CN109975693B - 一种***级封装后芯片互联测试方法及*** - Google Patents
一种***级封装后芯片互联测试方法及*** Download PDFInfo
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- CN109975693B CN109975693B CN201910261233.XA CN201910261233A CN109975693B CN 109975693 B CN109975693 B CN 109975693B CN 201910261233 A CN201910261233 A CN 201910261233A CN 109975693 B CN109975693 B CN 109975693B
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- 238000012360 testing method Methods 0.000 title claims abstract description 82
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 239000013598 vector Substances 0.000 claims abstract description 51
- 238000010586 diagram Methods 0.000 claims abstract description 14
- 230000009191 jumping Effects 0.000 claims abstract description 12
- 238000013100 final test Methods 0.000 claims abstract description 7
- 238000010998 test method Methods 0.000 claims abstract description 3
- 230000008054 signal transmission Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 6
- 238000012536 packaging technology Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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CN109975693A CN109975693A (zh) | 2019-07-05 |
CN109975693B true CN109975693B (zh) | 2021-12-10 |
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CN113779913B (zh) * | 2021-11-12 | 2022-03-22 | 浙江大学 | 一种面向ai多芯片***的验证平台结构和测试方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013166059A1 (en) * | 2012-04-30 | 2013-11-07 | Qualcomm Incorporated | Method and apparatus for characterizing thermal marginality in an integrated circuit |
CN107026651A (zh) * | 2017-04-11 | 2017-08-08 | 安庆师范大学 | 二分区间的数据压缩方法及集成电路的测试数据存储方法 |
CN107144776A (zh) * | 2017-04-17 | 2017-09-08 | 深圳先进技术研究院 | 一种总剂量效应的探测方法及装置 |
CN108830008A (zh) * | 2018-06-28 | 2018-11-16 | 中国科学院微电子研究所 | 一种标准单元库全模型的测试方法及测试*** |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013166059A1 (en) * | 2012-04-30 | 2013-11-07 | Qualcomm Incorporated | Method and apparatus for characterizing thermal marginality in an integrated circuit |
CN107026651A (zh) * | 2017-04-11 | 2017-08-08 | 安庆师范大学 | 二分区间的数据压缩方法及集成电路的测试数据存储方法 |
CN107144776A (zh) * | 2017-04-17 | 2017-09-08 | 深圳先进技术研究院 | 一种总剂量效应的探测方法及装置 |
CN108830008A (zh) * | 2018-06-28 | 2018-11-16 | 中国科学院微电子研究所 | 一种标准单元库全模型的测试方法及测试*** |
Non-Patent Citations (2)
Title |
---|
On-Chip Test Generation Using Linear Subspaces;R.Das;《Eleventh IEEE European Test Symposium》;20060619;第1-6页 * |
一种引导测试向量自动生成广义折叠集的方法;詹文法;《东南大学学报(自然科学版)》;20180320;第48卷(第2期);第265-269页 * |
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Effective date of registration: 20221205 Address after: No. 209, Tongyuan Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province, 215000 Patentee after: Suzhou Industrial Park Hongqi Technology Co.,Ltd. Address before: 230000 b-1018, Woye Garden commercial office building, 81 Ganquan Road, Shushan District, Hefei City, Anhui Province Patentee before: HEFEI WISDOM DRAGON MACHINERY DESIGN Co.,Ltd. Effective date of registration: 20221205 Address after: 230000 b-1018, Woye Garden commercial office building, 81 Ganquan Road, Shushan District, Hefei City, Anhui Province Patentee after: HEFEI WISDOM DRAGON MACHINERY DESIGN Co.,Ltd. Address before: 246133 1318 Jixian North Road, Anqing, Anhui Patentee before: ANQING NORMAL University |
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