CN106998414A

CN106998414A - Image sensor module and the camera model including the image sensor module

Info

Publication number: CN106998414A
Application number: CN201611233311.8A
Authority: CN
Inventors: 矢嶋淳史
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2016-01-26
Filing date: 2016-12-28
Publication date: 2017-08-01
Anticipated expiration: 2036-12-28
Also published as: CN206461695U; KR101792387B1; CN106998414B; KR20170089266A

Abstract

A kind of image sensor module and the camera model including the image sensor module are provided, described image sensor module may include：Printed circuit board (PCB), with the receiving space for plugging imaging sensor；Jointing material, continuously covers described image sensor and the printed circuit board (PCB)；Infrared (IR) filter, described image sensor is pasted by adhesive material, to set gap between the Infrared filter and described image sensor, so as to improve rigidity while miniature requirement is met.

Description

Image sensor module and the camera model including the image sensor module

This application claims Korea Spro 10-2016-0009458 submitted on January 26th, 2016 in Korean Intellectual Property Office The rights and interests of the priority of state's patent application, the disclosure of the korean patent application is all incorporated herein by quoting.

Technical field

This disclosure relates to a kind of image sensor module and the camera model including the image sensor module.

Background technology

In general, camera model has application to various information technologies (IT) device of portable communication appts etc., Also, tend to the recent trend of miniaturization, it is necessary to the miniaturization of camera model itself according to these portable communication appts.

In camera model, the image of object can partly be led by such as charge coupling device (CCD), CMOS The imaging sensor of body (CMOS) etc. is gathered, so as to be stored as data in the memory of device.Therefore, by image sensing Device is arranged on substrate, and the electrical connection that closing line is used between imaging sensor and substrate.

However, generally, in the case where imaging sensor is arranged on the upper surface of substrate, because imaging sensor takes Space, the overall dimensions of camera model may be increased.

The content of the invention

The one side of the disclosure can provide a kind of image sensor module that disclosure satisfy that miniature requirement and including the figure As the camera model of sensor assembly.

The one side of the disclosure may also provide a kind of with enhanced rigidity and intensity, while also meeting miniature requirement Image sensor module and the camera model including the image sensor module.

Another aspect of the present disclosure can provide a kind of valid pixel that can prevent foreign from penetrating into imaging sensor Image sensor module in region and the camera model including the image sensor module.

According to the one side of the disclosure, a kind of image sensor module may include：Printed circuit board (PCB), is passed with image is plugged The receiving space of sensor；Jointing material, continuously covers described image sensor and the printed circuit board (PCB)；Infrared (IR) filters Device, described image sensor is pasted by adhesive material, to be set between the Infrared filter and described image sensor Gap is put, wherein, air path is formed between described image sensor and the Infrared filter, so as to meet miniaturization Rigidity is improved while demand.According to another aspect of the present disclosure, a kind of camera model may include：Infrared (IR) filter, leads to Cross adhesive material and paste imaging sensor, to set gap between the Infrared filter and described image sensor；Print Printed circuit board, with the receiving space for plugging described image sensor；Jointing material, continuously cover described image sensor and The printed circuit board (PCB)；Housing, the printed circuit board (PCB) is attached to by the jointing material, and the housing includes Mirror module.

Brief description of the drawings

From detailed description below in conjunction with the accompanying drawings, the above and other aspects, features and advantages of the disclosure will be more clear Understand to Chu, wherein：

Fig. 1 is the schematic sectional view of the camera model of the exemplary embodiment according to the disclosure；

Fig. 2 is the sectional view of the image sensor module of the exemplary embodiment according to the disclosure；

Fig. 3 to Fig. 7 B is showing for the manufacturing process for the image sensor module for showing the exemplary embodiment according to the disclosure Figure；And

Fig. 8 is the diagram of the manufacturing process for the camera model for showing the exemplary embodiment according to the disclosure.

Embodiment

Hereinafter, it will be described in detail with reference to the accompanying drawings the exemplary embodiment of the disclosure.

Term on direction will be described.Optical direction refer to from lens barrel 21 to the direction of imaging sensor 51 or Imaging sensor 51 arrives the direction of lens barrel 21.

Fig. 1 is the schematic sectional view of the camera model of the exemplary embodiment according to the disclosure.

Reference picture 1, may include lens module 20 according to the camera model of the exemplary embodiment of the disclosure, makes lens module The actuators 40 of 20 motions, by be converted to by the incident light of lens barrel 21 electric signal image sensor module 50 and will Housing 30 and shell 10 that lens module 20 and actuator 40 are accommodated therein.

Lens module 20 may include lens barrel 21 and be attached to the bearing part 23 of lens barrel 21.

Lens barrel 21 can be in hollow columnar so that multiple lens for being imaged to object can be accommodated therein, Multiple lens can be arranged in lens barrel 21 along optical axis.The quantity of lens in lens barrel 21 can be according to lens barrel 21 Design and change, each lens can have such as relative to other lenses identical refractive index or the light of different refractive indexes Learn characteristic.

Lens barrel 21 can be coupled to bearing part 23, and lens barrel 21 and bearing part 23 can be moved in the direction of the optical axis.

Actuator 40 can be the device for moving lens module 20.

As an example, actuator 40 can be focused by making lens module 20 be moved along optical direction.

Actuator 40 may include magnet 41, coil 43 and substrate 47, to produce the driving force for focusing.In addition, actuating Device 40 may also include position sensor 45, to sense the position of lens module 20.

Magnet 41 can be arranged on a surface of bearing part 23, and coil 43 can be fixed to substrate 47, with face of magnet 41, And substrate 47 can be fixed to housing 30.

Position sensor 45 may be provided in the space in the middle body of coil 43, but the spirit of the disclosure is not by position Put the limitation of the installation site of sensor 45.

Image sensor module 50 is the device that the incident light through lens module 20 is converted to electric signal.

As an example, image sensor module 50 may include imaging sensor 51 and be connected to the printing of imaging sensor 51 Circuit board 53, and may also include infrared (IR) filter 55.

IR filters 55 can be used for being blocked in the light by the region of ultra-red in the incident light of lens barrel 21.

Imaging sensor 51 can will be converted to electric signal by the incident light of lens barrel 21.Therefore, imaging sensor 51 Can be such as charge coupled device (CCD) or complementary metal oxide semiconductor (CMOS).

The electric signal changed by imaging sensor 51 can be output as image by the display unit of portable electron device.

Imaging sensor 51 can be fixed to printed circuit board (PCB) 53 and be electrically connected to printed circuit board (PCB) 53 by closing line W.

Lens module 20 may be housed in housing 30.

As an example, the upper and lower part of housing 30 can be opened wide, lens barrel 21 may be housed in the inner space of housing 30 In.

Image sensor module 50 can also be provided at below housing 30.

Shell 10 can be coupled to housing 30, with around the outer surface of housing 30, and available for the interior of protection camera model Parts.

In addition, shell 10 can be used for shielding electromagnetic wave for camera model.

For example, the maskable electromagnetic wave of shell 10 so that the electromagnetic wave produced in camera model does not influence portable electronic to fill Other electronic building bricks in putting.

Further, since various electronic building bricks are also equipped with addition to camera model in portable electronic, therefore The maskable electromagnetic wave of shell 10 so that the electromagnetic wave produced in these electronic building bricks does not influence camera model.

Shell 10 can be formed by metal material, so as to be grounded via the ground mat being arranged in printed circuit board (PCB) 53 so that The maskable electromagnetic wave of shell 10.

Fig. 2 is the sectional view of the image sensor module of the exemplary embodiment according to the disclosure.

Reference picture 2 is described into the image sensor module 50 according to the exemplary embodiment of the disclosure.

Image sensor module 50 may include imaging sensor 51, install the printed circuit board (PCB) 53 of imaging sensor 51 thereon With IR filters 55.

Imaging sensor 51 is plugged to receiving space 53a therein and may be provided in printed circuit board (PCB) 53.Receiving space The width of 53a width comparable imaging sensor 51 is wide.

Although showing a case that the receiving space 53a of printed circuit board (PCB) 53 is in the form of slot in Fig. 2, receiving space 53a Shape not limited to this.That is, receiving space 53a can be formed by the hole for penetrating printed circuit board (PCB) 53.

Imaging sensor 51 may be provided in the receiving space 53a of printed circuit board (PCB) 53 and is electrically connected to by closing line W Printed circuit board (PCB) 53.

Because imaging sensor 51 is plugged in the receiving space 53a of printed circuit board (PCB) 53, therefore and imaging sensor 51 situations about being arranged on the upper surface of printed circuit board (PCB) 53 are compared, and camera model can reduce the height phase with imaging sensor 51 Corresponding height.

That is, can reduce is used for the space for setting imaging sensor 51 in camera model so that including image sensing The size of the image sensor module 50 of device 51 can reduce, and the overall chi of the camera model including image sensor module 50 It is very little also to reduce.

Because the receiving space 53a formation for setting imaging sensor 51 is in printed circuit board (PCB) 53, therefore can be in print A part for the thickness of thin of thickness ratio other parts in the direction of the optical axis is formed in printed circuit board 53.

Therefore, a part of rigidity of the thickness of thin of printed circuit board (PCB) 53 can be deteriorated, therefore, by image sensing Device module 50 and housing 30 are bonded to each other or when by camera model electronic installation mounted externally, exist by applying A part of stress to the thickness of thin of printed circuit board (PCB) 53 makes the impaired risk of printed circuit board (PCB) 53.

However, because the image sensor module 50 of the exemplary embodiment according to the disclosure includes continuously covering image The jointing material 59 of sensor 51 and printed circuit board (PCB) 53, therefore a part of rigidity of the thickness of thin of printed circuit board (PCB) 53 It can be enhanced.

As an example, because imaging sensor 51 is arranged in the part of the thickness of thin of printed circuit board (PCB) 53, and And jointing material 59 continuously covers imaging sensor 51 and printed circuit board (PCB) 53, therefore jointing material 59 can cover printed circuit The part that the thickness of plate changes.

That is, because jointing material 59 covers a part and printed circuit for the thickness relative thin of printed circuit board (PCB) 53 The part of the thickness relative thick of plate 53, therefore the rigidity of printed circuit board (PCB) 53 can be strengthened.

In addition, the closing line W that imaging sensor 51 and printed circuit board (PCB) 53 are electrically connected to each other is arranged on printed circuit board (PCB) Thickness change part at.Therefore, jointing material 59 can also cover closing line W.

Therefore, closing line W can be protected by jointing material 59, therefore, even if applying external impact etc. to it, prevented also from The problem of closing line W is cut off or is impaired.

In addition, jointing material 59 can prevent the foreign matter produced in the receiving space of printed circuit board (PCB) 53 or closing line W from penetrating into Into imaging sensor 51.

Jointing material 59 can be in being capable of light absorbing color.As an example, jointing material 59 can be in antiradar reflectivity Color, and can be black.

Therefore, jointing material 59 can prevent unexpected light from inciding effective picture of the imaging sensor 51 in camera model On element.

In the case of on the valid pixel that the light reflected by other parts is incident in camera model, in fact it could happen that credit Spot phenomenon (flare phenomenon) etc., but in the image sensor module 50 of the exemplary embodiment according to the disclosure In, the jointing material 59 set around the valid pixel of imaging sensor 51 can prevent the light of irregular reflection from inciding camera mould On valid pixel in block.

Meanwhile, IR filters 55 can be pasted on imaging sensor 51 by adhesive material 57, with IR filters 55 with Gap is set between imaging sensor 51.Here, adhesive material 57 may be provided at imaging sensor 51 effective pixel area it Outside.

Because IR filters 55 paste imaging sensor 51, therefore not necessarily form for IR filters 55 to be attached into phase Independent structure in machine module, so that, the size of camera model can be reduced.

Further, since the effective pixel area of imaging sensor 51 is covered by IR filters 55, therefore it can prevent foreign matter from oozing Enter into the effective pixel area of imaging sensor 51.

Meanwhile, in this manual, the gratifying material for instigating two objects to be bonded to each other to be integrated with each other of jointing material 59 Material.As an example, jointing material 59 can refer to making two objects be bonded to each other with logical after two objects are fixed to each other The material crossed specific function or reaction member (chemical reaction, temperature change etc.) and solidified.

Adhesive material 57 can refer to make two objects be attached to mutual material by the means of adhesion.As an example, viscous Patch material 57 can be by the material be also easy to after two objects are attached to each other by two objects it is separated half Solid material.In addition, adhesive material 57 can be by having the material of adhesion to be formed under solid state.

Power required for adhered to by adhesive material 57 two objects are separated from each other is than will be by jointing material 59 Power required for two objects of attachment are separated from each other is weak.

In addition, in the case where adhered to by jointing material 59 two objects are separated from each other, may be by jointing material 59 produce cohesional failure (cohesive failure) phenomenon, but in two objects that will be adhered to by adhesive material 57 each other In the case of separating, cohesional failure phenomenon will not be produced by adhesive material 57.

Fig. 3 to Fig. 7 B is showing for the manufacturing process for the image sensor module for showing the exemplary embodiment according to the disclosure Figure；Fig. 8 is the diagram of the manufacturing process for the camera model for showing the exemplary embodiment according to the disclosure.

First, reference picture 3 to Fig. 7 B is described to the system of the image sensor module of the exemplary embodiment according to the disclosure Make technique.

Receiving space 53a can be formed on printed circuit board (PCB) 53, imaging sensor 51 can be plugged in receiving space 53a (see Fig. 3).

Then, imaging sensor 51 and printed circuit board (PCB) 53 can be connected to each other (see Fig. 4) by closing line W.In addition, can Imaging sensor 51 is washed using wash mill 60, is likely to remain at removing in the effective pixel area of imaging sensor 51 Foreign matter (see Fig. 5).

Then, IR filters 55 can be pasted by imaging sensor 51 by adhesive material 57.Here, can be by by pasting The space that material 57 takes makes IR filters be set on optical direction separate (see Fig. 6 A) with imaging sensor 51.

When IR filters 55 are pasted into imaging sensor 51, adhesive material 57 can applied and be solidificated in IR After on the surface (hereinafter referred to as one surface) in face of imaging sensor 51 of filter 55, imaging sensor 51 can be glued It is affixed on one surface.

As an example, as shown in figs. 6 b and 6 c, adhesive material 57 can be applied at multiple positions, so that at multiple positions Edge of the adhesive material 57 along one surface of IR filters 55 be separated from each other.In contrast to this, can be by adhesive material 57 be coated in imaging sensor 51 on the surface of IR filters 55.

Therefore, the space of sky is formed between adhesive material 57 that can be at multiple positions, and the empty space is available Make air path 57a.

That is, IR filters 55 and imaging sensor 51 are glued each other when using the adhesive material 57 at multiple positions During patch, can by the empty space between the adhesive material 57 at multiple positions imaging sensor 51 and IR filters 55 it Between form air path 57a.

In the case of by the space-closed between IR filters 55 and imaging sensor 51, exist due to IR filters 55 The air that exists between imaging sensor 51 and the installation site of IR filters 55 is deviateed the risk of predeterminated position.

Therefore, in the image sensor module 50 of the exemplary embodiment according to the disclosure, glued by IR filters 55 When being attached to imaging sensor 51, air path 57a can be formed between IR filters 55 and imaging sensor 51 so that IR Air between filter 55 and imaging sensor 51 can flow to outside.

Then, jointing material 59 can be applied continuously to cover imaging sensor 51 and printed circuit board (PCB) 53.As showing Example, the coverability graph of jointing material 59 is as the edge of sensor 51 and edge (that is, the thickness of printed circuit board (PCB) 53 of printed circuit board (PCB) 53 Spend the part of relative thick) (see Fig. 7 A and 7B).

UV curing method or thermal curing methods can be used for jointing material 59.As shown in Figure 7A, material is bonded in coating After material 59, it can be consolidated by applying heat from the bottom of printed circuit board (PCB) 53 to its top irradiating ultraviolet light or to jointing material 59 Change the outside of jointing material 59, so as to prevent jointing material 59 from flowing to the outside of printed circuit board (PCB) 53.

Jointing material 59 can contact IR filters 55 while the edge of imaging sensor 51 is covered.For example, bonding material The side surface of the accessible IR filters 55 of material 59.

In addition, the accessible adhesive material 57 for pasting IR filters 55 and imaging sensor 51 each other of jointing material 59. That is, jointing material 59 can contact at least one of IR filters 55 and adhesive material 57.

Meanwhile, when jointing material 59 is coated on the edge of imaging sensor 51, there is jointing material 59 can The risk that can be penetrated into the effective pixel area of imaging sensor 51.

However, in the image sensor module 50 of the exemplary embodiment according to the disclosure, adhesive material 57 can be used as Barrier, to prevent jointing material 59 from flowing in the effective pixel area of imaging sensor 51.

As an example, because adhesive material 57 is arranged between imaging sensor 51 and IR filters 55 and is arranged on image Outside the effective pixel area of sensor 51, therefore the adhesive material 57 being arranged between imaging sensor 51 and IR filters 55 It can prevent jointing material 59 from flowing in the effective pixel area of imaging sensor 51.

Here, exist due to being coated with multiple positions between the adhesive material 57 at adhesive material 57 and multiple positions Empty space (air path 57a), therefore there is jointing material 59 and will flow to imaging sensor 51 by these empty spaces Risk in effective pixel area.

Therefore, jointing material 59 can have jointing material can not be by empty between the adhesive material 57 at multiple positions The viscosity in space (air path 57a).That is, jointing material 59 may be configured such that jointing material 59 enters image The flowing in gap between sensor 51 and IR filters 55 is limited.

In addition, because the viscosity of jointing material 59, the empty space between the adhesive material 57 at multiple positions is (empty Gas circuit footpath 57a) it is formed as being suitable to the size for preventing jointing material 59 by empty space.

The viscosity of jointing material 59 can be higher than the viscosity of adhesive material 57.

Meanwhile, the air path 57a between imaging sensor 51 and IR filters 55 can be by covering imaging sensor 51 The jointing material 59 at edge close.

Here, in the case of the contact adhesive material 57 of jointing material 59, jointing material 59 can partly plug air In the 57a of path.That is, need can not be by air path 57a viscosity, with not with jointing material 59 for jointing material 59 In the effective pixel area that imaging sensor 51 can be flowed to, wherein, jointing material 59 can partly plug air path 57a In.

Then, can by the printed circuit board (PCB) 53 of image sensor module 50 and wherein accommodate lens module 20 housing 30 that This is combined.

Here, printed circuit board (PCB) 53 and housing 30 can be bonded to each other by jointing material 59.

For example, the jointing material 59 at the edge of the accessible covering printed circuit board (PCB) 53 of housing 30, so as to be attached to printing electricity Road plate 53.

As shown in Figure 8, can be vertical with optical axis direction by edge after housing 30 and printed circuit board (PCB) 53 are bonded to each other Direction ultraviolet light on jointing material 59 or is applied heat to jointing material 59 and carrys out curing binder material 59.

Here, the contact surface of the contact jointing material 59 of housing 30 can be flat surfaces.

Do not including the situation of the adhesive material 57 as the barrier for preventing jointing material 59 from flowing in imaging sensor 51 Under, in order to prevent jointing material 59 from flowing, the contact surface of housing 30 is needed with complicated shape (for example, embossment shape Shape).

According to the disclosure, due to preventing jointing material 59 by adhesive material 57 to the flowing of imaging sensor 51, because The contact surface of this housing 30 can be embodied as flat.

As explained above, according to the exemplary embodiment of the disclosure, image sensor module and including the image sensing The camera model of device module can meet the demand of miniaturization, and while miniature requirement is met, also improve rigidity and strong Degree.

In addition, image sensor module and the camera model including the image sensor module can prevent foreign from penetrating into Into the effective pixel area of imaging sensor.

Although having shown that and describing exemplary embodiment above, those of ordinary skill in the art will be evident , in the case where not departing from the scope of the present invention being defined by the claims, variations and modifications can be made.

Claims

1. a kind of image sensor module, including：

Infrared filter, imaging sensor is pasted by adhesive material, to be sensed in the Infrared filter and described image Gap is set between device；

Printed circuit board (PCB), with the receiving space for plugging described image sensor；And

Jointing material, continuously covers described image sensor and the printed circuit board (PCB),

Wherein, air path is formed between described image sensor and the Infrared filter.

2. image sensor module according to claim 1, wherein, the air path is sealed by the jointing material Close.

3. image sensor module according to claim 1, wherein, the jointing material has the jointing material can not Pass through the viscosity of the air path.

4. image sensor module according to claim 1, wherein, the air path is formed as being suitable to prevent described viscous The size that condensation material passes through the air path.

5. image sensor module according to claim 1, wherein, the jointing material partly plugs the air In path.

6. image sensor module according to claim 1, wherein, adhesive material described in the ratio of viscosities of the jointing material Viscosity it is high.

7. image sensor module according to claim 1, wherein, the jointing material contacts the adhesive material and institute State at least one of Infrared filter.

8. image sensor module according to claim 7, wherein, the jointing material is in light absorbing color.

9. image sensor module according to claim 7, wherein, the jointing material is in black.

10. image sensor module according to claim 1, wherein, described image sensor and the printed circuit board (PCB) It is bonded to each other by closing line, and the jointing material covers the closing line.

11. image sensor module according to claim 1, wherein, along the edge of the Infrared filter each other Adhesive material is set at separated multiple positions.

12. a kind of camera model, including：

Printed circuit board (PCB), with the receiving space for plugging described image sensor；

Jointing material, continuously covers described image sensor and the printed circuit board (PCB)；And

Housing, the printed circuit board (PCB) is attached to by the jointing material, and the housing includes lens module.

13. camera model according to claim 12, wherein, the contact surface of the contact jointing material of the housing It is flat surfaces.

14. camera model according to claim 12, wherein, between described image sensor and the Infrared filter Form air path.

15. camera model according to claim 12, wherein, the jointing material is configured to limit the jointing material To the flowing in the gap between described image sensor and the Infrared filter.