CN109950218A - A kind of radiator and cooling system - Google Patents
A kind of radiator and cooling system Download PDFInfo
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- CN109950218A CN109950218A CN201711387259.6A CN201711387259A CN109950218A CN 109950218 A CN109950218 A CN 109950218A CN 201711387259 A CN201711387259 A CN 201711387259A CN 109950218 A CN109950218 A CN 109950218A
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- 238000001816 cooling Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims description 18
- 241001075561 Fioria Species 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 208000002925 dental caries Diseases 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The present invention provides a kind of radiator and cooling system, which includes: shell and be placed in the shell piezoelectric fan that the shell is divided into the first cavity, the second cavity；The piezoelectric fan, comprising: piezoelectric vibration source and head end are fixed on the fan blade in the piezoelectric vibration source；The shell is fixed in the piezoelectric vibration source, and the direction of vibration of the fan blade is towards first cavity, second cavity；The end two sides of the fan blade, equipped with being located at first cavity, the first venthole of second cavity, the second venthole；The head end two sides of the fan blade, equipped with being located at first cavity, the first air inlet of second cavity, the second air inlet.Radiator provided by the invention forms two cavitys in the two sides of piezoelectric fan, fan drives gas to pass through cavity, to achieve the purpose that heat dissipation, the radiator, small in size, structure is reliable, and the service life is long using piezoelectric fan and shell.
Description
Technical field
The present invention relates to technical field of heat dissipation, in particular to a kind of radiator and cooling system.
Background technique
In the past few decades, semiconductor development is swift and violent, is applied to each electronics field.However, semiconductor work
When making, a large amount of heat can be generated, increases the temperature of semiconductor chip seriously, it is anxious so as to cause semiconductor chip working efficiency
Play decline, seriously affects the service life of semiconductor chip, so efficient semiconductor packages heat dissipation design is particularly important.
In current semiconductor packages heat dissipation design, the heat dissipation effect of active heat removal radiates much stronger than passive, but one
As do not use active heat removal.One the reason is that semiconductor is used in the application of relative low-power.Another reason is tradition
Mechanical fans be not suitable for semiconductor packages heat dissipation design because its poor reliability, life of product are short.Strong noise and high power
And mechanical fans there are the shortcomings that.
However, modern electronic equipment, power is higher and higher, and radiating requirements are got over the increase of semiconductor chip power
Come it is bigger, in order to meet radiating requirements, it is necessary to develop new active heat removal solution.
Therefore, a kind of radiator and cooling system how to be proposed, structure is reliable, and the service life is long, low-power consumption, low noise, is this
Field technical staff technical problem urgently to be resolved.
Summary of the invention
In view of this, structure is reliable the purpose of the present invention is to provide a kind of radiator and cooling system, the service life is long, low
Power consumption, low noise.Its concrete scheme is as follows:
On the one hand, the present invention provides a kind of radiator, comprising: the shell is divided by shell and being placed in the shell
The piezoelectric fan of first cavity, the second cavity；
The piezoelectric fan, comprising: piezoelectric vibration source and head end are fixed on the fan blade in the piezoelectric vibration source；
The shell is fixed in the piezoelectric vibration source, the direction of vibration of the fan blade towards first cavity,
Second cavity；
The end two sides of the fan blade go out equipped be located at first cavity, second cavity first
Stomata, the second venthole；The head end two sides of the fan blade, equipped with being located at first cavity, second cavity
The first air inlet, the second air inlet.
Preferably, the vibration frequency in the piezoelectric vibration source is equal to the intrinsic frequency of the fan blade.
Preferably, the end two sides of the fan blade are provided with flank.
Preferably, the end cross section of the fan blade is H-shaped.
Preferably, the fan blade and flank are integrally formed.
Preferably, the fan blade is elastic piece.
Preferably, the shell has streamlined inner surface.
Preferably, the corner of the shell has Fillet Feature.
Preferably, first venthole, second venthole are equipped with unidirectional air outlet valve, first air inlet, institute
The second air inlet is stated equipped with breather cheek valve.
On the other hand, the present invention also provides a kind of cooling systems, are applied to semiconductor devices, comprising: array is in described half
N number of any of the above-described kind of radiator of conductor device periphery；
Wherein, the N is positive integer.
The present invention provides a kind of radiator, comprising: shell and is placed in the shell shell being divided into the first chamber
The piezoelectric fan of body, the second cavity；The piezoelectric fan, comprising: piezoelectric vibration source and head end are fixed on the piezoelectric vibration source
Fan blade；The shell is fixed in the piezoelectric vibration source, and the direction of vibration of the fan blade is towards first chamber
Body, second cavity；The end two sides of the fan blade, equipped with being located at first cavity, second cavity
The first venthole, the second venthole；The head end two sides of the fan blade, equipped with being located at first cavity, described
The first air inlet, the second air inlet of second cavity.Radiator provided by the invention, using piezoelectric fan and shell, in piezoelectricity
The two sides of fan form two cavitys, and fan drives gas to pass through cavity, and the design of radiator shell outlet hole site can be concentrated
Air-flow generates faster air velocity, to meet the needs of high power semi-conductor package cooling, the radiator is small in size, knot
Structure is reliable, low noise, and the low-power consumption service life is long.
The present invention also provides a kind of cooling systems, it may have above-mentioned beneficial effect, details are not described herein.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram for radiator that the specific embodiment of the invention provides；
Fig. 2 is the structural schematic diagram of the piezoelectric fan of radiator shown in Fig. 1；
Fig. 3 is the facing structure schematic diagram of radiator shown in Fig. 1；
Fig. 4 is the structural schematic diagram of piezoelectric fan provided in a kind of specific embodiment of the present invention；
Fig. 5 is a kind of stereoscopic schematic diagram for the LED light cooling system that specific embodiment provides of the present invention；
Fig. 6 is the top view of LED light cooling system shown in fig. 5.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1, Fig. 2, Fig. 3 are please referred to, Fig. 1 is a kind of structural representation for radiator that the specific embodiment of the invention provides
Figure；Fig. 2 is the structural schematic diagram of the piezoelectric fan of radiator shown in Fig. 1；Fig. 3 is the facing structure schematic diagram of radiator shown in Fig. 1.
In a kind of specific embodiment of the invention, the specific embodiment of the invention provides a kind of radiator 100, packet
Include: the shell is divided into the piezoelectric fan 120 of the first cavity, the second cavity with being placed in the shell by shell 110；It is described
Piezoelectric fan, comprising: piezoelectric vibration source 121 and head end are fixed on the fan blade 122 in the piezoelectric vibration source；The piezoelectricity vibration
The shell 110 is fixed in dynamic source, and the direction of vibration of the fan blade 122 is towards first cavity 111, second chamber
Body 112；The end two sides of the fan blade 122, equipped with being located at first cavity 111, second cavity 112
First venthole 113, the second venthole 114；The head end two sides of the fan blade 120, equipped with being located at first chamber
Body 111, the first air inlet 115 of second cavity 112, the second air inlet 116.
In a specific embodiment, piezoelectric fan includes that piezoelectric vibration source 121 and head end are fixed on the piezoelectric vibration source
Fan blade 122.Piezoelectric effect: certain dielectrics when being deformed in a certain direction by the effect of external force, inside
Polarization phenomena can be generated, while positive and negative opposite charge occur on its two apparent surfaces.After external force is removed, its meeting again
It is restored to uncharged state, this phenomenon is known as direct piezoelectric effect.When active force direction change when, the polarity of charge also with
Change.On the contrary, these dielectrics can also deform when applying electric field on polarization of dielectric direction, after electric field removes,
Dielectric deformation disappears therewith, and this phenomenon is known as inverse piezoelectric effect.
And piezoelectric fan is exactly according to made of inverse piezoelectric effect.Piezoelectric vibration source generally uses piezoelectric material, can be
Inorganic piezoelectric material, such as piezo-electric crystal and piezoelectric ceramics etc., wherein piezo-electric crystal generally refers to piezoelectric single crystal, piezoelectricity pottery
Porcelain then refers to piezoelectricity polycrystal；It is also possible to organic piezoelectric materials, also known as piezopolymer, as Kynoar (PVDF) is (thin
Film) and using it as other organic piezoelectricity (film) materials of representative etc..
In a specific embodiment, the frequency of 120 nominal operation of piezoelectric fan used in the specific embodiment of the invention
Rate is 50HZ, and whole fan blade 122 is in rectangle, and length, width and thickness is respectively 40mm, 12.7mm and 0.2mm.Fan leaf
The vibration of piece is driven by the piezoelectric vibration source 121 adhered to, can be with the resonance frequency of the amplitude of its 12.7mm.Horizontal distance
The first air outlet slit is arranged in top 10mm before fan blade tip at 10mm, and the second air touch-control is arranged in lower part 10mm.The
One air inlet 115, the second air inlet 116 are rectangular opening, having a size of 20mm x 20mm；First venthole 113, the second venthole
114 be all rectangle, having a size of 35mm x 5mm.
Specifically, the radiator is using piezoelectric fan 120 as cross-ventilated power, when fan blade 122 moves up
When, air enters the second cavity 112 from the second air inlet 116, and the air of first cavity 111 of the upside of fan blade 122 is from first
Venthole 113 is pumped out radiator.When fan blade 122 moves down, air enters the first cavity from the first air inlet 115
111, the air in second cavity 112 of the downside of fan blade 122 is pumped out radiator from the second venthole 114.Experiment measures knot
Fruit shows that the air-flow average speed of two air outlet slits is about 1.6m/s, maximum value 2.06m/s.This air cooler is applied to
In great power LED (light emitting diode) package cooling system, relative to passively Natural Heat Convection, convective heat-transfer coefficient increases
375%, LED heat source temperature decrease beyond 36.4 DEG C.It shows in about 75cm2Area on cooling about 1KW ability.Cause
This, the effect of active heat removal of the present invention is extraordinary, and long service life, low noise, low-power consumption.
It further, can be by the piezoelectricity in order to enable the blade of piezoelectric fan can fully absorb the energy of vibration
The vibration frequency of vibration source is equal to the intrinsic frequency of the fan blade.And the vibration frequency in piezoelectric vibration source and application piezoelectricity vibration
The frequency of alternating voltage on dynamic source is consistent.Intrinsic frequency is also referred to as natural frequency (natural frequency).Object is done
When free vibration, at any time by the variation of sinusoidal or cosine rule, the frequency of vibration is unrelated with primary condition for displacement, and only be
The inherent characteristic of system is related (such as quality, shape, material), referred to as intrinsic frequency, and the correspondence period is known as the natural period.Object
Frequency it is related with its hardness, quality, outer dimension, when deformation occurs for it, elastic force makes its recovery.Elastic force is mainly and size
Related with hardness, quality influences its acceleration.When same shape, frequency with high hardness is high, and the big frequency of quality is low.It can pass through
Shape and the coefficient of elasticity etc. for adjusting fan blade are consistent with the frequency in piezoelectric vibration source to adjust its intrinsic frequency, can also be with
The frequency for the alternating source being applied on piezoelectric vibration source is adjusted using frequency converter to implement the vibration frequency in piezoelectric vibration source
Equal to the intrinsic frequency of the fan blade.
Further, it in order to reduce air stream in the intracorporal resistance of shell, can set the shell to streamline
Type inner surface.It specifically, in a specific embodiment, can be special using fillet by the corner of the shell inner surface
Sign.So that the inner surface of entire shell reduces the obstruction flowed to air.
The radiator that the specific embodiment of the invention provides, using piezoelectric fan and shell, in the two sides shape of piezoelectric fan
At two cavitys, fan drives gas to pass through cavity, to achieve the purpose that heat dissipation, the radiator dissipating compared with the existing technology
Hot device, small in size, structure is reliable, and the service life is long, and fan drives gas to pass through cavity, the design energy of radiator shell outlet hole site
Focused airflow generates faster air velocity, thus meet the needs of high power semi-conductor package cooling, the radiator, volume
Small, structure is reliable, low noise, and the low-power consumption service life is long.
Referring to FIG. 4, Fig. 4 is the structural schematic diagram of piezoelectric fan provided in a kind of specific embodiment of the present invention.
On the basis of above-mentioned specific embodiment, in present embodiment, in order to reduce fan blade in vibration
The side leakage of wind can be provided with flank in the end two sides of the fan blade.It in a specific embodiment, can be by institute
The end cross section for stating fan blade is set as H-shaped, naturally it is also possible to be other shapes, such as respectively trapezoidal up and down.
Specifically, entire fan blade is plate-like, and the first flank 123, the second flank 124 is arranged in the two sides of fan blade.Due to sending
The shape of the air outlet of wind part is H font, can be effectively prevented the side leakage of wind, improve the consistency in the direction of wind.It is described
Fan blade and flank are integrally formed, and the fan blade can be elastic piece.
On the basis of above-mentioned specific embodiment, in present embodiment, in order to enable air inlet and venthole
It passes in and out air-flow and keeps pure property, reduce turbulent flow.Preferably, it can be equipped in first venthole, second venthole single
To air outlet valve, first air inlet, second air inlet are equipped with breather cheek valve.
Fig. 5, Fig. 6 are please referred to, Fig. 5 is that a kind of solid for the LED light cooling system that specific embodiment provides of the present invention is shown
It is intended to；Fig. 6 is the top view of LED light cooling system shown in fig. 5.
The specific embodiment of the invention also provides a kind of cooling system, is applied to semiconductor devices, comprising: array is in described
N number of any of the above-described kind of radiator of semiconductor devices periphery；Wherein, the N is positive integer.
In a specific embodiment, the radiator in above-mentioned specific embodiment can be specifically applied to LED light
In, for high-power LED lamp, at this moment very easy fever just needs to radiate.In this embodiment, LED light is outer
Shell 501 is in infundibulate, and funnel bottom is the bottom of shell 501.Light-emitting LED 504 are internally provided in LED light, is being shone
Radiating fin 503 is provided with around LED504, in light-emitting LED 504 operational heat, heat can be by way of heat transfer
It, can be near radiating fin 503 in order to facilitate the air circulation around radiating fin 503 on conduction to radiating fin 503
Through-hole is set on shell 501.
In the bottom of the LED light, the radiator in above-mentioned specific embodiment can be set, it is scattered for cold air to be blown to
On hot fin 503.In this embodiment, by the first air inlet of the radiator in above-mentioned specific embodiment, second
The bottom of the shell 501 for being set to LED light of air inlet inwardly is protected the first air inlet of radiator 502, the second air inlet
It holds and is connected to outside, the first venthole, the second venthole are connected to 501 inner space of shell of LED etc., due to entire shell
501 be infundibulate, and radiator 502 drives air to enter after shell 501, will be to the radiating fin 503 being set to inside shell 501
Diffusion, to accelerate the heat dissipation of radiating fin 503.The structure of radiator 502, radiating fin 503 and shell 501 constitutes LED
The cooling system of lamp.Certainly, the radiator in the specific embodiment of the invention also can be applied to the cooling system of other structures
In, particularly, it can be used for heat dissipation of semiconductor field, such as CPU, control chip etc..
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of radiator provided by the present invention and cooling system are described in detail above, tool used herein
Principle and implementation of the present invention are described for body example, the above embodiments are only used to help understand this hair
Bright method and core concept；At the same time, for those skilled in the art is being embodied according to the thought of the present invention
There will be changes in mode and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (10)
1. a kind of radiator characterized by comprising shell and be placed in the shell shell being divided into the first chamber
The piezoelectric fan of body, the second cavity；
The piezoelectric fan, comprising: piezoelectric vibration source and head end are fixed on the fan blade in the piezoelectric vibration source；
The shell is fixed in the piezoelectric vibration source, and the direction of vibration of the fan blade is towards first cavity, described
Second cavity；
The end two sides of the fan blade, equipped be located at first cavity, second cavity the first venthole,
Second venthole；The head end two sides of the fan blade, equipped with being located at the first of first cavity, second cavity
Air inlet, the second air inlet.
2. radiator according to claim 1, which is characterized in that the vibration frequency in the piezoelectric vibration source is equal to the wind
The intrinsic frequency of fan leaf.
3. radiator according to claim 1, which is characterized in that the end two sides of the fan blade are provided with flank.
4. radiator according to claim 3, which is characterized in that the end cross section of the fan blade is H-shaped.
5. radiator according to claim 3, which is characterized in that the fan blade and flank are integrally formed.
6. radiator according to claim 1, which is characterized in that the fan blade is elastic piece.
7. radiator according to any one of claims 1 to 6, which is characterized in that the shell has streamlined inner surface.
8. radiator according to claim 5, which is characterized in that the corner of the shell has Fillet Feature.
9. radiator according to any one of claims 1 to 6, which is characterized in that first venthole, described second go out
Stomata is equipped with unidirectional air outlet valve, and first air inlet, second air inlet are equipped with breather cheek valve.
10. a kind of cooling system is applied to semiconductor devices characterized by comprising array is in the semiconductor devices periphery
N number of radiator as described in any one of claim 1 to 9；
Wherein, the N is positive integer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711387259.6A CN109950218A (en) | 2017-12-20 | 2017-12-20 | A kind of radiator and cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711387259.6A CN109950218A (en) | 2017-12-20 | 2017-12-20 | A kind of radiator and cooling system |
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| Publication Number | Publication Date |
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| CN109950218A true CN109950218A (en) | 2019-06-28 |
Family
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| CN201711387259.6A Pending CN109950218A (en) | 2017-12-20 | 2017-12-20 | A kind of radiator and cooling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911112A (en) * | 2021-01-21 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115243520A (en) * | 2022-07-27 | 2022-10-25 | 江苏联能电子技术有限公司 | Radiator structure for piezoelectric fan system and fin arrangement method thereof |
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