CN208028981U - A kind of bundled components of image sensor chip, package assembling and camera module - Google Patents
A kind of bundled components of image sensor chip, package assembling and camera module Download PDFInfo
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- CN208028981U CN208028981U CN201820340634.5U CN201820340634U CN208028981U CN 208028981 U CN208028981 U CN 208028981U CN 201820340634 U CN201820340634 U CN 201820340634U CN 208028981 U CN208028981 U CN 208028981U
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- image sensor
- sensor chip
- wiring board
- bearing substrate
- plastic packaging
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Abstract
The utility model discloses a kind of bundled components of image sensor chip, package assembling and camera modules.The bundled components include bearing substrate, wiring board and image sensor chip, and the wiring board is arranged on the bearing substrate and there is etched-off area, described image sensing chip to be located in the etched-off area of the wiring board and be arranged on the bearing substrate for centre；Described image sensing chip is electrically connected by binding line and wiring board binding.The bundled components can effectively reduce the photosurface of image sensor chip to the thickness of module bottom surface, be conducive to the lightening of camera module.
Description
Technical field
The utility model is related to field of photography more particularly to a kind of bundled components of image sensor chip, package assembling and
Camera module.
Background technology
Lightening is the important development direction of camera module.As shown in Figure 1,3 ' the surface of overall thickness=camera lens of camera module
To the photosurface of image sensor chip 1 ' distance L1 '+image sensor chip 1 ' photosurface to module bottom surface distance L2 ',
Due to the optical confinement by camera lens 3 ', the distance L1 ' on 3 ' surface of camera lens to the photosurface of image sensor chip 1 ' is relatively solid
Fixed, usually between 3-5mm, depending on the different optical parameters of visor head 3 ', then reducing the photosensitive of image sensor chip 1 '
Face just becomes a kind of important method for the overall thickness for reducing camera module to the distance L2 ' of module bottom surface.Existing image passes
The photosurface of sense chip 1 ' is to the thickness of thickness+wiring board 2 ' of distance L2 '=image sensor chip 1 ' of module bottom surface, circuit
For plate 2 ' due to needing impact force when bearing binding routing, thickness is bigger, is unfavorable for the lightening of camera module.
Utility model content
In order to solve above-mentioned the deficiencies in the prior art, the utility model provide a kind of bundled components of image sensor chip,
Package assembling and camera module.The bundled components can effectively reduce the photosurface of image sensor chip to the thickness of module bottom surface
Degree, is conducive to the lightening of camera module.
Technical problem to be solved in the utility model is achieved by the following technical programs：
A kind of bundled components of image sensor chip, including bearing substrate, wiring board and image sensor chip, the circuit
Plate is arranged on the bearing substrate and there is etched-off area, described image sensing chip to be located at emptying for the wiring board for centre
In region and it is arranged on the bearing substrate；Described image sensing chip is bound to form electricity by binding line and the wiring board
Property connection.
Further, the thickness of the bearing substrate is between 0.1-0.2mm.
Further, the bearing substrate doubles as heat-radiating substrate.
Further, the bearing substrate is metallic plate or heat dissipation membrane.
A kind of package assembling of image sensor chip, including the bundled components of above-mentioned image sensor chip and plastic packaging branch
Frame, the plastic packaging rack integral are produced on the surface of the wiring board.
Further, the circuit element of PCB surface is stated in the plastic packaging holder environmental sealing residence.
Further, the circuit element includes capacitance and/or resistance.
Further, the material of the plastic packaging holder is epoxy resin.
Further, it is provided with optical filter on the plastic packaging holder, alternatively, being provided with carrying branch on the plastic packaging holder
Frame is provided with optical filter in the bearing support.
A kind of camera module includes the package assembling of above-mentioned image sensor chip.
The utility model has the advantages that：The bundled components are slotted on the wiring board makes etched-off area,
And the bearing substrate is set on the back side of the wiring board, described image sensing chip is sunk into the bearing substrate
On, in this way, thickness+bearing substrate of the photosurface of described image sensing chip to distance=image sensor chip of module bottom surface
Thickness, it is unrelated with the thickness of the wiring board, and the bearing substrate be used only as carrying described image sensing chip, thickness
Thickness than the wiring board is much smaller, can reduce the overall thickness of camera module in 0.2mm or more.
Description of the drawings
Fig. 1 is the schematic diagram of existing camera module；
Fig. 2 is the schematic diagram of the bundled components of image sensor chip provided by the utility model；
Fig. 3 is the schematic diagram of camera module provided by the utility model.
Specific implementation mode
The utility model is described in detail with reference to the accompanying drawings and examples.
Embodiment one
As shown in Fig. 2, a kind of bundled components of image sensor chip 1, including bearing substrate 3, wiring board 2 and image sensing
Chip 1, the wiring board 2 is arranged on the bearing substrate 3 and centre has etched-off area, described image sensing chip 1
In in the etched-off area of the wiring board 2 and be arranged on the bearing substrate 3；Described image sensing chip 1 passes through binding line 4
It is electrically connected with the binding of the wiring board 2.
The bundled components are slotted on the wiring board 2 makes etched-off area, and is arranged on the back side of the wiring board 2
The bearing substrate 3 sinks to described image sensing chip 1 on the bearing substrate 3, described in this way in camera module
The photosurface of image sensor chip 1 to thickness+bearing substrate 3 of distance L2=image sensor chip 1 of module bottom surface thickness,
It is unrelated with the thickness of the wiring board 2, and the bearing substrate 3 is used only as carrying described image sensing chip 1, thickness compares institute
The thickness for stating wiring board 2 is much smaller, can reduce the overall thickness of camera module in 0.2mm or more.
The thickness of the bearing substrate 3 is between 0.1-0.2mm.
The bearing substrate 3 doubles as heat-radiating substrate, to reinforce heat dissipation effect, it is preferable that the bearing substrate 3 is metal
Plate, such as stainless steel plate, aluminium sheet or copper coin etc., certainly, the bearing substrate 3 or heat dissipation membrane, such as graphite flake etc..
Embodiment two
As shown in figure 3, a kind of package assembling of image sensor chip 1, including the image sensing core described in embodiment two
The bundled components and plastic packaging holder 6 of piece 1,6 integration of plastic packaging holder are produced on the surface of the wiring board 2.
The circuit element 7 on 2 surface of wiring board is stated in 6 environmental sealing residence of the plastic packaging holder, and the circuit element 7 includes electricity
Appearance and/or resistance.
The package assembling makes the plastic packaging holder on the wiring board 2 using plastic packaging glue by plastic package process integration
6, the circuit element 7 on wiring board 2 is stated with environmental sealing residence, the size of camera module can be effectively reduced in 0.5mm or more.
The plastic packaging holder 6 does not contact that binding line 4 is not stated in environmental sealing residence yet, prevents plastic packaging glue in cure shrinkage pair
The fracture for causing the binding line 4 is pullled in the formation of the binding line 4.
Preferably, the material of the plastic packaging holder 6 is preferably but not limited to as epoxy resin.
Preferably, it is provided with optical filter 9 on the plastic packaging holder 6.But it is also possible to as in the present embodiment, the plastic packaging
It is provided with bearing support 8 on holder 6, optical filter 9 is provided in the bearing support 8.
Since the image sensor chip 1 in the bundled components has sunk the thickness of a wiring board 2, in order to protect
Demonstrate,prove camera module in camera lens 5 surface to the photosurface of described image sensing chip 1 distance it is constant, the plastic packaging holder 6 with/
Or bearing support 8 needs accordingly to reduce the thickness of a wiring board 2, with further 5 surface of camera lens and described image sensing chip 1
The distance of photosurface.
Embodiment three
A kind of package assembling of image sensor chip 1 as shown in figure 3, camera module, including described in embodiment two and
Camera lens 5, the camera lens 5 are pasted and fixed on the top on the plastic packaging holder 6 or bearing support 8 and positioned at the optical filter 9；
Alternatively, further including voice coil motor, the voice coil motor is pasted and fixed on the plastic packaging holder 6 or bearing support 8 and is located at institute
The top of optical filter 9 is stated, the camera lens 5 is assemblied in the voice coil motor.
The embodiment of the utility model above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot it therefore be interpreted as the limitation to the utility model patent range, as long as using the form institute of equivalent substitution or equivalent transformation
The technical solution of acquisition, shall fall within the scope of the present invention.
Claims (10)
1. a kind of bundled components of image sensor chip, which is characterized in that including bearing substrate, wiring board and image sensing core
Piece, the wiring board is arranged on the bearing substrate and there is etched-off area, described image sensing chip to be located at described for centre
In the etched-off area of wiring board and it is arranged on the bearing substrate；Described image sensing chip passes through binding line and the circuit
Plate binding is electrically connected.
2. the bundled components of image sensor chip according to claim 1, which is characterized in that the thickness of the bearing substrate
Between 0.1-0.2mm.
3. the bundled components of image sensor chip according to claim 1 or 2, which is characterized in that the bearing substrate is simultaneous
Make heat-radiating substrate.
4. the bundled components of image sensor chip according to claim 3, which is characterized in that the bearing substrate is metal
Plate or heat dissipation membrane.
5. a kind of package assembling of image sensor chip, which is characterized in that passed including any image in claim 1-4
The bundled components and plastic packaging holder of sense chip, the plastic packaging rack integral are produced on the surface of the wiring board.
6. the package assembling of image sensor chip according to claim 5, which is characterized in that the plastic packaging holder package is close
Seal the circuit element of the PCB surface.
7. the package assembling of image sensor chip according to claim 6, which is characterized in that the circuit element includes electricity
Appearance and/or resistance.
8. according to the package assembling of any image sensor chip in claim 5-7, which is characterized in that the plastic packaging branch
The material of frame is epoxy resin.
9. the package assembling of image sensor chip according to claim 5, which is characterized in that be arranged on the plastic packaging holder
There is optical filter, alternatively, being provided with bearing support on the plastic packaging holder, optical filter is provided in the bearing support.
10. a kind of camera module, which is characterized in that include the encapsulation of any image sensor chip in claim 5-9
Component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820340634.5U CN208028981U (en) | 2018-03-13 | 2018-03-13 | A kind of bundled components of image sensor chip, package assembling and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820340634.5U CN208028981U (en) | 2018-03-13 | 2018-03-13 | A kind of bundled components of image sensor chip, package assembling and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208028981U true CN208028981U (en) | 2018-10-30 |
Family
ID=63907632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820340634.5U Active CN208028981U (en) | 2018-03-13 | 2018-03-13 | A kind of bundled components of image sensor chip, package assembling and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208028981U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
-
2018
- 2018-03-13 CN CN201820340634.5U patent/CN208028981U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
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