred side
In case, protecting film 500 has been can be set in one end away from image sensor chip 300 of camera lens 400, and protecting film 500 can play
Protect the effect of camera lens 400.Infrared fileter has can be set in the other end towards image sensor chip 300 of camera lens 400
900, infrared fileter 900 can play the role of optical filtering.Circuit board 100 can connect flexible circuit board 700, specifically,
One end of flexible circuit board 700 is electrically connected with circuit board 100, and the other end can pass through the master of electric connector 800 and terminal device
Plate electrical connection.Specifically, electric connector 800 can be Board-to-Board Electrical Connector.
Metal support 200 plays the role of supporting image sensor chip 300, and metal support 200 and circuit board 100 connect
Connect, the structure of metal support 200 can there are many.Referring again to Fig. 1, metal support 200 may include flat support
The edge in flat support portion 210 can be set in portion 210 and interconnecting piece 220, interconnecting piece 220.Interconnecting piece 220 and circuit board 100
It is fixedly linked, flat support portion 210 is oppositely arranged with area of knockout 110, and image sensor chip 300 is mounted on flat support portion
On 210.Flat support portion 210 is that image sensor chip 300 provides installation site, and flat support portion 210 be capable of providing it is flat
The whole better mounting surface of degree, is conducive to the installation quality for improving image sensor chip 300.
Interconnecting piece 220 with circuit board 100 for connecting, specifically, interconnecting piece 220 can be by the modes such as being bonded, welding
It is fixedly linked with circuit board 100, the embodiment of the present invention does not limit the fixed form between interconnecting piece 220 and circuit board 100.
In the embodiment of the present invention, the quantity of interconnecting piece 220 can be one, or at least two.It is a kind of specific
In embodiment, the quantity of interconnecting piece 220 is four, and four interconnecting pieces 220 are located at four angles in flat support portion 210
All.More interconnecting piece 220 undoubtedly can be improved the connective stability between metal support 200 and circuit board 100.
As described above, area of knockout 110 can be aperture, and circuit board 100 may include pad 120, pad 120 and company
Socket part 220 is oppositely arranged.It can be opened up in the plate face of circuit board 100 being away from each other with the photosensitive direction of image sensor chip 300
There is connecting hole, connecting hole is penetrated through to pad 120, and in such cases, the hole wall and pad 120 for being equivalent to connecting hole are collectively formed one
A link slot, bottom surface of the pad 120 as link slot.Interconnecting piece 220 can be inserted in connecting hole, interconnecting piece 220 and pad 120
It is weldingly connected, the plate face away from photosensitive direction of the plate face away from photosensitive direction in flat support portion 210 and circuit board 100 can be with
It is coplanar.During assembling, the interconnecting piece 220 of metal support 200 can be pre-positioned in connecting hole, then with pad
120 are welded and fixed, and such structure is conducive to the assembling between metal support 200 and circuit board 100.At the same time, plate branch
Support part 210 and circuit board 100 it is coplanar away from the plate face in photosensitive direction, can undoubtedly further decrease circuit board 100 and flat
The stack thickness of plate support portion 210.Image sensor chip 300 is mounted in flat support portion 210, and can be located in aperture.
Certainly, the plate face away from photosensitive direction of flat support portion 210 and circuit board 100 can also be non-coplanar.
In the embodiment of the present invention, metal support 200 can be an integral structure part, specifically, metal support 200 can
Think Integral refractive comer pieces, or integral type cutting member.Using integral structure, it can undoubtedly facilitate metal support
200 manufacture is assembled.Metal support 200 can be stainless steel support portion, or the rigidity of other metallic materials
Support portion, or can also be alloy material support portion, the embodiment of the present invention does not limit the specific material of metal support 200.
Image sensor chip 300 can be realized and being electrically connected between circuit board 100 by gold thread.Metal support 200
The bearing height of image sensor chip 300 can be adjusted according to the height of circuit board 100, for various sizes of image
Sensing chip 300 is installed, and needs to adjust the difference in height of gold thread Yu circuit board 100, avoids gold thread under tension during dozen gold thread
Fracture.
More preferably in scheme, image sensor chip 300 is arranged in area of knockout 110, image sensor chip 300
Surface towards the camera lens 400 of camera module away from the distance of camera lens 400 is first distance, circuit board 100 towards camera lens 400
Distance of the surface away from camera lens 400 be second distance, first distance can be less than second distance, in such cases, image sensing
The height of the height meeting height circuit board 100 of chip 300, and then circuit board 100 can be protruded from after mounting towards mirror
First 400 plate face, this is not only advantageous to mention the yield of gold thread connection, but also 300 surface of image sensor chip easy to clean
Dust reduces the bad problems such as stain.
In camera module disclosed by the embodiments of the present invention, circuit board 100 can be rigid-flexible circuit board, or
Hard circuit board, is also possible to flexible circuit board, and the embodiment of the present invention does not limit the specific type of circuit board 100.
Based on camera module disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of terminal device, disclosed
Terminal device may include camera module described in foregoing embodiments.
Terminal device disclosed by the embodiments of the present invention can be mobile phone, tablet computer, E-book reader, game machine, can
The terminal devices such as wearable device (such as smartwatch), the embodiment of the present invention do not limit the specific type of terminal device.
Based on camera module disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of production of camera module
Method, please also refer to Fig. 1-Fig. 3, disclosed production method includes:
S101, area of knockout 110 is opened up in circuit board 100.
This step can open up area of knockout in circuit board 100 using modes such as stamping equipment, Radium art, cutting techniques
110, area of knockout 110 can be aperture, or slot.
S102, metal support 200 is fixed on circuit board 100, so that at least partly metal support 200 and digging
Empty region 110 is oppositely arranged.
In this step, metal support 200 is used to provide installation site for the image sensor chip 300 of camera module.
Metal support 200 can be fixed on circuit board 100 by modes such as paste solder printing, bonding, laser weldings, at least partly golden
Belong to support portion 200 to be oppositely arranged with area of knockout 110, and then enables to image sensor chip 300 to be located at after mounting and hollow out
In region 110.
S103, image sensor chip 300 is arranged on the position opposite with area of knockout 110 of metal support 200.
Image sensor chip 300 can also be mounted on metal support 200 using various ways, such as be welded.
S104, electrical connection image sensor chip 300 and circuit board 100.
This step is installed in place and then is electrically connected image sensor chip 300 and circuit board in image sensor chip 300
100, and then ensure that image sensor chip 300 can work normally.Image sensor chip 300 can pass through conducting resinl, gold thread etc.
It realizes and being electrically connected between circuit board 100.
The beneficial effect that the production method of camera module disclosed by the embodiments of the present invention reaches can refer to above corresponding
Partial description, details are not described herein.
Emphasis describes the difference between each embodiment, difference between each embodiment in foregoing embodiments of the present invention
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above description is only an embodiment of the present invention, is not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (10)
1. a kind of camera module characterized by comprising
Circuit board, the circuit board offer area of knockout；
Metal support, the metal support are connected with the circuit board, at least partly described metal support and the digging
Empty region is oppositely arranged；
The portion opposite with the area of knockout of the metal support is arranged in image sensor chip, described image sensing chip
On position, described image sensing chip and the circuit board electrical connection.
2. camera module according to claim 1, which is characterized in that the area of knockout is aperture.
3. camera module according to claim 1, which is characterized in that the metal support include flat support portion and
The interconnecting piece at flat support portion edge is set, and the interconnecting piece is fixedly linked with the circuit board, the flat support
Portion is oppositely arranged with the area of knockout, and described image sensing chip is mounted in the flat support portion.
4. camera module according to claim 3, which is characterized in that the interconnecting piece is by way of being bonded or welded
It is fixedly linked with the circuit board.
5. camera module according to claim 4, which is characterized in that the area of knockout is aperture, the circuit board
Including the pad being oppositely arranged with the interconnecting piece, the circuit board is away from each other with the photosensitive direction of described image sensing chip
Plate face offer connecting hole, the connecting hole is penetrated through to the pad, and the interconnecting piece is inserted into the connecting hole, and described
Interconnecting piece is connected with the pad solder, the plate face away from the photosensitive direction in the flat support portion and the circuit board
Plate face away from the photosensitive direction is coplanar.
6. camera module according to claim 3, which is characterized in that the metal support is an integral structure part.
7. camera module according to claim 1, which is characterized in that the metal support is stainless steel support portion.
8. camera module according to claim 1, which is characterized in that the setting of described image sensing chip is hollowed out described
In region, and the surface of the camera lens towards the camera module of described image sensing chip is the away from the distance of the camera lens
One distance, the surface towards the camera lens of the circuit board are second distance, the first distance away from the distance of the camera lens
Less than the second distance.
9. a kind of terminal device, which is characterized in that including camera module of any of claims 1-8.
10. a kind of production method of camera module characterized by comprising
Area of knockout is offered in circuit board；
Metal support is fixed on the circuit board, so that at least partly described metal support and the area of knockout
It is oppositely arranged；
Image sensor chip is arranged on the position opposite with the area of knockout of the metal support；
It is electrically connected described image sensing chip and the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910335910.8A CN109981958A (en) | 2019-04-24 | 2019-04-24 | The production method of camera module, terminal device and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910335910.8A CN109981958A (en) | 2019-04-24 | 2019-04-24 | The production method of camera module, terminal device and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109981958A true CN109981958A (en) | 2019-07-05 |
Family
ID=67086196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910335910.8A Pending CN109981958A (en) | 2019-04-24 | 2019-04-24 | The production method of camera module, terminal device and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109981958A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110266934A (en) * | 2019-07-24 | 2019-09-20 | Oppo（重庆）智能科技有限公司 | Chip assembly, camera and the electronic equipment of camera |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040007970A1 (en) * | 2000-07-18 | 2004-01-15 | Kelvin Ma | Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same |
| CN102593116A (en) * | 2011-01-12 | 2012-07-18 | 陈淑姿 | Thinned image capture module and manufacturing method thereof |
| CN103024251A (en) * | 2011-09-23 | 2013-04-03 | 三星电机株式会社 | Camera module |
| CN104796588A (en) * | 2015-03-10 | 2015-07-22 | 南昌欧菲光电技术有限公司 | Camera module |
| CN106506929A (en) * | 2016-12-23 | 2017-03-15 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
| CN106803870A (en) * | 2015-11-26 | 2017-06-06 | 三星电机株式会社 | Camera model |
| CN106998414A (en) * | 2016-01-26 | 2017-08-01 | 三星电机株式会社 | Image sensor module and the camera model including the image sensor module |
| CN107395938A (en) * | 2017-08-28 | 2017-11-24 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, there is its camera module and preparation method |
| TW201741752A (en) * | 2016-03-15 | 2017-12-01 | Sunny Optical Tech Group Company Limited | Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device |
| CN107566691A (en) * | 2016-07-03 | 2018-01-09 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN208028981U (en) * | 2018-03-13 | 2018-10-30 | 信利光电股份有限公司 | A kind of bundled components of image sensor chip, package assembling and camera module |
| CN208401972U (en) * | 2018-05-16 | 2019-01-18 | Oppo广东移动通信有限公司 | A kind of camera module |
-
2019
- 2019-04-24 CN CN201910335910.8A patent/CN109981958A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040007970A1 (en) * | 2000-07-18 | 2004-01-15 | Kelvin Ma | Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same |
| CN102593116A (en) * | 2011-01-12 | 2012-07-18 | 陈淑姿 | Thinned image capture module and manufacturing method thereof |
| CN103024251A (en) * | 2011-09-23 | 2013-04-03 | 三星电机株式会社 | Camera module |
| CN104796588A (en) * | 2015-03-10 | 2015-07-22 | 南昌欧菲光电技术有限公司 | Camera module |
| CN106803870A (en) * | 2015-11-26 | 2017-06-06 | 三星电机株式会社 | Camera model |
| CN106998414A (en) * | 2016-01-26 | 2017-08-01 | 三星电机株式会社 | Image sensor module and the camera model including the image sensor module |
| TW201741752A (en) * | 2016-03-15 | 2017-12-01 | Sunny Optical Tech Group Company Limited | Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device |
| CN107566691A (en) * | 2016-07-03 | 2018-01-09 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN106506929A (en) * | 2016-12-23 | 2017-03-15 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
| CN107395938A (en) * | 2017-08-28 | 2017-11-24 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, there is its camera module and preparation method |
| CN208028981U (en) * | 2018-03-13 | 2018-10-30 | 信利光电股份有限公司 | A kind of bundled components of image sensor chip, package assembling and camera module |
| CN208401972U (en) * | 2018-05-16 | 2019-01-18 | Oppo广东移动通信有限公司 | A kind of camera module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110266934A (en) * | 2019-07-24 | 2019-09-20 | Oppo（重庆）智能科技有限公司 | Chip assembly, camera and the electronic equipment of camera |
| CN110266934B (en) * | 2019-07-24 | 2021-03-23 | Oppo（重庆）智能科技有限公司 | Chip assembly of camera, camera and electronic equipment |
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Application publication date: 20190705 |